CN211782949U - Three-dimensional vacuum cavity vapor chamber radiator for high heat flux heat source - Google Patents
Three-dimensional vacuum cavity vapor chamber radiator for high heat flux heat source Download PDFInfo
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- CN211782949U CN211782949U CN202020126390.8U CN202020126390U CN211782949U CN 211782949 U CN211782949 U CN 211782949U CN 202020126390 U CN202020126390 U CN 202020126390U CN 211782949 U CN211782949 U CN 211782949U
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Abstract
The utility model discloses a three-dimensional vacuum cavity soaking plate radiator for high heat flux density heat source, include: the temperature-equalizing plate is internally provided with a vacuum cavity; the evaporation structure layer is arranged in the vacuum cavity of the temperature-equalizing plate; the refrigerant is filled in the vacuum cavity of the temperature equalizing plate; the hollow metal pipes are vertically arranged on the temperature-equalizing plate at intervals, the lower end of each hollow metal pipe is communicated with the vacuum cavity of the temperature-equalizing plate, and the upper end of each hollow metal pipe is closed; and a plurality of radiating fins which are axially sleeved on the plurality of hollow metal tubes at intervals and are positioned above the temperature equalizing plate. The utility model discloses combine the advantage of heat pipe and temperature-uniforming plate, upgrade one-dimensional heat conduction, two-dimentional heat conduction into three-dimensional heat conduction, both solved the problem of thermal diffusion, also solved the problem of heat toward eminence or conduction far away, greatly improved the radiating effect.
Description
Technical Field
The utility model relates to a radiator technical field especially relates to a three-dimensional vacuum cavity soaking plate radiator for high heat flux density heat source.
Background
High heat flux heat sources, such as high power and high heat flux LED lamps, generate a large amount of heat during operation, and the following heat sinks are commonly used for heat dissipation:
1. the heat radiator is made of aluminum materials, has a heat conductivity coefficient of about 180w/mk, has a poor heat dissipation effect, and is difficult to meet the heat dissipation requirements of high-power and high-heat-flux LED lamps;
2. the heat pipe type radiator has the advantages that the heat pipe in the radiator is one-dimensional linear heat conduction, heat can be conducted to a high place or a far place, but the heat diffusion is limited due to limited contact area, and the heat dissipation effect is still not ideal;
3. the heat pipe is one-dimensional linear heat conduction, and the heat in the vacuum cavity temperature-equalizing plate is conducted on a two-dimensional plane, so that the heat diffusion efficiency is higher. However, such a heat sink cannot be transferred to a high place or a remote place, and the heat dissipation effect is still not satisfactory.
The applicant has therefore found, through useful research and study, a solution to the above-mentioned problems, in the context of which the technical solutions to be described below have been created.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve lies in: aiming at the problem that the heat dissipation effect of the heat sink adopted by the existing high heat flow density heat source is poor, the three-dimensional vacuum cavity vapor chamber heat sink for the high heat flow density heat source is provided with a good heat dissipation effect.
The utility model discloses the technical problem that will solve can adopt following technical scheme to realize:
a three-dimensional vacuum cavity vapor chamber heat spreader for a high heat flux density heat source, comprising:
the temperature-equalizing plate is internally provided with a vacuum cavity;
the evaporation structure layer is arranged in the vacuum cavity of the temperature-equalizing plate;
the refrigerant is filled in the vacuum cavity of the temperature equalizing plate;
the hollow metal pipes are vertically arranged on the temperature-equalizing plate at intervals, the lower end of each hollow metal pipe is communicated with the vacuum cavity of the temperature-equalizing plate, and the upper end of each hollow metal pipe is closed; and
and the plurality of radiating fins are axially sleeved on the plurality of hollow metal tubes at intervals and are positioned above the temperature equalizing plate.
In a preferred embodiment of the present invention, the evaporation structure layer is a structure layer having a capillary force.
In a preferred embodiment of the present invention, the structural layer having a capillary force is a sintered powder layer or a mesh layer.
In a preferred embodiment of the present invention, the lower end of each hollow metal tube is fixedly connected to the vapor chamber by welding, bonding, or riveting.
In a preferred embodiment of the present invention, each heat dissipating fin is fixedly connected to each hollow metal tube by welding, bonding, or riveting.
In a preselected embodiment of the present invention, the refrigerant is one of acetone, R134a, R123, 1233ZD, 1234ZE or water.
In a preferred embodiment of the present invention, the heat dissipation device further comprises a blower for blowing air to the plurality of heat dissipation fins.
Due to the adoption of the technical scheme, the beneficial effects of the utility model reside in that: the utility model discloses combine the advantage of heat pipe and temperature-uniforming plate, upgrade one-dimensional heat conduction, two-dimentional heat conduction into three-dimensional heat conduction, both solved the problem of thermal diffusion, also solved the problem of heat toward eminence or conduction far away, greatly improved the radiating effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand and understand, the present invention is further explained by combining with the specific drawings.
Referring to fig. 1, a three-dimensional vacuum chamber vapor chamber heat spreader for a heat source with high heat flux density is shown, which includes a vapor chamber 100, an evaporation structure layer 200, a refrigerant (not shown), a plurality of hollow metal tubes 300, and a plurality of fins 400.
A vacuum chamber 110 is formed in the vapor chamber 100, and the lower plate 101 thereof directly contacts the heat source with high heat flux density. The high heat flux heat source can be a high power and high heat flux LED lamp, and other high heat flux heat sources are also suitable.
The evaporation structure layer 200 is disposed in the vacuum chamber 110 of the vapor chamber 100. In the present embodiment, the evaporation structure layer 200 is a layer having a capillary force, such as a sintered powder layer or a mesh layer.
The refrigerant is filled in the vacuum cavity 110 of the vapor chamber 100, and the refrigerant may be completely filled or partially filled. In the present embodiment, the refrigerant is one of acetone, R134a, R123, 1233ZD, 1234ZE, and water, but is not limited to the refrigerant described in the present embodiment and may be another refrigerant.
The hollow metal tubes 300 are vertically arranged on the temperature-uniforming plate 100 at intervals, the lower end 310 of each hollow metal tube 300 is communicated with the vacuum cavity of the temperature-uniforming plate 100, and the upper end 320 thereof is closed. In this embodiment, the lower end 310 of each hollow metal tube 300 is fixedly connected to the vapor chamber 100 by welding, bonding, or riveting.
The plurality of heat dissipation fins 400 are axially spaced and sleeved on the plurality of hollow metal tubes 300 and are located above the vapor chamber 100. In this embodiment, each of the heat dissipating fins 400 is fixedly connected to each of the hollow metal tubes 300 by welding, bonding, or riveting.
The three-dimensional vacuum cavity vapor chamber heat sink for high heat flux heat source of the present invention further comprises a blower (not shown in the figure) for blowing air to the plurality of heat dissipating fins 400. After the heat is transferred to the heat dissipation fins 400, the cold air blown out by the fan blows to the surfaces of the heat dissipation fins 400, and the heat is dissipated to the air through convection heat exchange. Of course, a natural heat dissipation method may be adopted, in which heat is dissipated to the air by heat radiation after the heat is transferred to the heat dissipation fins 400.
The utility model discloses a theory of operation that is used for three-dimensional vacuum cavity soaking plate radiator of high heat flux density heat source as follows:
in this embodiment, the LED lamp with high power and high heat flux density is used for example, the LED lamp is powered on to work, wherein a part of electric power is converted into light energy, another part of the electric power is converted into heat energy, the heat energy is conducted to the temperature equalization plate 100 to raise the temperature of the temperature equalization plate 100, the refrigerant in the evaporation structure layer 200 absorbs heat and is rapidly vaporized into gas, the gas conducts the heat into the hollow metal tubes 300 through the vacuum cavities 110 which are communicated with each other, the hollow metal tubes 300 are connected with the heat dissipation fins 400, the heat dissipation fins 400 dissipate the heat into air, the refrigerant gas releases the heat and is liquefied into liquid, the liquid flows to the evaporation structure layer 200 of the temperature equalization plate 100 along the tube walls of the hollow metal tubes 300, and the liquid flows back to the heat source by using the capillary force of the evaporation structure layer 200, and the cycle is. The circulation is rapid, and heat can be continuously conducted to achieve the effect of rapid heat dissipation.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A three-dimensional vacuum cavity vapor chamber heat spreader for a high heat flux density heat source, comprising:
the temperature-equalizing plate is internally provided with a vacuum cavity;
the evaporation structure layer is arranged in the vacuum cavity of the temperature-equalizing plate;
the refrigerant is filled in the vacuum cavity of the temperature equalizing plate;
the hollow metal pipes are vertically arranged on the temperature-equalizing plate at intervals, the lower end of each hollow metal pipe is communicated with the vacuum cavity of the temperature-equalizing plate, and the upper end of each hollow metal pipe is closed; and
and the plurality of radiating fins are axially sleeved on the plurality of hollow metal tubes at intervals and are positioned above the temperature equalizing plate.
2. The three-dimensional vacuum cavity vapor chamber heat spreader for a high heat flux heat source of claim 1, wherein the evaporation structure layer is a capillary structure layer.
3. The three-dimensional vacuum cavity soaking plate radiator for the heat source with high heat flow density as claimed in claim 2, wherein the structural layer with capillary force is a sintered powder layer or a silk screen layer.
4. The three-dimensional vacuum cavity vapor chamber heat spreader for the high heat flux heat source as claimed in claim 1, wherein the lower end of each hollow metal tube is fixedly connected with the vapor chamber by welding, bonding or riveting.
5. The three-dimensional vacuum cavity soaking plate radiator for the high heat flow density heat source according to claim 1, wherein each radiating fin is fixedly connected with each hollow metal tube by welding, bonding or riveting.
6. The heat spreader with a three-dimensional vacuum cavity heat source for high heat flux density as claimed in claim 1, wherein the refrigerant is one of acetone, R134a, R123, 1233ZD, 1234ZE or water.
7. The three-dimensional vacuum cavity vapor chamber heat spreader for a high heat flow density heat source as claimed in any one of claims 1 to 6, further comprising a fan for blowing air to the plurality of heat dissipating fins.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020126390.8U CN211782949U (en) | 2020-01-20 | 2020-01-20 | Three-dimensional vacuum cavity vapor chamber radiator for high heat flux heat source |
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| CN202020126390.8U CN211782949U (en) | 2020-01-20 | 2020-01-20 | Three-dimensional vacuum cavity vapor chamber radiator for high heat flux heat source |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023010836A1 (en) * | 2021-08-04 | 2023-02-09 | 中兴通讯股份有限公司 | Heat dissipation module and electronic device |
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2020
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023010836A1 (en) * | 2021-08-04 | 2023-02-09 | 中兴通讯股份有限公司 | Heat dissipation module and electronic device |
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