CN113572024A

CN113572024A - Light emitter, depth module and terminal

Info

Publication number: CN113572024A
Application number: CN202110788624.4A
Authority: CN
Inventors: 戴阳
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-07-13
Filing date: 2021-07-13
Publication date: 2021-10-29
Also published as: WO2023284369A1

Abstract

The application discloses light emitter, degree of depth module and terminal. The light emitter includes a first substrate, a light emitting module, and a driving module. The first substrate comprises a first side and a second side which are opposite to each other; the light emitting module is arranged on the first side and comprises a plurality of light emitting units; and the driving module is arranged on the second side and electrically connected with the light-emitting module so as to drive the light-emitting unit to emit light. In the light emitter, degree of depth module and the terminal of this application embodiment, light-emitting module and drive module set up the both sides at first substrate respectively, compare in drive module, light-emitting module and both walk line parts and all set up in first substrate with one side, area occupied is great, and when drive module and light-emitting module set up the both sides at first substrate, the area that drive module and light-emitting module occupy first substrate is less, is favorable to the miniaturization of degree of depth module.

Description

Light emitter, depth module and terminal

Technical Field

The present application relates to the field of depth technology, and more particularly, to an optical transmitter, a depth module, and a terminal.

Background

A Vertical-Cavity Surface-Emitting Laser (Vcsel) is a semiconductor Laser array, which is widely used in a depth module to realize depth detection of a target object. Vcsel and the corresponding drive chip are generally arranged on the substrate at the same time, the drive chip leads out a plurality of control lines, each control line is connected with the Vcsel unit on the Vcsel, so that the control on the Vcsel is realized through the drive chip, the area of the substrate occupied by the Vcsel, the drive chip and the control lines is large, the area of the substrate is large, and the miniaturization of the depth module is not facilitated.

Disclosure of Invention

The embodiment of the application provides an optical transmitter, a depth module and a terminal.

The light emitter of the embodiment of the present application includes a first substrate, a light emitting module, and a driving module. The first substrate comprises a first side and a second side which are opposite to each other; the light emitting module is arranged on the first side and comprises a plurality of light emitting units; and the driving module is arranged on the second side and electrically connected with the light-emitting module so as to drive the light-emitting unit to emit light.

The depth module of the embodiments of the present application includes an optical receiver and an optical transmitter. The light receiver is used for receiving the light rays emitted by the light emitter and reflected by the target object to generate the depth image. The light emitter includes a first substrate, a light emitting module, and a driving module. The first substrate comprises a first side and a second side which are opposite to each other; the light emitting module is arranged on the first side and comprises a plurality of light emitting units; and the driving module is arranged on the second side and electrically connected with the light-emitting module so as to drive the light-emitting unit to emit light.

The terminal of the embodiment of the application comprises a shell and a depth module. The depth module is arranged on the shell. The depth module includes an optical receiver and an optical transmitter. The light receiver is used for receiving the light rays emitted by the light emitter and reflected by the target object to generate the depth image. The light emitter includes a first substrate, a light emitting module, and a driving module. The first substrate comprises a first side and a second side which are opposite to each other; the light emitting module is arranged on the first side and comprises a plurality of light emitting units; and the driving module is arranged on the second side and electrically connected with the light-emitting module so as to drive the light-emitting unit to emit light.

In the light emitter, degree of depth module and the terminal of this application embodiment, light-emitting module and drive module set up the both sides at first substrate respectively, compare in drive module, light-emitting module and both walk line parts and all set up in first substrate with one side, area occupied is great, and when drive module and light-emitting module set up the both sides at first substrate, the area that drive module and light-emitting module occupy first substrate is less, is favorable to the miniaturization of degree of depth module.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a light emitter according to some embodiments of the present application;

FIG. 2 is a schematic block diagram of a terminal according to some embodiments of the present application;

FIG. 3 is a schematic diagram of a depth module according to some embodiments of the present disclosure;

FIG. 4 is a schematic plan view of a light emitter according to some embodiments of the present application;

fig. 5 and 6 are schematic structural diagrams of light emitters according to some embodiments of the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the embodiments of the present application.

Referring to fig. 1, an embodiment of the present application provides a light emitter 10. The light emitter 10 includes a first substrate 11, a light emitting module 12, and a driving module 13. The first substrate 11 comprises opposite first 111 and second 112 sides; the light emitting module 12 is disposed at the first side 111, the light emitting module 12 including a plurality of light emitting units 121; and the driving module 13 is disposed on the second side 112, and the driving module 13 is electrically connected to the light emitting module 12 to drive the light emitting unit 121 to emit light.

In the light emitter 10 of the embodiment of the present application, the light emitting module 12 and the driving module 13 are respectively disposed on two sides of the first substrate 11, and compared to the driving module 13, the light emitting module 12 and the routing portions of the driving module 13 and the light emitting module 12, which are disposed on the same side of the first substrate 11, the occupied area is large, when the driving module 13 and the light emitting module 12 are disposed on two sides of the first substrate 11, the area occupied by the driving module 13 and the light emitting module 12 on the first substrate 11 is small, which is beneficial to the miniaturization of the depth module 100.

Referring to fig. 2, a terminal 1000 according to an embodiment of the present disclosure includes a housing 200 and a depth module 100. The depth module 100 is disposed on the housing 200. Enclosure 200 can include a side wall 201 and a back panel 202 at a bottom, where side wall 201 and back panel 202 form a mounting space 203 for receiving components of terminal 1000. It is understood that the depth module 100 is disposed in the installation space 203, and when the depth module 100 needs to generate the depth information of the target object, the depth information of the target object can be obtained by emitting light to the target object through the back plate 202. The housing 200 also provides dust, water and protection for the depth module 100.

The material of the casing 200 may be metal, glass, plastic, etc., and the material of the casing 200 may also be a mixture of metal, glass and plastic. For example, the sidewall 201 is made of metal, and the back plate 202 is made of glass. For another example, the sidewall 201 and a portion of the backplate 202 are made of metal, and the other portion of the backplate 202 is made of glass.

Terminal 1000 can be, but is not limited to, VR glasses, AR glasses, a mobile phone, a tablet computer, a laptop computer, a smart watch, a game machine, a head-up display device, a laser ruler, etc., and in these electronic devices, a depth module 100 is often provided to implement a function of generating depth information of a target object.

Referring to fig. 3, the depth module 100 includes an optical transmitter 10 and an optical receiver 20. The light emitter 10 is used for emitting light to a target object, and the light receiver 20 is used for receiving the light reflected by the target object to generate a depth image. The depth image is used to characterize depth information of the target object.

The optical transmitter 10 may be a Vcsel light source, which has the advantages of small size, high connection efficiency, flexible and adjustable output power, etc. The Light emitter 10 may also be an edge-Emitting semiconductor (EEL) or Light Emitting Diode (LED) Light emitter. These light emitters 10 may be point light emitters 10 made of a single laser or diode, or may be arrayed light emitters made of multiple lasers or diodes. While the optical transmitter 10 in the embodiments of the present application is Vcsel, it is to be understood that the optical transmitter 10 is not limited to Vcsel.

The optical receiver 20 may include a Complementary Metal Oxide Semiconductor (CMOS) image sensor, which receives the structured light (e.g., speckle structured light) emitted by the optical transmitter 10 and reflected by the target object, and compares the received structured light with the reference depth image to generate a depth image of the target object.

The optical receiver 20 may include an image sensor composed of Single Photon Avalanche Diode (span), that is, the image sensor is formed by arranging a plurality of Single Photon Avalanche Diode arrays, so that a depth image of the target object can be generated based on the time-of-flight principle. The time-of-flight principle is to directly measure the emitting time of the light emitted from the light emitter 10 and the receiving time of the reflected light received by the single photon avalanche diode, and calculate the distance between the target object and the image sensor 40 according to the time difference, thereby generating the depth image. The present embodiment will be described by taking as an example an image sensor in which the optical receiver 20 includes a single photon avalanche diode.

The depth module 100 also includes a housing 30 and a lens 40. The housing 30 includes a side plate 31 and a top plate 32, the top plate 32 defines a first opening 321 and a second opening 322, and the lens 40 can be used to collimate the light emitted from the light emitter 10 so that the light emitted from the light emitter 10 can be emitted to the target object in parallel. The first opening 321 is disposed opposite to the light emitter 10, light emitted from the light emitter 10 passes through the lens 40 and then exits from the first opening 321, the second opening 322 is disposed opposite to the light receiver 20, and light emitted from the light emitter 10 is reflected by the target object and then received by the light receiver 20 after passing through the second opening 322, so as to generate a depth image.

Referring to fig. 1 again, the light emitter 10 includes a first substrate 11, a light emitting module 12, a driving module 13, a conductive element 14, and a circuit board 15.

The first substrate 11 comprises a first side 113 and a second side 114 opposite to each other, the first side 113 being located at the first side 111 of the first substrate 11, and the second side 114 being located at the second side 112 of the first substrate 11. The first substrate 11 may be a ceramic substrate, a diamond substrate, or a graphene substrate, and has good heat dissipation performance.

The light emitting module 12 is arranged on the first side 111, in particular on the first face 113. The light emitting module 12 includes a plurality of light emitting units 121 and a plurality of first connectors 122.

Referring to fig. 4, the light emitting units 121 are Vcsel units, and the light emitting units 121 are regularly or irregularly arranged. For example, the plurality of light emitting units 121 are arranged in a matrix, or the plurality of light emitting units 121 are randomly arranged.

The light emitting units 121 are divided into M groups, each group includes N light emitting units 121, the N light emitting units 121 of each group are sequentially connected, that is, the N light emitting units 121 of each group are connected in series, and M and N are integers greater than or equal to 1. As shown in fig. 4, the light emitting cells 121 are divided into 10 groups, each group including 8 light emitting cells 121, and each group of 8 light emitting cells 121 is connected in series.

The first connector 122 is a member provided on the light emitting module 12 for connecting with the driving module 13. The first connecting member 122 may be a pad, a pin, or the like that can be electrically connected. The number of the first connectors 122 is plural, each first connector 122 is connected to Q groups of light-emitting units 121 (as shown in fig. 4, one first connector 122 is connected to 2 groups of light-emitting units 121), Q is also an integer greater than or equal to 1, that is, the first connectors 122 can simultaneously realize the light-emitting control of one or more groups of light-emitting units 121.

The Q groups of light emitting units 121 connected by the first connection member 122 emit light simultaneously and are arranged at intervals. The first connection member 122 receives the light emitting signal and transmits the light emitting signal to the Q groups of light emitting units 121 connected thereto, thereby implementing the Q groups of light emitting units 121 to emit light simultaneously. As shown in fig. 4, the plurality of light emitting units 121 are arranged in a matrix, each group of light emitting units 121 is a column of the matrix, and each group of light emitting units 121 is connected in series, so that the first connecting member 122 only needs to be connected to one of the light emitting units 121, for example, the light emitting units 121 in the first rows of 1-3 columns and 6-8 columns are connected to the first connecting member 122, and the light emitting units 121 in the last rows of 4-5 columns and 9-10 columns are connected to the first connecting member 122, so that the plurality of first connecting members 122 are arranged at two ends of the light emitting module 12 in a staggered manner, and compared with the case where the first connecting members 122 are all disposed at one end of the light emitting units 121, the arrangement is dense, the arrangement is sparse, and the interference between signals corresponding to the first connecting members 122 can be reduced.

Compared with the case that the 2 rows of light-emitting units 121 are adjacently arranged and emit light simultaneously, and the interference caused by signals between the two rows of light-emitting units 121 emitting light simultaneously is large, the 2 rows of light-emitting units 121 emitting light simultaneously are arranged at intervals, so that the signal interference between the two rows of light-emitting units 121 connected by the first connecting member 122 and emitting light simultaneously can be further reduced, and the accuracy of light-emitting control is enhanced.

Further, the plurality of sets of light emitting units 121 connected to different first connectors 122 emit light in a time-sharing manner. Since the light emitting units 121 connected to the same first connector 122 are arranged at intervals, and the first connectors 122 connected to adjacent groups of light emitting units 121 (for example, adjacent 2 columns) are different, in order to prevent signal interference between the light emitting units 121 in any adjacent 2 columns, the light emitting units 121 in the adjacent 2 columns can be controlled to emit light in a time-sharing manner (for example, the 1 st column and the 6 th column, and the 2 nd column and the 7 th column emit light at different time points), so that the adjacent 2 columns cannot receive light emitting signals at the same time, and no signal interference exists between the light emitting units 121 in any adjacent 2 columns.

Referring to fig. 1 again, the driving module 13 is disposed on the second side 112, specifically, the second surface 114. The driving module 13 includes a plurality of second connectors 131, and the second connectors 131 are members provided on the driving module 13 for connecting with the light emitting module 12. The second connector 131 may be a pad, a pin, or the like that can be electrically connected.

The number of the second connectors 131 is multiple, and each of the second connectors 131 can be connected to one or more of the first connectors 122, that is, the second connectors 131 can simultaneously achieve the light emission control of the plurality of groups of light emitting units 121 corresponding to one or more of the first connectors 122. In the embodiment of the present application, the second connectors 131 and the first connectors 122 are in one-to-one correspondence, that is, each second connector 131 is connected to one first connector 122, so as to implement light emission control of one or more groups of light emitting units 121 corresponding to the first connectors 122.

The conductive member 14 is used to connect the first connection member 122 and the second connection member 131, and specifically, the conductive member 14 penetrates the first face 113 and the second face 114 of the first substrate 11 to connect the first connection member 122 and the second connection member 131.

The conductive element 14 includes a first pad 141, a conductive member 142 and a second pad 143, the first pad 141 is disposed on the first surface 113 of the first substrate 11, the first connecting member 122 is electrically connected to the first pad 141 by a lead, the second pad 143 is disposed on the second side 112, for example, the second pad 143 is disposed on the second surface 114, and the second connecting member 131 is electrically connected to the second pad 143 by a lead. The conductive member 142 penetrates the first substrate 11 to connect the first pad 141 and the second pad 143, for example, the first substrate 11 has a plurality of vias, and the conductive member 142 is a copper wire and connects the first pad 141 and the second pad 143 by plating copper on the vias.

It is understood that when detecting the depth of the target object, the light emitter 10 emits light first, the light receiver 20 starts timing according to the time when the light emitter 10 emits light, and stops timing when receiving the light reflected by the target object, thereby obtaining a time difference to calculate the depth of the target object.

However, in the conventional optical transmitter 10, the driving chip and the light source are disposed on the same surface of the substrate, and in order to achieve more precise control of the Vcsel, the number of Vcsel units connected to each control line is small, and even each control line only controls one Vcsel unit, which results in an increase in the number of control lines, a more complex routing of the control lines, a longer length, and an increase in the transmission time of signals in the routing, so that the time difference between the time when the driving chip drives the Vcsel unit to emit light and the time when the Vcsel unit actually emits light becomes large, and thus the accuracy of the time when the optical receiver 20 starts timing is low, and the depth detection accuracy is reduced.

In addition, the number of the wires is increased and the design of the wires is complicated, which results in an increase in the substrate space occupied by the wires and is not favorable for miniaturization of the optical transmitter 10, and when signals are transmitted in the control line at the same time, the probability of mutual interference is increased, which results in signal loss and even distortion, and further reduces the depth detection precision.

The light emitter 10 of the embodiment of the present application connects the light emitting module 12 and the driving module 13 respectively disposed on the first surface 113 and the second surface 114 opposite to each other of the first substrate 11 through the conductive component 14 penetrating through the first substrate 11, the conductive component 14 does not need to perform complex routing, only the first surface 113 and the second surface 114 need to be respectively disposed with a plurality of first pads 141 and second pads 143 to respectively connect the first connecting member 122 and the second connecting member 131, and then the conductive component 142 penetrates through the first substrate 11 to connect the first pads 141 and the second pads 143, which not only simplifies the routing design, the area occupied by the routing in the first substrate 11 is substantially the area occupied by the first pads 141, the area occupied by the conductive component 14 is small, and the miniaturization of the light emitter 10 is facilitated.

And the length of the trace is shorter, and is substantially equal to the thickness of the first substrate 11, so that the time difference between the time for the driving module 13 to drive the light-emitting module 12 to emit light and the time for the light-emitting unit 121 to actually emit light is shorter, the accuracy of the time for the light receiver 20 to start timing can be improved, and the depth detection precision is improved.

In addition, each first connecting element 122 is used for controlling the Q groups of light emitting units 121 in the present application, so that the number of the first connecting elements 122 is small, and the conductive elements 142 corresponding to the first connecting elements 122 are separated by the first substrate 11, which can reduce the probability of mutual interference when signals are transmitted in the conductive elements 14 corresponding to a plurality of first connecting elements 122 at the same time, reduce signal loss, and further improve the depth detection accuracy.

The circuit board 15 is used for mounting the first substrate 11, i.e. the first substrate 11 is mounted on the circuit board 15, and the driving module 13 is located between the circuit board 15 and the first substrate 11. The circuit board 15 may be a flexible circuit board, a rigid circuit board, or a rigid-flex circuit board.

The first substrate 11 can be fixedly mounted on the circuit board 15 by soldering, clamping, screwing, etc., and the driving module 13 can be in contact with the circuit board 15 but not electrically connected (e.g., an insulating layer is provided between the driving module 13 and the circuit board 15); or there is a gap between the driving module 13 and the circuit board 15, the driving module 13 is electrically connected to the circuit board 15 through the conductive element 14, for example, the circuit board 15 is electrically connected to the second pad 143 on the second surface 114 of the first substrate 11 through a lead.

Referring to fig. 5, in other embodiments, the light emitter 10 further includes a second substrate 16, the second substrate 16 is disposed on the first substrate 11 and located on the second side 112, the first substrate 11 and the second substrate 16 enclose an accommodating space 17, and the driving module 13 is disposed on the second substrate 16 and located in the accommodating space 17, so that the driving module 13 has a larger routing space, which is beneficial to the installation of the driving module 13. The second substrate 16 may be a ceramic substrate, a diamond substrate, or a graphene substrate, and has good heat dissipation performance.

The second substrate 16 includes a base plate 161 and a sidewall 162, the sidewall 162 is disposed on the base plate 161, the sidewall 162 and the first substrate 11 (specifically, the second surface 114 of the first substrate 11) enclose a receiving space 17, and the conductive member 14 penetrates through the first substrate 11 and the sidewall 162 to connect the first connecting member 122 and the second connecting member 131. In this way, the conductive component 14 penetrates through the first substrate 11 and the side wall 162 to connect the driving module 13 and the light emitting module 12, so that the wiring design of the driving module 13 and the light emitting module 12 can be simplified, and the area of the light emitter 10 and the interference between the wirings can be reduced.

Specifically, the first pad 141 is disposed on the first surface 113 and connected to the first connector 122 through a lead, the second pad 143 is disposed on the substrate 161 and at least partially located in the receiving space 17, the conductive member 142 penetrates the first substrate 11 and the sidewall 162 to connect the first pad 141 and the second pad 143, and the portion of the second pad 143 located in the receiving space 17 is connected to the second connector 131 through a lead.

The circuit board 15 is used for mounting the second substrate 16, i.e. the second substrate 16 is arranged on the circuit board 15, the circuit board 15 being located on a side of the second substrate 16 remote from the first substrate 11. A plurality of third connectors 163 are disposed on a side of the substrate 161 close to the circuit board 15, and the conductive elements 14 can penetrate through the substrate 161 and connect with the third connectors 163. The third connector 163 is electrically connected to the circuit board 15.

The connection between the conductive element 14 and the third connecting element 163 may be: the second pads 143 are connected to the third connecting members 163 by means of via copper plating, or the circuit board 15 forms a multi-layer wiring layer, which is connected to each other to connect the conductive members 14 and the third connecting members 163.

The circuit board 15 may be provided with a plurality of fourth connecting members 151, and after the second substrate 16 is disposed on the circuit board 15, the fourth connecting members 151 and the third connecting members 163 are disposed in a one-to-one correspondence and electrically connected to each other, so as to connect the driving module 13 and components such as capacitors and resistors on the circuit board 15. Each of the third and

fourth connection members

163 and 151 may be a pad, a pin, or the like capable of achieving electrical connection.

Referring to fig. 6, in one embodiment, the circuit board 15 is not provided with the third connecting member 163, but is directly connected to the fourth connecting member 151 of the circuit board 15 through the conductive member 14. Specifically, the fourth connecting part 151 is disposed on the circuit board 15 and located outside the orthographic projection of the substrate 161 on the circuit board 15, and the conductive element 14 (e.g., the second pad 143 and the conductive element 142) may penetrate the sidewall 162 to connect with the fourth connecting part 151, e.g., the second pad 143 partially protrudes from the sidewall 162, and then the portion is connected with the fourth connecting part 151 by a lead.

Taking the light emitter 10 shown in fig. 4 and 5 as an example, when performing depth detection, the driving module 13 sends out a light emitting signal, the light emitting signal passes through the second connecting member 131, the second bonding pad 143, the conductive member 142 and the first bonding pad 141, and is transmitted to the first connecting member 122, and then is transmitted to the 2 groups of light emitting units 121 corresponding to the first connecting member 122, so as to drive the 2 groups of light emitting units 121 to emit light, and then sequentially drives the 2 groups of light emitting units 121 corresponding to the other 4 first connecting members 122 to emit light in a time-sharing manner, and light emitted by the light emitting units 121 is reflected by a target object and then received by the light receiver 20, so as to calculate depth information of the target object according to a time difference between light emitting time and receiving time, so as to implement depth detection of the target object.

So, through the light emitting module 12 and the drive module 13 that stack up the setting, simplify the line design of walking of light emitting module 12 and drive module 13 to reduce the area of light emitter 10, be favorable to light emitter 10's miniaturization, and through the different Q group interval distribution's that first connecting piece 122 corresponds of timesharing transmission luminescence unit 121, signal interference when can reduce the luminescence of different groups luminescence unit 121, improve the accuracy of luminous control, be favorable to promoting the degree of depth detection precision.

In the description herein, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiments or examples is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In the description of the present application, it is to be understood that the terms "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner and are not to be considered limiting of the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims

1. An optical transmitter, comprising:

a first substrate comprising opposing first and second sides;

a light emitting module disposed at the first side, the light emitting module including a plurality of light emitting cells; and

the driving module is arranged on the second side and electrically connected with the light emitting module to drive the light emitting unit to emit light, and the orthographic projections of the light emitting module and the driving module on the first substrate are at least partially overlapped.

2. The light emitter of claim 1, wherein the light emitting module is provided with a plurality of first connectors, the driving module is provided with a plurality of second connectors, the first substrate is provided with a conductive assembly therethrough, and the first connectors and the second connectors are electrically connected through the conductive assembly.

3. The light emitter of claim 2, wherein the light emitting module comprises M groups of light emitting units, each group comprises N light emitting units, M and N are both greater than or equal to 1, each of the first connectors is connected to Q groups of the light emitting units, and Q is greater than or equal to 1 and less than or equal to M.

4. The light emitter of claim 2, wherein the first substrate comprises a first side on the first side and a second side on the second side, the light emitting module is mounted to the first side, the driver module is mounted to the second side, and the conductive assembly extends through the first side and the second side.

5. The light emitter of claim 4, further comprising a circuit board, wherein the first substrate is mounted on the circuit board, wherein the driver module is located between the circuit board and the first substrate, and wherein the conductive component is electrically connected to the circuit board.

6. The light emitter of claim 2, further comprising a second substrate disposed on the second side, the first substrate and the second substrate enclosing a receiving space; the driving module is arranged on the second substrate and is positioned in the accommodating space.

7. The light emitter of claim 6, wherein the second substrate comprises a base plate and a sidewall, the sidewall is disposed on the base plate, the sidewall and the first substrate enclose the receiving space, and the conductive member extends through the first substrate and the sidewall to connect the first connection member and the second connection member.

8. The light emitter of claim 7, wherein the conductive component comprises a conductive member extending through the first substrate and the sidewall, a first bonding pad on the first substrate, and a second bonding pad on the substrate, wherein the conductive member connects the first bonding pad and the second bonding pad, wherein the first connection member is connected to the first bonding pad by a wire, and wherein the second connection member is connected to the second bonding pad by a wire.

9. The light emitter of claim 7, further comprising a circuit board disposed on a side of the second substrate away from the first substrate, wherein a side of the substrate adjacent to the circuit board is provided with a plurality of third connectors, and wherein the conductive assembly is electrically connected to the third connectors, and wherein the third connectors are electrically connected to the circuit board.

10. The light emitter of claim 7, further comprising a circuit board, wherein the substrate is disposed on the circuit board, wherein the circuit board is provided with a plurality of fourth connectors, wherein the fourth connectors are located outside an orthographic projection of the substrate on the circuit board, and wherein the conductive assembly extends through the sidewall and is electrically connected to the fourth connectors.

11. The light emitter of claim 3, wherein the light emitting units connected to the same first connection member emit light simultaneously and are arranged at intervals.

12. The light emitter of claim 3, wherein groups of the light emitting elements that connect different first connectors emit light in a time-shared manner.

13. The light emitter of claim 6, wherein the first substrate and/or the second substrate is a ceramic substrate, a diamond substrate, or a graphene substrate.

14. A depth module comprising a light emitter according to any one of claims 1 to 13 and a light receiver for receiving light emitted by the light emitter and reflected by a target object to generate a depth image.

15. A terminal, characterized in that the terminal comprises a housing and a depth module according to claim 14, the depth module being arranged in the housing.