KR20080049881A - Flexible optical interconnection module for flat panel display and manufacturing method thereof - Google Patents

Abstract

A flexible optical interconnection module for a flat panel display and a manufacturing method thereof are provided to reduce the number of channels by using a serial transmission method. A light transmission unit includes a first main board connection member(20), a driving chip(30) connected to the first main board connection member, a light source part(40) driven by the driving chip, and a first substrate(10) for transmitting an optical signal of the light source part. A through-hole array is formed on the first substrate. An inner surface of the through-hole array is coated with a metal layer. A light reception unit includes a second main board connection member(220), a driving chip(230) connected to the second main board connection member, a light detection part(240) driven by the driving chip, and a second substrate(210) for receiving the optical signal from the light detection part. A through-hole array is formed in the second substrate. An inner surface of the through-hole array of the second substrate is coated with a metal layer. A flexible light waveguide having reflective mirrors(330,340) is formed between the light transmission unit and the light reception unit.

Description

Flexible optical interconnection module for flat panel display and manufacturing method

FIG. 1A is a side cross-sectional view of a flexible optical connection module for a flat panel display according to an embodiment of the present invention, and FIG. 1B is an optical transmitter of a flexible optical connection module for a flat panel display according to an embodiment of the present invention shown in FIG. Top view.

FIG. 2 is a side cross-sectional view of an optical transmitter of a flexible optical access module for a flat panel display according to an embodiment of the present invention shown in FIG.

3 is a diagram illustrating a signal transmission path through a through path of an optical transmitter in a flexible optical access module for a flat panel display according to an exemplary embodiment of the present invention.

4A to 4H are a plan view and a cross-sectional view showing a manufacturing process of a flexible optical connection module for a flat panel display according to an embodiment of the present invention.

5 is a side cross-sectional view of a flexible optical connection module for a flat panel display according to another embodiment of the present invention.

         <Explanation of symbols for the main parts of the drawings>

10: first substrate 210: second substrate

20: first main board connecting member 220: second main board connecting member

21: flexible printed circuit board 30, 230: driving chip

40: light source part VCSEL 45: light source light emitting part

50, 250: through hole 58, 258: metal reflective surface

60, 260: electrode pad 65, 265: solder bump

70, 270: bonding wire 80, 280: housing

100: light transmitting unit 200: light receiving unit

240: light detector 245: photodetector

300: optical waveguide 310: core

320: cladding 330, 340: 45 ° reflective mirror surface

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a flexible optical connection module for a flat panel display and a method of manufacturing the same, and more particularly, to plate an inner wall of a through hole as a transmission path of an optical signal in a substrate constituting an optical transmitter and an optical receiver that emit and receive optical signals. The present invention relates to a flexible optical connection module for a flat panel display and a method of manufacturing the same, which can minimize optical coupling loss and improve transmission speed by vertically coupling a flexible optical waveguide.

In general, in low-speed electronic systems, the connection between circuit boards and circuit boards, chips and chips or systems is made through electrical metal wiring, but in next-generation information and communication systems consisting of large parallel computers or ATM switching systems of 1 Tb / s or more As the information is increased in volume and the transmission speed is improved, electrical problems such as skew, electromagnetic interference (EMI), etc. are generated when the metal wiring is used, and thus the operation efficiency of the system is reduced and system integration becomes difficult.

In recent years, with the development of mobile communication, it is expected that digital TV can be watched or recorded in future mobile phones and PDAs such as 3G and 4G, and the data demand is expected to increase.

In addition, in the future, in accordance with higher transmission demands, flexible PCBs for electric transmission using existing polyimide connecting between the motherboard and the display will reach the limit of transmission.

On the other hand, recently, a technology for making an optical connection by using an optical transmission / reception module has been developed. In the optical coupling method inside the optical transmission / reception module, a ribbon optical fiber multichannel optical connector having a reflector positioned at an inclination angle of 45 ° is provided. Direct coupling of the optical receiving element to the polymer optical waveguide having a reflector positioned at an inclination angle of 45 °, and vertically coupling the optical transmitting and receiving element to the polymer optical waveguide and connecting the polymer optical waveguide to the multichannel optical connector. And a method of vertically coupling the optical transmission / reception element fixed to the plastic package to the multi-channel optical connector.

The technique of vertically connecting light in the light source and coupling the light waveguide is known as an "optical module" or an "optical connection module".

However, in the alignment of a conventional optical coupling device, the thickness of the device is due to a support such as a fiber block or butt-coupling or an optical metal bench for separate optical waveguide alignment. There is a problem of thickening, which is disadvantageous for the thin and thin parts of the device.

The present invention connects the main board connecting member to the optical transmitter and the optical receiver, respectively, to solve the conventional problems as described above, and vertical connection with the flexible optical waveguide through the inner wall of the plated through hole of the optical transmitter and the optical receiver. By using optical connection to minimize the speed problem and transmission loss of the optical signal, and converting the transmission method of the display and the driving chip in series to form a flexible and lightweight module for a flat panel display flexible optical connection module and its manufacturing method It is to provide.

In addition, the present invention provides a flexible optical connection module for a flat panel display comprising a light transmitting unit and a light receiving unit formed on a flexible circuit board, and aligned with through holes formed in the light transmitting unit and the light receiving unit to combine a flexible optical waveguide, and a method of manufacturing the same. It is for.

In order to solve the conventional problems as described above and to achieve the above object, the flexible optical connection module for a flat panel display includes a first main board connection member, a driving chip connected to the connecting member, and driven by the driving chip. A light transmitter including a first light source unit, a first substrate arranged in alignment with the light source unit to transmit an optical signal from the light source unit, and having a through-hole array plated with a metal film on an inner surface thereof; A driving chip connected with a connection member, an optical detector driven by the driving chip, and a through-hole array in which a metal film is plated on an inner surface of the optical detector, the optical detector being disposed to be aligned with the optical detector to receive an optical signal from the optical detector; A light receiving unit comprising two substrates and reflective mirror surfaces at both ends for optical connection between the light transmitting unit and the light receiving unit Having and a flexible optical waveguide.

In the flexible optical connection module for a flat panel display according to the present invention, the metal film plated on the inner wall of the through hole of the through hole array is selected from Au, Ag, Cu, Al, and Pt.

In the flexible optical connection module for flat panel display according to the present invention, the light transmitting unit includes a surface emission laser (VCSEL) array as a light source unit.

In the flexible optical connection module for flat panel display according to the present invention, the light receiving unit includes a photodiode array as a light detecting unit.

In the flexible optical connection module for a flat panel display according to the present invention, the first substrate and the second substrate forming the light transmitting unit and the light receiving unit are hard substrates which can be selected from ceramic, glass or FR4. do.

In the flexible optical connection module for a flat panel display according to the present invention, the first substrate and the second substrate forming the light transmitting unit and the light receiving unit may include a main board connection member, a driving chip, a bonding wire, a light source unit or a light detecting unit, and a light. And a housing for protecting the waveguide.

In the flexible optical connection module for a flat panel display according to the present invention, the reflective mirror surface of the flexible optical waveguide is a 45 ° reflective mirror surface or a curved reflective mirror surface.

In the flexible optical connection module for a flat panel display according to the present invention, the first main board connection member or the second main board connection member is made of a flexible printed circuit board.

On the other hand, the flexible optical connection module for a flat panel display according to the present invention, the drive chip is formed a predetermined electronic circuit pattern is connected to the circuit, the light source unit driven by the drive chip, to transmit the optical signal with the light source unit An optical transmitter including a first printed circuit board forming a through-hole array aligned with the light source unit, a driving chip to which a predetermined electronic circuit pattern is formed and connected to a circuit, an optical detection unit driven by the driving chip, and the optical detection unit A light receiver comprising a second printed circuit board forming a through-hole array aligned with the light detector for receiving an optical signal, and a 45 ° reflective mirror surface at both ends for optical connection between the light transmitter and the light receiver It includes a flexible optical waveguide having a.

In another flexible optical connection module for a flat panel display according to the present invention, the light transmitting unit includes a surface emitting laser (VCSEL) array as a light source unit.

Further, in another flexible optical connection module for a flat panel display according to the present invention, the light receiving unit is characterized in that it comprises a photodiode array as a light detector.

In addition, in the flexible optical connection module for a flat panel display according to the present invention, the first substrate and the second substrate forming the light transmitting unit and the light receiving unit, the main board connecting member, the driving chip, the bonding wire, the light source unit or the light And a housing for protecting the detector and the optical waveguide.

In another flexible optical connection module for flat panel display according to the present invention, the reflective mirror surface of the flexible optical waveguide is a 45 ° reflective mirror surface or a curved reflective mirror surface.

In another flexible optical connection module for a flat panel display according to the present invention, the first substrate and the second substrate forming the light transmitting unit and the light receiving unit are made of a flexible printed circuit board.

On the other hand, the method of manufacturing a flexible optical connection module for a flat panel display according to the present invention, forming an electrode circuit pattern on the motherboard connection member, forming an electrode circuit pattern on the substrate, through-hole array processing alignment mark, the substrate Machining the through-hole array in accordance with the through-hole processing alignment mark and plating the inner wall of the through-hole, connecting the substrate through which the through-hole is processed and a main board connection member having an electrode circuit pattern formed thereon; Mounting a light source unit or a light detection unit on a substrate of the processed optical transmitter and a optical receiver, aligning and fixing the optical waveguide in the through hole array, and housing the housing on the substrate of the optical transmitter and the optical receiver The step of installing.

In addition, in the method of manufacturing a flexible optical connection module for a flat panel display according to the present invention, the step of plating the through-hole array is characterized in that it is performed by electroless plating and electrolytic plating.

In addition, in the method of manufacturing a flexible optical connection module for a flat panel display according to the present invention, the step of fixing and aligning the optical waveguide on the substrate surface is a thermosetting resin or UV curable resin on the surface of the substrate surface and the optical waveguide After applying, by curing by applying heat or ultraviolet, characterized in that the optical waveguide is aligned and fixed to the substrate.

On the other hand, another method of manufacturing a flexible optical connection module for a flat panel display according to the present invention, forming an electrode circuit pattern, a through-hole array processing alignment mark on a flexible printed circuit board, the through-hole processing alignment mark on the substrate Processing the through-hole array according to each other, mounting the light source unit or the light detector unit on the substrate of the optical transmitter and the optical receiver, in which the through holes are processed, aligning and fixing the optical waveguide to the through-hole array; And installing a housing on a substrate of the optical transmitter and the optical receiver.

In addition, in the method of manufacturing a flexible optical connection module for a flat panel display according to the present invention, the step of fixing and aligning the optical waveguide on the substrate surface is a thermosetting resin or UV on the surface of the substrate surface and the optical waveguide After the curing resin is applied, the optical waveguide is aligned and fixed to the substrate by curing by applying heat or ultraviolet rays.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1A is a side cross-sectional view of a flexible optical connection module for a flat panel display according to an embodiment of the present invention, and FIG. 1B is an optical transmitter of a flexible optical connection module for a flat panel display according to an embodiment of the present invention shown in FIG. Top view.

2 is a side cross-sectional view of an optical transmitter in a flexible optical connection module for a flat panel display according to an embodiment of the present invention shown in FIGS. 1A and 1B.

1A, 1B, and 2, a flexible optical access module for a flat panel display according to an embodiment of the present invention includes an optical transmitter 100, an optical receiver 200, the optical transmitter 100, and an optical receiver ( It consists of an optical waveguide 300 for transmitting an optical signal between the (200).

The optical transmitter 100 and the optical receiver 200 are connected to the first substrate 10 and the first main board connecting member 20, respectively, the second substrate 210 and the second main board connecting member 220. Is connected and configured.

In addition, the first substrate 10 included in the optical transmitter 100 includes a driving chip 30 connected to the first main board connecting member 20, the first main board connecting member 20, and the The light source unit 40 driven by the driving chip 30 and the through-hole array 50 arranged in alignment with the light source unit 40 to transmit the optical signal emitted from the light source unit 40 and the inner wall of which is plated. ) Is configured.

 In addition, the second substrate 210 included in the light receiving unit 200 includes the second main board connection member 220, the driving chip 230 connected to the second main board connection member 220, and the A light detector 240 driven by the driving chip 230 to receive and detect an optical signal; and an inner wall of the light detector 240 arranged and aligned with the light detector 240 to receive the optical signal. The plated through-hole array 250 is constructed.

In addition, the first substrate 10 forming the optical transmitter 100 and the second substrate 210 forming the optical receiver 200 are fixed to the optical transmitter 100, the optical receiver 200, and the light, respectively. And a flexible optical waveguide 300 having reflective mirror surfaces 330 at both ends for connection.

The reflective mirror surface may be a 45 ° reflective mirror surface or a curved reflective mirror surface, but preferably a 45 ° reflective mirror surface is used.

In the flexible optical waveguide 300, a core 310 is positioned at an inner center thereof, and a cladding 320 is positioned around the core.

A vertical cavity surface emitting laser (VCSEL) array 40 is mounted on the first substrate 10 on which the optical transmitter 100 is formed as the light source unit 40, and the VCSEL array 40 is connected to the flexible optical waveguide 300. The metal reflective surface 58 is formed in the through hole array 50 that transmits the optical signal.

In addition, a photo diode array is used as the photodetector 240 in the second substrate 210 on which the light receiver 200 is formed.

The circuit pattern formed on the first and second main board connection members 20 and 220 includes a connector for connecting the main board and the light transmitter 100 or the light receiver 200, a light source unit 40, or a light detector ( And a circuit pattern for transmitting an electrical signal to the driving chips 30 and 230 for driving the 240.

In addition, the first and second motherboard connection members 20 and 220 and the driving chip 30 and 230 are connected, and the driving chip 30 and 230 and the light source unit VCSEL or the photodetector 240 are photodiodes. The connection between the electrode pads on which the array is located uses bonding wires 70 and 270.

The VCSEL array and the photodiode array are mounted on the first and second substrates 10 and 210 by flip chip bonding using solder bumps 65 and 265.

In addition, as shown in FIG. 1B, the VCSEL array is disposed as solder bumps 65 on the electrode pad 60 formed on the first substrate 10, and the electrode pad 60 on which the VCSEL array is positioned is bonded. It is connected to the driving chip 30 by a wire 70.

The connection method illustrated in FIG. 1B is equally applied to the case of the light receiving unit 200.

Here, the metal plated on the inner walls of the through hole arrays 50 and 250 formed on the first and second substrates 10 and 210 may be selected from Au, Ag, Cu, Al, and Pt.

 In addition, in the flexible optical connection module for a flat panel display according to the present invention, each of the first and second substrates 10 and 210 forming the light transmitting unit 100 and the light receiving unit 200 is a conventional hard or soft. Although all of the substrates can be used, it is preferably characterized in that the rigid substrate that can be selected from ceramic, glass or FR-4.

Meanwhile, electronic circuits formed on the first and second main board connection members 20 and 220 are formed on the first and second substrates 10 and 210 forming the light transmitting unit 100 and the light receiving unit 200. The housing 80 and 280 may be further provided to protect the pattern, the driving chips 30 and 230, the bonding wires 70 and 270, the light source 40, and the light detector 240.

Referring to Figure 3 will be described in detail the operation of the flexible optical connection module for a flat panel display according to an embodiment of the present invention.

3 is a diagram illustrating a transmission path of an optical signal through a through path of an optical transmitter in a flexible optical access module for a flat panel display according to an exemplary embodiment of the present invention.

First, the electrical signal transmitted from the first motherboard connection member 20 is transmitted to the driving chip 30 for driving the VCSEL, and the driving chip 30 for driving the VCSEL independently of the VCSEL array which is the light source unit 40. Each drive emits a high speed modulated optical signal.

The emitted optical signal is emitted through the through-holes while generating continuous total reflection by the metal reflecting surface 58 plated on the inner wall of the through-hole array 50 of the first substrate 10, and the emitted optical signal is Reflected by the 45 ° reflective mirror surface 330 of the flexible optical waveguide 300 is incident on the core 310 of the flexible optical waveguide 300.

The optical signal propagated through the core 310 of the flexible optical waveguide 300 is reflected by the 45 ° reflective mirror surface 340 at the end of the flexible optical waveguide 300 of the optical receiver 200, thereby receiving the optical receiver 200. Totally reflected on the metal reflective surface 258 plated on the inner wall of the through-hole array 250 of the second substrate 210 of the second substrate 210 and incident to the photodetector 240, and converted into an electrical signal by the photodetector 240. After it is transmitted to the second motherboard connection member 220.

As shown in FIG. 3, when the inner surface of the through hole is plated with metal, the optical signal emitted from the VCSEL light emitting part is totally reflected by the plated metal to reduce the coupling loss between the VCSEL and the optical waveguide.

In the optical receiver as well, the coupling loss between the optical waveguide and the photodiode can be reduced by metal plating the inner surface of the through hole.

On the other hand, the arrow shown in the drawing indicates a path in which the optical signal is emitted from the optical transmitter 100 and transmitted to the optical receiver 200 as described above.

In addition, reference numeral 25 in FIG. 1B denotes a signal line pattern 25 formed on the first motherboard connection member 20 connected to the driving chip 30.

4A to 4H are plan views and cross-sectional views illustrating a manufacturing process of a flexible optical connection module for a flat panel display according to an embodiment of the present invention.

First, electrode patterns 11 and 13 are formed on the first and second main board connection members of FIG. 4A and the first and second substrates of FIG. 4B to fabricate the flexible optical connection module.

In FIG. 4A, the first and second main board connection members are flexible circuit boards having a signal line pattern 25 formed therein, and have an empty space 22 in the center for mounting the driving chip and the light source unit.

The electrode pattern 11 on the first substrate is a metal deposition part formed at a position where the driving chip 30 is mounted, and the electrode pattern 13 is electrically connected to each VCSEL element forming a VCSEL array which is a light source part 40. Signal line pattern for supplying a signal.

In addition, in FIG. 4B, the first substrate includes a hole processing alignment mark 14 which is a pattern representing a position 12 at which the solder ball is to be raised and a position at which the through hole 50 is to be drilled.

Next, the through-hole array is machined using mechanical or laser drilling to match the hole alignment marks 14 of the first substrate 10 as shown in FIG. 4C.

In FIG. 4D, an inner surface of each of the machined through holes is metal plated to form a metal reflective surface for total reflection of the optical signal.

The metal reflective surface may be formed by electroless plating and electrolytic plating by selecting from Au, Ag, Cu, Al, and Pt.

Next, as shown in FIG. 4E, the first substrate 10 having the through hole 50 processed therebetween is connected to the first main board connecting member 20 having the electronic circuit pattern formed thereon as shown in FIG. 3D.

As shown in FIG. 4F, the VCSEL is mounted on the first substrate 10 to which the first main board connection member 20 is connected by using flip chip bonding technology, and the driving chip 30 is a bonding wire 70. To be used.

The flexible optical waveguide 300 is closely aligned with the through-hole so as to minimize light loss and then fixed to the first substrate surface (FIG. 4g).

Here, the step of aligning and fixing the optical waveguide 300 on the surface of the first substrate 10 may be a thermosetting resin or a UV curable resin on the surface of the first substrate 10 and the surface of the optical waveguide 300. After application, the optical waveguide 300 is aligned and fixed to the first substrate 10 by applying heat or ultraviolet rays to cure.

The optical receiver 200 is also manufactured in the same manner as the optical transmitter 100 described above.

Finally, a housing is added to the first and second substrates 10 and 210 forming the optical transmitter 100 or the optical receiver 200 to protect the optical transmitter 100 and the optical receiver 200 (FIG. 4H). . The above manufacturing procedure can be changed according to conditions.

5 is a side cross-sectional view of a flexible optical connection module for a flat panel display according to another embodiment of the present invention.

The flexible optical connection module illustrated in FIG. 5 is a case in which a VCSEL as a light source or a photodiode as a light detector and a driving chip are directly mounted on a flexible circuit board and directly connected to an optical waveguide through a processed hole.

Fig. 5 shows a schematic cross-sectional view of the structure of the optical transmitter of the flexible optical connection module for flat panel display.

 In FIG. 5, the flexible optical connection module is omitted from the thick substrate in comparison with the flexible optical connection modules shown in FIGS. 1 and 2, and the mounting, coupling method, etc. of the circuit components are different except for plating the inner surface of the through hole. same.

The optical transmitter of the optical connection module shown in FIG. 5 includes a driving chip 30 connected to a flexible printed circuit board 21 on which a predetermined electronic circuit pattern is formed and a light source unit driven by the driving chip 30. 40 and a through-hole array 50 which is aligned with the light source unit 40 so as to transmit an optical signal and is formed directly on the flexible printed circuit board 21.

In addition, an optical receiver is also aligned with the optical detector to receive an optical signal, a driving chip connected to a printed circuit board to which a predetermined electronic circuit pattern is formed corresponding to the optical transmitter, the optical detector driven by the driving chip, and an optical signal. And through-hole arrays formed directly on the printed circuit board.

A flexible optical waveguide 300 having curved or 45 ° reflective mirror surfaces 330 at both ends for optical connection between the flexible printed circuit board 21 forming the optical transmitter and the printed circuit board forming the optical receiver. Connected.

The manufacturing process of the optical connection module in which the optical transmitter and the optical receiver are formed on the flexible printed circuit board illustrated in FIG. 5 and the optical waveguide is coupled may be referred to the manufacturing process of the above-described embodiment shown in FIGS. 4A to 4H.

First, in order to fabricate the flexible optical connection module, the flexible circuit board 20 of FIG. 4A corresponds to the flexible printed circuit board 21 on which the signal line pattern 25 is formed.

The driving chip and the light source unit are mounted in accordance with the signal line pattern on the flexible printed circuit board 21.

In addition, the hole alignment mark 14, which is a pattern representing a position 12 at which the solder ball is to be raised and a position at which the through hole 50 is drilled, is also displayed on the printed circuit board 21.

Next, referring to FIG. 4C, the through-hole array is processed by using a drill or a laser in accordance with the hole alignment mark 14 directly on the flexible printed circuit board 21 without the hard thick substrate being omitted.

Next, referring to FIG. 4F, the VCSEL is mounted on the flexible printed circuit board 21 by using flip chip bonding technology, and the driving chip 30 is bonded wire 70 by omitting the first substrate 10. Mount using.

The flexible optical waveguide 300 is closely aligned with the through-hole so as to minimize light loss, and then fixed to the flexible printed circuit board 21 (see FIG. 4G).

The optical waveguide 300 applies a thermosetting resin or a UV curable resin to the surface of the flexible printed circuit board 21 and the surface of the optical waveguide 300, and then hardens by applying heat or ultraviolet rays to the optical waveguide 300. ) Is fixed to the flexible printed circuit board 21.

The optical receiver 200 is also manufactured in the same manner as the optical transmitter 100 described above.

Finally, the housing 80 is added to the flexible printed circuit board 21 forming the optical transmitter 100 or the optical receiver 200 to protect the optical transmitter 100 and the optical receiver 200 (see FIG. 4H). .

In the method of forming the optical transmitter and the optical receiver directly on the flexible printed circuit board 21 and aligning the through-holes to couple the flexible optical waveguide, the manufacturing process becomes simpler, and the circuit board has only a thickness of several tens of micrometers. Since the distance between the VCSEL or photodiode and the optical waveguide can be reduced to several tens of micrometers, it is more advantageous to reduce the optical coupling loss.

As described above, according to the flexible optical connection module for a flat panel display and a manufacturing method thereof according to the present invention, the following effects can be expected.

When the flexible circuit board for flat panel display is used as a flexible optical connection module using an optical connection method, it is possible not only to solve the speed limit problem of the existing electric transmission, but also to parallel the transmission method between the display and the driving chip in parallel. It is possible to switch to the (serial) type to reduce the number of channels.

In addition, when the flexible optical connection module is used, power consumption can be improved by lowering the driving voltage in the driving circuit unit in the case of PDP, and a flexible and lightweight module can be configured by using a flexible substrate suitable for portable use.

In addition, the thickness of the device can be made thinner than the method using a fiber block or an optical waveguide butt-coupling.

In addition, since the distance between the VCSEL or the photodiode and the 45 ° mirror surface of the optical waveguide can be minimized, the optical loss can be minimized rather than the vertical light connection using the conventional 45 ° mirror surface optical waveguide.

In addition, the alignment tolerance can be increased, which facilitates packaging, and eliminates the need for a support such as an optical metal bench for separate optical waveguide alignment.

Although the present invention has been described in detail only with respect to the specific embodiments described, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications belong to the appended claims. .

Claims (20)

A first main board connecting member, a driving chip connected to the connecting member, a light source unit driven by the driving chip, and aligned with the light source unit to transmit an optical signal from the light source unit, and through-plated with a metal film on an inner surface thereof An optical transmitter including a first substrate on which a hole array is formed; A second main board connecting member, a driving chip connected to the connecting member, an optical detector driven by the driving chip, and aligned with the optical detector for receiving an optical signal from the optical detector, wherein a metal film is disposed on an inner surface thereof. An optical receiver including a second substrate on which a plated through-hole array is formed; And And a flexible optical waveguide having reflective mirror surfaces at both ends for optical connection between the optical transmitter and the optical receiver. The method of claim 1, The metal film plated on the inner wall of the through hole of the through hole array is selected from Au, Ag, Cu, Al, Pt. The method of claim 1, And the light transmitting unit comprises a surface emitting laser (VCSEL) array as a light source unit. The method of claim 1, And the photoreceptor comprises a photodiode array as a photodetector. The method of claim 1, And a first substrate and a second substrate forming the light transmitting unit and the light receiving unit are rigid substrates that can be selected from ceramics, glass, or FR4. The method of claim 1, The first and second substrates forming the light transmitting unit and the light receiving unit include a main board connecting member, a driving chip, a bonding wire, a light source unit or a light detecting unit, and a housing protecting the optical waveguide. Optical connection module. The method of claim 1, And the reflective mirror surface of the flexible optical waveguide is a 45 ° reflective mirror surface or a curved reflective mirror surface. The method of claim 1, The first main board connecting member or the second main board connecting member is a flexible optical connection module for a flat panel display, characterized in that made of a flexible printed circuit board. A driving chip to which a predetermined electronic circuit pattern is formed and connected to a circuit; a light source unit driven by the driving chip; and a first printed circuit board forming a through hole array aligned with the light source unit to transmit an optical signal to the light source unit. An optical transmitter; A second printed circuit forming a through-chip array formed with a predetermined electronic circuit pattern, a driving chip connected to a circuit, an optical detector driven by the driving chip, and an array of through holes aligned with the optical detector to receive an optical signal from the optical detector; An optical receiver including a substrate; And And a flexible optical waveguide having 45 ° reflective mirror surfaces at both ends for optical connection between the optical transmitter and the optical receiver. The method of claim 9, And the optical transmitting unit includes a surface emitting laser (VCSEL) array as a light source unit. The method of claim 9, And the photoreceptor comprises a photodiode array as a photodetector. The method of claim 9, The first printed circuit board and the second printed circuit board forming the optical transmitter and the optical receiver include a main board connection member, a driving chip, a bonding wire, a light source unit or a light detector, and a housing protecting the optical waveguide. Flexible optical connection module for flat panel displays. The method of claim 9, And the reflective mirror surface of the flexible optical waveguide is a 45 ° reflective mirror surface or a circular curved reflective mirror surface. The method of claim 9, And a first printed circuit board and a second printed circuit board forming the light transmitting unit and the light receiving unit. Forming an electrode circuit pattern on the main board connection member; Forming an electrode circuit pattern, a through hole array processing alignment mark on the substrate; Processing the through hole array in accordance with the through hole machining alignment mark on the substrate and plating the inner wall of the through hole; Connecting the main board connecting member on which the substrate having the through-hole processed and the electrode circuit pattern are formed; Mounting a light source unit or a light detection unit on the substrate of the optical transmitter and the optical receiver, in which the through holes are processed; Aligning and fixing the optical waveguide to the through hole array; And The method of manufacturing a flexible optical connection module for a flat panel display comprising the step of providing a housing on the substrate of the optical transmitter and the optical receiver. The method of claim 15, The plating of the through-hole array is a method of manufacturing a flexible optical connection module for a flat panel display, characterized in that performed by electroless plating and electrolytic plating. The method of claim 15, Aligning and fixing the optical waveguide to the substrate surface may include applying a thermosetting resin or a UV curable resin to the substrate surface and the surface of the optical waveguide, and curing the optical waveguide to the substrate by applying heat or ultraviolet rays. The manufacturing method of the flexible optical connection module for flat panel displays characterized by the fixing of alignment. Forming an electrode circuit pattern and a through hole array processing alignment mark on the flexible printed circuit board; Machining a through-hole array in accordance with the through-hole machining alignment mark on the substrate; Mounting a light source unit or a light detection unit on the substrate of the optical transmitter and the optical receiver, in which the through holes are processed; Aligning and fixing the optical waveguide to the through hole array; And The method of manufacturing a flexible optical connection module for a flat panel display comprising the step of providing a housing on the substrate of the optical transmitter and the optical receiver. The method of claim 18, Aligning and fixing the optical waveguide to the substrate surface may include applying a thermosetting resin or a UV curable resin to the substrate surface and the surface of the optical waveguide, and curing the optical waveguide to the substrate by applying heat or ultraviolet rays. The manufacturing method of the flexible optical connection module for flat panel displays characterized by the fixing of alignment. The method according to claim 15 or 18, The through-hole array formed on the substrate is a method of manufacturing a flexible optical connection module for a flat panel display, characterized in that formed by mechanical processing or laser drill processing.

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