CN114745925B - Micro-groove group heat dissipation device with porous dielectric material and heat dissipation method - Google Patents
Micro-groove group heat dissipation device with porous dielectric material and heat dissipation method Download PDFInfo
- Publication number
- CN114745925B CN114745925B CN202210425571.4A CN202210425571A CN114745925B CN 114745925 B CN114745925 B CN 114745925B CN 202210425571 A CN202210425571 A CN 202210425571A CN 114745925 B CN114745925 B CN 114745925B
- Authority
- CN
- China
- Prior art keywords
- micro
- heat sink
- groove group
- main body
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000003989 dielectric material Substances 0.000 title claims description 18
- 239000000463 material Substances 0.000 claims abstract description 38
- 230000008859 change Effects 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000006260 foam Substances 0.000 claims description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 241000208818 Helianthus Species 0.000 claims description 3
- 235000003222 Helianthus annuus Nutrition 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 239000012153 distilled water Substances 0.000 claims description 3
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 3
- 238000004334 fluoridation Methods 0.000 claims description 2
- 230000020169 heat generation Effects 0.000 claims description 2
- 239000011148 porous material Substances 0.000 description 11
- 230000008901 benefit Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 230000005499 meniscus Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a micro-groove group heat dissipation device with porous medium material and a heat dissipation method, wherein the device comprises: the main body radiator is internally provided with a vacuum cavity filled with a phase change working medium; a fin group disposed outside the main body radiator, including a fin radiator; the micro-groove group heat sink is arranged at the bottom of the main body radiator and is connected with the bottom of the vacuum cavity; the phase change working medium is in contact with the micro-channel on the micro-channel group heat sink through the arrangement of the porous medium material, and can adapt to the rotation angle in any direction under a certain liquid filling rate, so that the problem that the micro-channel group heat sink in the traditional bottom-emitting LED micro-channel group heat sink cannot be in contact with the liquid replenishing of the phase change working medium in the heat sink under a certain inclination and rotation angle is solved.
Description
Technical Field
The invention belongs to the technical field of heat dissipation and cooling, and particularly relates to a micro-groove group heat dissipation device with a porous medium material and a heat dissipation method.
Background
Microscale heat transfer technology is currently the leading edge and hotspot in the field of international academy of heat transfer. The phase change cooling technology, the micro heat pipe technology and the micro-groove group evaporation type heat sink technology of microelectronic and optoelectronic devices are micro-cooling system technologies which are different from the existing cooling technologies. The micro-groove group evaporation type heat sink structure can enable liquid to flow along the micro-groove by utilizing capillary force, and meanwhile, a thin liquid film with high-strength evaporation capacity can be formed in an expansion meniscus area near a solid-liquid-gas three-phase contact line, and the development of the technology at present has no serious influence of critical heat flow restriction, so that the application prospect and economic benefit in many engineering technical fields are very good.
The porous dielectric material is a metal porous material and a nonmetal porous material. The metal porous material is widely applied to the field of basic heat transfer due to the advantages of light weight, large specific surface area, good heat conductivity, controllable porosity and the like. The foam metal is a novel ultra-light multifunctional metal porous material containing foam pores, and has the advantages of controllable porosity, stable structure, high temperature resistance and the like. Related researches show that the foam metal can greatly improve the nucleate boiling nucleation rate, increase the fluid disturbance and simultaneously increase the heat exchange area when applied to the mobile boiling phase transformation heat, thereby greatly improving the heat exchange efficiency. The nonmetallic porous materials include ceramic porous materials, carbon foam porous materials, and the like. The porous nonmetallic material has the advantages of low price, long service cycle, light weight, oxidation resistance and the like.
At present, when the traditional bottom-emitting LED micro-groove group radiator works normally, certain inclination and rotation angles are formed according to actual demands, and due to the directivity of the micro-groove group heat sink channels, the phase-change working medium cannot be contacted with the channels under certain inclination and rotation angles. If the micro-groove group heat sink cannot be sufficiently supplemented with the phase change working medium, the radiator will be locally dry-burned, so that the LED light source is burnt. The existing solution is to increase the liquid filling rate and increase the chance that the heat sink channels of the micro-groove group contact the phase change working medium, but the higher liquid filling rate can cause the increase of heat transfer resistance and affect the working performance of the radiator.
Disclosure of Invention
The purpose is as follows: in order to overcome the defects in the prior art, the invention provides a method for solving the problem that a micro-groove group heat sink in the traditional bottom-emission LED micro-groove group heat sink cannot contact with a phase change working medium in the heat sink under the condition of a certain inclination and rotation angle by utilizing a porous medium material so as to improve the adaptability of the micro-groove group heat sink to the inclination and rotation angle in practical application.
The technical scheme is as follows: to achieve the above object, in one aspect, there is provided a micro-groove group heat dissipating device having a porous dielectric material, comprising:
the main body radiator is internally provided with a vacuum cavity filled with a phase change working medium;
A fin group disposed outside the main body radiator, including a fin radiator;
the micro-groove group heat sink is arranged at the bottom of the main body radiator and is connected with the bottom of the vacuum cavity;
The porous medium material is fixedly arranged between the micro-groove group heat sink and the main body radiator, and the phase change working medium is kept in contact with micro-grooves on the micro-groove group heat sink through the porous medium material.
As a preferred embodiment of the present invention: the porous medium material is ceramic or foam metal.
As a preferred embodiment of the present invention: the micro-groove group heat sink is a different-diameter concentric cylinder, and the radius of the upper cylinder is smaller than that of the lower cylinder; the porous medium material is a torus, the inner diameter is the same as the radius of the upper cylinder of the micro-groove group heat sink, the outer diameter is the same as the radius of the lower cylinder of the micro-groove group heat sink, and the height is the same as the height of the upper cylinder of the micro-groove group heat sink.
As a preferred embodiment of the present invention: the upper surface of the upper cylinder of the micro-groove group heat sink is provided with uniformly distributed micro-grooves, and the cross section of each micro-groove is one of rectangle, triangle and trapezoid.
As a preferred embodiment of the present invention: the main body radiator is a sunflower radiator.
As a preferred embodiment of the present invention: the fin radiator in the fin group comprises 4 rough fins and N fine fins, wherein N is greater than or equal to 16, the 4 rough fins are respectively and centrally symmetrical and mutually perpendicular, the periphery of the radiator is divided into 4 areas in equal proportion, the fine fins are uniformly distributed in the four areas, and the number of the fine fins in each area is the same.
As a preferred embodiment of the present invention: the main body radiator and the rib group are integrally formed, or the rib group is connected to the main body radiator.
As a preferred embodiment of the present invention: the phase change working medium comprises: distilled water, electronic fluoridation liquid, deionized water, ethanol, methanol and liquid metal.
On the other hand, the heat dissipation method of the micro-groove group heat dissipation device with the porous medium material is provided, the heat generation amount of a heat source is transferred to the bottom surface of the micro-groove group heat sink in a heat transfer mode of heat conduction through heat conduction silicone grease or heat conduction silica gel, and due to the existence of the porous medium material, under the condition of a certain inclination and rotation angle, a phase change working medium in the main body heat sink is contacted with the micro-groove group heat sink through the porous medium material, and the phase change working medium enters the micro-groove to exchange heat under the driving of capillary force of the micro-groove; after the phase change working medium liquid absorbs heat and evaporates into working medium steam, the working medium steam is condensed on the inner wall surface of the main body radiator, the heat is transferred to the side wall of the main body radiator, the heat is transferred to the fin group through the side wall of the main body radiator again through heat conduction, and finally the fin group and the external environment dissipate the heat to the external environment through a natural convection heat transfer mode.
Compared with the prior art, the invention has the following beneficial effects:
(1) According to the micro-groove group radiating device and the radiating method thereof, the porous medium material is selected from ceramic porous material or foam metal, the inclination and the rotation angle of the radiator can be adjusted according to requirements, the rotation angle in any direction with the inclination angle ranging from-90 degrees to 90 degrees can be adapted under a certain liquid filling rate, the micro-groove group heat sink is ensured to be in continuous contact with the phase change working medium, and the situation of local dry burning of the micro-groove group heat sink is avoided.
(2) The phase change working medium enters the micro-groove group heat sink from the edge of the channel by using the porous medium material, so that the phase change working medium can more uniformly contact and dissipate heat with the micro-groove group heat sink in a moderate liquid filling rate, and the liquid filling rate is prevented from being improved in order to improve the opportunity that the micro-groove group heat sink channel contacts the phase change working medium, thereby increasing the heat transfer resistance and affecting the working performance of the radiator.
Drawings
Fig. 1 is an overall schematic diagram of a micro-groove group heat dissipating device with porous dielectric material according to the present embodiment;
FIG. 2 is a schematic view of a porous dielectric material according to the present embodiment;
FIG. 3 is a schematic diagram of a micro-groove group heat sink according to the present embodiment;
FIG. 4 is a cross-sectional view of a micro-groove group heat sink with porous dielectric material according to the present embodiment;
fig. 5 is a schematic partial view of the present embodiment.
In the figure, 1 is a main body radiator; 2 is a fin group; 3 is a porous medium material; 4 is a micro-groove group heat sink; and 5 is a vacuum cavity.
Detailed Description
The present application is further illustrated in the accompanying drawings and detailed description which are to be understood as being merely illustrative of the application and not limiting of its scope, and various equivalent modifications to the application will fall within the scope of the application as defined in the appended claims after reading the application.
The invention provides a micro-groove group radiator with a porous medium material 3, which comprises the following components: the main body radiator 1, the rib group 2, the porous medium material 3 and the micro-groove group heat sink 4. Wherein, the main body radiator 1 is internally provided with a vacuum cavity 5, and the vacuum cavity 5 is filled with a phase change working medium. The fin group 2 is provided outside the main body radiator 1. And the micro-groove group heat sink 4 is arranged at the bottom of the main body radiator 1 and is connected with the bottom of the vacuum cavity 5. The porous dielectric material 3 is ceramic or foam metal and is arranged between the micro-groove group heat sink 4 and the main body radiator 1.
Example 1
In the micro-groove group radiator with the porous medium material of the embodiment, the vacuum cavity 5 is arranged in the main body radiator 1 and is filled with a certain amount of phase change working medium. The fin group 2 is installed on the main body radiator 1 by a plurality of fin monomers at equal intervals. The porous medium material 3 is made of ceramic porous material or foam metal and is tightly attached to the periphery of the micro-groove group heat sink 4. And the micro-groove group heat sink 4 is arranged at the bottom of the main body radiator 1 and is connected with the bottom of the vacuum cavity 5. The heat source is tightly fixed on the bottom surface of the micro-groove group heat sink 4 through heat interface materials such as heat conduction silicone grease or heat conduction silica gel pad.
As shown in FIG. 1, the main body radiator 1 is a sunflower radiator with an outer diameter of 20-200 mm and a height of 20-200 mm, and is internally provided with a vacuum cavity 5, and is internally provided with a micro-groove group heat sink 4 for enhancing heat exchange and a phase change working medium. The phase change working medium is at least one of distilled water, electronic fluorinated liquid, deionized water, ethanol, methanol, liquid metal and the like which have low boiling points, are nontoxic, have stable chemical properties and are not easy to react with the inner wall of the main radiator 1. The fin group 2 is composed of a plurality of equally spaced fin monomers and is arranged on the main body radiator 1. The main body radiator 1 and the fin group 2 are made of metal such as aluminum, copper or nonmetal such as ceramics and plastics, and can be processed into an integrated structure by extrusion or forging, or can be fixed on the main body radiator 1 by welding, bonding, expansion joint or other mechanical modes. Through the setting of vacuum cavity 5, can reduce radiator weight by a wide margin, micro-groove group heat sink 4 and phase change working medium can improve the heat dispersion of radiator effectively, and main part radiator 1 sets up the fin group of installation and makes outside heat dispersion obtain improving, more does benefit to the heat and gives off to the external world.
Example 2
As shown in fig. 2, the micro-groove group radiator with the porous medium material of the present embodiment is further improved on the basis of embodiment 1, the shape of the porous medium material 3 is a torus, the size is 15-190 mm in inner diameter, 20-200 mm in outer diameter, and 1-5 mm in height, and the material is two kinds of ceramic or foam metal, which are used for absorbing the phase change working medium. The ceramic porous material has the advantages of low price, long service cycle, light weight, oxidation resistance and the like; the foam metal has the advantages of controllable porosity, stable structure, high temperature resistance and the like. Both materials can be in close contact with the micro-groove group heat sink 4.
Example 3
As shown in fig. 3 to 5, a micro-groove group radiator with a porous dielectric material of the present embodiment is further improved on the basis of embodiment 2 in order to bring the porous dielectric material 3 into close contact with the micro-groove group heat sink 4. The micro-groove group heat sink 4 is designed into a different-diameter concentric cylinder, and the radius of the upper cylinder is smaller than that of the lower cylinder. The outer diameter of the upper cylinder is 15-190 mm, the height of the upper cylinder is 1-5mm, the outer diameter of the lower cylinder is 20-200 mm, the height of the lower cylinder is 1-15 mm, and the upper surface of the upper cylinder is provided with evenly distributed micro-channels, wherein N is more than or equal to 10, the arrangement density of the micro-channels is more than 2 pieces/cm, the cross section of each micro-channel is rectangular, triangular, trapezoidal or other irregular patterns, and the size is as follows: the groove width is 20-5000 mu m, the groove depth is 20-5000 mu m, and the groove spacing is 20-5000 mu m. The combination of porous dielectric material 3 and micro-groove cluster heat sink 4 is secured to the bottom of body heat spreader 1 by welding, bonding, expansion or other mechanical means. The largest area ratio of the porous dielectric material 3 to the micro-groove group heat sink 4 is 7:9.
Through the collocation of the structural design of the porous medium material 3 and the micro-groove group heat sink 4, the application range of the radiator is improved, the radiator can adapt to the inclination angle of-90 degrees under a certain liquid filling rate, and the rotation angle in any direction ensures that the micro-groove group heat sink is continuously contacted with the phase change working medium, and the situation of local dry burning of the micro-groove group heat sink is avoided.
The heat radiation method of the micro-groove group heat radiation device with the porous medium material is adopted, and the heat source heat productivity is transferred to the bottom surface of the micro-groove group heat sink 4 through heat conduction by heat conduction silicone grease or heat conduction silica gel. Due to the existence of the porous medium material 3, under the condition of a certain inclination and rotation angle, the phase-change working medium in the main radiator 1 can contact with the micro-groove group heat sink 4 through the porous medium material 3, and the phase-change working medium enters the micro-groove to exchange heat under the driving of capillary force of the micro-groove. In an ideal state, a meniscus shape is formed in the micro-groove, and the phase change working medium has strong evaporation heat exchange efficiency in a thin liquid film area of the meniscus, so that high heat flux density heat exchange under low temperature rise can be realized. After the phase change working medium liquid absorbs heat and evaporates into working medium steam, the working medium steam is condensed on the inner wall surface of the main body radiator 1, and the heat is transferred to the side wall of the main body radiator 1. The heat is transferred to the fin group 2 again through the side wall of the main body radiator 1 in a heat conduction mode of heat conduction, and finally the fin group 2 dissipates the heat to the external environment through a heat transfer mode of natural convection with the external environment.
The foregoing is only a preferred embodiment of the invention, it being noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present invention, and such modifications and adaptations are intended to be comprehended within the scope of the invention.
Claims (9)
1. A micro-slot group heat sink with porous dielectric material, comprising:
the main body radiator is internally provided with a vacuum cavity filled with a phase change working medium;
A fin group disposed outside the main body radiator, including a fin radiator;
the micro-groove group heat sink is arranged at the bottom of the main body radiator and is connected with the bottom of the vacuum cavity;
characterized by further comprising:
The porous medium material is fixedly arranged between the micro-groove group heat sink and the main body radiator, and the porous medium material enables the phase change working medium to be in contact with micro-grooves on the micro-groove group heat sink;
the micro-groove group heat sink is a different-diameter concentric cylinder, and the radius of the upper cylinder is smaller than that of the lower cylinder;
The porous medium material is a torus, the inner diameter of the torus is the same as the radius of the upper cylinder of the micro-groove group heat sink, the outer diameter of the torus is the same as the radius of the lower cylinder of the micro-groove group heat sink, and the height of the torus is the same as the height of the upper cylinder of the micro-groove group heat sink.
2. The micro-slot group heat sink with porous dielectric material of claim 1, wherein the porous dielectric material is ceramic or foam metal.
3. The micro-slot group heat sink with porous dielectric material of claim 2, wherein the maximum ratio of porous dielectric material to micro-slot group heat sink area is 7:9.
4. A micro-groove group heat sink with porous medium material as claimed in claim 3, wherein the upper surface of the upper cylinder of the micro-groove group heat sink is provided with uniformly distributed micro-grooves, and the cross section of the micro-grooves is one of rectangle, triangle and trapezoid.
5. The micro-groove group heat sink with porous dielectric material of claim 1, wherein the main body heat sink is a sunflower heat sink.
6. The micro-groove group heat dissipating device with porous medium material according to claim 5, wherein the fin heat sink in the fin group comprises 4 fins and N fins, N is greater than or equal to 16, the 4 fins are respectively symmetrical in center and perpendicular to each other, the periphery of the heat sink is divided into 4 areas in equal proportion, the fins are uniformly distributed in the four areas, and the number of the fins in each area is the same.
7. The micro-groove group heat sink with porous medium material according to claim 6, wherein the main body heat sink is integrally formed with the fin group or the fin group is connected to the main body heat sink.
8. The micro-groove group heat dissipating device with porous medium material of claim 1, wherein the phase change working medium comprises: distilled water, electronic fluoridation liquid, deionized water, ethanol, methanol and liquid metal.
9. The heat dissipation method of the micro-groove group heat dissipation device with the porous medium material is characterized in that the heat generation amount of a heat source is transferred to the bottom surface of the micro-groove group heat sink in a heat conduction mode through heat conduction silicone grease or heat conduction silica gel, and due to the existence of the porous medium material, under the condition of a certain inclination and rotation angle, a phase change working medium in the main body heat sink is contacted with the micro-groove group heat sink through the porous medium material, and enters the micro-groove to exchange heat under the driving of capillary force of the micro-groove; after the phase change working medium liquid absorbs heat and evaporates into working medium steam, the working medium steam is condensed on the inner wall surface of the main body radiator, the heat is transferred to the side wall of the main body radiator, the heat is transferred to the fin group through the side wall of the main body radiator again through heat conduction, and finally the fin group and the external environment dissipate the heat to the external environment through a natural convection heat transfer mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210425571.4A CN114745925B (en) | 2022-04-22 | 2022-04-22 | Micro-groove group heat dissipation device with porous dielectric material and heat dissipation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210425571.4A CN114745925B (en) | 2022-04-22 | 2022-04-22 | Micro-groove group heat dissipation device with porous dielectric material and heat dissipation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114745925A CN114745925A (en) | 2022-07-12 |
| CN114745925B true CN114745925B (en) | 2024-05-28 |
Family
ID=82283342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210425571.4A Active CN114745925B (en) | 2022-04-22 | 2022-04-22 | Micro-groove group heat dissipation device with porous dielectric material and heat dissipation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114745925B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102235615A (en) * | 2010-04-21 | 2011-11-09 | 中国科学院工程热物理研究所 | Cavity-type light emitting diode lamp |
| CN108133918A (en) * | 2018-02-11 | 2018-06-08 | 中国科学院工程热物理研究所 | Micro capillary groove evaporator |
| CN113915594A (en) * | 2021-09-16 | 2022-01-11 | 中国科学院工程热物理研究所 | Radiator with double-phase change cavity |
-
2022
- 2022-04-22 CN CN202210425571.4A patent/CN114745925B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102235615A (en) * | 2010-04-21 | 2011-11-09 | 中国科学院工程热物理研究所 | Cavity-type light emitting diode lamp |
| CN108133918A (en) * | 2018-02-11 | 2018-06-08 | 中国科学院工程热物理研究所 | Micro capillary groove evaporator |
| CN113915594A (en) * | 2021-09-16 | 2022-01-11 | 中国科学院工程热物理研究所 | Radiator with double-phase change cavity |
Non-Patent Citations (4)
| Title |
|---|
| Experimental Investigation on Flow and Thermal Characteristics of a Micro Phase-Change Cooling System With a Microgroove Evaporator;Xuegong Hu;《International Journal of Thermal Sciences》;20071130;全文 * |
| 微槽群蒸发器在电子芯片冷却方面的应用;胡学功, 颜晓虹, 赵耀华;化工学报;20050330(第03期);全文 * |
| 竖直毛细微槽群热沉中蒸发液体的干涸特性;胡学功;唐大伟;;化工学报;20070328(第03期);全文 * |
| 超亲水微纳复合结构表面热沉强化润湿与传热实验;胡学功;《化工进展》;20190605;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114745925A (en) | 2022-07-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2022033289A1 (en) | Flat plate heat pipe and manufacturing method therefor, and heat exchanger | |
| US8737071B2 (en) | Heat dissipation device | |
| CN101510533B (en) | Novel microelectronic device radiator | |
| KR100495699B1 (en) | Flat plate heat transferring apparatus and manufacturing method thereof | |
| CN101515572B (en) | Novel LED and a high-power radiator of a radiating element | |
| CN113028869B (en) | Loop thermosiphon fin | |
| CN104676545A (en) | Heat absorbing device, heat radiating device and LED (light-emitting diode) mining lamp radiating system | |
| WO2023010836A1 (en) | Heat dissipation module and electronic device | |
| CN111246706A (en) | Double-sided heat dissipation device | |
| CN211012603U (en) | Ultrathin flexible flat heat pipe | |
| CN114899160A (en) | 3D temperature-uniforming plate and radiator with same | |
| CN113446883B (en) | Double-fluid loop staggered wave type micro-channel radiator based on elastic turbulence | |
| CN114745925B (en) | Micro-groove group heat dissipation device with porous dielectric material and heat dissipation method | |
| CN204513305U (en) | Heat sink, heat abstractor and LED bay light cooling system | |
| CN2720631Y (en) | Fin heat-tube radiator | |
| CN105352351A (en) | Improved vapor chamber structure | |
| CN1933713A (en) | Radiating module and heat tube thereof | |
| US20110290451A1 (en) | Heat cooler | |
| KR101447129B1 (en) | Cooling Unit | |
| CN210900093U (en) | Fin radiator | |
| CN100433960C (en) | Liquid-cooled column-shaped heat pipe radiator | |
| CN210470132U (en) | Direct-contact low-thermal-resistance heat pipe radiator for heating device | |
| CN209845583U (en) | Double-sided heat dissipation device and inverter | |
| CN112888264A (en) | Double-deck microchannel heat abstractor based on gas-liquid separation | |
| CN207394786U (en) | A kind of radiator of great power LED module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |