JPH028168U - - Google Patents
Info
- Publication number
- JPH028168U JPH028168U JP8640088U JP8640088U JPH028168U JP H028168 U JPH028168 U JP H028168U JP 8640088 U JP8640088 U JP 8640088U JP 8640088 U JP8640088 U JP 8640088U JP H028168 U JPH028168 U JP H028168U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- component
- leg
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例におけるプリント配
線板の要部を示す裏面斜視図、第２図及び第３図
は同プリント配線板に取付ける電気部品の異なる
例を示す斜視図、第４図及び第５図は同プリント
配線板の孔の異なる形状例を示す図である。
１……プリント配線板、２，２′……電気部品
、３，３′……足、４……部品取付用の孔。
FIG. 1 is a rear perspective view showing essential parts of a printed wiring board according to an embodiment of the present invention, FIGS. 2 and 3 are perspective views showing different examples of electrical components to be attached to the same printed wiring board, and FIG. 4 and FIG. 5 are diagrams showing examples of different shapes of holes in the same printed wiring board. 1... Printed wiring board, 2, 2'... Electrical components, 3, 3'... Legs, 4... Holes for mounting parts.
Claims (1)
取付用の孔に挿入して半田付けにより取付けるプ
リント配線板において、 上記電気部品の各足が挿入される部品取付用の
孔を一連の孔として形成したことを特徴とするプ
リント配線板。[Scope of claim for utility model registration] A printed wiring board in which each leg of an electrical component having multiple legs is inserted into a component mounting hole and attached by soldering, the component into which each leg of the electrical component is inserted. A printed wiring board characterized in that mounting holes are formed as a series of holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8640088U JPH028168U (en) | 1988-06-28 | 1988-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8640088U JPH028168U (en) | 1988-06-28 | 1988-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028168U true JPH028168U (en) | 1990-01-19 |
Family
ID=31311038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8640088U Pending JPH028168U (en) | 1988-06-28 | 1988-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028168U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013075393A (en) * | 2011-09-30 | 2013-04-25 | Toshiba Hokuto Electronics Corp | Thermal print head |
-
1988
- 1988-06-28 JP JP8640088U patent/JPH028168U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013075393A (en) * | 2011-09-30 | 2013-04-25 | Toshiba Hokuto Electronics Corp | Thermal print head |