JPH0359643U - - Google Patents
Info
- Publication number
- JPH0359643U JPH0359643U JP12138289U JP12138289U JPH0359643U JP H0359643 U JPH0359643 U JP H0359643U JP 12138289 U JP12138289 U JP 12138289U JP 12138289 U JP12138289 U JP 12138289U JP H0359643 U JPH0359643 U JP H0359643U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- spring member
- heat sink
- legs
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図A及びBは本考案の一実施例を示す本考
案の構成斜視図及び断面図、第2図は従来例の構
成斜視図である。
1……プリント基板、1a……係合穴、2……
電子部品、3……リード、4……ヒートシンク、
5……バネ部材、52b……脚部。
1A and 1B are a perspective view and a sectional view of the structure of the present invention showing an embodiment of the present invention, and FIG. 2 is a perspective view of the structure of a conventional example. 1... Printed circuit board, 1a... Engagement hole, 2...
Electronic components, 3...leads, 4...heat sinks,
5... Spring member, 52b... Leg portion.
Claims (1)
のヒートシンクに電子部品を押圧固定するバネ部
材とを備えた電子部品取り付け装置において、 前記バネ部材を略U字形に構成すると共に、U
字形の一端部に凸形状の係合用突起を有する一対
の脚部を設け、前記電子部品と前記ヒートシンク
とを前記U字形バネ部材の開放端から挾み込んで
、前記一対の脚部を前記プリント基板に対応して
設けられた穴部に係合して取り付けることを特徴
とした電子部品取り付け装置。[Claims for Utility Model Registration] An electronic component mounting device comprising a heat sink mounted on a printed circuit board and a spring member for press-fixing an electronic component to the heat sink, the spring member having a substantially U-shape, U
A pair of legs having a convex engagement protrusion is provided at one end of the shape, and the electronic component and the heat sink are inserted into the open end of the U-shaped spring member, and the pair of legs are attached to the print. An electronic component mounting device characterized by being mounted by engaging with a hole provided correspondingly to a board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12138289U JPH0359643U (en) | 1989-10-17 | 1989-10-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12138289U JPH0359643U (en) | 1989-10-17 | 1989-10-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0359643U true JPH0359643U (en) | 1991-06-12 |
Family
ID=31669416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12138289U Pending JPH0359643U (en) | 1989-10-17 | 1989-10-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0359643U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012119542A (en) * | 2010-12-01 | 2012-06-21 | Aisin Aw Co Ltd | Structure and method of fixing heat source element and thermal conductive member to each other |
-
1989
- 1989-10-17 JP JP12138289U patent/JPH0359643U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012119542A (en) * | 2010-12-01 | 2012-06-21 | Aisin Aw Co Ltd | Structure and method of fixing heat source element and thermal conductive member to each other |
US8797743B2 (en) | 2010-12-01 | 2014-08-05 | Aisin Aw Co., Ltd. | Fixing structure for heat source element and heat conducting member, and method of fixing heat source element and heat conducting member |
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