JPS6333697U - - Google Patents
Info
- Publication number
- JPS6333697U JPS6333697U JP12577986U JP12577986U JPS6333697U JP S6333697 U JPS6333697 U JP S6333697U JP 12577986 U JP12577986 U JP 12577986U JP 12577986 U JP12577986 U JP 12577986U JP S6333697 U JPS6333697 U JP S6333697U
- Authority
- JP
- Japan
- Prior art keywords
- insulating plate
- electronic component
- cooling device
- insulated
- penetrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1a図は、本考案の一実施例に係る電子部品
冷却装置の斜視図である。第1b図は、本考案の
一実施例に係る電子部品冷却装置の正面図である
。第1c図は、本考案の一実施例に係る電子部品
冷却装置の使用状態を示す側面図である。
1……絶縁板、2……冷却フイン、3……筐体
の壁面、4……プリント板、5……電子部品のピ
ン。
FIG. 1a is a perspective view of an electronic component cooling device according to an embodiment of the present invention. FIG. 1b is a front view of an electronic component cooling device according to an embodiment of the present invention. FIG. 1c is a side view showing the state of use of the electronic component cooling device according to an embodiment of the present invention. 1...Insulating board, 2...Cooling fin, 3...Wall surface of the housing, 4...Printed board, 5...Pin of electronic component.
Claims (1)
縁板1によつて支持され、または、前記絶縁板1
と一体に形成され、前記絶縁板1の一方向11に
同一の長さ伸延しており、前記絶縁板1の面上に
マトリツクス状に配置される複数の冷却フイン2
と を有する電子部品冷却装置。[Claims for Utility Model Registration] An insulating plate 1, which penetrates the insulating plate 1, is insulated from each other, is supported by the insulating plate 1, or
A plurality of cooling fins 2 are formed integrally with the insulating plate 1, extend the same length in one direction 11 of the insulating plate 1, and are arranged in a matrix on the surface of the insulating plate 1.
An electronic component cooling device having.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986125779U JPH0328554Y2 (en) | 1986-08-20 | 1986-08-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986125779U JPH0328554Y2 (en) | 1986-08-20 | 1986-08-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6333697U true JPS6333697U (en) | 1988-03-04 |
JPH0328554Y2 JPH0328554Y2 (en) | 1991-06-19 |
Family
ID=31018979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986125779U Expired JPH0328554Y2 (en) | 1986-08-20 | 1986-08-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0328554Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5168363U (en) * | 1974-11-27 | 1976-05-29 | ||
JPS5972741U (en) * | 1982-11-05 | 1984-05-17 | 三菱アルミニウム株式会社 | Heatsink for electrical elements |
-
1986
- 1986-08-20 JP JP1986125779U patent/JPH0328554Y2/ja not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5168363U (en) * | 1974-11-27 | 1976-05-29 | ||
JPS5972741U (en) * | 1982-11-05 | 1984-05-17 | 三菱アルミニウム株式会社 | Heatsink for electrical elements |
Also Published As
Publication number | Publication date |
---|---|
JPH0328554Y2 (en) | 1991-06-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6333697U (en) | ||
JPH0476094U (en) | ||
JPS6022841U (en) | radiator | |
JPH02140893U (en) | ||
JPS6018550U (en) | Heat dissipation structure | |
JPH0260288U (en) | ||
JPH02131395U (en) | ||
JPS6262446U (en) | ||
JPS6245860U (en) | ||
JPH0334292U (en) | ||
JPH0330440U (en) | ||
JPS62134252U (en) | ||
JPS5827947U (en) | Hybrid integrated circuit device | |
JPS61157336U (en) | ||
JPS5929095U (en) | electronic equipment | |
JPS6146744U (en) | Heat dissipation mechanism for integrated circuit devices | |
JPS6146745U (en) | Centralized heat dissipation mechanism for integrated circuit devices | |
JPS6310596U (en) | ||
JPS6364097U (en) | ||
JPH0415892U (en) | ||
JPH0361371U (en) | ||
JPS63172168U (en) | ||
JPH01154689U (en) | ||
JPS62176977U (en) | ||
JPH0160596U (en) |