JPH0160574U - - Google Patents
Info
- Publication number
- JPH0160574U JPH0160574U JP15578187U JP15578187U JPH0160574U JP H0160574 U JPH0160574 U JP H0160574U JP 15578187 U JP15578187 U JP 15578187U JP 15578187 U JP15578187 U JP 15578187U JP H0160574 U JPH0160574 U JP H0160574U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat sink
- component unit
- clamp member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案を適用した回路部品ユニツト
のプリント基板への取付状態を示す側面図、第２
図は同じくその外観斜視図、第３図は従来の回路
部品ユニツトのプリント基板への取付構造を示す
側面図である。
１…回路部品ユニツト、２…放熱板、４…プリ
ント基板、４ｃ…小孔、６…クランプ部材、６ｂ
…脚部、６ｃ…突出部、６ｄ…挿入部。
Figure 1 is a side view showing how a circuit component unit to which this invention is applied is attached to a printed circuit board, Figure 2
The same figure is a perspective view of the external appearance, and FIG. 3 is a side view showing a conventional mounting structure of a circuit component unit on a printed circuit board. 1... Circuit component unit, 2... Heat sink, 4... Printed circuit board, 4c... Small hole, 6... Clamp member, 6b
...Leg portion, 6c...Protrusion part, 6d...Insertion part.
Claims (1)
成した回路部品ユニツトをその放熱板と共にプリ
ント基板へ取付ける取付構造において、 前記回路部品ユニツトと放熱板とを、少なくと
も脚部が半田付け可能な材質で形成されたクラン
プ部材と共に一体に固定し、前記放熱板とプリン
ト基板との間に所定の間隔を設けて前記クランプ
部材の脚部をプリント基板に形成された小孔に挿
着し、該脚部の前記プリント基板からの突出部へ
の半田付により該クランプ部材をプリント基板に
固定してなることを特徴とする回路部品ユニツト
のプリント基板への取付構造。[Claims for Utility Model Registration] In a mounting structure in which a circuit component unit configured as a circuit using electronic components requiring a heat sink is attached to a printed circuit board together with the heat sink, the circuit component unit and the heat sink are at least The legs are fixed together with a clamp member made of a solderable material, and a predetermined interval is provided between the heat sink and the printed circuit board, and the legs of the clamp member are attached to a small part formed on the printed circuit board. A structure for attaching a circuit component unit to a printed circuit board, characterized in that the clamp member is fixed to the printed circuit board by inserting it into a hole and soldering to the protrusion of the leg from the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15578187U JPH0160574U (en) | 1987-10-12 | 1987-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15578187U JPH0160574U (en) | 1987-10-12 | 1987-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160574U true JPH0160574U (en) | 1989-04-17 |
Family
ID=31433711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15578187U Pending JPH0160574U (en) | 1987-10-12 | 1987-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160574U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0951153A (en) * | 1995-08-07 | 1997-02-18 | Hitachi Ltd | Structure of printed board assembly |
-
1987
- 1987-10-12 JP JP15578187U patent/JPH0160574U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0951153A (en) * | 1995-08-07 | 1997-02-18 | Hitachi Ltd | Structure of printed board assembly |
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