JPS62134252U - - Google Patents
Info
- Publication number
- JPS62134252U JPS62134252U JP1985786U JP1985786U JPS62134252U JP S62134252 U JPS62134252 U JP S62134252U JP 1985786 U JP1985786 U JP 1985786U JP 1985786 U JP1985786 U JP 1985786U JP S62134252 U JPS62134252 U JP S62134252U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- plate
- holding
- sides
- dissipation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Description
図面は本考案の一実施例を示すもので、第1図
は放熱装置の斜視図、第2図は放熱装置の正面図
、第3図は本考案の他の実施例の放熱装置を示す
斜視図、第4図、第5図は本考案の更に他の実施
例を示すもので、第4図は放熱装置の斜視図、第
5図は放熱装置の正面図である。
1……放熱装置、2……放熱板、2a……抱持
片、A……IC、P……プリント基板、P1……
挿通孔。
The drawings show one embodiment of the present invention; Fig. 1 is a perspective view of a heat radiating device, Fig. 2 is a front view of the heat radiating device, and Fig. 3 is a perspective view showing a heat radiating device of another embodiment of the present invention. 4 and 5 show still other embodiments of the present invention, in which FIG. 4 is a perspective view of the heat radiating device, and FIG. 5 is a front view of the heat radiating device. 1... Heat dissipation device, 2... Heat dissipation plate, 2a... Holding piece, A... IC, P... Printed circuit board, P 1 ...
Insertion hole.
Claims (1)
熱板の両側下部にIC本体を抱持する抱持片を設
けたことを特徴とするIC用放熱装置。 (2) 前記放熱板がその板上に複数の放熱フイン
を有することを特徴とする実用新案登録請求の範
囲第1項記載のIC用放熱装置。[Claims for Utility Model Registration] (1) A heat dissipation device for an IC, characterized in that a heat dissipation plate with good heat conductivity that is in contact with the top surface of the IC body is provided with holding pieces for holding the IC body at the lower sides of both sides. (2) The heat dissipation device for an IC according to claim 1, wherein the heat dissipation plate has a plurality of heat dissipation fins on the plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985786U JPS62134252U (en) | 1986-02-14 | 1986-02-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985786U JPS62134252U (en) | 1986-02-14 | 1986-02-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62134252U true JPS62134252U (en) | 1987-08-24 |
Family
ID=30814825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985786U Pending JPS62134252U (en) | 1986-02-14 | 1986-02-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62134252U (en) |
-
1986
- 1986-02-14 JP JP1985786U patent/JPS62134252U/ja active Pending
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