CN202647293U - Light emitting diode (LED) lamp belt module capable of directly forming LED support on guide wires - Google Patents
Light emitting diode (LED) lamp belt module capable of directly forming LED support on guide wires Download PDFInfo
- Publication number
- CN202647293U CN202647293U CN2012202506546U CN201220250654U CN202647293U CN 202647293 U CN202647293 U CN 202647293U CN 2012202506546 U CN2012202506546 U CN 2012202506546U CN 201220250654 U CN201220250654 U CN 201220250654U CN 202647293 U CN202647293 U CN 202647293U
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- Prior art keywords
- led
- wire
- support
- plain conductor
- cup
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- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model relates to a light emitting diode (LED) lamp belt module capable of directly forming an LED support on guide wires. The LED lamp belt module comprises metal guide wires, an insulation support and an LED chip, wherein the insulation support is combined with the metal guide wires into a whole, and the LED chip is arranged in the insulation support in sealing mode and connected with the metal guide wires to form an LED operation circuit. The LED lamp belt module is simple in structure, high in operation reliability, brief in manufacturing process, high in production efficiency, low in production cost, and environmental-friendly.
Description
Technical field
The utility model belongs to the LED application, is specifically related to directly make at wire the LED lamp band module of packaged chip on the LED insulating support.
Background technology
Traditional LED cup-shaped support, namely the led support of SMT paster all forms by metallic plate or the die-cut backlash pressure injection of metal tape.
The utility model is a plurality of cup-shaped support that directly form the LED interconnection at wire, reduced the making flow process, saved material, made simultaneously LED lamp pearl and circuit integrating, no longer used by the SMT surface mount bead weld of LED lamp is connected on making LED lamp band module or LED product on the wiring board.
Therefore, the utility model is directly made the alternative existing loaded down with trivial details traditional manufacturing technique of LED lamp band module of LED insulating materials cup-shaped support packaged chip at wire.Can be used for the LED field, and be widely used in various LED products.Low cost of manufacture, efficient are high, and very environmental protection.
Summary of the invention
The utility model relates to the LED lamp band module of directly making LED insulating materials cup-shaped support packaged chip at wire.
More specifically, the utility model provides a kind of LED lamp band module that directly forms led support on wire, comprising: plain conductor; The insulating support that is combined as a whole with described plain conductor; Be encapsulated in the described insulating support and be electrically connected the led chip that forms the LED operating circuit with described plain conductor.
According to an embodiment of the present utility model, described plain conductor is the wall scroll plain conductor, wherein, forms a plurality of breach at described wall scroll plain conductor, and described breach is positioned in the described insulating support.
According to an embodiment of the present utility model, described insulating support is the cup-shaped support that injection moulding forms cup-like structure on described plain conductor, two plain conductor sections of described breach both sides are positioned at the cup end of described cup-shaped support, are formed for the die bond of described led chip and the connecting portion of nation's line.
According to an embodiment of the present utility model, described plain conductor is two plain conductors that are arranged side by side, and described insulating support is positioned to across described two strip metal wires.
According to an embodiment of the present utility model, described insulating support is the cup-shaped support that injection moulding forms cup-like structure on described plain conductor, and described two strip metal wires are formed for the die bond of described led chip and the connecting portion of nation's line in described cup-shaped support.
According to an embodiment of the present utility model, described two strip metal wires are plain conductors parallel to each other.
According to an embodiment of the present utility model, described insulating support is the cup-shaped support that injection moulding forms cup-like structure on described plain conductor.
According to an embodiment of the present utility model, described plain conductor is the many strip metals that the are arranged side by side wire more than two, wherein, each described insulating support is positioned to across described many strip metals wire, and described insulating support is the cup-shaped support that injection moulding forms cup-like structure on described plain conductor.
According to an embodiment of the present utility model, the described LED lamp band module that directly forms led support on wire forms LED light fixture, LED Christmas lamp, LED neon light, LED guardrail pipe, LED advertisement and identifier, LED panel light or LED fluorescent tube.
According to an embodiment of the present utility model, described led chip die bond and its negative wire nation fix on the cathode conductor in the described two strip metal wires, and the positive wire nation of described led chip fixes on the positive wire in the described two strip metal wires.
According to an embodiment of the present utility model, described plain conductor is silver-plated plain conductor.
According to the utility model, a kind of method that directly forms the LED lamp band module of led support on the wire that is produced on is provided, comprising: plain conductor is provided; Injection moulding forms the insulator with cup-like structure on described plain conductor; In described cup-like structure, led chip is carried out die bond and nation's line operation, each led chip is connected electrically between two different plain conductors or the metal guide line segment, thereby forms the LED operating circuit; The led chip of finishing die bond and nation's line is encapsulated in the described cup-like structure.
The utility model also provides a kind of LED lamp band module of directly making LED insulating materials cup-shaped support packaged chip at wire, comprising: the plain conductor that the tensioning that is arranged in parallel is fixing; Be combined in the insulating materials reflector of plain conductor relevant position; Be encapsulated in the led chip on the plain conductor in the insulating materials reflector; With the encapsulating structure that is used for packaging LED chips.Light fixture module of the present utility model can be widely used in LED light fixture, LED Christmas lamp, LED neon light, LED guardrail pipe, LED advertisement and identifier, LED panel light, LED fluorescent tube etc.The utility model making flow process is brief, and production efficiency is high; Production cost is low; And very environmental protection
According to the utility model, the LED lamp band module of directly making LED insulating materials cup-shaped support packaged chip at wire also is provided, comprising: plain conductor; Plain conductor is combined with the insulating materials reflector and is formed support, forms metal both positive and negative polarity tie point in cup; Be encapsulated in the led chip on the plain conductor in the insulating materials reflector; With the encapsulating structure that is used for packaging LED chips.
According to an embodiment of the present utility model, described insulating materials reflector support is to form in single wire, and wire forms one and disconnects mouth in the cup bottom, form chip die bond and nation's line (bonding) both positive and negative polarity tie point at the two ends that disconnect mouth.
According to an embodiment of the present utility model, described insulating materials reflector support is to form at two wires side by side, and two lines at the bottom of cup form chip die bond and nation's line both positive and negative polarity tie point, and led chip die bond, nation's line connect conducting at tie point.
According to an embodiment of the present utility model, described insulating materials reflector support be more than three or three side by side wire form, many wires at the bottom of cup form a plurality of chip die bonds and nation's line both positive and negative polarity tie point, are packaged into the LED lamp of a plurality of chips.
According to an embodiment of the present utility model, described insulating materials reflector support is to form at two or more wire side by side, each bar wire forms one and disconnects mouth in the cup bottom, form the tie point of a plurality of chips and nation's line at disconnection mouthful two ends, is packaged into the LED lamp of a plurality of chips.
According to an embodiment of the present utility model, described insulating materials reflector support is the support of the cup-like structure that injection moulding forms on wire.
According to an embodiment of the present utility model, described insulating materials reflector support be by the back side with glue insulating laminated plate, central conductor layer and have cup-like structure with glue insulating materials reflector adhesive solidification cup-like structure support together.
According to an embodiment of the present utility model, the described LED lamp band module that directly forms led support on wire is the module that comprises one or more LED lamps.
The utility model has also disclosed a kind of method that directly forms the LED lamp band module of led support on the wire that is produced on, and comprising: plain conductor is provided; Injection moulding forms the insulator with concave structure on described plain conductor; In described concave structure, led chip is carried out die bond and nation's line operation, each led chip is connected electrically between two different plain conductors or the metal guide line segment, thereby forms the LED operating circuit; The led chip of finishing die bond and nation's line is encapsulated in the described concave structure.
In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
Fig. 1 for according to the utility model one embodiment with wire with the be arranged in parallel schematic diagram of two fixing strip metal wires of tensioning of mould.
Fig. 2 is that plain conductor shown in Figure 1 is combined the schematic diagram that forms support with the insulating materials reflector.
Fig. 3 forms support and the integrated schematic diagram of circuit for the redundance that the circuit according to design excises wire shown in Figure 2.
Fig. 4 is for fixing on led chip nation in the schematic diagram on the wire in the insulating materials reflector shown in Figure 3.
Fig. 5 is to the schematic diagram after the structure sealing shown in Figure 4.
Fig. 6 is generalized section directly make the LED light fixture product of LED cup support packaging LED chips at two strip metal wires shown in Figure 4.
Fig. 7 for according to another embodiment of the utility model with wire with the be arranged in parallel schematic diagram of the fixing strip metal wire of tensioning of mould.
Fig. 8 is the schematic diagram that goes out the excision mouth in the position of the led chip to be packaged of wire shown in Figure 7 with die punching.
Fig. 9 be with glue insulating laminated plate, plain conductor shown in Figure 8 and insulating materials body with cup-like structure at the incision site place of wire in conjunction with the schematic diagram that forms support.
Figure 10 is the generalized section of the support shown in " Fig. 9 ".
Figure 11 is for fixing on led chip nation in the schematic diagram at the incision site place of the wire in the insulating materials reflector shown in Figure 9.
Figure 12 is the schematic diagram after the LED cup support packaging LED chips that wall scroll plain conductor shown in Figure 11 is made carries out sealing.
Figure 13 is in the generalized section of directly making the LED light fixture product of LED cup support packaging LED chips at wall scroll plain conductor shown in Figure 11.
Figure 14 for according to another embodiment of the utility model with wire with the be arranged in parallel schematic diagram of the fixing many strip metals wire of tensioning of mould.
Figure 15 is that many strip metals wire shown in Figure 14 is combined the schematic diagram that forms support with the insulating materials reflector.
Figure 16 is for fixing on a plurality of led chip nation in the schematic diagram on the corresponding many wires in the insulating materials reflector shown in Figure 15.
Figure 17 is for carrying out the schematic diagram after the sealing to LED cup support packaging LED chips shown in Figure 16.
Figure 18 is the schematic diagram after three strip metal wires making LED cup support packaging LED chips carries out sealing according to another embodiment of the utility model.
The specific embodiment
The below will be described in more detail the utility model direct implementation that forms the LED lamp band module of led support on wire.
But those skilled in the art are appreciated that obviously these embodiments have only enumerated some preferred embodiments of the present utility model, to the utility model and protection domain thereof without any restriction.Those of ordinary skill in the art can carry out some apparent variation and changes to these under the situation of understanding the utility model basic conception, these all belong in the scope of the present utility model.Scope of the present utility model is only limited by claim.
Embodiment one makes LED insulating materials LED cup-shaped support at two wires
1, first two wires 1 is carried out silver-plated processing (entirely silver-plated), again with wire 1 abreast, the tensioning of preferred parallel juxtaposition ground is fixed on the wiring mould (as shown in Figure 1), then the fixing wire 1 of tensioning is inserted in the injection mold of injection machine, inject raw material, injection mo(u)lding insulating materials reflector 2 on adjacent two wires 1 corresponding position, form the LED cup-shaped support (as shown in Figure 2) that two strip metal wires 1 and insulating materials reflector 2 are fixed together, such LED cup-shaped support can be a plurality of, for example as shown in Figure 2.
2, according to the circuit of design, can with the unnecessary wire excision in the LED cup-shaped support outside, be made into wire circuit (for example series circuit shown in Figure 3), thereby form LED cup-shaped support and the integrated structure of wire line (as shown in Figure 3).
3, the cathode conductor at the cup end of insulating materials reflector 2 drips bonded adhesives → paste led chip 3 and oven dry in the position of dripping bonded adhesives and then fixed (bonding) led chip 3 of nation; For example, according to a preferred embodiment, the negative wire nation of led chip 3 can be fixed on the cathode conductor of bonding chip, the positive wire nation of led chip 3 is fixed on (as shown in Figure 4) → test-based examination on another wire → seal up encapsulation with the curing → test → FQC of glue 4 (shown in Fig. 5,6) → curings → afterwards → pack → put in storage.Like this, just be made into a kind of LED lamp band module of directly making LED insulating materials cup-shaped support packaged chip at two wires.
Embodiment two makes LED insulating materials LED cup-shaped support in single wire
1, first wire 1 is carried out silver-plated processing (entirely silver-plated), again with wire 1 abreast, the ground tensioning of preferred parallel juxtaposition is fixed on the wiring mould (as shown in Figure 7), then prepare the position of packaging LED chips at wire with mould, punch out breach 5 (as shown in Figure 8), with the back side that sticks on breach 6 places of wire 1 with insulating laminated plate 6 (for example as shown in figure 10) contraposition of glue, front at breach 5 places of wire 1 is pasted together with the one side contraposition of the insulating materials body 7 with the cup-like structure of being preferably with glue, forms such as Fig. 9, the insulating materials reflector support 7 of structure shown in 10.
2, drip bonded adhesives → paste led chip 3 and oven dry in the position of dripping bonded adhesives and then fixed (bonding) led chip 3 of nation at the wire of wire otch 5 one ends at the cup end of insulating materials reflector 7; For example, according to a preferred embodiment, the negative wire nation of led chip 3 can be fixed on the cathode conductor of bonding chip, the positive wire nation of led chip 3 is fixed on (as shown in figure 11) → test-based examination on otch 5 another routine wires → seal up encapsulation with the curing → test → FQC of glue 4 (shown in Figure 12,13) → curings → afterwards → pack → put in storage.Like this, just be made into a kind of LED lamp band module of directly making LED insulating materials cup-shaped support packaged chip in single wire.
Embodiment three makes LED insulating materials LED cup-shaped support at many wires
1, first wire 1 is carried out silver-plated processing (entirely silver-plated), again with many wires 1 abreast, the tensioning of preferred parallel juxtaposition ground is fixed on the wiring mould (as shown in figure 14), then the fixing wire 1 of tensioning is inserted in the injection mold of injection machine, inject raw material, injection mo(u)lding insulating materials reflector 2 on many wires 1 corresponding position forms the LED cup-shaped support (as shown in figure 15) that many (being shown as 4 such as Figure 14) plain conductors 1 and insulating materials reflector 2 are fixed together.
2, drip bonded adhesives → paste led chip 3 and oven dry in the position of dripping bonded adhesives in the corresponding position of each cathode conductor at the cup end of insulating materials reflector 2, and then fixed (bonding) led chip 3 of nation; For example, according to a preferred embodiment, the negative wire nation of each led chip 3 can be fixed on this wire of die bond separately, and respectively with the positive wire of different chips together nation's line (bonding) do not having (as shown in figure 16) → test-based examination on another common wire of die bond → seal up encapsulation with the curing → test → FQC of glue 4 (shown in Figure 17,18) → curings → afterwards → pack → put in storage.Like this, just be made into a kind of LED lamp band module of directly making LED insulating materials cup-shaped support packaged chip at many shown in Figure 16 (for example four) wires as shown in figure 17.
As shown in figure 18 be a kind of LED lamp band module of directly making LED insulating materials cup-shaped support packaged chips at three wires according to another embodiment of the utility model, wherein, each LED in the same insulation cup-shaped support 2 are connected electrically on the same wire line 1 at place.
By above preferred embodiment also by reference to the accompanying drawings, direct LED lamp band module at one or more wire making LED insulating materials cup-shaped support packaged chip of the present utility model is described in detail.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some specific embodiment, to scope of the present utility model, especially the scope of claim does not have any restriction.Scope of the present utility model only is defined by the claims.
Claims (10)
1. a LED lamp band module that directly forms led support on wire is characterized in that, described LED lamp band module comprises:
Plain conductor;
The insulating support that is combined as a whole with described plain conductor; With
Be encapsulated in the described insulating support and be electrically connected the led chip that forms the LED operating circuit with described plain conductor.
2. the LED lamp band module that on wire, directly forms led support according to claim 1, it is characterized in that: described insulating support is the cup-shaped support that injection moulding forms cup-like structure on described plain conductor, described plain conductor is the wall scroll plain conductor, wherein, form a plurality of breach at described wall scroll plain conductor, described breach is positioned in the described insulating support.
3. the LED lamp band module that directly forms led support on wire according to claim 1, it is characterized in that: described insulating support is the cup-shaped support that injection moulding forms cup-like structure on described plain conductor.
4. the LED lamp band module that on wire, directly forms led support according to claim 2, it is characterized in that: two plain conductor sections of described breach both sides are positioned at the cup end of described cup-shaped support, are formed for the die bond of described led chip and the connecting portion of nation's line.
5. according to claim 1 or the 3 described LED lamp band modules that on wire, directly form led support, it is characterized in that: described plain conductor is two plain conductors that are arranged side by side, described insulating support is positioned to across described two strip metal wires, and described two strip metal wires are formed for the die bond of described led chip and the connecting portion of nation's line in described cup-shaped support.
6. the LED lamp band module that directly forms led support on wire according to claim 5, it is characterized in that: described two strip metal wires are plain conductors parallel to each other.
7. the LED lamp band module that on wire, directly forms led support according to claim 5, it is characterized in that: described led chip die bond and its negative wire nation fix on the cathode conductor in the described two strip metal wires, and the positive wire nation of described led chip fixes on the positive wire in the described two strip metal wires.
8. according to claim 1 or the 3 described LED lamp band modules that on wire, directly form led support, it is characterized in that: described plain conductor is the many strip metals that the are arranged side by side wire more than two, wherein, each described insulating support is positioned to across described many strip metals wire.
9. each described LED lamp band module that directly forms led support on wire according to claim 1-4, it is characterized in that: described LED lamp band module forms LED light fixture, LED Christmas lamp, LED neon light, LED guardrail pipe, LED advertisement and identifier, LED panel light or LED fluorescent tube.
10. each described LED lamp band module that directly forms led support on wire according to claim 1-4, it is characterized in that: described plain conductor is silver-plated plain conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202506546U CN202647293U (en) | 2012-05-21 | 2012-05-21 | Light emitting diode (LED) lamp belt module capable of directly forming LED support on guide wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202506546U CN202647293U (en) | 2012-05-21 | 2012-05-21 | Light emitting diode (LED) lamp belt module capable of directly forming LED support on guide wires |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202647293U true CN202647293U (en) | 2013-01-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202506546U Expired - Lifetime CN202647293U (en) | 2012-05-21 | 2012-05-21 | Light emitting diode (LED) lamp belt module capable of directly forming LED support on guide wires |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202647293U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709444A (en) * | 2012-05-21 | 2012-10-03 | 王定锋 | Light-emitting diode (LED) strip module with LED brackets directly formed on wires and manufacturing method for LED strip module |
| CN103388805A (en) * | 2013-07-01 | 2013-11-13 | 临安市新三联照明电器有限公司 | LED (Light Emitting Diode) filament support series connection forming method based on support material plate |
-
2012
- 2012-05-21 CN CN2012202506546U patent/CN202647293U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709444A (en) * | 2012-05-21 | 2012-10-03 | 王定锋 | Light-emitting diode (LED) strip module with LED brackets directly formed on wires and manufacturing method for LED strip module |
| CN102709444B (en) * | 2012-05-21 | 2015-03-18 | 王定锋 | Light-emitting diode (LED) strip module with LED brackets directly formed on wires and manufacturing method for LED strip module |
| CN103388805A (en) * | 2013-07-01 | 2013-11-13 | 临安市新三联照明电器有限公司 | LED (Light Emitting Diode) filament support series connection forming method based on support material plate |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130102 |
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| CX01 | Expiry of patent term |