CN202927510U

CN202927510U - Light-emitting diode (LED) lamp module with LED chip reversely arranged on conducting resin circuit directly

Info

Publication number: CN202927510U
Application number: CN201220250914XU
Authority: CN
Inventors: 王定锋; 徐文红
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-05-21
Filing date: 2012-05-21
Publication date: 2013-05-08
Anticipated expiration: 2022-05-21

Abstract

The utility model relates to a light-emitting diode (LED) lamp module with an LED chip reversely arranged on a conducting resin circuit directly. The LED lamp module comprises a three-dimensional heat dissipating support lamp carrier and conducting resin arranged on the three-dimensional heat dissipating support lamp carrier, the conducting resin form the circuit of the LED lamp mould. The reversely-arranged LED chip is directly reversely arranged on the circuit formed by the conducting resin in a packaging mode. According to the LED lamp module, heat transmission distance is greatly shortened, heat transmission effect is good, the circuit can be formed without etching, the LED chip is arranged in a reversely-arranged chip mounting method, when light of a lighting layer emits, shielding by an electrode and an electrode lead is avoided, light emitting efficiency of an LED is improved, current density of the LED chip is increased, the LED does not need to be weld in an attaching mode by a surface mount technology (SMT), the whole manufacturing technological process is shortened, materials are saved, manufacturing time is shortened, production efficiency is greatly improved, production cost is lowered, pollution to environment caused by etching in a traditional production manufacturing line process is reduced, and accordingly environment protection is achieved.

Description

The direct LED light fixture module on the conducting resinl circuit with the LED chip upside-down mounting

Technical field

The utility model belongs to the LED application, is specifically related to the LED light fixture module on the conducting resinl circuit with the direct upside-down mounting of LED chip.

Background technology

The combination that light fixture carrier and circuit are supported in traditional solid heat radiation is to take first to produce an aluminum-based circuit board or copper base circuit board, perhaps ceramic base wiring board, after by SMT, element being welded, then the wiring board back side is sticked on heat radiation support on the light fixture carrier, this kind method is because heat transfer distances is far away, add thermal resistance impedance layer by layer, cause the conduction velocity of heat low, the heat conduction is very slow, and production process is quite loaded down with trivial details, Production Time is long, but also environment is caused severe contamination.

How to reduce thermal resistance, the heat that LED is produced can distribute as soon as possible, is all a difficult problem of LED industry all the time, along with LED uses and develops rapidly in every field, solves this difficult problem just more and extremely more urgent.

Summary of the invention

Therefore, in order to overcome above defective and deficiency, need a kind of more simple and reliable technique.

Before describing the utility model in detail, it will be appreciated by those skilled in the art that in addition, term " circuit " and " circuit " can use interchangeably in the application.

According to a preferred embodiment of the present utility model, can be directly the LED chip of flip chip structure be encapsulated in three-dimensional heat radiation with the upside-down mounting method and supports on the conducting resinl circuit that light fixture carrier and conducting resinl circuit combine together.Owing to adopting the flip-chip installation method, LED chip is installed, therefore greatly improved the luminous efficiency of LED, increased the current density of LED chip, and improved the heat dispersion of LED chip, and good heat dispersion is very important for the reliability of LED module, especially great power LED module and service life.In addition, the light fixture carrier is supported in three-dimensional heat radiation and the conducting resinl circuit combines together, greatly shortened heat transfer distances, heat-transfer effect is good, and the welding that LED need not be other, its manufacture craft is cheap simply again, alternative existing loaded down with trivial details traditional manufacturing technique, efficient is high, low cost of manufacture, can be used for the LED field, and be widely used in various LED products.

this kind directly with the LED chip upside-down mounting LED light fixture module on the conducting resinl circuit compare with traditional manufacture craft, greatly shortened heat transfer distances, heat-transfer effect is good, and just can make circuit without etching, adopt simultaneously the flip-chip installation method that LED chip is installed, the light of luminescent layer can not be subject to covering of electrode and contact conductor when penetrating the outside, improved the luminous efficiency of LED, increased the current density of LED chip, LED and components and parts thereof also mount welding without SMT, whole manufacturing process flow shortens, saved material and shortened Production Time, greatly improved production efficiency, reduced production cost, also reduced traditional mode of production and made etching pollution on the environment in the circuit process, thereby very environmental protection.

More specifically, according to the utility model, provide a kind of directly LED light fixture module on the conducting resinl circuit with the upside-down mounting of flip chip type LED chip, comprising: the light fixture carrier is supported in three-dimensional heat radiation; Be arranged in the conducting resinl on described three-dimensional heat radiation support light fixture carrier, described conducting resinl forms the circuit of described LED light fixture module; With the flip chip type LED chip of direct flip-chip packaged on the circuit that described conducting resinl forms.

According to an embodiment of the present utility model, it is that the light fixture carrier is supported in the nonmetallic three-dimensional heat radiation of insulating that the light fixture carrier is supported in described three-dimensional heat radiation.

According to another embodiment of the present utility model, described three-dimensional heat radiation support light fixture carrier is that light fixture carrier and the combination that covers the insulating barrier on described cubic metal characters or patterns heat radiation support light fixture carrier are supported in the cubic metal characters or patterns heat radiation, and described conducting resinl directly is arranged on described insulating barrier.

According to another embodiment of the present utility model, described cubic metal characters or patterns heat radiation is supported the light fixture carrier and is made by aluminium, copper, aluminium alloy, copper alloy or stainless steel.

According to another embodiment of the present utility model, described flip-chip packaged is that described flip chip type LED chip is installed the encapsulation that is connected on the described circuit that described conducting resinl forms.

According to another embodiment of the present utility model, described flip chip type LED chip is that no-welding type is connected to the flip chip type LED chip on the described circuit that described conducting resinl forms.

According to another embodiment of the present utility model, described three-dimensional heat radiation support light fixture carrier is the radiator with a plurality of radiating fins.

According to another embodiment of the present utility model, described LED light fixture module also comprises the reflective membrane that is arranged in described three-dimensional heat radiation support light fixture carrier one side.

According to another embodiment of the present utility model, described conducting resinl is cold curing conducting resinl, intermediate temperature setting conducting resinl, hot setting conducting resinl or UV-Curing Electric Conductive Adhesives.

According to another embodiment of the present utility model, described conducting resinl is directly to be printed on described three-dimensional heat radiation to support the conducting resinl that forms described circuit on the light fixture carrier.

According to another embodiment of the present utility model, described flip chip type LED chip is the high-power LED chip of flip chip type.

According to another embodiment of the present utility model, described LED module is used for making LED illuminating module, LED bulb lamp, LED street lamp, LED fluorescent tube, LED panel light, LED shot-light, LED Down lamp or LED sign module.

According to an embodiment of the present utility model, described conducting resinl is to have electric conductivity and the conductive rubber that can solidify, conduction lotion or conduction slurry.

According to an embodiment of the present utility model, described reflective membrane Pasting works the effect of conducting resinl route protection and the effect of reflective increase front face brightness done simultaneously on the conducting resinl circuit.

In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.

Description of drawings

Fig. 1 supports for the solid heat radiation at metal according to the utility model one embodiment the schematic diagram that insulating barrier is set on the light fixture carrier.

Fig. 2 supports for the conducting resinl according to the utility model one embodiment is printed on the cubic metal characters or patterns heat radiation schematic diagram that forms the conducting resinl circuit on light fixture carrier insulating barrier.

Fig. 3 is for being bonded and fixed at the LED chip of inverted structure and power supply terminal schematic diagram on the conducting resinl circuit according to the utility model one embodiment.

Fig. 4 is the schematic diagram after the LED chip sealing of inverted structure shown in Figure 3.

Fig. 5 is the schematic diagram after pasting one deck reflective membrane on the conducting resinl circuit of the LED light fixture module of making shown in Figure 4.

Fig. 6 is according to the LED light fixture module of the utility model one embodiment and the decomposing schematic representation of the lampshade of preparing to cover.

Fig. 7 is for covering the schematic diagram after lampshade according to the LED light fixture module of the utility model one embodiment.

The specific embodiment

The below will directly the concrete enforcement of the LED light fixture module on the conducting resinl circuit be described in more detail with the LED chip upside-down mounting to of the present utility model.

But those skilled in the art are appreciated that obviously these embodiments have only enumerated some preferred embodiments of the present utility model, to the utility model and protection domain thereof without any restriction.Those of ordinary skill in the art can carry out some apparent variation and changes to these under the situation of understanding the utility model basic conception, these all belong in scope of the present utility model.Scope of the present utility model is only limited by claim.

According to a preferred embodiment of the present utility model, light fixture carrier 1 is supported in cubic metal characters or patterns heat radiation as shown in Figure 1 clean and dry with the insulating barrier 2 that overlays on cubic metal characters or patterns heat radiation support light fixture carrier 1.

Cubic metal characters or patterns heat radiation is supported light fixture carrier 1 and is preferably made by the metal of the high thermal conductivity of being convenient to dispel the heat, for example aluminium, copper, aluminium alloy, copper alloy, etc.

Certainly, those of ordinary skill in the art it is also understood that, it can be also that the light fixture carrier is supported in the nonmetallic three-dimensional heat radiation of insulating that the light fixture carrier is supported in the solid heat radiation of LED light fixture module of the present utility model, is for example the good insulating polymer carrier of ceramic monolith, thermal conductivity, etc.In this case, can omit the insulating barrier 2 that overlays on cubic metal characters or patterns heat radiation support light fixture carrier 1.

Then, in another preferred embodiment of the present utility model, circuit according to design, the cubic metal characters or patterns heat radiation that conducting resinl 3 is printed on the LED light fixture is supported on the insulating barrier 2 of light fixture carrier 1 (if the light fixture carrier is supported in the nonmetal three-dimensional heat radiation of insulation, support on the light fixture carrier with regard to the nonmetal three-dimensional heat radiation that directly conducting resinl 2 is printed on insulation), the conducting wire 3 (as shown in Figure 2) of a kind of conducting resinl of formation

Afterwards, according to a preferred embodiment of the present utility model, just can adopt the flip-chip installation method that LED chip 4 is installed on the conducting resinl circuit 3 of solid heat radiation support light fixture carrier 1, the electrode of LED chip 4 is engaged with conducting resinl circuit 3, and place bonding power supply terminal 6 at the wiring position place of power line, then carry out following steps: oven dry (as shown in Figure 3) → test → sealing 5 (as shown in Figure 4) → curing → test, obtain with the LED light fixture module of the direct upside-down mounting of LED chip 4 on conducting resinl circuit 3, as shown in Figure 4.The installation method of flip-chip is known for the those of ordinary skill in electronic devices and components field, therefore repeats no more.

After the LED light fixture module that completes shown in Figure 4; also can be according to flip LED chips 4 being arranged the position of sealing 5 and the position of power supply terminal 6; leave in advance window; then be pasted on (as shown in Figure 5) on conducting resinl circuit 3 with reflective membrane 7; reflective membrane 7 plays does protection circuit effect and the effect of reflective increase front face brightness, then tests, covers lampshade 7 (as Fig. 6, shown in Figure 7).

Below the specific embodiment of the LED light fixture module on the conducting resinl circuit is described in detail the utility model with the LED chip upside-down mounting by reference to the accompanying drawings and directly.But, it will be appreciated by those skilled in the art that the above is only to illustrate and describe some specific embodiment, to scope of the present utility model, especially the scope of claim, do not have any restriction.Scope of the present utility model only is defined by the claims.

Claims

1. the direct LED light fixture module on the conducting resinl circuit with the LED chip upside-down mounting, is characterized in that, described LED light fixture module comprises:

The light fixture carrier is supported in three-dimensional heat radiation;

Be arranged in the conducting resinl on described three-dimensional heat radiation support light fixture carrier, described conducting resinl forms the circuit of described LED light fixture module; With

The flip chip type LED chip of direct flip-chip packaged on the circuit that described conducting resinl forms.

2. the directly LED light fixture module on the conducting resinl circuit with the LED chip upside-down mounting according to claim 1 is characterized in that: it is that the light fixture carrier is supported in the nonmetallic three-dimensional heat radiation of insulation that the light fixture carrier is supported in described three-dimensional heat radiation.

3. the directly LED light fixture module on the conducting resinl circuit with the LED chip upside-down mounting according to claim 1, it is characterized in that: described three-dimensional heat radiation support light fixture carrier is that light fixture carrier and the combination that covers the insulating barrier on described cubic metal characters or patterns heat radiation support light fixture carrier are supported in the cubic metal characters or patterns heat radiation, and described conducting resinl directly is arranged on described insulating barrier.

4. the directly LED light fixture module on the conducting resinl circuit with the LED chip upside-down mounting according to claim 1, it is characterized in that: described conducting resinl is to have electric conductivity and the conductive rubber that can solidify, conduction lotion or conduction slurry.

5. the directly LED light fixture module on the conducting resinl circuit with the LED chip upside-down mounting according to claim 1 is characterized in that: described flip chip type LED chip is that no-welding type is connected to the flip chip type LED chip on the described circuit that described conducting resinl forms.

6. the directly LED light fixture module on the conducting resinl circuit with the LED chip upside-down mounting according to claim 1 is characterized in that: it is three-dimensional radiator with a plurality of radiating fins that the light fixture carrier is supported in described three-dimensional heat radiation.

7. the directly LED light fixture module on the conducting resinl circuit with the LED chip upside-down mounting according to claim 1 is characterized in that: described LED light fixture module also comprises and is arranged in the reflective membrane that light fixture carrier one side is supported in described three-dimensional heat radiation.

8. the directly LED light fixture module on the conducting resinl circuit with the LED chip upside-down mounting according to claim 1, it is characterized in that: described conducting resinl is cold curing conducting resinl, intermediate temperature setting conducting resinl, hot setting conducting resinl or UV-Curing Electric Conductive Adhesives.

9. directly with LED chip upside-down mounting LED light fixture module on conducting resinl circuit described according to any one in above claim, it is characterized in that: described conducting resinl is directly to be printed on described three-dimensional heat radiation to support the conducting resinl that forms described circuit on the light fixture carrier.

10. the directly LED light fixture module on the conducting resinl circuit with the LED chip upside-down mounting according to claim 1, it is characterized in that: described flip chip type LED chip is the high-power LED chip of flip chip type.