CN201251150Y

CN201251150Y - Heat radiation method and a device therefor for a large power LED illuminating lamp

Info

Publication number: CN201251150Y
Application number: CNU2007200617238U
Authority: CN
Inventors: 陈炳武
Original assignee: Individual
Current assignee: Individual
Priority date: 2007-12-18
Filing date: 2007-12-18
Publication date: 2009-06-03
Anticipated expiration: 2017-12-18

Abstract

The utility model belongs to the technical field of the LED illuminating lamp, and in particular relates to a heat radiation method and a a device therefor for a large power LED illuminating lamp, which is characterized in adopting a method for refrigerating and cooling down a chip part area by refrigerating agent; a closed pipeline is arranged inside the heat radiation device, and the refrigerating agent with appropriate quantity is filled into the pipeline, and a large power LED is close to the closed end of the pipeline and is arranged on the heat radiation device; when the temperature of the chip part is higher than the boiling temperature of the refrigerating agent, the refrigerating agent is evaporated, so that the heat ascends to the upper end of the pipeline; after the heat is transferred to the wall of the pipeline, the heat is condensed to be liquid drop and descends to the bottom part; after absorbing the heat, the heat is recycled, so that the temperature at the bottom of the refrigerating pipeline is kept low, and at the same time, the temperature of the chip part is prevented from increasing, thereby delaying the light decay of the chip, and improving the valid working service life of the LED; at the same time, the structure of the lamp can be simplified, the power can be relatively improved, thereby having favorable social benefit and economic benefit.

Description

The heat dissipating method of high-power LED illuminating lamp and device

Technical field

The utility model relates to lighting device, is specifically related to the LED lighting technical field.

Background technology

Existing high-power LED illuminating lamp is on the heat dissipation problem of handling LED, the conventional heat radiating fin structure design of many employings, this is perhaps enough for 3 watts of light fixtures below the power, but the light fixture of power just seems that heat dispersion is very poor more than 5 watts, hindered light fixture to more powerful development, trace it to its cause and be, the heat that conventional heat radiation relies on the thermal conducting function of metal shell that led chip is produced is delivered in the outer air of lamp, but this heat transfer rate is limited, when the power of led chip is above greater than 5W, the heat that produces can not in time be delivered in the environment and go, so gathering of heat makes the temperature of chip more and more higher, up to surpassing the maximum temperature that chip can bear, consequence is well imagined, do not burnt out, quickened the light decay process of LED exactly, will be shortened the useful working life of LED light fixture greatly.

Goal of the invention

The purpose of this utility model is exactly the conventional heat dissipating method of Gonna breakthrough, with the heat dissipation problem that a kind of new light fixture heat dissipating method theory and new structural design are handled high-powered LED lamp, reach and improve lamp life and promote light fixture to the purpose of the application direction development of great power LED more.

Summary of the invention

The technical solution of the utility model is: utilize refrigerant liquid that the method for refrigeration cooling and supporting with it heat abstractor design are strengthened in the die sites zone, realize the purpose of this utility model.Its operation principle is, when the heat of led chip generation makes its temperature be elevated to the above temperature of refrigerant boiling point, refrigerant becomes steam with explosive evaporation, steam will be taken away near the heat the led chip and be transmitted to fast on the fin away from chip, so just can not make heat accumulation near chip, the method of transmitting heat with refrigerant is different fully with conventional heat dissipating method character, conventional heat radiation relies on the heat transfer performance of metal shell, the heat that makes the led chip generation is by the outer surface that is delivered to shell on the chip gradually, this heat transmission has long process, and meeting formation temperature gradient, promptly temperature reduces gradually on the path from the chip to the shell, causing near the heat of chip seriously to gather causes chip temperature to raise, refrigerant is climbed to the upper end of coolant tubes near the evaporation chip, liquid backflow bottom will be condensed into behind the heat transferred tube wall, evaporation again after the heat absorption, so constantly circulation, constantly take away the heat of die sites, therefore refrigerant heat conduction and heat radiation method of the present utility model is better than conventional heat conducting heat dissipating method.The design of heat abstractor then will be adopted the structural design that adapts according to the use occasion of light fixture and the design feature of light fixture itself, its total feature structure is, closed conduct is set in heat abstractor, inject an amount of refrigerant liquid in the pipeline, great power LED is mounted on the heat abstractor near the blind end of this pipeline.Refrigerant be boiling point between-50 ℃ to 120 ℃ simple substance liquid or the mixing material of multiple liquid substance, concrete preparation will be determined according to the requirement of light fixture.

Technique effect

High-powered LED lamp adopts the utility model heat dissipating method design heat abstractor, not only can improve the heat conductivility and the heat dispersion of heat abstractor, and the light fixture size of high-powered LED lamp is dwindled, and prolong service life.

Description of drawings

Fig. 1 is the structural representation of one of the utility model embodiment;

Fig. 2 is two the structural representation of the utility model embodiment;

Fig. 3 is three the structural representation of the utility model embodiment;

Fig. 4 is three the profile of embodiment;

Fig. 5 is four the structural representation of the utility model embodiment;

Fig. 6 is four the vertical view of embodiment;

Fig. 7 is the cross-sectional plan view of four expansion structures of embodiment;

The specific embodiment

Accompanying drawing 1 is a kind of embodiment scheme, can be used on the LED light fixture of glass lamp one class, illustrate lamp holder 1 among the figure, power module 2, lamp housing 3, the Lower Half of lamp is the heat abstractor 7 that integral die-cast becomes, form by the preferred especially aluminum material die casting of metal material, the reverse side design that the plane of LED8 is installed has the thermal column 4 and the radiating fin 6 of some quantity, the center of thermal column 4 is a pipeline 5, be packaged with an amount of refrigerant liquid 9 in the pipeline 5, because great power LED is mounted on the heat abstractor near the blind end of pipeline, the heat that chip produces will pass to refrigerant liquid with very short thermally conductive pathways, when temperature rises to the refrigerant boiling temperature, part refrigerant will be vaporized, as everyone knows, to take away the heat of duct bottom end during vaporizing liquid, that is to say can be to pipe end refrigeration, this temperature that has just limited die sites continues to rise, refrigerant steam passes to heat the tube wall of conduit upper fast, then passing to the lamp outer air dissipates heat, if there is not this effect of refrigerant, heat dissipating method heat radiation routinely, then heat will from the close-by examples to those far off slowly transmit along thermally conductive pathways, the heat that certainly will cause the chip place can not in time pass and form heat accumulation, cause chip temperature to raise, chip is in work under the high temperature for a long time, will speed up the light decay process, shorten the useful working life of LED, therefore manage to reduce as far as possible the temperature of die sites, always favourable to the useful working life that improves LED.

Accompanying drawing 2 is second kind of embodiment scheme, applicable to the light fixture of making forms such as street lamp, strip wall hanging lamp, lamp affixed to the ceiling, its advantage is to make simply, heat abstractor and lamp housing unite two into one and make by the aluminium extrusion process is disposable, has a pipeline 11 at least on the diagram heat abstractor 10, when pipe ends is stopped up sealing, inject an amount of refrigerant liquid 9 in the pipeline, high-power LED luminescent part 8 mounts near the blind end of pipeline.Operation principle such as preceding repeats no more.

Accompanying drawing 3, Fig. 4 are the third embodiment scheme schematic diagrames of the utility model heat sink arrangement, heat abstractor is made of metal coolant tubes 12 and radiating fin 13, be sealed with an amount of refrigerant liquid 9 in the pipeline, the body of this heat abstractor can be made by metal extrusion process and extrusion process, and fin shape and quantity can design arbitrarily according to the needs of light fixture.

Fig. 5, Fig. 6, Fig. 7 are the 4th kind of embodiment scheme schematic diagrames of the utility model heat abstractor, heat abstractor is made of metal coolant tubes 14 and some heat radiation plates 15, the heat radiation plate is stacked on the metal coolant tubes external diameter at regular intervals, be sealed with an amount of refrigerant liquid 9 in the pipeline, the metal coolant tubes can have many and be contained in the identical heat radiation plate, shown in the vertical view of Fig. 7.

Claims

1, a kind of heat abstractor of high-power LED illuminating lamp, the heat abstractor that comprises hardware, it is characterized in that: closed conduct is set in heat abstractor, injects an amount of refrigerant liquid in the pipeline, great power LED is mounted on the heat abstractor near the blind end of this pipeline.

2, the heat abstractor of high-power LED illuminating lamp according to claim 1, it is characterized in that: heat abstractor is formed by the preferred especially aluminum material die casting of metal material, its reverse side design that plane of LED is installed has some thermal columns or radiating fin, the center of thermal column is a pipeline, is packaged with an amount of refrigerant liquid in the pipe.

3, the heat abstractor of high-power LED illuminating lamp according to claim 1 is characterized in that: heat abstractor is made by the aluminium extrusion process, wherein has a pipeline at least, when pipe ends is stopped up sealing, injects an amount of refrigerant liquid in the pipeline.

4, the heat abstractor of high-power LED illuminating lamp according to claim 1 is characterized in that: heat abstractor is made of metal cooling tube and radiating fin, is sealed with an amount of refrigerant liquid in the pipeline.

5, the heat abstractor of high-power LED illuminating lamp according to claim 1, it is characterized in that: heat abstractor is made of metal cooling tube and some heat radiation plates, the heat radiation plate is stacked on the metal cooling external diameter of pipe at regular intervals, metal cooling tube can have one to several, is sealed with an amount of refrigerant liquid in the pipeline.

6, the heat abstractor of high-power LED illuminating lamp according to claim 1 is characterized in that: said cold-producing medium be boiling point between-50 ℃ to 120 ℃ simple substance liquid or the mixing material of multiple liquid substance.