CN108490523A - Diffraction optical element and its manufacturing method, laser projection module, depth camera and electronic device - Google Patents

Diffraction optical element and its manufacturing method, laser projection module, depth camera and electronic device Download PDF

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Publication number
CN108490523A
CN108490523A CN201810201709.6A CN201810201709A CN108490523A CN 108490523 A CN108490523 A CN 108490523A CN 201810201709 A CN201810201709 A CN 201810201709A CN 108490523 A CN108490523 A CN 108490523A
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CN
China
Prior art keywords
base material
optical element
diffraction optical
laser
grooves
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CN201810201709.6A
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Chinese (zh)
Inventor
周奇群
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201810201709.6A priority Critical patent/CN108490523A/en
Publication of CN108490523A publication Critical patent/CN108490523A/en
Priority to PCT/CN2019/073947 priority patent/WO2019174426A1/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/18Diffraction gratings
    • G02B5/1847Manufacturing methods
    • G02B5/1857Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4205Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive optical element [DOE] contributing to image formation, e.g. whereby modulation transfer function MTF or optical aberrations are relevant

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)

Abstract

The manufacturing method of diffraction optical element of the present invention includes:Base material made of one quartz glass is provided;And the base material is etched to form the diffractive grooves of multiple multistage ladder types on the substrate.The manufacturing method of the diffraction optical element of embodiment of the present invention leads to overetched mode and forms the diffractive grooves of multiple multistage ladder types on the base material made of quartz glass to obtain diffraction optical element, due to forming that diffractive grooves are smaller to the intensity effect of base material by the way of etching, thus the intensity of the diffraction optical element formed using etching mode is larger.In addition, since base material is made of quartz glass, diffraction optical element is affected by temperature smaller, and the temperature drift of generation is smaller.The invention also discloses diffraction optical element, laser projection module, depth camera and electronic devices.

Description

Diffraction optical element and its manufacturing method, laser projection module, depth camera and electronics Device
Technical field
The present invention relates to consumer electrical product technical field, more particularly to a kind of manufacturing method of diffraction optical element, Diffraction optical element, laser projection module, depth camera and electronic device.
Background technology
Since the diffraction structure on diffraction optical element is more complicated, so as to cause diffraction optical element manufacturing process compared with More and manufacture difficulty is larger, and then leads to that the manufacture efficiency of diffraction optical element is relatively low and manufacturing cost is higher.
Invention content
Embodiments of the present invention provide a kind of manufacturing method of diffraction optical element, diffraction optical element, laser and throw Penetrate module, depth camera and electronic device.
The manufacturing method of the diffraction optical element of embodiment of the present invention includes:
Base material made of one quartz glass is provided;And
The base material is etched to form the diffractive grooves of multiple multistage ladder types on the substrate.
The manufacturing method of the diffraction optical element of embodiment of the present invention is led to overetched mode and is made by quartz glass Base material on form the diffractive grooves of multiple multistage ladder types to obtain diffraction optical element, spread out due to being formed by the way of etching It is smaller to the intensity effect of base material to penetrate groove, thus it is larger using the intensity of the diffraction optical element of etching mode formation.In addition, Since base material is made of quartz glass, diffraction optical element is affected by temperature smaller, and the temperature drift of generation is smaller.
In some embodiments, the base material includes front, and the etching base material to form on the substrate The step of diffractive grooves of multiple multistage ladder types includes:
Photoresist is formed in the front;
Multiple glue grooves are formed on the photoresist, the glue groove runs through the photoresist;
The corresponding base material of multiple glue grooves is etched to form multiple base material grooves on the substrate;
Remove the photoresist;
It repeats and described form photoresist in the front, described forms multiple glue grooves, institute on the photoresist It states the multiple corresponding base materials of glue groove of etching and the removal photoresist is described to be formed on the substrate Diffractive grooves.
The diffraction optical element of embodiment of the present invention includes the base material made of quartz glass, and the base material passes through etching It is formed with the diffractive grooves of multiple multistage ladder types.
In some embodiments, the base material includes front, and the diffractive grooves are described described by repeating Front forms that photoresist, described that multiple glue grooves, the multiple glue grooves of the etching are formed on the photoresist is corresponding The base material and the removal photoresist are formed.
The laser projection module of embodiment of the present invention includes:
Lens barrel, the lens barrel include lens barrel side wall and offer host cavity;
Light source, the light source are housed in the host cavity and for emitting laser;And
Collimating element, the collimating element are housed in the laser in the host cavity and for collimating the light source transmitting; And
Diffraction optical element described in above-mentioned any one embodiment, the diffraction optical element are housed in the receiving Intracavitary, the diffractive grooves are towards the light source, and the diffraction optical element is for swashing after collimating element collimation described in diffraction Light is to form laser pattern.
In some embodiments, the light source includes vertical cavity surface emitting laser or edge-emitting laser.
In some embodiments, the light source includes edge-emitting laser, and the edge-emitting laser includes light-emitting surface, The light-emitting surface is towards the collimating element.
In some embodiments, the laser projection module further includes circuit board assemblies and fixing piece, the fixing piece For fixing the light source in the circuit board assemblies.
In some embodiments, the fixing piece includes sealing, sealing setting the edge-emitting laser with Between the circuit board assemblies, the sealing is heat-conducting glue.
In some embodiments, the fixing piece includes at least two elasticity branch being arranged on the circuit board assemblies Support, at least two support frames as described above are collectively formed receiving space, and the receiving space is for accommodating the light source, and at least two Support frame as described above is used to support said light source.
The depth camera of embodiment of the present invention includes:
Laser projection module described in above-mentioned any one embodiment;
Image acquisition device, described image collector are used to acquire to be projected into object space from the laser projection module The laser pattern.
The electronic device of embodiment of the present invention includes shell and depth camera described above, the depth camera setting It exposes on the housing and from the shell to obtain the depth image.
Diffraction optical element in the electronic device of embodiment of the present invention, depth camera, laser projection module passes through erosion The mode at quarter forms the diffractive grooves of multiple multistage ladder types to obtain diffraction optical element on the base material made of quartz glass, Due to the diffraction for forming that diffractive grooves are smaller to the intensity effect of base material by the way of etching, thus being formed using etching mode The intensity of optical element is larger.In addition, since base material is made of quartz glass, diffraction optical element is affected by temperature smaller, production Raw temperature drift is smaller.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become apparent, or the practice of embodiment through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the following accompanying drawings to embodiment by change It obtains obviously and is readily appreciated that, wherein:
Fig. 1 is the flow diagram of the manufacturing method of the diffraction optical element of certain embodiments of the present invention.
Fig. 2 is the dimensional structure diagram of the diffraction optical element of certain embodiments of the present invention.
Fig. 3 is the sectional view of the diffraction optical element of certain embodiments of the present invention.
Fig. 4 to fig. 6 is the distribution schematic diagram of the diffractive grooves of the diffraction optical element of certain embodiments of the present invention.
Fig. 7 is the flow diagram of the manufacturing method of the diffraction optical element of certain embodiments of the present invention.
Fig. 8 and Fig. 9 is the principle schematic of the manufacturing method of the diffraction optical element of certain embodiments of the present invention.
Figure 10 is the structural schematic diagram of the laser projection module of certain embodiments of the present invention.
Figure 11 is the enlarged diagram at the laser projection module XI in Figure 10.
Figure 12 to Figure 14 is the part-structure schematic diagram of the laser projection module of embodiment of the present invention.
Figure 15 is the structural schematic diagram of the depth camera of certain embodiments of the present invention.
Figure 16 is the structural schematic diagram of the electronic device of certain embodiments of the present invention.
Specific implementation mode
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of The description present invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with spy Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic. " first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature. In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can Can also be to be electrically connected or can mutually communicate to be mechanical connection;It can be directly connected, it can also be by between intermediary It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower" It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter, This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with Recognize the application of other techniques and/or the use of other materials.
It please refers to Fig.1 to Fig.3, the manufacturing method of the diffraction optical element 15 of embodiment of the present invention includes:
S1 provides base material 151 made of a quartz glass;
S2, etching base material 151 on base material 151 to form the diffractive grooves 152 of multiple multistage ladder types.
Specifically, diffractive grooves 152 can be formed by an etching work procedure on the front 1512 of base material 151;Alternatively, The front 1512 that diffractive grooves 152 can etch base material 151 by multiple etching work procedures is formed.Wherein, Fig. 8 and Fig. 9 is please referred to, One etching work procedure includes:Photoresist 19 is formed on front 1512;Multiple glue grooves 191 are formed on photoresist 19, glue is recessed Slot 191 runs through photoresist 19;191 corresponding base material 151 of multiple glue grooves is etched to form multiple base material grooves on base material 151 1513;Remove photoresist 19.
The diffractive grooves 152 of multistage ladder type are that diffractive grooves 152 are intercepted by the section in the front 1512 perpendicular to base material 151 Cross sectional shape.Referring to Fig. 3, the quantity of the ladder (step) in the diffractive grooves 152 of multistage ladder type includes at least two, example Such as, the groove of diffractive grooves 152 of multistage ladder type including two ladders, the groove of three ladders, the groove of four ladders, five The groove of the groove of ladder, the groove of six ladders and any number of ladders.The diffractive grooves 152 of ladder quantity having the same Shape can with all same, be all different or not exactly the same, wherein the shape of multiple diffractive grooves 152 is identical to be appreciated that It is completely the same for the shape (including the length of ladder, width and height etc.) of any two diffractive grooves 152;Rank having the same The shape of multiple diffractive grooves 152 of terraced quantity differs at least one in the length that can be understood as ladder, width and height It is a to differ.
The quantity of ladder in the multiple diffractive grooves 152 formed on diffraction optical element 15 (or base material 151) can be equal Identical or not exactly the same, the shapes of multiple diffractive grooves 152 of ladder quantity having the same can be all different, all same Or it is not exactly the same.For example, the multiple diffractive grooves 152 formed on diffraction optical element 15 can be the recessed of six ladders Slot, the shape all same of multiple diffractive grooves 152;Alternatively, the multiple diffractive grooves 152 formed on diffraction optical element 15 can be with It is the groove of six ladders, the shape of multiple diffractive grooves 152 is all different;Alternatively, formed on diffraction optical element 15 Multiple diffractive grooves 152 can be the groove of six ladders, and the shape of multiple diffractive grooves 152 is not exactly the same;Alternatively, spreading out It includes the groove of four ladders and the groove of six ladders, four ranks to penetrate multiple diffractive grooves 152 for being formed on optical element 15 The shape all same of the shape all same of the groove of ladder, the groove of six ladders;Alternatively, what is formed on diffraction optical element 15 is more A diffractive grooves 152 include the groove of four ladders and the groove of six ladders, the shape of the groove of four ladders is all different, The shape of the groove of six ladders is all different;Alternatively, the multiple diffractive grooves 152 formed on diffraction optical element 15 include four The groove of the groove of a ladder and six ladders, the shape of the groove of four ladders is not exactly the same, the grooves of six ladders Shape is not exactly the same;Alternatively, the multiple diffractive grooves 152 formed on diffraction optical element 15 include four ladders groove and The groove of six ladders, the shape all same of the groove of four ladders, six ladders groove shape it is not exactly the same;Or Person, the multiple diffractive grooves 152 formed on diffraction optical element 15 include the groove of four ladders and the groove of six ladders, and four The shape of the groove of a ladder is not exactly the same, the shape all same of the groove of six ladders.
Please refer to fig. 4 to fig. 6, the shape of the orthographic projection of the outer profiles of diffractive grooves 152 on the front 1512 of base material 151 Can be circle, rectangle, ellipse, polygon or irregular shape.Multiple diffractive grooves 152 on diffraction optical element 15 It can be distributed by preset rules, for example, please refer to Fig. 4 and Fig. 5, multiple diffractive grooves 152 on diffraction optical element 15 can be with In array distribution, specifically, multiple diffractive grooves 152 can be distributed (as shown in Figure 5) or annular array distribution with rectangular array (as shown in Figure 4);Alternatively, multiple diffractive grooves 152 on diffraction optical element 15 are in one direction (such as on line direction) etc. It is spaced apart, (such as on column direction) is distributed in unequal interval in the other directions.In other embodiments, multiple diffraction Groove 152 can also be dispersedly distributed on diffraction optical element 15 (as shown in Figure 6).
The manufacturing method of the diffraction optical element 15 of embodiment of the present invention leads to overetched mode by quartz glass system At base material 151 on form the diffractive grooves 152 of multiple multistage ladder types to obtain diffraction optical element 15, due to using etching Mode forms that diffractive grooves 152 are smaller to the intensity effect of base material 151, thus the diffraction optical element formed using etching mode 15 intensity is larger.In addition, since base material 151 is made of quartz glass, diffraction optical element 15 is affected by temperature smaller, generation Temperature drift it is smaller.
Fig. 7 to Fig. 9 is please referred to, in some embodiments, the etching base material 151 is multiple to be formed on base material 151 The step of diffractive grooves 152 of multistage ladder type (step S2) includes:
S21 forms photoresist 19 in front 1512;
S22, forms multiple glue grooves 191 on photoresist 19, and glue groove 191 runs through photoresist 19;
S23 etches 191 corresponding base material 151 of multiple glue grooves to form multiple base material grooves 1513 on base material 151;
S24 removes photoresist 19;
S25 is repeated and described formed photoresist 19 (step S21) in front 1512, described formed on photoresist 19 Multiple glue grooves 191 (step S22), the multiple 191 corresponding base materials 151 (step S23) of glue groove of the etching and the removal Photoresist 19 (step S24) on base material 151 to form diffractive grooves 152.
The glue groove 191 of embodiment of the present invention can be formed by way of exposing, developing.In other embodiment In, glue groove 191 can also be collectively formed by way of imprinting and etching, for example, glue groove 191 can be with nano-imprint lithography (Namo Imprint Lithography) technology is formed.
Step S25 repeatedly etches base material groove 1513 on the basis of the base material groove 1513 that step S23 is formed (etching work procedure).Specifically, the region of each etching work procedure etching base material 151 is:Diffractive grooves 152 are in the ladder to be etched On the region that is formed of the section (section be parallel to front 1512) that is intercepted;The depth of each etching work procedure etching base material 1513 For:The depth of the ladder.For example, referring to Fig. 8, when it includes the groove of four ladders that the diffractive grooves 152 of multistage ladder type, which are, Etching base material 151 first etching work procedure be:The region for etching base material 151 is diffractive grooves 152 recently from front 1512 A ladder (the first ladder) on the region that is formed of the section that is intercepted, the depth of etching base material 151 is the depth of the first ladder Degree;Second etching work procedure be:The region for etching base material 151 is diffractive grooves 152 in the ladder (second being connect with the first ladder Ladder) on the region that is formed of the section that is intercepted, the depth of etching base material 151 is the depth of the second ladder;Third etches work Sequence is:What the region of etching base material 151 was intercepted by diffractive grooves 152 on the ladder (third ladder) being connect with the second ladder The depth in the region that section is formed, etching base material 151 is the depth of third ladder;4th etching work procedure be:Etch base material 151 The region that is formed of the section that is intercepted on the ladder (fourth order ladder) being connect with third ladder by diffractive grooves 152 of region, The depth for etching base material 151 is the depth of fourth order ladder to obtain diffractive grooves 152.Such etching mode is in each etching work procedure In etching area depth (that is, depth of ladder) all same, and the width of etching area is gradually reduced.
In other embodiments, the region of each etching work procedure etching base material 151 is:One rank of diffractive grooves 152 Ladder is in the region that 1512 projection of front is formed;Each the depth of etching work procedure etching base material 1513 is:The depth of the ladder.Example Such as, referring to Fig. 9, when it includes the groove of four ladders that the diffractive grooves 152 of multistage ladder type, which are, the first of etching base material 151 A etching work procedure is:The region for etching base material 151 is from a positive 1512 nearest ladder (the first ladder) in front 1512 The region formed is projected, the depth of etching base material 151 is the depth of the first ladder;Second etching work procedure be:Etch base material 151 Region be the ladder (the second ladder) that is connect with the first ladder in the region that 1512 projection of front is formed, etching base material 151 Depth is the depth of the second ladder;Third etching work procedure is:The region for etching base material 151 is the ladder being connect with the second ladder (third ladder) in the region that 1512 projection of front is formed, the depth of etching base material 151 is the depth of third ladder;4th erosion Carving process is:The region of etching base material 151 is that the ladder (fourth order ladder) being connect with third ladder projects formation in front 1512 Region, etching base material 151 depth be fourth order ladder depth to obtain diffractive grooves 152.Such etching mode is each The width all same of etching area in etching work procedure, and the depth (that is, depth of ladder) of etching area gradually increases or subtracts It is small.
Fig. 2 and Fig. 3 is please referred to, the manufacturing method of present embodiment must take office by repeating etching work procedure It anticipates the diffractive grooves 152 of multiple ladders.
The diffraction optical element 15 of embodiment of the present invention includes base material 151 made of quartz glass, and base material 151 passes through The mode of etching is formed with the diffractive grooves 152 of multiple step types.In present embodiment, 151 rounded laminated structure of base material. In other embodiment, base material 151 can be with oval laminated structure, rectangular sheet structure, polygon laminated structure.
The diffraction optical element 15 of embodiment of the present invention leads to overetched mode in base material 151 made of quartz glass The upper diffractive grooves 152 for forming multiple multistage ladder types are spread out with obtaining diffraction optical element 15 due to being formed by the way of etching It is smaller to the intensity effect of base material 151 to penetrate groove 152, thus using etching mode formed diffraction optical element 15 intensity compared with Greatly.In addition, since base material 151 is made of quartz glass, diffraction optical element 15 be affected by temperature it is smaller, the temperature drift of generation compared with It is small.
In some embodiments, base material 151 includes front 1512, and diffractive grooves 152 are by repeating in front 1512 formation photoresists 19 form multiple glue grooves 191, the multiple 191 corresponding base materials of glue groove of etching on photoresist 19 151 and removal photoresist 19 formation.That is, diffractive grooves 152 are formed by repeating etching work procedure.
Fig. 2 and Figure 10 is please referred to, the laser projection module 10 of embodiment of the present invention includes lens barrel 12, light source 13, collimation The diffraction optical element 15 of element 14 and above-mentioned any one embodiment.Lens barrel 12 includes lens barrel side wall 122 and offers receipts Vessel 121.Light source 13 is housed in host cavity 121 and for emitting laser.Collimating element 14 is housed in host cavity 121 and is used in combination In the laser that collimated light source 13 emits.Diffraction optical element 15 is housed in host cavity 121, diffractive grooves 152 towards light source 13, Diffraction optical element 15 is for the laser after the collimation of diffraction collimating element 14 to form laser pattern.
The diffraction optical element 15 of embodiment of the present invention leads to overetched mode in base material 151 made of quartz glass The upper diffractive grooves 152 for forming multiple multistage ladder types are spread out with obtaining diffraction optical element 15 due to being formed by the way of etching It is smaller to the intensity effect of base material 151 to penetrate groove 152, thus using etching mode formed diffraction optical element 15 intensity compared with Greatly.In addition, since base material 151 is made of quartz glass, diffraction optical element 15 be affected by temperature it is smaller, the temperature drift of generation compared with It is small.
Additionally, it is appreciated that diffraction optical element 15 will produce heat when working, lead to diffraction optical element 15 itself Temperature increases.After the temperature of diffraction optical element 15 increases, diffraction optical element 15 is caused to generate larger temperature drift, i.e. laser is thrown Penetrate the centre wavelength that module 10 projects and generate offset, in this way, when laser projection module 10 15 temperature drift of diffraction optical element compared with When big, due to the corresponding optical filtering wave of the optical filter for the image acquisition device 20 (shown in Figure 16) being used cooperatively with laser projection module 10 Section is limited, and part of the wavelength beyond optical filtering wave band for the laser that laser projection module 10 caused by temperature drift emits can not be schemed As collector 20 collects, therefore, image acquisition device 20 can not accurately obtain the laser pattern of the projection of laser projection module 10, Further influence the acquisition of high accuracy depth image.Due to the base of diffraction optical element 15 in laser projection module 10 of the present invention Material 151 is made of quartz glass, and diffraction optical element 15 is affected by temperature smaller, and the temperature drift of generation is smaller, can ensure follow-up The acquisition of high accuracy depth image.
Please refer to Fig. 2, Figure 10 and Figure 11, the laser projection module 10 of embodiment of the present invention include circuit board assemblies 11, The diffraction optical element 15 of lens barrel 12, light source 13, collimating element 14 and above-mentioned any one embodiment.
Circuit board assemblies 11 include substrate 111 and the circuit board 112 being carried on substrate 111.Substrate 111 is for carrying mirror Cylinder 12, light source 13 and circuit board 112.The material of substrate 111 can be plastics, for example, substrate 111 material can be PET, At least one of PMMA, PC or PI.That is, the list of any one in PET, PMMA, PC or PI may be used in substrate 111 One plastic material is made.In this way, 111 lighter weight of substrate and have enough support strengths.
Circuit board 112 can be any one in printed circuit board, flexible PCB, Rigid Flex.Circuit board 112 On can offer via 113, can be used for accommodating light source 13 in via 113, the part of circuit board 112 is covered by lens barrel 12, Another part extends out and can be connect with connector 17, and laser projection module 10 can be connected to electronics dress by connector 17 On the mainboard for setting 1000 (as shown in figure 16).
Lens barrel 12 is arranged on circuit board assemblies 11.Lens barrel 12 includes the first face 124 and the second face 125 opposite to each other.This reality It applies in mode, the second face 125 of lens barrel 12 is arranged on circuit board 112, and specifically, the second face 125 can pass through glued, card At least one of modes such as conjunction, threaded connection are arranged on circuit board 112.In other embodiments, the second of lens barrel 12 Face 125 can also be arranged on substrate 111.
Lens barrel 12 includes lens barrel side wall 122 and ring-shaped step 123.Lens barrel side wall 122 is formed around with host cavity 121, and And host cavity 121 runs through the first face 124 and the second face 125.Lens barrel side wall 122 includes the inner surface 1221 close to host cavity 121, Step 123 from inner surface 1221 towards host cavity 121 in extend to form.Ring-shaped step 123 surrounded unthreaded hole 1231, crossed unthreaded hole 1231 It can be as a part for host cavity 121.Step 123 includes the first confined planes 1232 and the second confined planes 1233, the first limit Face 1232 is opposite with the second confined planes 1233.Specifically, step 123 is between the first face 124 and the second face 125, the first limit Compared with the second confined planes 1233 closer to the first face 124, the first confined planes 1232 can be plane 1232 with the second confined planes 1233 Parallel plane.The cross section of the lens barrel 12 of present embodiment is in circular ring shape.In other embodiments, the cross section of lens barrel 12 Outer profile can rounded, oval, rectangle or any limit shape, the Internal periphery of the cross section of lens barrel 12 can also it is rounded, Ellipse, rectangle or any limit shape, for example, the outer profile of the cross section of lens barrel 12 is round, Internal periphery is ellipse;Alternatively, The outer profile of the cross section of lens barrel 12 is round, Internal periphery is rectangle;Alternatively, the outer profile of the cross section of lens barrel 12 be it is round, Internal periphery is polygon;Alternatively, the outer profile of the cross section of lens barrel 12 is rectangle, Internal periphery is round.
Light source 13 is arranged on circuit board assemblies 11 and is housed in host cavity 121.Specifically, light source 13 can be arranged It being electrically connected on circuit board 112 and with circuit board 112, light source 13 can also be arranged on substrate 111 and be housed in via 113, At this point it is possible to by arranging that light source 13 is electrically connected by conducting wire with circuit board 112.For emitting laser, laser can be light source 13 Infrared light, in one example, light source 13 may include the emitting laser of semiconductor substrate and setting on a semiconductor substrate, Semiconductor substrate is arranged on substrate 111, and emitting laser can be vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser,VCSEL).Single emitting laser can be arranged in semiconductor substrate, can also be arranged by more The array laser of a emitting laser composition, specifically, multiple emitting lasers can be with regularly or irregularly two-dimentional The form arrangement of pattern is on a semiconductor substrate.
Collimating element 14 can be optical lens, and collimating element 14 is used for the laser that collimated light source 13 emits, collimating element 14 are housed in host cavity 121, and the direction that collimating element 14 can be directed toward the first face 124 along the second face 125 is assembled into host cavity In 121, specifically, collimating element 14 includes faying face 143 can recognize when faying face 143 is combined with the second confined planes 1233 It is installed in place for collimating element 14.Collimating element 14 includes optical section 141 and mounting portion 142, and mounting portion 142 is used for and lens barrel side Wall 122 combines so that collimating element 14 is fixed in host cavity 121, and in embodiments of the present invention, faying face 143 is mounting portion 142 end face, optical section 141 include two curved surfaces positioned at 14 opposite both sides of collimating element.Collimating element 14 is wherein One curved surface stretched into unthreaded hole 1231.
Incorporated by reference to Fig. 3, diffraction optical element 15 is housed in host cavity 121.Diffraction optical element 15 includes closer to The diffractive grooves 152 of the diffraction mounting surface 150 in two faces 125, multiple multistage ladder types on diffraction optical element 15 are formed in diffraction On mounting surface 150, that is to say, that diffraction mounting surface 150 is the front 1512 of base material 151.Diffraction mounting surface 150 is arranged first It is contradicted on confined planes 1232 and with the first confined planes 1232.Diffraction optical element 15 is for swashing after the collimation of diffraction collimating element 14 Light is to form laser pattern, and specifically, the diffractive grooves 152 of multiple multistage ladder types on diffraction mounting surface 150 can be with light excessively The position in hole 1231 corresponds to, and the diffractive grooves 152 of multiple multistage ladder types of diffraction optical element 15 collimate collimated element 14 Laser diffraction afterwards goes out laser pattern corresponding with diffraction structure.
Diffraction optical element 15 in the laser projection module 10 of embodiment of the present invention leads to overetched mode by stone The diffractive grooves 152 of multiple multistage ladder types are formed on base material 151 made of English glass to obtain diffraction optical element 15, due to adopting The diffraction for forming that diffractive grooves 152 are smaller to the intensity effect of base material 151 with the mode of etching, thus being formed using etching mode The intensity of optical element 15 is larger.In addition, since base material 151 is made of quartz glass, diffraction optical element 15 is affected by temperature Smaller, the temperature drift of generation is smaller.
0 and Figure 12 are please referred to Fig.1, in some embodiments, light source 13 includes edge-emitting laser (edge- Emitting laser, EEL) 131, specifically, edge-emitting laser 131 can be distributed feedback laser (Distributed Feedback Laser, DFB).Edge-emitting laser 131 is whole to be in the form of a column, and edge-emitting laser 131 is remote An end face from circuit board assemblies 11 is formed with light-emitting surface 1311, and laser is sent out from light-emitting surface 1311,1311 direction of light-emitting surface Collimating element 14.Light source, temperature drift of the one side edge-emitting laser 131 compared with VCSEL array are used as using edge-emitting laser 131 Smaller, other direction is not necessarily to array of designs structure since edge-emitting laser 131 is single-point light emitting structure, makes simply, swashs The cost of light source of light projection module 10 is relatively low.
2 and Figure 13 are please referred to Fig.1, in some embodiments, laser projection module 10 further includes fixing piece 18, fixing piece 18 by edge-emitting laser 131 for being fixed on circuit board assemblies 11.The laser of distributed feedback laser is when propagating, warp The feedback for crossing optical grating construction obtains the gain of power.The power for improving distributed feedback laser needs to inject by increasing Electric current and/or the length for increasing distributed feedback laser can make distributed feedback laser due to increasing Injection Current Power consumption increases and serious problem of generating heat occurs, and therefore, in order to ensure that distributed feedback laser can work normally, needs The length for increasing distributed feedback laser, causes distributed feedback laser generally in elongate strip structure.When edge emitting laser When the light-emitting surface 1311 of device 131 is towards collimating element 14, edge-emitting laser 131 is placed in vertical, due to edge-emitting laser 131 be in elongate strip structure, and edge-emitting laser 131, which is susceptible to, to be fallen, shift or shake etc. surprisingly, therefore is passed through to be arranged and be fixed Part 18 can fix edge-emitting laser 131, prevent edge-emitting laser 131 fall, shift or shake etc. it is unexpected.
Specifically, 2 are please referred to Fig.1, in some embodiments, fixing piece 18 includes sealing 181, and the setting of sealing 181 exists Between edge-emitting laser 131 and circuit board assemblies 11.More specifically, in example as shown in figure 12, edge-emitting laser 131 opposite with light-emitting surface 1311 is bonded on one side on circuit board assemblies 11.In example as shown in fig. 13 that, edge emitting swashs The side 1312 of light device 131 can also be bonded on circuit board assemblies 11, and sealing 181 wraps the side 1312 of surrounding, also may be used Only to bond some face and circuit board assemblies 11 or certain several face of bonding and the circuit board assemblies 11 of side 1312.Further Ground, sealing 181 can be heat-conducting glue, and the heat that the work of light source 13 generates is conducted into circuit board assemblies 11.In order to improve Radiating efficiency, can also offer heat emission hole 1111 on substrate 111, and the heat that light source 13 or the work of circuit board 112 generate can be with It is shed by heat emission hole 1111, heat-conducting glue can also be filled in heat emission hole 1111, to further increase the heat dissipation of circuit board assemblies 11 Performance.
4 are please referred to Fig.1, in some embodiments, fixing piece 18 includes at least two be arranged on circuit board assemblies 11 Receiving space 183 is collectively formed in a flexible supporting frames 182, at least two supporting racks 182, and receiving space 183 is sent out for asylum edge Laser 131 is penetrated, at least two supporting racks 182 are used to support edge-emitting laser 131, to further prevent edge emitting laser Device 131 shakes.
In some embodiments, substrate 111 can save, and light source 13 can be directly anchored on circuit board 112 to subtract The integral thickness of small laser projecting apparatus 10.
0 and Figure 11 is please referred to Fig.1, in some embodiments, is offered on step 123 through 1232 He of the first confined planes The detection through-hole 1234 of second confined planes 1233, detection through-hole 1234 are spaced with unthreaded hole 1231 is crossed, and detect the center of through-hole 1234 Axis can be straight line.Laser diffraction module 10 further includes detection device 16, and detection device 16 includes transmitter 161 and receiver 162.Transmitter 161 and receiver 162 1 are mounted on collimating element 14, another is mounted on diffraction optical element 15. Specifically, transmitter 161 can be arranged on faying face 143, and receiver 162 is arranged on diffraction mounting surface 150;Or hair Emitter 161 can be arranged on diffraction mounting surface 150, and receiver 162 is arranged on faying face 143.Embodiment of the present invention With transmitter 161 be arranged on faying face 143, and receiver 162 be arranged on diffraction mounting surface 150 for illustrate.Hair Emitter 161 and receiver 162 be aligned detection through-hole 1234 both ends installation, transmitter 161 be used for from one end to detection through-hole Transmitting detection signal in 1234, detection signal reaches the other end after passing through detection through-hole 1234, and is received by receiver 162.It connects The information such as intensity, the phase of detection signal that device 162 is received by analysis are received, to judge collimating element 14 and diffraction light at this time Whether the installation site for learning element 15 is correct.
Transmitter 161 can be pinger and detect sound wave for emitting, and receiver 162 can be that sound wave connects at this time It receives device and for receiving the detection sound wave across detection through-hole 1234, detection sound wave can be ultrasonic wave;Transmitter 161 can be Optical transmitting set is simultaneously used to emit detection light, and receiver 162 can be optical receiver and be used to receive across detection through-hole at this time 1234 detection light, detection light can be laser.The present invention is optical transmitting set with transmitter 161, and receiver 162 is optical receiver For illustrate, and the only face receiver 162 of transmitter 161 surface launching detect signal, the only face transmitter of receiver 162 161 face (receiving plane) receives detection signal.In embodiments of the present invention, when the position of collimating element 14 and diffraction optical element 15 It sets when being respectively mounted correct, the detection signal that transmitter 161 emits passes through the interior of detection through-hole 1234 and not through-hole 1234 after testing Wall reflects, and the propagation distance that detection signal reaches receiver 162 is shorter, and detection signal impinges perpendicularly on receiver 161 at this time Receiving plane on, receiver 162 receive detection signal intensity it is higher.
When collimating element 14 is displaced, tilts or falls off, the detection signal that transmitter 161 emits is logical across detection During hole 1234, detection signal can be received by receiver 162 after the inner wall multiple reflections of through-hole 1234 again after testing, be detected The propagation distance that signal reaches receiver 162 is longer, and the intensity for the detection signal that receiver 162 receives is weaker.Work as diffraction light When element 15 is displaced, tilts or falls off, the receiving plane no longer face transmitter 161 of receiver 162, receiver 162 connects The detection signal received is not incident perpendicularly on receiving plane or part receiving plane is not aligned with detection through-hole 1234 and is connect at this time Detection signal is can not receive, the intensity for the detection signal that receiver 162 receives is weaker.Therefore, receiver 162 is received by judging The intensity of the detection signal arrived is it may determine that whether collimating element 14 is in correct installation site with diffraction optical element 15.
5 are please referred to Fig.1, the depth camera 100 of embodiment of the present invention includes the laser throwing of any of the above-described embodiment Penetrate module 10 and image acquisition device 20.It could be formed with projection window corresponding with laser projection module 10 on depth camera 100 40, and acquisition window corresponding with image acquisition device 20 50.Laser projection module 10 is used for by projecting window 40 to target empty Between project laser pattern, image acquisition device 20 is used to acquire by the modulated laser pattern of subject matter by acquisition window 50. In one example, the laser that laser projection module 10 projects is infrared light, and image acquisition device 20 is infrared camera.
Diffraction optical element 15 in the depth camera 100 of embodiment of the present invention leads to overetched mode by quartzy glass The diffractive grooves 152 of multiple multistage ladder types are formed on base material 151 made of glass to obtain diffraction optical element 15, due to using erosion The mode at quarter forms that diffractive grooves 152 are smaller to the intensity effect of base material 151, thus the diffraction optics formed using etching mode The intensity of element 15 is larger.In addition, since base material 151 is made of quartz glass, diffraction optical element 15 be affected by temperature it is smaller, The temperature drift of generation is smaller.
5 are please referred to Fig.1, in some embodiments, depth camera 100 further includes processor 30.Processor 30 and laser Projection module 10 and image acquisition device 20 are all connected with, and processor 30 is for handling laser pattern to obtain depth image.Specifically, Processor 30 calculates each pixel corresponding with reference pattern of each pixel in the laser pattern using image matching algorithm The deviation value of point, the depth image of the laser pattern is further obtained further according to the deviation value.Wherein, image matching algorithm can be Digital picture correlation (Digital Image Correlation, DIC) algorithm.It is of course also possible to use other images match are calculated Method replaces DIC algorithms.
6 are please referred to Fig.1, the electronic device 1000 of embodiment of the present invention includes shell 200 and depth camera 100.Electronics Device 1000 can be mobile phone, tablet computer, laptop computer, game machine, head aobvious equipment, access control system, automatic teller machine etc., the present invention Embodiment is illustrated so that electronic device 1000 is mobile phone as an example, it will be understood that the concrete form of electronic device 1000 can be Other, this is not restricted.The setting of depth camera 100 exposes in shell 200 and from shell 200 to obtain depth image, shell Body 200 can provide the protections such as dust-proof, waterproof, shatter-resistant to depth camera 100, and it is right with depth camera 100 to be offered on shell 200 The hole answered, so that light is pierced by from hole or penetrates shell 200.
Diffraction optical element 15 in the electronic device 1000 of embodiment of the present invention leads to overetched mode by quartz The diffractive grooves 152 of multiple multistage ladder types are formed on base material 151 made of glass to obtain diffraction optical element 15, due to using The mode of etching forms that diffractive grooves 152 are smaller to the intensity effect of base material 151, thus the diffraction light formed using etching mode The intensity for learning element 15 is larger.In addition, since base material 151 is made of quartz glass, diffraction optical element 15 be affected by temperature compared with Small, the temperature drift of generation is smaller.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " etc. means in conjunction with the embodiment party Formula or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention In.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, Particular features, structures, materials, or characteristics described can be in any one or more embodiments or example with suitable Mode combine.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, Three etc., unless otherwise specifically defined.
Although embodiments of the present invention have been shown and described above, it is to be understood that the above embodiment is Illustratively, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be right The above embodiment is changed, changes, replacing and modification, and the scope of the present invention is limited by claim and its equivalent.

Claims (12)

1. a kind of manufacturing method of diffraction optical element, which is characterized in that including:
Base material made of one quartz glass is provided;And
The base material is etched to form the diffractive grooves of multiple multistage ladder types on the substrate.
2. manufacturing method according to claim 1, which is characterized in that the base material includes front, the etching base The step of diffractive grooves of the material to form multiple multistage ladder types on the substrate includes:
Photoresist is formed in the front;
Multiple glue grooves are formed on the photoresist, the glue groove runs through the photoresist;
The corresponding base material of multiple glue grooves is etched to form multiple base material grooves on the substrate;
Remove the photoresist;And
It repeats and described form photoresist in the front, described forms multiple glue grooves, the erosion on the photoresist The corresponding base material of multiple glue grooves and the removal photoresist are carved to form the diffraction on the substrate Groove.
3. a kind of diffraction optical element, which is characterized in that including the base material made of quartz glass, the base material is by etching shape At the diffractive grooves for having multiple multistage ladder types.
4. diffraction optical element according to claim 3, which is characterized in that the base material includes front, and the diffraction is recessed Slot described forms photoresist, the multiple glue grooves, described of being formed on the photoresist by repeating in the front It etches the corresponding base material of multiple glue grooves and the removal photoresist is formed.
5. a kind of laser projection module, which is characterized in that including:
Lens barrel, the lens barrel include lens barrel side wall and offer host cavity;
Light source, the light source are housed in the host cavity and for emitting laser;And
Collimating element, the collimating element are housed in the laser in the host cavity and for collimating the light source transmitting;And
Diffraction optical element described in claim 3 or 4, the diffraction optical element is housed in the host cavity, described to spread out Groove is penetrated towards the light source, the diffraction optical element is for the laser after collimating element collimation described in diffraction to form laser Pattern.
6. laser projection module according to claim 5, which is characterized in that the light source includes vertical cavity surface-emitting laser Device or edge-emitting laser.
7. laser projection module according to claim 5, which is characterized in that the light source includes edge-emitting laser, institute It includes light-emitting surface to state edge-emitting laser, and the light-emitting surface is towards the collimating element.
8. laser projection module according to claim 7, which is characterized in that the laser projection module further includes circuit board Component and fixing piece, the fixing piece is for fixing the light source in the circuit board assemblies.
9. laser projection module according to claim 8, which is characterized in that the fixing piece includes sealing, the sealing It is arranged between the edge-emitting laser and the circuit board assemblies, the sealing is heat-conducting glue.
10. laser projection module according to claim 8, which is characterized in that the fixing piece includes being arranged in the electricity Receiving space is collectively formed at least two flexible supporting frames on the board group part of road, at least two support frames as described above, and the receiving is empty Between for accommodating the light source, at least two support frames as described above are used to support said light source.
11. a kind of depth camera, which is characterized in that including:
Laser projection module described in claim 5-10 any one;
Image acquisition device, described image collector is for described in acquiring and being projected into object space from the laser projection module Laser pattern.
12. a kind of electronic device, which is characterized in that including:
Shell;With
Depth camera described in claim 11, depth camera setting expose on the housing and from the shell with Obtain the depth image.
CN201810201709.6A 2018-03-12 2018-03-12 Diffraction optical element and its manufacturing method, laser projection module, depth camera and electronic device Pending CN108490523A (en)

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PCT/CN2019/073947 WO2019174426A1 (en) 2018-03-12 2019-01-30 Diffractive optical element, manufacturing method therefor, laser projection module, depth camera and electronic device

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CN109884742A (en) * 2019-04-03 2019-06-14 深圳市灵明光子科技有限公司 Optical field imaging device and optical field imaging method
WO2019174426A1 (en) * 2018-03-12 2019-09-19 Oppo广东移动通信有限公司 Diffractive optical element, manufacturing method therefor, laser projection module, depth camera and electronic device

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Publication number Priority date Publication date Assignee Title
US5828491A (en) * 1996-12-20 1998-10-27 The Regents Of The University Of California Phase plate technology for laser marking of magnetic discs
CN101398496A (en) * 2007-09-24 2009-04-01 鸿富锦精密工业(深圳)有限公司 Optical filter
JP2010244588A (en) * 2009-04-01 2010-10-28 Sharp Corp Diffraction element for two wavelength, and optical pickup using the same

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Publication number Priority date Publication date Assignee Title
US5828491A (en) * 1996-12-20 1998-10-27 The Regents Of The University Of California Phase plate technology for laser marking of magnetic discs
CN101398496A (en) * 2007-09-24 2009-04-01 鸿富锦精密工业(深圳)有限公司 Optical filter
JP2010244588A (en) * 2009-04-01 2010-10-28 Sharp Corp Diffraction element for two wavelength, and optical pickup using the same

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Application publication date: 20180904