CN108490522A - Diffraction optical element and its manufacturing method, laser projection module, depth camera and electronic device - Google Patents

Diffraction optical element and its manufacturing method, laser projection module, depth camera and electronic device Download PDF

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Publication number
CN108490522A
CN108490522A CN201810201149.4A CN201810201149A CN108490522A CN 108490522 A CN108490522 A CN 108490522A CN 201810201149 A CN201810201149 A CN 201810201149A CN 108490522 A CN108490522 A CN 108490522A
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CN
China
Prior art keywords
optical element
diffraction optical
laser
base material
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810201149.4A
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Chinese (zh)
Inventor
周奇群
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201810201149.4A priority Critical patent/CN108490522A/en
Publication of CN108490522A publication Critical patent/CN108490522A/en
Priority to PCT/CN2019/073947 priority patent/WO2019174426A1/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/18Diffraction gratings
    • G02B5/1847Manufacturing methods
    • G02B5/1857Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4205Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive optical element [DOE] contributing to image formation, e.g. whereby modulation transfer function MTF or optical aberrations are relevant

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)

Abstract

The manufacturing method of diffraction optical element of the present invention includes:Base material made of one transparent plastic is provided;And the base material is imprinted to form the groove of multiple multistage ladder types on the substrate.The manufacturing method of the diffraction optical element of embodiment of the present invention forms the groove of multiple multistage ladder types to obtain diffraction optical element by way of coining on the base material being made of transparent plastic, to which the process for manufacturing diffraction optical element is less, improves the manufacture efficiency of diffraction optical element and reduce the manufacturing cost of diffraction optical element.The invention also discloses diffraction optical element, laser projection module, depth camera and electronic devices.

Description

Diffraction optical element and its manufacturing method, laser projection module, depth camera and electronics Device
Technical field
The present invention relates to consumer electrical product technical field, more particularly to a kind of manufacturing method of diffraction optical element, Diffraction optical element, laser projection module, depth camera and electronic device.
Background technology
Since the diffraction structure on diffraction optical element is more complicated, so as to cause diffraction optical element manufacturing process compared with More and manufacture difficulty is larger, and then leads to that the manufacture efficiency of diffraction optical element is relatively low and manufacturing cost is higher.
Invention content
Embodiments of the present invention provide a kind of manufacturing method of diffraction optical element, diffraction optical element, laser and throw Penetrate module, depth camera and electronic device.
The manufacturing method of the diffraction optical element of embodiment of the present invention includes:
Base material made of one transparent plastic is provided;And
The base material is imprinted to form the groove of multiple multistage ladder types on the substrate
The manufacturing method of the diffraction optical element of embodiment of the present invention is being made of transparent plastic by way of coining Substrate on form the grooves of multiple multistage ladder types to obtain diffraction optical element, to manufacture the process of diffraction optical element compared with It is few, it improves the manufacture efficiency of diffraction optical element and reduces the manufacturing cost of diffraction optical element.Due to diffraction optics member Part is made of plastics, and for the diffraction optical element made of glass, can save cost of manufacture.
In some embodiments, the coining base material to form the groove of multiple multistage ladder types on the substrate The step of include:
The base material, which is imprinted, using nanometer embossing forms multiple grooves.
In some embodiments, the overall depth of the groove is less than the thickness of the base material.
The diffraction optical element of embodiment of the present invention includes the base material being made of transparent plastic, and the base material passes through coining It is formed with the groove of multiple multistage ladder types.
In some embodiments, multiple grooves imprint the base material by nanometer embossing and are formed.
In some embodiments, the overall depth of the groove is less than the thickness of the base material.
The laser projection module of embodiment of the present invention includes:
Lens barrel, the lens barrel include lens barrel side wall and offer host cavity;
Light source, the light source are housed in the host cavity and for emitting laser;And
Collimating element, the collimating element are housed in the laser in the host cavity and for collimating the light source transmitting; And
Diffraction optical element described in above-mentioned any one embodiment, the diffraction optical element are housed in the receiving Intracavitary, the groove towards the light source, the diffraction optical element for the laser after collimating element collimation described in diffraction with Form laser pattern.
In some embodiments, the light source includes vertical cavity surface emitting laser or edge-emitting laser.
In some embodiments, the light source includes edge-emitting laser, and the edge-emitting laser includes light-emitting surface, The light-emitting surface is towards the collimating element.
In some embodiments, the laser projection module further includes circuit board assemblies and fixing piece, the fixing piece For fixing the light source in the circuit board assemblies.
In some embodiments, the fixing piece includes sealing, sealing setting the edge-emitting laser with Between the circuit board assemblies, the sealing is heat-conducting glue.
In some embodiments, the fixing piece includes at least two elasticity branch being arranged on the circuit board assemblies Support, at least two support frames as described above are collectively formed receiving space, and the receiving space is for accommodating the light source, and at least two Support frame as described above is used to support said light source.
The depth camera of embodiment of the present invention includes:
Laser projection module described in above-mentioned any one embodiment;And
Image acquisition device, described image collector are used to acquire to be projected into object space from the laser projection module The laser pattern.
The electronic device of embodiment of the present invention includes shell and depth camera described above, the depth camera setting It exposes on the housing and from the shell to obtain the depth image.
Diffraction optical element in the electronic device of embodiment of the present invention, depth camera, laser projection module passes through pressure The mode of print forms the groove of multiple multistage ladder types to obtain diffraction optical element on the substrate being made of transparent plastic, thus The process for manufacturing diffraction optical element is less, improves the manufacture efficiency of diffraction optical element and reduces diffraction optical element Manufacturing cost.Since diffraction optical element is made of plastics, for the diffraction optical element made of glass, Neng Goujie Save cost of manufacture.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become apparent, or the practice of embodiment through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the following accompanying drawings to embodiment by change It obtains obviously and is readily appreciated that, wherein:
Fig. 1 is the flow diagram of the manufacturing method of the diffraction optical element of certain embodiments of the present invention.
Fig. 2 is the dimensional structure diagram of the diffraction optical element of certain embodiments of the present invention.
Fig. 3 is the sectional view of the diffraction optical element of certain embodiments of the present invention.
Fig. 4 to fig. 6 is the distribution schematic diagram of the groove of the diffraction optical element of certain embodiments of the present invention.
Fig. 7 is the structural schematic diagram of the laser projection module of certain embodiments of the present invention.
Fig. 8 is the enlarged diagram at the laser projection module VIII in Fig. 7.
Fig. 9 to Figure 11 is the part-structure schematic diagram of the laser projection module of embodiment of the present invention.
Figure 12 is the structural schematic diagram of the depth camera of certain embodiments of the present invention.
Figure 13 is the structural schematic diagram of the electronic device of certain embodiments of the present invention.
Specific implementation mode
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of The description present invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with spy Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic. " first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature. In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can Can also be to be electrically connected or can mutually communicate to be mechanical connection;It can be directly connected, it can also be by between intermediary It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower" It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter, This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with Recognize the application of other techniques and/or the use of other materials.
It please refers to Fig.1 to Fig.3, the manufacturing method of the diffraction optical element 15 of embodiment of the present invention includes:
S1 provides base material 151 made of a transparent plastic;And
S2, coining base material 151 on base material 151 to form the groove 152 of multiple multistage ladder types.
Base material 151 can be by polymethyl methacrylate (polymethyl methacrylate, PMMA), makrolon (Polycarbonate, PC), polystyrene (Polystyrene, PS), acrylonitrile-butadiene-styrene copolymer (Acrylonitrile Butadiene Styrene, ABS), polyethylene terephthalate (polyethylene Terephthalate, PET), polyimides (Polyimide, PI), allyl diglycol carbonic ether (Allgl diglycol Carbonate, ADC) in any one or more material be made.
Step S2 is impressed into the one of base material 151 by the master mold (not shown) for being formed with 152 matched protrusion of groove Groove 152 is formed on a surface 1512, and direct electronic beam writing technology system can be utilized with 152 matched protrusion of groove on master mold It is formed.The groove 152 of multistage ladder type is cross sectional shape of the groove 152 along the section formation perpendicular to 151 surface of base material.It please join Fig. 3 is read, the quantity of the ladder (step) in the groove 152 of multistage ladder type includes at least two, for example, the groove of multistage ladder type 152 include groove, six ladders of the groove of two ladders, the groove of three ladders, the groove of four ladders, five ladders The groove of groove and any number of ladders.The shape of the groove 152 of ladder quantity having the same can with all same, be all different Or it is not exactly the same, wherein shape that the shape of multiple grooves 152 is identical to can be understood as any two groove 152 (including rank Length, width and height of ladder etc.) it is completely the same;The shape of multiple grooves 152 of ladder quantity having the same differs can It is differed at least one of length, width and the height that are interpreted as ladder.
The quantity of ladder in the multiple grooves 152 formed on diffraction optical element 15 (or base material 151) can be with all same Or it is not exactly the same, the shapes of multiple grooves 152 of ladder quantity having the same can be all different, all same or not exclusively It is identical.For example, the multiple grooves 152 formed on diffraction optical element 15 can be the groove of six ladders, multiple grooves 152 Shape all same;Alternatively, the multiple grooves 152 formed on diffraction optical element 15 can be the groove of six ladders, it is more The shape of a groove 152 is all different;Alternatively, the multiple grooves 152 formed on diffraction optical element 15 can be six ranks The groove of ladder, the shape of multiple grooves 152 are not exactly the same;Alternatively, the multiple grooves 152 formed on diffraction optical element 15 wrap Include the groove of four ladders and the groove of six ladders, the shape all same of the groove of four ladders, six ladders groove Shape all same;Alternatively, the multiple grooves 152 formed on diffraction optical element 15 include the groove and six ladders of four ladders Groove, the shape of the groove of four ladders is all different, the shape of the groove of six ladders is all different;Alternatively, diffraction light It includes the groove of four ladders and the groove of six ladders, the groove of four ladders to learn multiple grooves 152 for being formed on element 15 Not exactly the same, six ladders the groove of shape shape it is not exactly the same;Alternatively, what is formed on diffraction optical element 15 is more A groove 152 includes the groove of four ladders and the groove of six ladders, the shape all same of the groove of four ladders, six ranks The shape of the groove of ladder is not exactly the same;Alternatively, the multiple grooves 152 formed on diffraction optical element 15 include four ladders The groove of groove and six ladders, the shape of the groove of four ladders is not exactly the same, the shape of the groove of six ladders is homogeneous Together.
Please refer to fig. 4 to fig. 6, the shape of the orthographic projection of the outer profile of groove 152 on the surface of base material 151 1512 can be with For circle, rectangle, ellipse, polygon or irregular shape.Multiple grooves 152 on diffraction optical element 15 can be by pre- If regular distribution, for example, please referring to Fig. 4 and Fig. 5, multiple grooves 152 on diffraction optical element 15 can be in array distribution, tool Body, multiple grooves 152 can be distributed (as shown in Figure 5) or annular array distribution (as shown in Figure 4) with rectangular array;Alternatively, (such as on line direction) is spacedly distributed multiple grooves 152 on diffraction optical element 15 in one direction, in another direction Upper (such as on column direction) is distributed in unequal interval.In other embodiments, multiple grooves 152 can also be dispersedly distributed On diffraction optical element 15 (as shown in Figure 6).
The manufacturing method of the diffraction optical element 15 of embodiment of the present invention is by way of coining by transparent plastic system At base material 151 on form the grooves 152 of multiple multistage ladder types to obtain diffraction optical element 15, to manufacture diffraction optics member The process of part 15 is less, improves the manufacture efficiency of diffraction optical element 15 and reduces being manufactured into for diffraction optical element 15 This.In addition, since diffraction optical element 15 is made of plastics, it, can for the diffraction optical element made of glass Save cost of manufacture.
In some embodiments, the coining base material 151 on base material 151 to form the groove of multiple multistage ladder types 152 the step of, (step S2) included:
S21 imprints base material 151 to form multiple grooves 152 using nanometer embossing (Nano Imprint).
Specifically, the protrusion on the master mold for imprinting base material 151 is that receiving of being formed is made using direct electronic beam writing technology Rice grating pattern.Include the step of multiple grooves 152 to be formed using the method coining base material 151 of hot padding:S211 heats base Material 151 is so that base material 151 softens and persistently heated to base material 151;S212, will be in the base material 151 of master mold indentation softening;S213, Stop heating to base material 151;S214 detaches master mold with base material 151 after the cooling and solidifying of base material 151, with the shape on base material 151 At groove 152.
Present embodiment can form smaller, structure using nanometer embossing coining base material 151 on base material 151 Finer groove 152, to which more grooves 152, Jin Erti can be formed on the diffraction optical element 15 of same size Rise the diffraction property of diffraction optical element 15.
It please refers to Fig.1 and Fig. 2, the diffraction optical element 15 of embodiment of the present invention includes the base material being made of transparent plastic 151.Base material 151 is formed with the groove 152 of multiple multistage ladder types by coining.In present embodiment, 151 rounded sheet of base material Structure.In other embodiments, base material 151 can be with oval laminated structure, rectangular sheet structure, polygon sheet knot Structure.
The diffraction optical element 15 of embodiment of the present invention is by way of coining in the base material 151 being made of transparent plastic The upper groove 152 for forming multiple multistage ladder types is to obtain diffraction optical element 15, the process to manufacture diffraction optical element 15 It is less, it improves the manufacture efficiency of diffraction optical element 15 and reduces the manufacturing cost of diffraction optical element 15.In addition, due to Diffraction optical element 15 is made of plastics, and for the diffraction optical element made of glass, can save cost of manufacture.
In some embodiments, multiple grooves 152 on diffraction optical element 15 can pass through nanometer embossing pressure Print the formation of base material 151.
Referring to Fig. 3, in some embodiments, the overall depth D of groove 152 is less than (or the diffraction optics member of base material 151 Part 15) thickness H.The overall depth H of groove 152 refers to the depth capacity of groove 152.In this way, imprinting base material using master mold When 151, master mold will not run through base material 151,.
Fig. 2 and Fig. 7 is please referred to, the laser projection module 10 of embodiment of the present invention includes lens barrel 12, light source 13, collimation member The diffraction optical element 15 of part 14 and above-mentioned any one embodiment.Lens barrel 12 includes lens barrel side wall 122 and offers receiving Chamber 121.Light source 13 is housed in host cavity 121 and for emitting laser.Collimating element 14 is housed in host cavity 121 and is used for The laser that collimated light source 13 emits.Diffraction optical element 15 is housed in host cavity 121, and groove 152 is towards light source 13, diffraction light The laser after element 15 is collimated for diffraction collimating element 14 is learned to form laser pattern.
Diffraction optical element 15 in the laser projection module 10 of embodiment of the present invention is by way of coining by saturating The groove 152 of multiple multistage ladder types is formed on base material 151 made of bright plastics to obtain diffraction optical element 15, to which manufacture is spread out The process for penetrating optical element 15 is less, improves the manufacture efficiency of diffraction optical element 15 and reduces diffraction optical element 15 Manufacturing cost.In addition, since diffraction optical element 15 is made of plastics, compared to the diffraction optical element made of glass Speech, can save cost of manufacture.
Fig. 2, Fig. 7 and Fig. 8 are please referred to, the laser projection module 10 of embodiment of the present invention includes circuit board assemblies 11, mirror The diffraction optical element 15 of cylinder 12, light source 13, collimating element 14 and above-mentioned any one embodiment.
Circuit board assemblies 11 include substrate 111 and the circuit board 112 being carried on substrate 111.Substrate 111 is for carrying mirror Cylinder 12, light source 13 and circuit board 112.The material of substrate 111 can be plastics, for example, substrate 111 material can be PET, At least one of PMMA, PC or PI.That is, the list of any one in PET, PMMA, PC or PI may be used in substrate 111 One plastic material is made.In this way, 111 lighter weight of substrate and have enough support strengths.
Circuit board 112 can be any one in printed circuit board, flexible PCB, Rigid Flex.Circuit board 112 On can offer via 113, can be used for accommodating light source 13 in via 113, the part of circuit board 112 is covered by lens barrel 12, Another part extends out and can be connect with connector 17, and laser projection module 10 can be connected to electronics dress by connector 17 On the mainboard for setting 1000 (as shown in figure 13).
Lens barrel 12 is arranged on circuit board assemblies 11.Lens barrel 12 includes the first face 124 and the second face 125 opposite to each other.This reality It applies in mode, the second face 125 of lens barrel 12 is arranged on circuit board 112, and specifically, the second face 125 can pass through glued, card At least one of modes such as conjunction, threaded connection are arranged on circuit board 112.In other embodiments, the second of lens barrel 12 Face 125 can also be arranged on substrate 111.
Lens barrel 12 includes lens barrel side wall 122 and ring-shaped step 123.Lens barrel side wall 122 is formed around with host cavity 121, and And host cavity 121 runs through the first face 124 and the second face 125.Lens barrel side wall 122 includes the inner surface 1221 close to host cavity 121, Step 123 from inner surface 1221 towards host cavity 121 in extend to form.Ring-shaped step 123 surrounded unthreaded hole 1231, crossed unthreaded hole 1231 It can be as a part for host cavity 121.Step 123 includes the first confined planes 1232 and the second confined planes 1233, the first limit Face 1232 is opposite with the second confined planes 1233.Specifically, step 123 is between the first face 124 and the second face 125, the first limit Compared with the second confined planes 1233 closer to the first face 124, the first confined planes 1232 can be plane 1232 with the second confined planes 1233 Parallel plane.The cross section of the lens barrel 12 of present embodiment is in circular ring shape.In other embodiments, the cross section of lens barrel 12 Outer profile can rounded, oval, rectangle or any limit shape, the Internal periphery of the cross section of lens barrel 12 can also it is rounded, Ellipse, rectangle or any limit shape, for example, the outer profile of the cross section of lens barrel 12 is round, Internal periphery is ellipse;Alternatively, The outer profile of the cross section of lens barrel 12 is round, Internal periphery is rectangle;Alternatively, the outer profile of the cross section of lens barrel 12 be it is round, Internal periphery is polygon;Alternatively, the outer profile of the cross section of lens barrel 12 is rectangle, Internal periphery is round.
Light source 13 is arranged on circuit board assemblies 11 and is housed in host cavity 121.Specifically, light source 13 can be arranged It being electrically connected on circuit board 112 and with circuit board 112, light source 13 can also be arranged on substrate 111 and be housed in via 113, At this point it is possible to by arranging that light source 13 is electrically connected by conducting wire with circuit board 112.For emitting laser, laser can be light source 13 Infrared light, in one example, light source 13 may include the emitting laser of semiconductor substrate and setting on a semiconductor substrate, Semiconductor substrate is arranged on substrate 111, and emitting laser can be vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser,VCSEL).Single emitting laser can be arranged in semiconductor substrate, can also be arranged by more The array laser of a emitting laser composition, specifically, multiple emitting lasers can be with regularly or irregularly two-dimentional The form arrangement of pattern is on a semiconductor substrate.
Collimating element 14 can be optical lens, and collimating element 14 is used for the laser that collimated light source 13 emits, collimating element 14 are housed in host cavity 121, and the direction that collimating element 14 can be directed toward the first face 124 along the second face 125 is assembled into host cavity In 121, specifically, collimating element 14 includes faying face 143 can recognize when faying face 143 is combined with the second confined planes 1233 It is installed in place for collimating element 14.Collimating element 14 includes optical section 141 and mounting portion 142, and mounting portion 142 is used for and lens barrel side Wall 122 combines so that collimating element 14 is fixed in host cavity 121, and in embodiments of the present invention, faying face 143 is mounting portion 142 end face, optical section 141 include two curved surfaces positioned at 14 opposite both sides of collimating element.Collimating element 14 is wherein One curved surface stretched into unthreaded hole 1231.
Incorporated by reference to Fig. 3, diffraction optical element 15 is housed in host cavity 121.Diffraction optical element 15 includes closer to The groove 152 of the diffraction mounting surface 150 in two faces 125, multiple multistage ladder types on diffraction optical element 15 is formed in diffraction installation On face 150, that is to say, that diffraction mounting surface 150 is the surface 1512 of base material 151.The setting of diffraction mounting surface 150 is in the first limit It is contradicted on face 1232 and with the first confined planes 1232.Diffraction optical element 15 for diffraction collimating element 14 collimate after laser with Laser pattern is formed, specifically, the groove 152 of multiple multistage ladder types on diffraction mounting surface 150 can be with unthreaded hole 1231 excessively Position corresponds to, the grooves 152 of multiple multistage ladder types of diffraction optical element 15 collimated element 14 is collimated after laser diffraction Go out laser pattern corresponding with diffraction structure.
Diffraction optical element 15 in the laser projection module 10 of embodiment of the present invention is by way of coining by saturating The groove 152 of multiple multistage ladder types is formed on base material 151 made of bright plastics to obtain diffraction optical element 15, to which manufacture is spread out The process for penetrating optical element 15 is less, improves the manufacture efficiency of diffraction optical element 15 and reduces diffraction optical element 15 Manufacturing cost.In addition, since diffraction optical element 15 is made of plastics, compared to the diffraction optical element made of glass Speech, can save cost of manufacture.
Fig. 7 and Fig. 9 are please referred to, in some embodiments, light source 13 includes edge-emitting laser (edge-emitting Laser, EEL) 131, specifically, edge-emitting laser 131 can be distributed feedback laser (Distributed Feedback Laser, DFB).Edge-emitting laser 131 is whole to be in the form of a column, and edge-emitting laser 131 is far from circuit board assemblies 11 An end face be formed with light-emitting surface 1311, laser is sent out from light-emitting surface 1311, and light-emitting surface 1311 is towards collimating element 14.Using Edge-emitting laser 131 is used as light source, and one side edge-emitting laser 131 is smaller compared with the temperature drift of VCSEL array, other direction, Since edge-emitting laser 131 is single-point light emitting structure, it is not necessarily to array of designs structure, is made simply, laser projection module 10 Cost of light source is relatively low.
Fig. 9 and Figure 10 are please referred to, in some embodiments, laser projection module 10 further includes fixing piece 18, fixing piece 18 by edge-emitting laser 131 for being fixed on circuit board assemblies 11.The laser of distributed feedback laser is when propagating, warp The feedback for crossing optical grating construction obtains the gain of power.The power for improving distributed feedback laser needs to inject by increasing Electric current and/or the length for increasing distributed feedback laser can make distributed feedback laser due to increasing Injection Current Power consumption increases and serious problem of generating heat occurs, and therefore, in order to ensure that distributed feedback laser can work normally, needs The length for increasing distributed feedback laser, causes distributed feedback laser generally in elongate strip structure.When edge emitting laser When the light-emitting surface 1311 of device 131 is towards collimating element 14, edge-emitting laser 131 is placed in vertical, due to edge-emitting laser 131 be in elongate strip structure, and edge-emitting laser 131, which is susceptible to, to be fallen, shift or shake etc. surprisingly, therefore is passed through to be arranged and be fixed Part 18 can fix edge-emitting laser 131, prevent edge-emitting laser 131 fall, shift or shake etc. it is unexpected.
Specifically, referring to Fig. 9, in some embodiments, fixing piece 18 includes sealing 181, sealing 181 is arranged on side Between emitting laser 131 and circuit board assemblies 11.More specifically, in example as shown in Figure 9, edge-emitting laser 131 Opposite with light-emitting surface 1311 be bonded on one side on circuit board assemblies 11.In example as shown in Figure 10, edge emitting laser The side 1312 of device 131 can also be bonded on circuit board assemblies 11, and sealing 181 wraps the side 1312 of surrounding, can also Only bond some face and circuit board assemblies 11 or certain several face of bonding and the circuit board assemblies 11 of side 1312.Further, Sealing 181 can be heat-conducting glue, and the heat that the work of light source 13 generates is conducted into circuit board assemblies 11.In order to improve heat dissipation Efficiency can also offer heat emission hole 1111 on substrate 111, and the heat that light source 13 or the work of circuit board 112 generate can be by dissipating Hot hole 1111 sheds, and heat-conducting glue can also be filled in heat emission hole 1111, to further increase the heat dissipation performance of circuit board assemblies 11.
1 is please referred to Fig.1, in some embodiments, fixing piece 18 includes at least two be arranged on circuit board assemblies 11 Receiving space 183 is collectively formed in a flexible supporting frames 182, at least two supporting racks 182, and receiving space 183 is sent out for asylum edge Laser 131 is penetrated, at least two supporting racks 182 are used to support edge-emitting laser 131, to further prevent edge emitting laser Device 131 shakes.
In some embodiments, substrate 111 can save, and light source 13 can be directly anchored on circuit board 112 to subtract The integral thickness of small laser projecting apparatus 10.
Fig. 7 and Fig. 8 is please referred to, in some embodiments, is offered on step 123 through the first confined planes 1232 and The detection through-hole 1234 of two confined planes 1233, detection through-hole 1234 are spaced with unthreaded hole 1231 is crossed, and detect the central shaft of through-hole 1234 Line can be straight line.Laser diffraction module 10 further includes detection device 16, and detection device 16 includes transmitter 161 and receiver 162.Transmitter 161 and receiver 162 1 are mounted on collimating element 14, another is mounted on diffraction optical element 15. Specifically, transmitter 161 can be arranged on faying face 143, and receiver 162 is arranged on diffraction mounting surface 150;Or hair Emitter 161 can be arranged on diffraction mounting surface 150, and receiver 162 is arranged on faying face 143.Embodiment of the present invention With transmitter 161 be arranged on faying face 143, and receiver 162 be arranged on diffraction mounting surface 150 for illustrate.Hair Emitter 161 and receiver 162 be aligned detection through-hole 1234 both ends installation, transmitter 161 be used for from one end to detection through-hole Transmitting detection signal in 1234, detection signal reaches the other end after passing through detection through-hole 1234, and is received by receiver 162.It connects The information such as intensity, the phase of detection signal that device 162 is received by analysis are received, to judge collimating element 14 and diffraction light at this time Whether the installation site for learning element 15 is correct.
Transmitter 161 can be pinger and detect sound wave for emitting, and receiver 162 can be that sound wave connects at this time It receives device and for receiving the detection sound wave across detection through-hole 1234, detection sound wave can be ultrasonic wave;Transmitter 161 can be Optical transmitting set is simultaneously used to emit detection light, and receiver 162 can be optical receiver and be used to receive across detection through-hole at this time 1234 detection light, detection light can be laser.The present invention is optical transmitting set with transmitter 161, and receiver 162 is optical receiver For illustrate, and the only face receiver 162 of transmitter 161 surface launching detect signal, the only face transmitter of receiver 162 161 face (receiving plane) receives detection signal.In embodiments of the present invention, when the position of collimating element 14 and diffraction optical element 15 It sets when being respectively mounted correct, the detection signal that transmitter 161 emits passes through the interior of detection through-hole 1234 and not through-hole 1234 after testing Wall reflects, and the propagation distance that detection signal reaches receiver 162 is shorter, and detection signal impinges perpendicularly on receiver 161 at this time Receiving plane on, receiver 162 receive detection signal intensity it is higher.
When collimating element 14 is displaced, tilts or falls off, the detection signal that transmitter 161 emits is logical across detection During hole 1234, detection signal can be received by receiver 162 after the inner wall multiple reflections of through-hole 1234 again after testing, be detected The propagation distance that signal reaches receiver 162 is longer, and the intensity for the detection signal that receiver 162 receives is weaker.Work as diffraction light When element 15 is displaced, tilts or falls off, the receiving plane no longer face transmitter 161 of receiver 162, receiver 162 connects The detection signal received is not incident perpendicularly on receiving plane or part receiving plane is not aligned with detection through-hole 1234 and is connect at this time Detection signal is can not receive, the intensity for the detection signal that receiver 162 receives is weaker.Therefore, receiver 162 is received by judging The intensity of the detection signal arrived is it may determine that whether collimating element 14 is in correct installation site with diffraction optical element 15.
2 are please referred to Fig.1, the depth camera 100 of embodiment of the present invention includes the laser throwing of any of the above-described embodiment Penetrate module 10 and image acquisition device 20.It could be formed with projection window corresponding with laser projection module 10 on depth camera 100 40, and acquisition window corresponding with image acquisition device 20 50.Laser projection module 10 is used for by projecting window 40 to target empty Between project laser pattern, image acquisition device 20 is used to acquire by the modulated laser pattern of subject matter by acquisition window 50. In one example, the laser that laser projection module 10 projects is infrared light, and image acquisition device 20 is infrared camera.
Diffraction optical element 15 in the depth camera 100 of embodiment of the present invention is by way of coining by transparent modeling The groove 152 of multiple multistage ladder types is formed on base material 151 made of material to obtain diffraction optical element 15, to manufacture diffraction light The process for learning element 15 is less, improves the manufacture efficiency of diffraction optical element 15 and reduces the manufacture of diffraction optical element 15 Cost.In addition, since diffraction optical element 15 is made of plastics, for the diffraction optical element made of glass, energy Enough save cost of manufacture.
2 are please referred to Fig.1, in some embodiments, depth camera 100 further includes processor 30.Processor 30 and laser Projection module 10 and image acquisition device 20 are all connected with, and processor 30 is for handling laser pattern to obtain depth image.Specifically, Processor 30 calculates each pixel corresponding with reference pattern of each pixel in the laser pattern using image matching algorithm The deviation value of point, the depth image of the laser pattern is further obtained further according to the deviation value.Wherein, image matching algorithm can be Digital picture correlation (Digital Image Correlation, DIC) algorithm.It is of course also possible to use other images match are calculated Method replaces DIC algorithms.
3 are please referred to Fig.1, the electronic device 1000 of embodiment of the present invention includes shell 200 and depth camera 100.Electronics Device 1000 can be mobile phone, tablet computer, laptop computer, game machine, head aobvious equipment, access control system, automatic teller machine etc., the present invention Embodiment is illustrated so that electronic device 1000 is mobile phone as an example, it will be understood that the concrete form of electronic device 1000 can be Other, this is not restricted.The setting of depth camera 100 exposes in shell 200 and from shell 200 to obtain depth image, shell Body 200 can provide the protections such as dust-proof, waterproof, shatter-resistant to depth camera 100, and it is right with depth camera 100 to be offered on shell 200 The hole answered, so that light is pierced by from hole or penetrates shell 200.
Diffraction optical element 15 in the electronic device 1000 of embodiment of the present invention is by way of coining by transparent The groove 152 of multiple multistage ladder types is formed on base material 151 made of plastics to obtain diffraction optical element 15, to manufacture diffraction The process of optical element 15 is less, improves the manufacture efficiency of diffraction optical element 15 and reduces the system of diffraction optical element 15 Cause this.In addition, since diffraction optical element 15 is made of plastics, for the diffraction optical element made of glass, Cost of manufacture can be saved.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " etc. means in conjunction with the embodiment party Formula or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention In.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, Particular features, structures, materials, or characteristics described can be in any one or more embodiments or example with suitable Mode combine.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, Three etc., unless otherwise specifically defined.
Although embodiments of the present invention have been shown and described above, it is to be understood that the above embodiment is Illustratively, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be right The above embodiment is changed, changes, replacing and modification, and the scope of the present invention is limited by claim and its equivalent.

Claims (14)

1. a kind of manufacturing method of diffraction optical element, which is characterized in that including:
Base material made of one transparent plastic is provided;And
The base material is imprinted to form the groove of multiple multistage ladder types on the substrate.
2. manufacturing method according to claim 1, which is characterized in that the coining base material is with shape on the substrate At multiple multistage ladder types groove the step of include:
The base material, which is imprinted, using nanometer embossing forms multiple grooves.
3. manufacturing method according to claim 1, which is characterized in that the overall depth of the groove is less than the base material Thickness.
4. a kind of diffraction optical element, which is characterized in that including the base material being made of transparent plastic, the base material is by imprinting shape At the groove for having multiple multistage ladder types.
5. diffraction optical element according to claim 4, which is characterized in that multiple grooves pass through nanometer embossing The base material is imprinted to be formed.
6. diffraction optical element according to claim 4, which is characterized in that the overall depth of the groove is less than the base The thickness of material.
7. a kind of laser projection module, which is characterized in that including:
Lens barrel, the lens barrel include lens barrel side wall and offer host cavity;
Light source, the light source are housed in the host cavity and for emitting laser;And
Collimating element, the collimating element are housed in the laser in the host cavity and for collimating the light source transmitting;And
Diffraction optical element described in claim 4 to 6 any one, the diffraction optical element are housed in the host cavity Interior, the groove is towards the light source, and the diffraction optical element is for the laser after collimating element collimation described in diffraction with shape At laser pattern.
8. laser projection module according to claim 7, which is characterized in that the light source includes vertical cavity surface-emitting laser Device or edge-emitting laser.
9. laser projection module according to claim 7, which is characterized in that the light source includes edge-emitting laser, institute It includes light-emitting surface to state edge-emitting laser, and the light-emitting surface is towards the collimating element.
10. laser projection module according to claim 9, which is characterized in that the laser projection module further includes circuit Board group part and fixing piece, the fixing piece is for fixing the light source in the circuit board assemblies.
11. laser projection module according to claim 10, which is characterized in that the fixing piece includes sealing, the envelope Glue is arranged between the edge-emitting laser and the circuit board assemblies, and the sealing is heat-conducting glue.
12. laser projection module according to claim 10, which is characterized in that the fixing piece includes being arranged in the electricity Receiving space is collectively formed at least two flexible supporting frames on the board group part of road, at least two support frames as described above, and the receiving is empty Between for accommodating the light source, at least two support frames as described above are used to support said light source.
13. a kind of depth camera, which is characterized in that including:
Laser projection module described in claim 7-12 any one;And
Image acquisition device, described image collector is for described in acquiring and being projected into object space from the laser projection module Laser pattern.
14. a kind of electronic device, which is characterized in that including:
Shell;With
Depth camera described in claim 13, depth camera setting expose on the housing and from the shell with Obtain the depth image.
CN201810201149.4A 2018-03-12 2018-03-12 Diffraction optical element and its manufacturing method, laser projection module, depth camera and electronic device Pending CN108490522A (en)

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PCT/CN2019/073947 WO2019174426A1 (en) 2018-03-12 2019-01-30 Diffractive optical element, manufacturing method therefor, laser projection module, depth camera and electronic device

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Publication number Priority date Publication date Assignee Title
WO2019174426A1 (en) * 2018-03-12 2019-09-19 Oppo广东移动通信有限公司 Diffractive optical element, manufacturing method therefor, laser projection module, depth camera and electronic device
EP3786707A1 (en) * 2019-08-28 2021-03-03 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Projection module and terminal

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Publication number Priority date Publication date Assignee Title
US5828491A (en) * 1996-12-20 1998-10-27 The Regents Of The University Of California Phase plate technology for laser marking of magnetic discs
CN102096134A (en) * 2011-01-17 2011-06-15 西安交通大学 Quantum dot implant reflection type active grating and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5828491A (en) * 1996-12-20 1998-10-27 The Regents Of The University Of California Phase plate technology for laser marking of magnetic discs
CN102096134A (en) * 2011-01-17 2011-06-15 西安交通大学 Quantum dot implant reflection type active grating and manufacturing method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019174426A1 (en) * 2018-03-12 2019-09-19 Oppo广东移动通信有限公司 Diffractive optical element, manufacturing method therefor, laser projection module, depth camera and electronic device
EP3786707A1 (en) * 2019-08-28 2021-03-03 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Projection module and terminal
US11546453B2 (en) 2019-08-28 2023-01-03 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Projection module and terminal

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Application publication date: 20180904