CN201521929U - Heat dissipation structure for high-power LED lamp - Google Patents
Heat dissipation structure for high-power LED lamp Download PDFInfo
- Publication number
- CN201521929U CN201521929U CN2009202450356U CN200920245035U CN201521929U CN 201521929 U CN201521929 U CN 201521929U CN 2009202450356 U CN2009202450356 U CN 2009202450356U CN 200920245035 U CN200920245035 U CN 200920245035U CN 201521929 U CN201521929 U CN 201521929U
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- heat dissipation
- aluminium
- led lamp
- radiator
- zigzag
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Abstract
The utility model discloses a heat dissipation structure for a high-power LED lamp. The heat dissipation structure comprises a tooth-shaped aluminium substrate and an aluminium radiator mounted on the tooth-shaped aluminium substrate, wherein one face of the tooth-shaped aluminium substrate is a plane allowing an LED chip to be mounted and the other face thereof is a zigzag face allowing the aluminium radiator to be mounted, a zigzag structure of the zigzag face corresponds to a zigzag structure on the surface of the aluminium radiator, and the zigzag face meshes with and is fixed together with the aluminium radiator through the zigzag structures. The heat dissipation structure has the advantages of simple structure, reasonable design, low cost and strong heat dissipation capability, and can effectively solve the problem of poor heat dissipation capability and the like of a traditional heat dissipation structure for the high-power LED lamp due to the adoption of a plane circuit board.
Description
Technical field
The utility model belongs to LED lamp applications technical field, especially relates to a kind of high-power LED lamp radiator structure.
Background technology
The LED street lamp since it is born, more and more has been subjected to the attention of countries in the world because of the characteristic of its luminous efficiency higher (electric energy can reach more than 90%), and nowadays the LED illuminating lamp becomes people's main R﹠D direction.But, because in the high-power LED lamp course of work, led chip work heating has a large amount of caloric requirements to leave.But, existing LED street lamp all adopts the mode that is installed in the LED lamp on the planar substrates and forms dot matrix on this substrate mostly, its led chip wiring board all is the design of adopting plane contact with contacting of radiator, there is the gap in aluminium radiator with contacting of LED wiring board in the use, the heat sinking function of LED will be influenced greatly, the heat radiation difficulty.Along with being extensive use of of high-power LED lamp, the particularly application of LED street lamp, the heat dissipation problem of LED light fixture become and prolong the high-power LED lamp bottleneck in service life, and heat dissipation problem solves bad, to make LED light fixture light decay serious, thereby have a strong impact on the service life of LED light fixture.
The utility model content
Technical problem to be solved in the utility model is at above-mentioned deficiency of the prior art, a kind of high-power LED lamp radiator structure is provided, it is simple in structure, reasonable in design, cost is low and heat-sinking capability is strong, can effectively solve traditional LED lamp cooling structure practical problems such as the existing heat-sinking capability difference of planar line plate.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of high-power LED lamp radiator structure, it is characterized in that: comprise dentation aluminium base and the aluminium radiator that is installed on the dentation aluminium base, plane and its another side the serrated face for for aluminium radiator install of the one side of described dentation aluminium base for installing for led chip, the broached-tooth design of described serrated face corresponding with the broached-tooth design on aluminium radiator surface and the two by described broached-tooth design engages fixed together.
Be coated with one deck substrate insulating layer on the plane of described dentation aluminium base, and substrate insulating layer is provided with one deck and covers copper circuit layer by what the printed circuit of made was formed, described led chip is weldingly fixed on and covers on the copper circuit layer.
The utility model compared with prior art has the following advantages:
1, simple in structure, reasonable in design, cost is low and processing and fabricating is convenient.
2, heat-sinking capability is strong, the utility model is used in combination the dentation aluminium base dexterously with the aluminium radiator that the surface is provided with broached-tooth design equally, and the broached-tooth design tight engagement between dentation aluminium base and aluminium radiator, improved the contact area of dentation aluminium base and aluminium radiator so greatly, improved the heat sinking function of LED light fixture to a great extent, the heat that makes led chip produce is delivered to aluminium radiator fast by the dentation aluminium base, by aluminium radiator heat is dispersed in the air then.To sum up, the utility model uses the drawback of planar line plate usually at traditional LED lamp cooling structure, proposed to use the dentation aluminium base to replace the improvement of planar line plate, because the toothed surfaces of dentation aluminium base and aluminium radiator is meshed well, when increasing the two contact area greatly, also significantly improved the radiating efficiency and the stability of radiator structure.
In sum, the utility model is simple in structure, reasonable in design, cost is low and heat-sinking capability is strong, can effectively solve traditional LED lamp cooling structure practical problems such as the existing heat-sinking capability difference of planar line plate.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Description of reference numerals:
The 1-LED chip; 2-covers copper circuit layer; The 3-substrate insulating layer;
4-dentation aluminium base; The 5-aluminium radiator.
The specific embodiment
As shown in Figure 1, the utility model comprises dentation aluminium base 4 and the aluminium radiator 5 that is installed on the dentation aluminium base 4, plane and its another side the serrated face for for aluminium radiator 5 install of the one side of described dentation aluminium base 4 for installing for led chip 1, the broached-tooth design of described serrated face corresponding with the broached-tooth design on aluminium radiator 5 surfaces and the two by described broached-tooth design engages fixed together.
In the present embodiment, be coated with one deck substrate insulating layer 3 on the plane of described dentation aluminium base 4, and substrate insulating layer 3 is provided with one deck and covers copper circuit layer 2 by what the printed circuit of made was formed, described led chip 1 is weldingly fixed on and covers on the copper circuit layer 2.
The course of work of the present utility model is: when covering copper circuit layer 2 energisings, during led chip 1 work, the heat that is produced by led chip 1 is delivered to dentation aluminium base 4 fast by very thin substrate insulating layer 3, because the broached-tooth design of dentation aluminium base 4 and aluminium radiator 5 is the toothed surfaces tight engagement, make heat to conduct to aluminium radiator 5 rapidly from dentation aluminium base 4, the two contacts by toothed surfaces, increased contact area greatly, improved heat-sinking capability well, at last the heat that is produced in led chip 1 course of work has been delivered in the outside air by aluminium radiator 5.
The above; it only is preferred embodiment of the present utility model; be not that the utility model is imposed any restrictions; everyly any simple modification that above embodiment did, change and equivalent structure are changed, all still belong in the protection domain of technical solutions of the utility model according to the utility model technical spirit.
Claims (2)
1. high-power LED lamp radiator structure, it is characterized in that: comprise dentation aluminium base (4) and be installed in aluminium radiator (5) on the dentation aluminium base (4), plane and its another side the serrated face for for aluminium radiator (5) install of the one side of described dentation aluminium base (4) for installing for led chip (1), the surperficial broached-tooth design of the broached-tooth design of described serrated face and aluminium radiator (5) corresponding and the two by described broached-tooth design engages fixed together.
2. according to the described a kind of high-power LED lamp radiator structure of claim 1, it is characterized in that: be coated with one deck substrate insulating layer (3) on the plane of described dentation aluminium base (4), and substrate insulating layer (3) is provided with one deck and covers copper circuit layer (2) by what the printed circuit of made was formed, and described led chip (1) is weldingly fixed on and covers on the copper circuit layer (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202450356U CN201521929U (en) | 2009-11-02 | 2009-11-02 | Heat dissipation structure for high-power LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202450356U CN201521929U (en) | 2009-11-02 | 2009-11-02 | Heat dissipation structure for high-power LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201521929U true CN201521929U (en) | 2010-07-07 |
Family
ID=42508105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202450356U Expired - Fee Related CN201521929U (en) | 2009-11-02 | 2009-11-02 | Heat dissipation structure for high-power LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201521929U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102478222A (en) * | 2010-11-22 | 2012-05-30 | 西安博昱新能源有限公司 | Heat radiation structure for high-power LED lamp |
| CN102966860A (en) * | 2011-08-31 | 2013-03-13 | 奥斯兰姆有限公司 | LED (light-emitting diode) lamp and method for producing LED lamp |
| CN113777473A (en) * | 2021-09-24 | 2021-12-10 | 长江存储科技有限责任公司 | Aging test system |
-
2009
- 2009-11-02 CN CN2009202450356U patent/CN201521929U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102478222A (en) * | 2010-11-22 | 2012-05-30 | 西安博昱新能源有限公司 | Heat radiation structure for high-power LED lamp |
| CN102966860A (en) * | 2011-08-31 | 2013-03-13 | 奥斯兰姆有限公司 | LED (light-emitting diode) lamp and method for producing LED lamp |
| CN113777473A (en) * | 2021-09-24 | 2021-12-10 | 长江存储科技有限责任公司 | Aging test system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: XI AN DAYU PHOTOELECTRICITY SCIENCE + TECHNOLOGY C Free format text: FORMER OWNER: ZHANG CHAO Effective date: 20100804 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 710075 ROOM 2508, BUILDING G, WANGZUO MODERN CITY, TANGYAN ROAD, NEW + HIGH-TECHNOLOGY ZONE, XI AN CITY, SHAANXI PROVINCE TO: 710075 ROOM 2508, 25/F, BUILDING G, WANGZUO MODERN CITY, TANGYAN ROAD, NEW + HIGH-TECHNOLOGY ZONE, XI AN CITY, SHAANXI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20100804 Address after: 710075 Shaanxi city of Xi'an province high tech Zone Tang Yan Mong block G of modern city 25 floor room 12505 Patentee after: Xi'an Dayu Photoelectric Technology Co., Ltd. Address before: 710075 Shaanxi city of Xi'an province high tech Zone Tang Yan Mong block G of modern city room 2508 Patentee before: Zhang Chao |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100707 Termination date: 20121102 |