CN205680674U - High power electronic chip array heat radiation module - Google Patents
High power electronic chip array heat radiation module Download PDFInfo
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- CN205680674U CN205680674U CN201620508110.3U CN201620508110U CN205680674U CN 205680674 U CN205680674 U CN 205680674U CN 201620508110 U CN201620508110 U CN 201620508110U CN 205680674 U CN205680674 U CN 205680674U
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Abstract
The utility model discloses a kind of high power electronic chip array heat radiation module, including heat sink cavity, the base plate of packaging heat sink cavity bottom, the cover plate of packaging heat sink cavity top, heat pipe array and radiator fan, described heat pipe array is connected through cover plate is fixing with base plate in packaging heat sink cavity, described radiator fan is arranged on above heat pipe array, fills the evaporator section by heat pipe array bottom and bury phase-change material therein underground in the closed chamber that base plate, heat sink cavity and cover plate are constituted；The condensation segment on this heat pipe array top is exposed in atmosphere.The utility model significantly improves the thermal response speed of described bottom phase-change material fusing decalescence and sustainable heat-sinking capability；Heat pipe outer wall is coupled with bionical fin and effectively extends heat exchange area, enhances fusing and the solidification heat exchange of phase-change material；The powder porous liquid-sucking core of axial slot formula preferably achieves mating of capillary pressure and permeability, reduces the backflow resistance of hot intraductal working medium, thus enhances the heat transfer property of heat pipe self.
Description
Technical field
The utility model belongs to semiconductor devices cooling device technical field, particularly a kind of high power electronic chip array
Heat radiation module.
Background technology
The miniaturization of electronic equipment and components and parts, integrated and intelligent so that the encapsulation of unit volume electronic chip is close
Degree and operating frequency improve constantly, thus cause the power consumption heat flow density of electronic chip to be increased dramatically, and join with rib extended surface
Close the traditional heat-dissipating technology that forced-convection heat transfer is representative and cannot meet the growing radiating requirements of electronic chip.Especially
It is that it is array-like high-density packages that the successful Application of information technology and microelectric technique generally requires high power electronic chip,
This just the research and development to high power, big energy electron heat dissipation technology propose bigger challenge.
Existing electronic radiation (cooling) technology specifically includes that and is directly immersed in formula cooling technology, thermoelectric-cooled technology, active
Micro-channel heat dissipation technology, Jet Cooling, heat pipe heat radiation technology, solid-liquid phase change cooling technology etc..Wherein, heat pipe heat radiation skill
Art relies on inside heat pipe fluid working substance latent heat of phase change-sensible heat coupled transportation to realize heat high efficiency of transmission, has that thermal conductivity is good, environment
The plurality of advantages such as adaptability is excellent, isothermal is excellent, and then obtained relatively broad application.But, heat pipe self uniqueness
Operation principle and limited working medium charging amount make it there is a series of heat transport limitation when high-power heat-dissipation load operation, cause
The limit heat dissipation capacity of heat pipe heat radiation technology is restricted, and is applicable to the big work(such as CPU as patent CN101990389A discloses one
The heat radiation module of rate electronic cooling, it utilizes a capillary heat pipe that electronic component heat production is transported to fin extension in time
Heat exchange surface the forced convertion being driven by radiator fan are dissipated and release, but when the load that dispels the heat is excessive, heat pipe capillary core is provided
Capillary suction force the backflow of enough condensate liquids cannot be driven to supplement evaporator section working medium, form capillary limitation, cause heat radiation module
Operational failure.Patent CN101900313A discloses a kind of annular steam cavity heat pipe heat radiation module for high-powered LED lamp, its
Principle is to utilize central annular vapor chamber heat pipe by the heat production high efficiency of transmission of bottom high-powered LED lamp array of packages to top annular
Radiating fin dissipates to be released, but when too high heat radiation working under load, internal face can be refluxed by the steam of vapor chamber center high speed uplink
Condensate liquid forms strong flip Trim rolling action, causes the amount of refluxer can not meet the fluid infusion demand of evaporator section,
Form entrainment limit, cause evaporator section to dryout inefficacy.Outside heat extraction pipe heat dissipation technology, solid-liquid phase change cooling technology is because having cooling
Measure big, the storage advantages such as exothermic process isothermal is good, process is easy to control and receive much concern.But phase-change material thermal conductivity factor is generally inclined
Low and thermal response speed is slow, though having obtained in recent years a certain degree of optimizing and improving, but its sustainable cooling capacity is still subject to
Phase-change material encapsulates quantitative limitation, and thermal response speed startup stage its work also needs to be further improved, such as patent
CN104235800A discloses a kind of intermittent high-power LED phase-change attemperating unit, inhales when it utilizes solid-liquid phase change material to melt
The latent heat of phase change received realizes the cooling of high-power LED chip dot matrix, and it carrys out hardening constituent by arranging metal lattice skeleton
Become the heat conduction of material, but owing to phase-change material encapsulation amount is limited, it is also restrained for cool time that it melts heat absorption so that it is only applicable
High-power LED chip dot matrix in intermittent work.Patent CN104235801A discloses a kind of great power LED carrying heat pipe
Phase-change temperature control device, it coordinates Varying-thickness fin to improve phase transformation by way of extending heat exchange area by embedment high thermal conductivity heat pipe
The effective thermal conductivity of material and thermal response rates, but owing to heat pipe and Varying-thickness fin are wholly embedded among phase-change material, its
Rely solely on heat pipe startup stage work to realize with the thawing heat absorption of Varying-thickness fin heat-transfer couple phase-change material, thermal response speed
Limited, it is still difficult to meet quick heat radiating demand startup stage high power electronic chip operation.
Utility model content
The purpose of this utility model be to provide a kind of by heat conduction, convection current, phase transformation coupling formula achieve thermo-responsive fast,
The high power electronic chip array heat radiation module that the heat radiation limit is high, temperature control capacity is strong.
The technical solution realizing the utility model purpose is: a kind of high power electronic chip array heat radiation module, bag
Include heat sink cavity, the base plate of packaging heat sink cavity bottom, the cover plate of packaging heat sink cavity top, heat pipe array and radiator fan,
Described heat pipe array is connected through cover plate is fixing with base plate in packaging heat sink cavity, and described radiator fan is arranged on heat pipe array
Top, fills the evaporator section by heat pipe array bottom in the closed chamber that base plate, heat sink cavity and cover plate are constituted and buries underground therein
Phase-change material；The condensation segment on this heat pipe array top is exposed in atmosphere.
The utility model compared with prior art, its remarkable advantage: (1) effectively overcome phase-change material thermal conductivity factor low,
The slow-footed defect of thermal response, the heat pipe array that bottom evaporator section is embedded in phase-change material can rely on the high thermal conductivity of self to incite somebody to action
The heat production of bottom electronic chip array is quickly derived and is released scattered for heat by the Forced Air Convection of top condensation segment, significantly changes
It has been apt to the thermal response speed of described bottom phase-change material fusing decalescence and sustainable heat-sinking capability.(2) heat pipe outer wall coupling
There is bionical fin effectively to extend heat exchange area, optimize the heat conduction heat flux being assigned with between heat pipe array and phase-change material, enhance
The fusing of phase-change material and solidification heat exchange.(3) the fusing decalescence amount of bottom phase-change material is big, temperature-controllable is good, effectively
Improve the heat radiation limit and the temperature control ability of heat pipe array, and in phase-change material, the addition of high thermal conductivity nano particle makes phase transformation dive
Heat storage with release response speed faster, process evenly, be more beneficial for phase change temperature control.(4) what heat pipe inner wall was arranged is axial
The powder porous liquid-sucking core of groove-type preferably achieves mating of capillary pressure and permeability, reduces the backflow of hot intraductal working medium
Resistance, thus enhance the heat transfer property of heat pipe self.(5) the utility model structural reduction is compact, convenient for installation and maintenance, it is easy to
Combination extension.
Below in conjunction with the accompanying drawings the utility model is described in further detail.
Brief description
Fig. 1 is the outline drawing of the utility model high power electronic chip array heat radiation module.
Fig. 2 is the installation diagram of the utility model high power electronic chip array heat radiation module.
Fig. 3 is the schematic top plan view of the utility model high power electronic chip array heat radiation module.
Fig. 4 is the front elevational schematic of the utility model high power electronic chip array heat radiation module.
Fig. 5 is heat pipe structure schematic diagram in Fig. 2.
Fig. 6 is the A-A profile of Fig. 5.
Fig. 7 is axial slot formula powder porous liquid-sucking core formpiston schematic diagram.
Fig. 8 is the Making programme figure of the powder porous liquid-sucking core of axial slot formula.
Detailed description of the invention
In conjunction with Fig. 1 and Fig. 2, the utility model high power electronic chip array heat radiation module achieves heat conduction-convection current-phase transformation
Coupling, including the seal cover board at the 10th, packaging heat sink cavity 6 top of the base plate bottom heat sink cavity the 6th, packaging heat sink cavity 6 the 3rd, heat
Pipe array 5 and radiator fan 2, described heat pipe array 5 connects through seal cover board 3 is fixing with base plate 10 in packaging heat sink cavity 6
Connecing, described radiator fan 2 is arranged on above heat pipe array 5, in the closed chamber that base plate the 10th, heat sink cavity 6 and seal cover board 3 are constituted
Interior filling buries the evaporator section of heat pipe array 5 bottom underground phase-change material 9 therein；The condensation segment on this heat pipe array 5 top is exposed
In atmosphere.
Heat sink cavity 6 of the present utility model uses high thermal conductivity metal casting or is machined into, its ambient external wall
Being machined with many group radiated ribs 4 in order to increase area of dissipation, corner is respectively machined with the cylindrical support column 7 installing radiator fan 2:
When the electronic chip array 12 that the module that dispels the heat is applied to be encapsulated in base plate 10 back side dispels the heat, support column 7 is offered tapped blind hole, is supplied
Fastening bolt 1 is tightened radiator fan 2 above heat pipe array 5；When heat radiation module is applied to be welded on independent mainboard
Electronic chip array 12 when dispelling the heat, support column 7 offers through hole, for fastening bolt 1 pass through radiator fan 2 and support column 7 with
On mainboard, corresponding fixing threaded hole screws, and is fastened on base plate 10 on electronic chip array 12.Base plate 10 uses with heat sink cavity 6
Welding or splicing connect, and base plate 10 is machined with the groove 11 installing heat pipe array 5, and this groove 11 back side correspondence is machined with and electricity
The corresponding smooth thermal conductive contact face of sub-chip array 12.Described heat pipe array 5 one end is by welding, expanded joint or bolt connection etc.
Mode is vertically mounted in groove 11, and ensures to thermally contact well with groove 11, and thermal conductive contact face utilizes heat-conducting silicone grease and electronics
Chip array 12 realizes well thermally contacting.Being filled with phase-change material 9 in described heat sink cavity 6, its loading depends on being used
The coefficient of thermal expansion of phase-change material, latent heat of phase change and required heat radiation load, but less than the 95% of described heat sink cavity 6 cumulative volume,
With the volumetric expansion after consideration phase-change material fusing.Described heat sink cavity 6 top arranges seal cover board 3, and its top is machined with
The through slot 8 that heating tube array 5 matches, phase-change material 9 is filled after finishing, and seal cover board 3 is passed through heat pipe array 5 by phase transformation
Material 9 is encapsulated in heat sink cavity 6, between seal cover board 3 and heat sink cavity 6 upper limb and between through slot 8 and heat pipe array 5
Cementing or welding mode is all used to seal.
In conjunction with Fig. 3 and Fig. 4, the utility model heat pipe array 5 bottom is embedded in phase-change material 9 as evaporator section, buries underground
Length accounts for the 1/3 to 2/3 of heat pipe array total height, specifically can be adjusted flexibly according to required heat radiation load and work intermittent time.
The top of heat pipe array 5 is positioned on evaporator section as condensation segment, exposed in atmosphere.Every heat pipe in described heat pipe array 5
The liquid filled ratio of 13 is 30%～60%, and filled working medium can select according to tube wall metal compatibility and required heat radiation load, as
Water, ammonia, ethanol, methyl alcohol, R123 or acetone etc..So, in heat pipe 13 evaporator section working medium at external heat source (electronic chip array 12
The produced heat of work) effect lower phase transformation evaporation produces steam and rises to heat pipe condenser section, radiator fan 2 drive strong
Under the cooling effect of convection current processed, condensation segment working medium cools down and is condensed into liquid, and condensation water is under gravity and capillary suction force effect
It is back to evaporator section and complete a circulation.When electronic chip array 12 works, by working medium in heat pipe 13 constantly evaporate,
Condensing, the heat that electronic chip array 12 is produced is derived continuously rapidly, and will be big by the Forced Air Convection of condensation segment
Partial heat dissipates to be released, and phase-change material 9 also absorbs the heat generation phase transformation fusing that part derives simultaneously.This radiation processes effectively combines
Heat pipe self high-efficiency heat conduction, bottom evaporator section phase-change material latent heat of phase change heat exchange and top condensation segment Forced Air Convection heat exchange
Advantage: the fusing decalescence amount of bottom evaporator section phase-change material 9 is big, temperature-controllable is good, effectively improves heat pipe heat radiation
The heat radiation limit of module and temperature control ability；Meanwhile, the Forced Air Convection of top condensation segment all the time can be by described heat pipe array 5
The most of heat derived dissipates rapidly to be released, and significantly improves the thermal response of the fusing decalescence of bottom evaporator section phase-change material 9
Speed can the ensureing module that entirely dispels the heat when phase-change material 9 is completely melt still has suitable heat-sinking capability, thus improves
Sustainable heat-sinking capability.When electronic chip array 12 quits work, radiator fan 2 will work on a period of time, by phase transformation
The heat that material 9 is accumulated is by heat pipe array condensation segment and the Forced Air Convection on heat sink cavity outside wall surface radiated rib 4
Dissipating and releasing, this will assist in the rapid curing of phase-change material 9, so that its cooling capacity is recovered rapidly.
In conjunction with Fig. 5, heat pipe 13 body of the present utility model is by casting or is machined into, and its material can be according to work
Condition and working media compatibility etc. select different high thermal conductivity metal or alloy, as carbon steel, low-alloy steel, stainless steel,
Copper (alloy), aluminium (alloy) or nickel (alloy) etc..Heat pipe is uniformly arranged bionical upwardly through welding or mach mode in 13 weeks
Fin 14, fin material keeps consistent with described heat pipe body, and fin number is advisable with 4～8.
Described bionical fin 14 includes at least 2 grades of level crotch fins and every grade of crotch fin comprises again the fin of more than 2,
The root of the 1st grade of crotch fin is connected with heat pipe 13 outer wall.The adjacent two-stage crotch fin thickness ratio of described bionical fin 14 is
n1/α, length is than for n1/β, wherein, n is the number of every grade of crotch fin, and α is the thickness factor and 2≤α < 3, β is length factor and 1
<β≤2.Bionical fin 14 produces increasing branch by described crotch fins at different levels, and this has increased considerably heat pipe array
Heat exchange area between 5 and phase-change material 9, and optimize the heat conduction heat flux being assigned with between heat pipe array 5 and phase-change material 9.Meanwhile, heat
Pipe array 5 has very high thermal conductivity factor so that it is become the heat conduction bone of phase-change material fusing and solidification together with bionical fin 14
Frame carrys out the phase-change heat-exchange of reinforced transformation material 9.
In conjunction with Fig. 6, Fig. 7 and Fig. 8, heat pipe 13 internal face surrounding sintering has the powder porous liquid-sucking core of axial slot formula 15, logical
Cross sintering process in detail below and made the powder porous liquid-sucking core of axial slot formula 15: according to the powder porous imbibition of described groove-type
The design size of core 15, uses the formpiston 19 that micro WEDM processes and heat pipe 13 internal diameter profile size match (such as Fig. 7
Shown in), it is contemplated that carbon-coating can play good lubrication drag reduction effect in knockout course, uses graphite as the system of formpiston 19
Standby material.Formpiston 19 is put in pre-processed heat pipe package 20 center cavity, then by loose for metal dust 21 or warp
Jolt ramming is inserted in the space being surrounded between formpiston 19 and heat pipe package 20, until metal dust 21 adequately fills up formation powder and burns
Knot layer, thus obtain sintering precast body (as shown in Figure 8), described metal dust 21 particle diameter is 20～100 μm, and material can basis
Condition of work selects different materials from the compatibility of working media in described heat pipe array etc., such as copper, nickel, titanium or stainless steel
Deng.Putting into and have thermal sintering in the sintering furnace of protective atmosphere described sintering precast body, sintering temperature control process is: with 350～
400 DEG C of speed hourly are incubated 30～35 minutes after being warming up to 400～450 DEG C, then hourly with 350～400 DEG C again
Speed be warming up to 950～1000 DEG C after heat preservation sintering 45～90 minutes；After stove cooling, formpiston 19 is extracted, i.e. can get groove
The powder porous liquid-sucking core of road formula 15.Finally, fill working medium by heat pipe package 20 end welded seal and after vacuumizing, i.e. obtain heat
Pipe 13.Sinter the powder porous liquid-sucking core of groove-type 15 by the method, with low cost, easy to operate, can preferably realize powder
Between the particle of end, hole is uniformly distributed.
The length of the powder porous liquid-sucking core of above-mentioned groove-type 15 is highly consistent with heat pipe 13 inner chamber body and has 16～48
Axially through capillary wick groove 16, this capillary wick groove 16 is made up of capillary wick seam 17 and backflash 18, in this backflash 18
In being embedded in the powder sintered layer in heat pipe inner wall face and by capillary wick seam 17 and the powder porous liquid-sucking core of axial slot formula 15 institute
The cavity surrounding is connected.The width of capillary wick seam 17 is 200～400 μm, and the degree of depth is 100～300 μm, and backflash 18 is transversal
Face shape can be rectangle (A of Fig. 6), " Ω " shape (B of Fig. 6), dove-tail form (C of Fig. 6) and triangle (D of Fig. 6), its waterpower
A diameter of 500～800 μm.The cavity cross-section equivalent diameter that liquid-sucking core 15 is surrounded is 2.0～5.0mm.Axial slot formula powder
The higher curvature meniscus that porous wick structure 15 both may utilize at described capillary wick seam 17 minute openings provides high capillary pumped pressure
Power, may utilize again described large scale backflash 18 and promotes the permeability of liquid-sucking core, reduces working medium backflow resistance, can also significantly drop
The backflow of low liquid is by the shearing inhibition of steam reverse flow, and meanwhile, sintered powder loose structure further increases hair
Thin swabbing pressure.So, the capillary limitation of heat pipe 13 and entrainment limit are significantly improved, and heat transfer property is substantially strengthened.
Phase-change material 9 of the present utility model is less than electronic chip with fusing points such as paraffin, sodium citrate, sodium phosphate or nitrate
Material based on the material of array 12 safe working temperature, and the method being combined by physical dispersion and chemical dispersion is mixed into
The high thermal conductivity nano particles such as copper nanoparticle, nanometer aluminium powder, nano-sized carbon copper-clad or nano aluminium oxide, concrete grammar is: by basis
Melt material is liquid, weighs a certain amount of nanoparticle powder and joins together with chemical dispersant in liquid state phase change material,
And carry out physics sonic oscillation dispersion to it about 2 hours, it is thus achieved that the preferable nano-composite phase-changing material stoste of uniform and dispersiveness,
Then enter line stabilization cooling down to stoste, until phase-change material is fully cured, the time of whole cooling solidification process controls
25～30 minutes.Wherein, described nano particle diameter scope is 30～50nm, and mass fraction is 1wt%～5wt%；Chemistry point
Powder can be chosen according to the physicochemical characteristics of basic material and nano particle, such as CTAB, SDBS, Span-80, GA and
Hitenol BC-10 etc., its mass fraction is 0.20wt%～0.32wt%.High thermal conductivity nano particle is favorably improved described
The effective thermal conductivity of phase transformation basic material, and promote latent heat of phase change storage and the thermal response speed of release further, make phase transformation
The fusing of material 9 is more uniformly quick with solidification recovery process, is more beneficial for phase change temperature control.
Claims (8)
1. a high power electronic chip array heat radiation module, it is characterised in that include heat sink cavity (6), packaging heat sink cavity
(6) base plate (10) bottom, the cover plate (3) at packaging heat sink cavity (6) top, heat pipe array (5) and radiator fan (2), described
Heat pipe array (5) is connected through cover plate (3) is fixing with base plate (10) in packaging heat sink cavity (6), and described radiator fan (2) sets
Put in heat pipe array (5) top, fill heat pipe battle array in the closed chamber that base plate (10), heat sink cavity (6) and cover plate (3) are constituted
The evaporator section of row (5) bottom buries phase-change material therein (9) underground；The condensation segment on this heat pipe array (5) top is exposed in atmosphere.
2. high power electronic chip array according to claim 1 heat radiation module, it is characterised in that described heat pipe array (5)
In every heat pipe (13) be circumferentially uniformly arranged bionical fin (14), described bionical fin (14) include at least 2 grades of crotch fins,
Every grade of crotch fin comprises again the fin of more than 2, and the root of the 1st grade of crotch fin is connected with the outer wall of this heat pipe (13)；Institute
State the adjacent two-stage crotch fin thickness of bionical fin (14) than for n1/α, length is than for n1/β, wherein n is every grade of crotch fin
Number, α is the thickness factor and 2≤α < 3, β is length factor and 1 < β≤2.
3. high power electronic chip array according to claim 1 heat radiation module, it is characterised in that described heat sink cavity (6)
Outside wall arranges the fin (4) strengthening heat radiation；The groove (11) installing heat pipe array (5) is offered on described base plate (10).
4. high power electronic chip array according to claim 1 heat radiation module, it is characterised in that described heat pipe array (5)
The length that bottom is embedded in phase-change material accounts for the 1/3 to 2/3 of described heat pipe array total height.
5. high power electronic chip array according to claim 1 heat radiation module, it is characterised in that described heat pipe array (5)
In on every heat pipe (13) internal face sintering have the powder porous liquid-sucking core of axial slot formula (15).
6. high power electronic chip array according to claim 5 heat radiation module, it is characterised in that described groove-type powder
The length of porous wick structure (15) is highly consistent with heat pipe (13) inner chamber body, and in the middle of the powder porous liquid-sucking core of groove-type (15)
Setting have 16～48 axially through capillary wick groove (16), this capillary wick groove (16) by capillary wick seam (17) and backflow
Groove (18) forms, and it is interior and many with groove-type powder by capillary wick seam (17) that described backflash (18) is embedded in powder sintered layer
The cavity that hole liquid-sucking core (15) is surrounded is connected.
7. high power electronic chip array according to claim 6 heat radiation module, it is characterised in that described capillary wick stitches
(17) width is 200～400 μm, and the degree of depth is 100～300 μm.
8. high power electronic chip array according to claim 6 heat radiation module, it is characterised in that described backflash (18)
Shape of cross section is rectangle, " Ω " shape, dove-tail form or triangle, and its hydraulic diameter is 500～800 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201620508110.3U CN205680674U (en) | 2016-05-28 | 2016-05-28 | High power electronic chip array heat radiation module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620508110.3U CN205680674U (en) | 2016-05-28 | 2016-05-28 | High power electronic chip array heat radiation module |
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| CN205680674U true CN205680674U (en) | 2016-11-09 |
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| CN201620508110.3U Expired - Fee Related CN205680674U (en) | 2016-05-28 | 2016-05-28 | High power electronic chip array heat radiation module |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105845649A (en) * | 2016-05-28 | 2016-08-10 | 扬州大学 | High power electronic chip array radiating module |
| CN106524092A (en) * | 2016-12-09 | 2017-03-22 | 淳铭散热科技股份有限公司 | Cooling device for electronic devices and apparatuses |
| CN107041102A (en) * | 2016-12-09 | 2017-08-11 | 淳铭散热科技股份有限公司 | The heat abstractor of a kind of electronic equipment and device |
| CN109168304A (en) * | 2018-10-25 | 2019-01-08 | 海鹰企业集团有限责任公司 | A kind of underwater tubular electronic compartment radiator |
| CN109647301A (en) * | 2019-02-21 | 2019-04-19 | 山东金德新材料有限公司 | A kind of big flow micro passage reaction chip |
| CN110186302A (en) * | 2019-06-04 | 2019-08-30 | 中国科学院工程热物理研究所 | Steam cavity flat-plate heat pipe based on fin-tube type condensation segment |
| CN111770664A (en) * | 2020-06-12 | 2020-10-13 | 中国船舶重工集团公司第七二四研究所 | Three-dimensional heat pipe coupling fin phase change energy storage thermal control device |
-
2016
- 2016-05-28 CN CN201620508110.3U patent/CN205680674U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105845649A (en) * | 2016-05-28 | 2016-08-10 | 扬州大学 | High power electronic chip array radiating module |
| CN106524092A (en) * | 2016-12-09 | 2017-03-22 | 淳铭散热科技股份有限公司 | Cooling device for electronic devices and apparatuses |
| CN107041102A (en) * | 2016-12-09 | 2017-08-11 | 淳铭散热科技股份有限公司 | The heat abstractor of a kind of electronic equipment and device |
| CN109168304A (en) * | 2018-10-25 | 2019-01-08 | 海鹰企业集团有限责任公司 | A kind of underwater tubular electronic compartment radiator |
| CN109168304B (en) * | 2018-10-25 | 2023-10-27 | 海鹰企业集团有限责任公司 | Heat abstractor for cylindrical electronic cabin under water |
| CN109647301A (en) * | 2019-02-21 | 2019-04-19 | 山东金德新材料有限公司 | A kind of big flow micro passage reaction chip |
| CN110186302A (en) * | 2019-06-04 | 2019-08-30 | 中国科学院工程热物理研究所 | Steam cavity flat-plate heat pipe based on fin-tube type condensation segment |
| CN111770664A (en) * | 2020-06-12 | 2020-10-13 | 中国船舶重工集团公司第七二四研究所 | Three-dimensional heat pipe coupling fin phase change energy storage thermal control device |
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