CN108799856B

CN108799856B - Light source device

Info

Publication number: CN108799856B
Application number: CN201810610798.XA
Authority: CN
Inventors: 张桂英; 胡学功
Original assignee: Institute of Engineering Thermophysics of CAS
Current assignee: Institute of Engineering Thermophysics of CAS
Priority date: 2018-06-13
Filing date: 2018-06-13
Publication date: 2024-05-07
Anticipated expiration: 2038-06-13
Also published as: CN108799856A

Abstract

The present invention provides a light source device, comprising: a light source substrate; a light source chip disposed on the light source substrate in heat transfer contact with the light source substrate, at least partially inclined with respect to a horizontal plane; the lens cover is connected with the light source substrate to form a cavity, and the light source chip is packaged in the cavity; the heat dissipation assembly is connected with the light source substrate to dissipate heat generated when the light source chip emits light, and is arranged on the opposite side of the light source substrate relative to the light source chip, and is connected to the periphery of the light source substrate to form a closed steam cavity with the light source substrate, and the steam cavity is suitable for storing liquid phase change heat dissipation media; and the plate-shaped porous medium liquid absorption core is positioned in the steam cavity and in heat transfer contact with the light source substrate, and the porous medium liquid absorption core is suitable for absorbing the liquid phase-change heat dissipation medium, so that the liquid phase-change heat dissipation medium absorbs heat and then is converted into gas to enter the steam cavity, and the gas is condensed into liquid state again in the steam cavity through the heat dissipation assembly so as to be absorbed again by the porous medium liquid absorption core.

Description

Light source device

Technical Field

The present invention relates to a light source device, and more particularly, to a side-emission light source device.

Background

Most of the input power of a light-emitting source, such as an LED lamp, can be converted into heat, and the heat accumulation can cause the temperature of the light-emitting source to rise, so that the spectral line of the light-emitting source shifts, the light efficiency is reduced and the service life is shortened. Therefore, the heat sink is a critical component in the design of high power light emitting sources, such as LED fixtures. Common sectional materials are limited in heat dissipation capacity and heat pipe heat dissipation capacity, so that good heat dissipation effect is difficult to generate for a high-power luminous source. Liquid phase-change heat dissipation becomes the mainstream technology for solving the heat dissipation of high-power light-emitting sources at present.

Liquid phase-change heat dissipation has been used to solve the heat dissipation problem of bottom-emitting LED lamps. Along with strong cognition of society on environmental protection and energy saving, side-emitting LED lamps such as high-power projection lamps, fish-attracting lamps and the like are increasingly widely used. For the side-emitting LED lamp, as the heating source is at least partially inclined relative to the horizontal plane, and the flow of the phase-change liquid is influenced by gravity, the heating source is difficult to infiltrate for effective heat dissipation, so that no viable liquid phase-change heat dissipation solution exists at present.

Disclosure of Invention

The invention aims to provide a light source device for solving the problem that a side-emitting light source such as a side-emitting LED lamp is difficult to effectively dissipate heat through liquid phase change.

An embodiment of the present invention provides a light source device including:

A light source substrate;

a light source chip disposed on the light source substrate, in heat transfer contact with the light source substrate, and at least partially inclined with respect to a horizontal plane;

A lens cover connected with the light source substrate to form a cavity, wherein the light source chip is packaged in the cavity; and

The heat dissipation component is connected with the light source substrate to dissipate heat generated when the light source chip emits light,

The heat dissipation assembly is arranged on the opposite side of the light source substrate relative to the light source chip, is connected to the peripheral part of the light source substrate to form a closed steam cavity with the light source substrate, and is suitable for storing liquid phase-change heat dissipation medium; and

The porous medium liquid absorption core is positioned in the steam cavity and in heat transfer contact with the light source substrate, wherein the porous medium liquid absorption core is suitable for absorbing the liquid phase-change heat dissipation medium, so that the liquid phase-change heat dissipation medium absorbs heat and then is converted into gas to enter the steam cavity, and the gas is condensed into liquid state again in the steam cavity through the heat dissipation assembly so as to be absorbed again by the porous medium liquid absorption core.

According to some embodiments, a heat dissipating assembly includes:

The top end cover is arranged at the top end of the steam cavity;

The bottom end cover is arranged at the bottom end of the steam cavity;

And the heat dissipation part is connected with the top end cover and the bottom end cover, forms an arched inner wall surface of the steam cavity, which is opposite to the light source substrate, and the outer side of the arched inner wall surface is connected with heat dissipation fins.

According to some embodiments, the heat dissipating assembly further comprises: a baffle plate is arranged around the porous medium liquid absorption core in the steam cavity, and a guide channel is formed between the baffle plate and the porous medium liquid absorption core so as to guide the gas converted by the liquid phase-change heat dissipation medium in the porous medium liquid absorption core to flow upwards.

According to some embodiments, the light source chip and the light source substrate are connected by a thermal interface material.

According to some embodiments, in the porous media wick, the pores relatively near the bottom are smaller in pore size and greater in density than the pores relatively near the top.

According to some embodiments, a closable hole is provided in the center of the top end cap, the hole being used for feeding liquid phase change heat dissipation medium into the vapor chamber or for extracting air from the vapor chamber.

According to some embodiments, the arched inner wall surface of the steam cavity is coated with a hydrophobic material.

According to some embodiments, a plurality of micro channels are provided on the inner surface of the bottom end cap for directing the liquid phase change heat sink medium evenly to the bottom of the porous medium wick.

According to some embodiments, the top of the micro channel has a gap from the bottom of the porous media wick.

According to some embodiments, the microchannels are perpendicular to or form an acute angle with the porous media wick.

According to some embodiments, the light source device is a side-emitting LED lamp.

Compared with the prior art, the invention has at least the following advantages:

According to the light source device provided by the embodiment of the invention, the heat dissipation assembly and the porous medium liquid absorption core are arranged, and the heat dissipation is performed by utilizing the liquid circulation phase change, so that the heat dissipation problem of the side-emitting LED is effectively solved.

Drawings

Other objects and advantages of the present invention will become apparent from the following description of the invention with reference to the accompanying drawings, which provide a thorough understanding of the present invention.

Fig. 1 is a schematic perspective view of a side-emission light source device according to an embodiment of the present invention;

Fig. 2 is a schematic side view of the light source device of fig. 1;

FIG. 3 is a cross-sectional view of the light source device of FIG. 1;

FIGS. 4A and 4B are side and plan schematic views, respectively, of a bottom end cap in the light source device of FIG. 1; and

Fig. 5 is a schematic side view of a side-emission light source device according to another embodiment of the present invention.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. In addition, the drawings are only schematic illustrations of embodiments of the invention and are not necessarily drawn to scale.

Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs.

The invention provides a light source device, in particular to a side-emitting light source device, which comprises a heat dissipation component, wherein the heat dissipation component utilizes the characteristic that liquid is converted into gas to absorb heat, the liquid is stored in a metal porous medium liquid suction core, when the heat of a light source chip is transferred to the metal porous medium liquid suction core, the liquid in the metal porous medium liquid suction core can absorb the heat and convert into gas, and the gas can release the heat to convert into liquid when touching a steam cavity wall, so that the purpose of heat dissipation is realized.

For a side-emitting light source device, for example, a side-emitting LED lamp, since the light source chip is at least partially inclined with respect to the horizontal plane, and the flow of the phase-change liquid is affected by gravity, it is difficult to infiltrate the heat source to effectively dissipate heat. Here, side-emission means that a light-emitting source (e.g., LED lamp) emits light sideways, and its light source chip is at least partially inclined with respect to a horizontal plane. Typical side-emitting light source devices are, for example, horizontally emitting LED lamps.

Exemplary embodiments of the side-emission light source device of the present invention are described in detail below with reference to the accompanying drawings.

Fig. 1 is a schematic perspective view of a side-emitting light emitting device 100 according to an embodiment of the present invention. Fig. 2 is a left side schematic view of the light emitting device 100 of fig. 1. Fig. 3 is a sectional view of A-A of the light emitting device 100 of fig. 1.

As shown in fig. 1 and 3, the light emitting device 100 includes a light source substrate 31; a light source chip 2 disposed on the light source substrate 31, in heat transfer contact with the light source substrate 31, and at least partially inclined with respect to a horizontal plane; a lens cover 1 connected with the light source substrate 31 to form a cavity in which the light source chip 2 is packaged; and a heat dissipation assembly 3 connected with the light source substrate to dissipate heat generated when the light source chip emits light, wherein the heat dissipation assembly 3 is disposed at an opposite side of the light source substrate 31 to the light source chip 2, the heat dissipation assembly 3 is connected to an outer circumferential portion of the light source substrate 31 to enclose a closed vapor chamber 320 with the light source substrate 31, and the vapor chamber 320 is adapted to store a liquid phase-change heat dissipation medium; and a plate-shaped porous medium wick 34 positioned in the vapor chamber 320 and in heat transfer contact with the light source substrate 31, wherein the porous medium wick 34 is adapted to absorb the liquid phase-change heat-dissipating medium, so that the liquid phase-change heat-dissipating medium absorbs heat and is converted into gas to enter the vapor chamber 320, and is condensed again into a liquid state in the vapor chamber 320 by the heat-dissipating component to be re-absorbed by the porous medium wick.

According to the above structure, by providing the light source substrate, the heat radiation member, the porous medium wick, and by circulating the phase change heat radiation of the phase change heat radiation medium, the light source chip 2 can be cooled effectively.

The heat generated by the light source chip 2 is transferred through the light source substrate 31 to the plate-like porous medium wick 34 in heat transfer contact with the light source substrate 31, and the light source substrate 31 is made of a material with low density and high heat conductivity, for example, an aluminum alloy. The light source substrate 31 is made of low-density materials, so that the weight of the whole device can be reduced, the whole light source device is lighter, and the good heat conducting property of the light source substrate 31 can better transfer the heat generated by the light source chip 2 into the steam cavity 320. The porous medium wick 34 is filled with a liquid phase-change heat-dissipating medium, and the heat is absorbed by the liquid phase-change heat-dissipating medium in the porous medium wick 34, and the liquid phase-change heat-dissipating medium absorbs the heat and then generates a phase change, i.e., converts the liquid phase into a gaseous phase. The porous medium liquid absorption core 34 is, for example, a metal porous medium, namely foam metal, has high heat conductivity and large specific surface area, and can increase the solid-liquid contact area; the pore diameter range of the metal porous medium can be nano-scale, the liquid infiltration height can be improved, and the heat dissipation effect is improved.

The gas generated by the phase change of the liquid in the porous media wick 34 overflows from the top of the porous media wick 34 under the action of the buoyancy force and enters the vapor chamber 320. The gas is condensed when it hits the inner wall of the steam chamber 320, and heat is transferred to the chamber of the steam chamber 320, and then the heat on the chamber of the steam chamber 320 is transferred to the environment by the flowing action of the external air. The condensed beads inside the steam chamber 320 slide down along the inner wall of the steam chamber 320 by gravity and flow into the bottom of the steam chamber 320. The liquid on the bottom will then re-enter the pores of the porous media wick 34, effecting a phase change cycle of the liquid.

With continued reference to fig. 1, according to a preferred embodiment, the heat dissipating assembly 3 comprises: a top end cap 321 disposed at the top end of the steam chamber 320; a bottom end cap 322 disposed at the bottom end of the steam chamber 320; a heat radiating portion 323 connecting the top cover 321 and the bottom cover 322, the heat radiating portion 323 forming an arched inner wall surface 324 of the steam chamber 320 opposite to the light source substrate 31, and a heat radiating fin 325 being connected to an outer side of the arched inner wall surface 324.

The heat generated by the light source chip 2 is transferred to the plate-shaped porous medium liquid absorbing core 34 in heat transfer contact with the light source substrate 31 through the light source substrate 31, and the heat is absorbed by the liquid phase-change heat dissipating medium inside the porous medium liquid absorbing core 34, and the liquid phase-change heat dissipating medium absorbs the heat to generate a phase change. The generated gas overflows from the top of porous media wick 34 into vapor chamber 320.

The gas is condensed when encountering the inner wall of the steam cavity 320, heat is transferred to the cavity of the steam cavity 320, and then the heat on the cavity of the steam cavity 320 is transferred to the environment under the flowing action of external air, so that the contact area between the air and the steam cavity 320 is enlarged by the arched inner wall surface 324 of the cavity, and the heat dissipation is accelerated. The arcuate inner wall surface 324 may have a maximum distance from the surface of the porous medium wick 34 of between 2 and 10mm. The outer side of the arched inner wall surface is connected with a plurality of radiating fins 325, the radiating fins 325 can be in an emission shape, the thickness range of each radiating fin can be 0.5-3mm, and the distance between fin roots can be 1-5mm. The gas in the vapor chamber 320, as it is converted to a liquid at the arched inner wall surface 324, transfers heat to the heat sink fins 325, which is carried away by the heat conduction of the fins and convection with air. The number of the radiating fins 325 is large, and the surface area of the single radiating fin is large, so that the total contact area with air is increased, heat can be quickly transferred, and the radiating effect is enhanced.

With continued reference to fig. 1, according to a preferred embodiment, the heat sink assembly 3 further includes a baffle 35 disposed around the porous-medium wick 34 in the vapor chamber 320, the thickness of the baffle 35 ranging, for example, between 0.2 and 1mm, and a guide channel is formed between the baffle 35 and the porous-medium wick 34 to guide upward flow of the gas converted by the liquid phase-change heat sink medium in the porous-medium wick 34.

Because a large number of densely distributed small holes exist in the porous medium liquid suction core 34, gas overflows from the middle lower part of the porous medium liquid suction core 34, and if the partition plate 35 is not arranged, the gas can be directly contacted with the middle lower part of the steam cavity, so that the heat dissipation of the whole arched inner wall surface cannot be fully utilized, and the cooling effect is greatly reduced. The partition 35 is disposed around the porous medium wick 34, so that the gas generated by the porous medium wick 34 can be guided to the top of the steam chamber as much as possible, and then the gas starts to condense from the top of the steam chamber 320 and flows down along the arch-shaped inner wall surface 324, so that the heat can be better dissipated through the large-area heat dissipation fins 325, and the heat dissipation is performed by using the arch-shaped inner wall surface of the steam chamber to the greatest extent, so that the cooling effect is greatly enhanced. The spacing between the spacer 35 and the porous media wick 34 may be 0.5-2mm.

With continued reference to fig. 1, in a preferred embodiment, the light source chip 2 and the light source substrate 31 are connected by a thermal interface material 33. The thermal interface material is a material with high heat conduction performance and high ductility, for example, can be heat conduction silica gel or heat conduction silicone grease. The thermal interface material 33 is disposed between the light source chip 2 and the light source substrate 31, and can greatly reduce the contact thermal resistance. Therefore, the thermal interface material can effectively enhance the heat conduction performance of the light source chip and the light source substrate 31.

According to a preferred embodiment, in the metal porous media wick 34, the pores arranged relatively near the bottom are smaller in pore size and greater in density than the pores relatively near the top. That is, in the porous-medium wick 34, the arrangement of the pores is non-uniform, and the sizes of the pores are also different. For example, the pore diameter of the pores at the bottom is in the range of 0.05-0.1mm, and the pore diameter of the pores at the top is in the range of 0.1-0.5mm, so that the density of the pores at the bottom is large and the density of the pores at the top is small. The pores of the bottom are set to be relatively small in order to better utilize capillary action to absorb liquid, and the pores of the top are set to be relatively large in order to facilitate better escape of liquid converted gas.

The porous media wick 34 may be made of a metal porous media. The metal porous medium has higher heat conductivity, namely good heat conductivity, can be copper foam, aluminum foam, and can be other metals with good heat conductivity. The porous media wick 34 has an internal porosity of 40% to 85%. "porosity" as used herein refers to the percentage of the internal pore volume of porous media wick 34 to the total volume. Too small a porosity can result in too small a contact area between the liquid and the interior of the porous media wick 34 for good heat transfer; too much porosity can result in an insufficiently strong porous media wick 34 that is prone to breakage. Maintaining the internal porosity of porous media wick 34 at 40% -85% may not only provide a relatively large contact area between the interior of porous media wick 34 and the liquid, but may also provide a relatively robust porous media wick 34.

With continued reference to FIG. 1, in the preferred embodiment, a closable aperture 3210 is provided in the center of the top cover 321, the aperture 3210 being used to introduce liquid phase change heat sink medium into the vapor chamber 320 or to draw air from the vapor chamber 320. The diameter of the holes is for example in the range of 2-6mm. The holes 3210 may be sealed screw holes, and the entire heat sink is sealed with a fine screw after the vapor chamber 320 is vacuumed or the liquid phase change heat dissipation medium liquid is injected into the vapor chamber 320. The whole steam cavity 320 is vacuumized, so that the evaporation of liquid is facilitated, the condensation of gas is facilitated, the liquid phase change circulation rate can be greatly accelerated, and the cooling effect is improved. In theory, the phase change cycle of the liquid may not be lost, but is difficult to achieve in practice, so that when the phase change cycle of the liquid in the vapor chamber 320 reaches a certain level, the liquid gradually decreases, and the liquid needs to be fed into the vapor chamber 320 from the hole 3210 so that the phase change cycle of the liquid may be continued.

According to a preferred embodiment, the dome-shaped inner wall surface 324 of the steam chamber is preferably an aluminum alloy material, the inner wall surface being smooth and coated with a hydrophobic material. Hydrophobic materials refer to materials that are difficult to bind to water, and even so to speak, to liquids. Not only are hydrophobic materials difficult to bind to liquids, but they also reduce the contact time with liquids. The hydrophobic material is coated on the arched inner wall of the steam cavity 320, so that the converted liquid can fall down rapidly, thereby accelerating the phase change circulation of the liquid and enhancing the heat dissipation effect.

Referring to fig. 1 and 4A, 4B, according to a preferred embodiment, a plurality of micro channels 3220 are provided on the inner surface of bottom end cap 322 for directing the uniform flow of liquid phase change heat sink medium to the bottom of porous medium wick 34. The plurality of micro channels 3220 are arranged substantially in parallel, extending in a direction from the arcuate inner wall surface 324 of the vapor chamber 320 to the porous media wick 34. The bottom end cap 322 may be an aluminum alloy block 3221 with micro-channels 3220, the micro-channels 3220 being grooved on a top surface of the aluminum alloy block 3221. Micro-channel 3220 can realize uniform liquid distribution of the aluminum alloy block. The micro-channel has a width of 0.1-0.5mm, a depth of 0.1-1mm, and a space between 0.1-1 mm. When the liquid in the vapor chamber 320 flows down along the arched inner wall surface 324 and enters the micro channel 3220, the micro channel 3220 can collect the liquid and then flow to the bottom of the porous medium liquid absorption core 34, so that the porous medium liquid absorption core 34 can absorb the liquid uniformly, and the liquid phase change circulation is accelerated.

According to a preferred embodiment, the top of micro channel 3220 has a gap 13 with the bottom of porous media wick 34. Because liquid sometimes flows through the micro channel 3220 during the filling process, the gap between the top of the micro channel 3220 and the bottom of the porous media wick 34 allows the entire area of the bottom of the porous media wick 34 to absorb liquid without affecting the absorption efficiency due to the contact between the partial area of the bottom of the porous media wick 34 and the top of the micro channel 3220. The width of the gap is, for example, in the range of 0.5mm to 5mm.

Fig. 3 is a sectional view of the light emitting device 100. As shown in fig. 3, the light emitting device 100 includes a heat dissipation fin 325, a light source chip 2, a thermal interface material 33, a top end cap 321, a hole 3210 provided in the center of the top end cap, a light source substrate 31, a porous medium wick 34, a bottom end cap 322, micro channels 3220 provided on the top surface of the bottom end cap 322, a vapor chamber 320, and a partition 35.

According to a preferred embodiment, the micro channels 3220 are perpendicular to or form an acute angle with the porous media wick 34. This ensures that liquid can quickly flow to the bottom of porous media wick 34 when the light source device is used in different situations. For example, the micro channels 3220 are perpendicular to or form an acute angle with the porous media wick 34 by disposing the top surface of the aluminum alloy block 3221 of the bottom end cap 322 perpendicular to or at an acute angle with respect to the porous media wick 34.

Fig. 4A and 4B are schematic side and plan structural views of a bottom end cap of the light emitting device 100, respectively. As shown in fig. 4A-4B, a plurality of micro channels 3220 are disposed on the inner surface of the bottom end cover 322, where the micro channels 3220 form an acute angle with the horizontal plane, that is, the micro channels 3220 form an acute angle with the porous medium wick 34, the arc surface 81 of the bottom end cover 322 corresponds to the arc inner wall surface of the vapor chamber 320, when the liquid flows down from the arc inner wall surface of the vapor chamber 320 to a certain position on the arc, due to the micro channels 3220 form an angle with the horizontal plane, under the influence of gravity, the liquid flows from a point on the arc to the end of the micro channels 3220 along the channels of the micro channels 3220, and the end of the micro channels 3220 corresponds to the bottom of the porous medium wick 34. The present embodiment can be applied to a horizontally operating light source device such as a horizontally emitting LED lamp, e.g., a projector, a fish trap, in which the light emitting chip (light source chip) thereof is vertical to the horizontal plane; the micro channel 3220 and the porous medium wick 34 form an acute angle smaller, so as to ensure that the micro channel 3220 has a certain angle with the horizontal plane, so that the liquid can flow to the bottom of the porous medium wick 34 along the micro channel 3220 under the influence of gravity.

The embodiment where the micro channel 3220 is perpendicular to the porous medium wick 34 is suitable for application to an LED light fixture that emits light obliquely downward (corresponding to the device of fig. 1 being tilted to the left as a whole), so that the micro channel 3220 is perpendicular to the porous medium wick 34 but forms an angle with the horizontal, and the liquid can smoothly flow along the micro channel to the bottom of the porous medium wick 34.

According to the preferred embodiment, the outside of the radiating fin can adopt natural convection air to radiate heat, or forced convection air to radiate heat, for example, a fan can be arranged in the radiating component, so that air flow from bottom to top is formed for the radiating component, and the radiating effect can be further improved. Fig. 5 is a schematic structural view of a side-emitting LED according to an embodiment of the present invention. As shown in fig. 5, a fan 12 is provided above the heat radiating fins 325, thereby forming a bottom-up air flow, which accelerates the heat transfer of the heat radiating fins 325. Other aspects of this embodiment are the same as the embodiment of fig. 1 and will not be described in detail herein. Of course, in other embodiments, other auxiliary cooling devices may be provided, as long as the air flow in the vicinity of the heat dissipating fins is increased.

The light source device in the above embodiment is described by taking a side-emitting LED lamp as an example, but it should be understood by those skilled in the art that the side-emitting LED lamp is only a specific example of the light source device, and all the objects that can emit light belong to the light source device according to the present invention.

The invention adopts the metal porous medium liquid absorption core to realize the phase change of liquid, thereby realizing the heat dissipation of the light source device. The metal porous medium, namely foam metal, has high heat conductivity and large specific surface area, and can increase the solid-liquid contact area; the pore diameter range of the metal porous medium can be nano-scale, the liquid infiltration height can be improved, and the heat dissipation effect is improved; the arc-shaped curved surface steam cavity has smaller condensation heat resistance, so that the overall heat resistance of the radiator is reduced; the included angle between the bottom micro groove group and the metal porous medium liquid absorption core is acute, and the included angle has a certain gradient, so that liquid can be accelerated to flow into the bottom of the metal porous medium liquid absorption core, and the phenomenon that a gap exists between the liquid and the metal porous medium liquid absorption core to interrupt the phase change condensation cycle is prevented.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A light source device, comprising:

A light source substrate;

Wherein the heat dissipation assembly is arranged at the opposite side of the light source substrate relative to the light source chip, and is connected to the peripheral part of the light source substrate so as to form a closed steam cavity with the light source substrate, and the steam cavity is suitable for storing liquid phase-change heat dissipation medium; and

The plate-shaped porous medium liquid absorption core is positioned in the steam cavity and in heat transfer contact with the light source substrate, the porous medium liquid absorption core is suitable for absorbing the liquid phase-change heat dissipation medium, so that the liquid phase-change heat dissipation medium absorbs heat and then is converted into gas to enter the steam cavity, and the gas is condensed into liquid state again in the steam cavity through the heat dissipation component so as to be absorbed again by the porous medium liquid absorption core;

the heat dissipation assembly further includes: a baffle plate arranged around the porous medium liquid absorption core in the steam cavity, wherein a guide channel is formed between the baffle plate and the porous medium liquid absorption core so as to guide the gas converted by the liquid phase-change heat dissipation medium in the porous medium liquid absorption core to flow upwards;

In the porous medium liquid absorption core, the pore diameter of the pore relatively close to the bottom is smaller than that of the pore relatively close to the top, and the density is high;

The heat dissipation assembly further comprises a bottom end cover arranged at the bottom end of the steam cavity, and a plurality of micro-channels are arranged on the inner surface of the bottom end cover and used for guiding the liquid phase-change heat dissipation medium to uniformly flow to the bottom of the porous medium liquid absorption core.

2. A light source device as recited in claim 1, wherein the heat sink assembly comprises:

The top end cover is arranged at the top end of the steam cavity;

The heat dissipation part is connected with the top end cover and the bottom end cover, the heat dissipation part forms an arched inner wall surface of the steam cavity, which is opposite to the light source substrate, and the outer side of the arched inner wall surface is connected with heat dissipation fins.

3. A light source device as recited in claim 1, wherein the light source chip and the light source substrate are connected by a thermal interface material.

4. A light source device according to claim 2, wherein,

And a closable hole is arranged in the center of the top end cover, and the hole is used for inputting liquid phase-change heat dissipation medium into the steam cavity or extracting air of the steam cavity.

5. A light source device as claimed in claim 2, characterized in that the arched inner wall surface of the steam chamber is coated with a hydrophobic material.

6. A light source device as recited in claim 1, wherein a top of the microchannel has a gap from a bottom of the porous media wick.

7. A light source device as recited in claim 1, wherein said microchannel is perpendicular to or forms an acute angle with said porous media wick.

8. A light source device according to claim 1, characterized in that the light source device is a side-emitting LED lamp.