CN110858463A

CN110858463A - Display device

Info

Publication number: CN110858463A
Application number: CN201810970042.6A
Authority: CN
Inventors: 黄建中; 李砚霆; 何俊杰
Original assignee: BRIGHTEK OPTOELECTRONIC SHENZHEN CO Ltd; Brightek Shenzhen Optoelectronic Co ltd
Current assignee: BRIGHTEK OPTOELECTRONIC SHENZHEN CO Ltd; Brightek Shenzhen Optoelectronic Co ltd
Priority date: 2018-08-23
Filing date: 2018-08-23
Publication date: 2020-03-03

Abstract

The present disclosure relates to a display device. A display device includes a plurality of light emitting units, a circuit board, and a processing unit. Each light-emitting unit comprises an insulating body, a substrate, a light-emitting chip, a driving chip and pins. The two opposite ends of the insulating body are respectively provided with a first groove and a second groove in a concave mode. The substrate is arranged in the insulating body. The light emitting chip is fixedly arranged on the substrate and exposed out of the first groove. The driving chip is fixedly arranged on the substrate and exposed out of the second groove. The first groove is filled with light-transmitting colloid. The second groove is filled with packaging colloid. Each light-emitting unit is fixedly arranged on the circuit main board. The processing unit is fixedly arranged on the circuit main board, the processing unit is electrically connected with each light-emitting unit, and the processing unit can independently control the brightness or color temperature of the light beams emitted by each light-emitting unit. The invention can be used for solving the problems of high production cost, complex related circuits and the like of the circuit mainboard of the existing high-density display equipment.

Description

Display device

Technical Field

The present invention relates to a display device, and more particularly, to a display device having high-density LEDs.

Background

In the conventional high-density display device, a plurality of LED units and related driving chips are disposed on a circuit board, and the number of the LED units is large, so that the number of the corresponding driving chips is also large, thereby solving the problems of complicated circuit design and high production cost of the circuit board.

In addition, in order to reduce the circuit complexity and the production cost of the circuit main board, some manufacturers may drive a single driving chip to drive a plurality of LED units at the same time, so that although the circuit complexity of the circuit main board may be slightly reduced, when any LED unit driven by the same driving chip is damaged, the plurality of LED units may not be operated together; alternatively, if any one of the driving chips is destroyed, the plurality of LED units cannot operate at the same time.

Disclosure of Invention

The present invention is directed to a display device, which is used to solve the problems of high production cost and complicated related circuits of the circuit board of the conventional high-density display device.

In order to achieve the above object, the present invention provides a display device characterized by comprising: a plurality of light emitting units, each of the light emitting units comprising: the packaging structure comprises an insulating body, a first sealing layer, a second sealing layer and a packaging adhesive, wherein two opposite ends of the insulating body are respectively recessed to form a first groove and a second groove; the substrate is arranged in the insulating body, the opposite wide side surfaces of the substrate are respectively defined as a first mounting surface and a second mounting surface, the first mounting surface is correspondingly exposed out of the first groove, the second mounting surface is correspondingly exposed out of the second groove, and the substrate comprises a plurality of conductive channels; at least one light emitting chip which is fixedly arranged on the first mounting surface, is correspondingly positioned in the first groove and is coated by the light-transmitting colloid; the driving chip is fixedly arranged on the second mounting surface, electrically connected with the light-emitting chip through the plurality of conductive channels, and coated in the packaging colloid without being exposed out of the insulating body or the packaging colloid; the pins are partially exposed out of the insulating body, part of the pins are electrically connected with the light-emitting chip, and part of the pins are electrically connected with the driving chip; the circuit main board is fixedly arranged on the light-emitting units, and the light-emitting units are arranged at intervals; and the processing unit is fixedly arranged on the circuit main board and is electrically connected with each light-emitting unit through the circuit main board, and the processing unit can independently control the brightness or color temperature of the light beam emitted by each light-emitting unit.

Preferably, the light emitting chip is electrically connected with the conductive wiring structure formed on the first mounting surface through a plurality of metal wires; or the light-emitting chip is connected with a plurality of welding pads arranged on the first mounting surface through a welding body.

Preferably, the driving chip is electrically connected with the conductive wiring structure arranged on the second mounting surface through a plurality of metal wires; or the driving chip is connected with a plurality of welding pads arranged on the second mounting surface through welding bodies.

Preferably, the encapsulant is a light-transmitting structure or a light-proof structure.

Preferably, each of the light emitting units has three light emitting chips, which are a first light emitting diode chip, a second light emitting diode chip and a third light emitting diode chip, respectively, and the first light emitting diode chip can emit light beams with wavelengths of 610 nm to 780 nm; the second light-emitting diode chip can emit light beams with the wavelength of 500 nanometers to 570 nanometers; the third light-emitting diode chip can emit light beams with the wavelength of 450-495 nanometers; the irradiation range of any one of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip can be partially overlapped with the irradiation range of at least one of the rest light-emitting diode chips; the light beams emitted by the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip can be mixed into a light-mixed light beam; the processing unit can control any one of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip of each light-emitting unit so as to control the brightness or the color temperature of the mixed light beam.

Preferably, the circuit board only includes four electrical layer structures, which are a first signal layer structure, a power layer structure, a second signal layer structure and a ground layer structure.

In order to achieve the above object, the present invention also provides a display device characterized by comprising: a plurality of light emitting units, each of the light emitting units comprising: the packaging structure comprises an insulating body, a first sealing layer, a second sealing layer and a packaging adhesive, wherein two opposite ends of the insulating body are respectively recessed to form a first groove and a second groove; the two opposite side surfaces of each lead frame are respectively exposed out of the first groove and the second groove, and part of each lead frame is exposed out of the insulating body; the plurality of light-emitting chips are fixedly arranged on the parts of the plurality of lead frames, which are exposed out of the first grooves, are correspondingly positioned in the first grooves, and are electrically connected with at least one part of the lead frames through a plurality of first metal leads; the plurality of light-emitting chips and the plurality of first metal wires are coated by the light-transmitting colloid; the driving chip is fixedly arranged on the parts of the lead frames, which are exposed out of the second grooves, and is electrically connected with at least one part of the lead frames through a plurality of second metal leads; the plurality of driving chips and the plurality of second metal wires are coated by the packaging colloid; the driving chip is electrically connected with the plurality of light-emitting chips through the plurality of second metal wires and the lead frame electrically connected with the second metal wires; the circuit main board is fixedly arranged on the light-emitting units, and the light-emitting units are arranged at intervals; and the processing unit is fixedly arranged on the circuit main board and is electrically connected with each light-emitting unit through the circuit main board, and the processing unit can independently control the brightness or color temperature of the light beam emitted by each light-emitting unit.

Preferably, the light emitting unit has three light emitting chips, which are a first light emitting diode chip, a second light emitting diode chip and a third light emitting diode chip, respectively, and the first light emitting diode chip can emit light beams with wavelengths of 610 nm to 780 nm; the second light-emitting diode chip can emit light beams with the wavelength of 500 nanometers to 570 nanometers; the third light-emitting diode chip can emit light beams with the wavelength of 450-495 nanometers; the irradiation range of any one of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip can be partially overlapped with the irradiation range of at least one of the rest light-emitting diode chips; the light beams emitted by the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip can be mixed into a light-mixed light beam; the processing unit can control any one of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip of each light-emitting unit so as to control the brightness or the color temperature of the mixed light beam.

The beneficial effects of the invention can be that: the design that the driving chip and the light emitting chip are arranged on the substrate or on two opposite side surfaces of the plurality of lead frames can greatly reduce the size of the whole light emitting unit, thereby effectively reducing the spacing distance between the light emitting units of the display device and increasing the arrangement density of the light emitting units in the unit area of the display device. In addition, through the design that the driving chip is arranged in each light-emitting unit, the circuit complexity of the circuit main board can be greatly reduced, and the production cost of the circuit main board can be reduced.

Drawings

Fig. 1 is a partial schematic view of a display device of the present invention.

Fig. 2 is a partial cross-sectional view of a display device of the present invention.

Fig. 3 is a schematic diagram of a first embodiment of a light emitting unit of a display device of the present invention.

Fig. 4 is a schematic view of another view of the light emitting unit of the display device according to the first embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view of a light emitting unit of a display device according to a first embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view of a light emitting unit of a display device according to a second embodiment of the present invention.

Fig. 7 is a partially enlarged schematic view of fig. 6.

Fig. 8 is a perspective view illustrating a light emitting unit of a display device according to a third embodiment of the present invention.

Fig. 9 is a schematic cross-sectional view of a light emitting unit of a display device according to a third embodiment of the present invention.

Fig. 10 is a flowchart illustrating a method for manufacturing a light emitting unit of a display device according to a first embodiment of the present invention.

Fig. 11 is a flowchart illustrating a method for manufacturing a light emitting unit of a display device according to a second embodiment of the present invention.

Fig. 12 is a flowchart illustrating a method for manufacturing a light emitting unit of a display device according to a third embodiment of the present invention.

Fig. 13 is a flowchart illustrating a method for manufacturing a light emitting unit of a display device according to a fourth embodiment of the present invention.

Detailed Description

Please refer to fig. 1, which is a partial schematic view of a display device according to the present invention. As shown, the display apparatus 1000 includes: a plurality of light emitting units 100, a circuit board 200 and a processing unit 300. The light emitting units 100 are arranged on the circuit board 200 at intervals, the processing unit 300 is fixedly disposed on the circuit board 200, the processing unit 300 can be electrically connected to the light emitting units 100 through the circuit board 200, and the processing unit 300 can independently control the brightness or color temperature of the light beams emitted by the light emitting units 100.

As shown in fig. 2, a cross-sectional view of the circuit board 200 and the single light emitting unit 100 is shown. The circuit board 200 may only include four electrical layers, which are a first signal layer 201, a power layer 202, a second signal layer 203 and a ground layer 204. Each light emitting unit 100 can be electrically connected to the processing unit 300 and the related power supply through the first signal layer structure 201, the power layer structure 202, the second signal layer structure 203 and the ground layer structure 204, so as to receive the signal transmitted from the processing unit 300 and the power transmitted from the power supply.

The number, size, spacing distance and arrangement of the light emitting units 100 shown in fig. 1 can be varied according to the requirement, and are not limited to the illustration. In addition, the size of the processing unit 300 and the arrangement position thereof relative to the light emitting units 100 may also vary according to requirements, and the illustration is only an example. In addition, in a special application, the processing unit 300 may not be disposed on the same side of the circuit board 200 as the light emitting unit 100, and the processing unit 300 and the plurality of light emitting units 100 may be disposed on opposite sides of the circuit board 200. The processing unit 300 is, for example, a microprocessor or various processors capable of controlling the light emitting diodes. In different applications, the display device 1000 may also include a plurality of processing units 300, and the different processing units 300 may be a plurality of light emitting units 100 correspondingly controlling different areas.

Referring to fig. 3 to 5, fig. 3 and 4 are schematic perspective views of a light emitting unit according to a first embodiment of the invention; fig. 5 is a schematic cross-sectional view of a light emitting unit according to a first embodiment of the invention. As shown in the figure, the light emitting unit 100 includes an insulating body 10, a transparent encapsulant 11, an encapsulant 12, a substrate 13, three light emitting chips 14, a driving chip 15, and four pins 16.

The two opposite ends of the insulating body 10 are recessed to form a first groove 10a and a second groove 10b, respectively, the first groove 10a is filled with a transparent adhesive 11, and the second groove 10b is filled with an encapsulant 12. In practical applications, the shapes of the first groove 10a and the second groove 10b may vary according to requirements, and are shown in the figures as only one example; the first groove 10a and the second groove 10b are not substantially communicated with each other, but not limited thereto. In practical applications, the side wall forming the first groove 10a may be provided with a reflective layer (not shown), and the side wall forming the first groove 10a may also be inclined, so as to assist in guiding the light beam emitted by the light emitting chip 14.

The substrate 13 is disposed in the insulation body 10, two opposite wide side surfaces of the substrate 13 are respectively defined as a first mounting surface 131 and a second mounting surface 132, the first mounting surface 131 is correspondingly exposed at the bottom of the first groove 10a, and the second mounting surface 132 is correspondingly exposed at the bottom of the second groove 10 b. As shown in fig. 5, the substrate 13 includes a plurality of conductive vias 133 therein. Specifically, the substrate 13 may be any type of circuit board, the first mounting surface 131 and the second mounting surface 132 may be formed with a conductive wiring structure (Layout) and a plurality of pads by etching or the like according to the requirement, and the conductive vias 133 may be formed by through holes formed in the substrate 13 and conductive material filled in the through holes. The structures such as the conductive wiring structure and the bonding pads formed on the first mounting surface 131 and the second mounting surface 132 may be designed according to the types of the light emitting chips 14, the number of the light emitting chips 14, the types of the driving chips 15, and the number of the pins 16 of the light emitting unit 100, and are not limited herein. The number and the arrangement position of the conductive vias 133 may be determined according to the positions of the driving chip 15 and the light emitting chip 14 on the substrate 13.

As shown in fig. 3 and 5, the three light emitting chips 14 are fixedly disposed on the first mounting surface 131, and each light emitting chip 14 is electrically connected to the conductive wiring structure on the first mounting surface 131 and the conductive channel 133 in the substrate 13 through a plurality of metal wires 141. The three light emitting chips 14 fixed on the first mounting surface 131 are correspondingly located in the first groove 10a, the three light emitting chips 14 are covered by the light transmissive colloid 11, and light beams emitted by the three light emitting chips 14 can pass through the light transmissive colloid 11 to be emitted outwards.

In practical applications, the three light emitting chips 14 may be a first light emitting diode chip, a second light emitting diode chip and a third light emitting diode chip, respectively, and the first light emitting diode chip can emit light beams with wavelengths of 610 nm to 780 nm; the second light emitting diode chip can emit light beams with the wavelength of 500 nanometers to 570 nanometers; the third LED chip can emit light beams with the wavelength of 450-495 nanometers; that is, the three light emitting chips 14 may emit light beams of red light, green light, and blue light, respectively. The irradiation range of any one of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip can be partially overlapped with the irradiation range of at least one of the rest light-emitting diode chips, and the light beams emitted by the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip can be mutually mixed into a mixed light beam.

In the present embodiment, three light emitting chips 14 capable of emitting different light are taken as an example, but not limited thereto, in a specific embodiment, the light emitting unit 100 may have more than four or less than two light emitting chips 14, and the wavelength of the light beam emitted by the light emitting chips 14 is also not limited thereto, and can be selected according to the requirement.

The driving chip 15 is fixedly disposed on the second mounting surface 132, and the driving chip 15 is electrically connected to the conductive wiring structure on the second mounting surface 132 through a plurality of metal wires 151, and the driving chip 15 can be electrically connected to the three light emitting chips 14 through the conductive vias 133 in the substrate 13. The driving chip 15 is correspondingly disposed in the second groove 10b, and the driving chip 15 is covered in the encapsulant 12, while the driving chip 15 is not exposed out of the insulation body 10 or the encapsulant 12. The encapsulant 12 may be an opaque structure or a transparent structure, which is not limited herein.

The second recess 10b is only used to expose the second mounting surface 132 of the substrate 13, so that the driving chip 15 can be correspondingly disposed on the second mounting surface 132, and therefore, the size and shape of the second recess 10b are substantially designed according to the size of the driving chip 15, and the size and shape of the second recess 10b have no absolute relative relationship with the size and shape of the first recess 10 a. Thus, the second groove 10b is located just below the first groove 10a, which effectively reduces the overall size of the light emitting unit 100.

As shown in fig. 4, the plurality of pins 16 are exposed outside the insulating body 10, a portion of the pins 16 are electrically connected to the light emitting chip 14, and a portion of the pins 16 are electrically connected to the driving chip 15; the pins 16 can be electrically connected to the light emitting chips 14 and the driving chip 15 through the conductive wiring structure on the first mounting surface 131, the conductive wiring structure on the second mounting surface 132, and the conductive vias 133 of the substrate 13.

The light emitting units 100 are fixed and electrically connected to the circuit board 200 (as shown in fig. 1) through the plurality of pins 16, and the processing unit 300 can transmit control signals to the driving chips 15 of the light emitting units 100 through the circuit board 200 and the plurality of pins 16, so as to change the brightness or color temperature of the light beams emitted by the light emitting units 100; on the contrary, when the single light emitting unit 100 has a plurality of light emitting chips capable of emitting different color temperatures, the processing unit 300 can correspondingly control the brightness and the color temperature of the mixed light beam emitted by the light emitting unit 100. Specifically, since the processing unit 300 can independently control a single light emitting unit 100, the display apparatus 1000 of the present invention can adjust the color temperature of the light beams emitted by each light emitting unit 100 according to the requirement, so that the plurality of light emitting units 100 of the display apparatus 1000 can have high uniformity when emitting light beams with the same color temperature respectively.

In addition, since each light emitting unit 100 has an independent driving chip 15, and the circuit board 200 controls the driving chips 15 of the light emitting units 100 to control the light emitting units 100, there may be no absolute connection relationship between the light emitting units 100, that is, the related personnel or machinery may replace a single light emitting unit 100.

In practical applications, the pin 16 may be a structure extending from the substrate 13, or the pin 16 may be a metal member independent from the substrate 13, and one end of the pin 16 is fixed on the substrate 13 and the other end of the pin 16 is correspondingly exposed outside the insulating body 10.

Referring to fig. 6 and 7 together, fig. 6 is a schematic cross-sectional view illustrating a second embodiment of each light emitting unit of the display device of the present invention, and fig. 7 is a partially enlarged view illustrating fig. 6. As shown in the figure, the biggest difference between the present embodiment and the previous embodiment is: each of the light emitting chips 14 may be connected to the plurality of pads 134 disposed on the first mounting surface 131 through the bonding body 142, and the driving chip 15 may be connected to the plurality of pads 134 disposed on the second mounting surface 132 through the bonding body 142. The plurality of pads 134 disposed on the first mounting surface 131 and the second mounting surface 132 are electrically connected to the conductive vias 133 disposed in the substrate 13.

Specifically, in the process of actually mounting the light emitting chip 14 and the driving chip 15, solder balls (e.g., solder balls) may be disposed at positions where the light emitting chip 14 and the driving chip 15 are to be electrically connected, the light emitting chip 14 and the driving chip 15 with the solder balls are directly disposed on the plurality of solder pads 134 on the first mounting surface 131 and the second mounting surface 132, and then the solder balls are cured to form the solder bodies 142 between the light emitting chip 14 and the solder pads 134 and between the driving chip 15 and the solder pads 134; thus, the manufacturing method does not need to use the metal wires described in the foregoing embodiments, so that the yield of correctly mounting the light emitting chips 14 or the driving chips 15 on the substrate 13 can be greatly improved.

In particular, in practical applications, the light emitting chip 14 and the driving chip 15 can be mounted on the substrate 13 in the manner of the present embodiment or the foregoing embodiment, respectively, according to the requirements of practical production and manufacturing; for example, in the same light emitting unit 100, the light emitting chip 14 may be electrically connected to the substrate 13 through a plurality of metal wires 141, and the driving chip 15 may be electrically connected to the substrate 13 through a plurality of bonding bodies 142; alternatively, in the same light emitting unit 100, the light emitting chip 14 may be electrically connected to the substrate 13 through the plurality of bonding bodies 142, and the driving chip 15 may be electrically connected to the substrate 13 through the plurality of metal wires 151.

Please refer to fig. 8 and 9 together, which are schematic diagrams illustrating a third embodiment of each light emitting unit of the display device of the present invention. As shown in the figure, the biggest difference between the present embodiment and the previous embodiment is: the light emitting unit 100 may not include the substrate 13, and the light emitting unit 100 includes a plurality of lead frames 17(lead frames). The following description only refers to the lead frame 17, and the rest of the components refer to the description of the foregoing embodiments, which are not repeated herein.

Two opposite side surfaces of each lead frame 17 are respectively exposed out of the first groove 10a and the second groove 10b, and a portion of each lead frame 17 is exposed out of the insulating body 10 to serve as the pin 16 carried in the foregoing embodiment; for a detailed description of the pin 16, please refer to the foregoing embodiments, which are not described herein.

The plurality of light emitting chips 14 are fixedly disposed on the portions of the plurality of lead frames 17 exposed out of the first grooves 10a, the plurality of light emitting chips 14 are correspondingly disposed in the first grooves 10a, and each light emitting chip 14 is electrically connected to at least a portion of the lead frame 17 through a plurality of first metal wires 141. The light emitting chips 14 and the first metal wires 141 are covered by the transparent adhesive 11. The number of the lead frames 17 may be determined according to the number of the light emitting chips 14 and the type of the driving chip 15, but is not limited thereto, and may be, for example, 4, 6, 8, and the like.

The driving chip 15 is fixedly disposed on the portions of the plurality of lead frames 17 exposed out of the second grooves 10b, and the driving chip 15 is electrically connected to at least a portion of the lead frames 17 through a plurality of second metal wires 151. The driving chip 15 and the plurality of second metal wires 151 are covered by the encapsulant 12. The driving chip 15 is electrically connected to the light emitting chips 14 through the second metal wires 151 and the lead frame 17 electrically connected to each of the second metal wires 151. Therefore, the driving chip 15 can receive the electrical signals transmitted by the processing unit 300 through the plurality of lead frames 17 to correspondingly control the brightness or color temperature of the light beams emitted by the light emitting chips 14.

Particularly, the circuit board included in the conventional high-density display device is provided with a driving chip for driving the LED units and circuits thereof, and the conventional circuit board has problems of complicated circuit and high production cost. Specifically, the conventional circuit board has to have at least six electrical layer structures to have enough space for designing the related circuits. In addition, in order to save the complexity of the driving chip and the related circuits of the conventional high-density display device, a single driving chip is usually used to drive a plurality of LED units simultaneously, so that when the single LED unit is damaged, the remaining LED units sharing the same driving chip may not be lighted at the same time.

In contrast, in the display device 1000 according to the embodiments of the present invention, the driving chip 15 for driving each light emitting unit 100 is disposed in each light emitting unit 100, so that the complexity of the circuit board 200 can be greatly reduced, and the production cost of the circuit board 200 can be greatly reduced. In addition, the plurality of light emitting units 100 of the display device 1000 of the present invention may not share the same driving chip 15 with each other, and thus, the above-mentioned conventional high-density display device is not prone to have a problem that the destruction of a single LED unit, which is likely to occur, would cause the simultaneous destruction of a plurality of LED units.

In addition, the display device 1000 of the present invention can greatly reduce the size of the whole light emitting unit 100 by the design that the driving chip 15 and the light emitting chip 14 are disposed on the substrate 13 or the two opposite side surfaces of the plurality of lead frames 17, thereby effectively reducing the distance between the plurality of light emitting units 100 of the display device 1000 and increasing the disposition density of the light emitting units 100 in the unit area of the display device 1000.

Please refer to fig. 10, which is a flowchart illustrating a method for fabricating each light emitting unit of the display device according to a first embodiment of the present invention. The manufacturing method of the light-emitting unit of the display device comprises the following steps:

a substrate fabricating step S11: forming a plurality of first welding pads and a plurality of second welding pads on two opposite wide side surfaces of a substrate respectively, and forming a plurality of conductive channels in the substrate, so that at least one part of the first welding pads can be electrically connected with at least one part of the second welding pads through the plurality of conductive channels;

an insulating body molding step S12: covering a part of the substrate with an insulating material to form an insulating body, wherein two opposite ends of the insulating body are respectively recessed to form a first groove and a second groove;

a die bonding step S13: welding and fixing at least one light-emitting chip fixed with a plurality of welding balls on a plurality of first welding pads;

a transparent colloid forming step S14: filling a transparent adhesive in the first groove, and curing the transparent adhesive to form a transparent adhesive, wherein the transparent adhesive seals the first groove;

a driving chip fixing step S15: welding and fixing a driving chip fixed with a plurality of welding balls on a plurality of second welding pads;

a molding step S16: and filling a packaging adhesive in the second groove, and curing the packaging adhesive to form a packaging adhesive, wherein the packaging adhesive seals the second groove.

Please refer to fig. 11, which is a flowchart illustrating a method for fabricating each light emitting unit of the display device according to a second embodiment of the present invention.

A substrate fabricating step S21: forming a plurality of first welding pads and a plurality of second welding pads on two opposite wide side surfaces of a substrate respectively, and forming a plurality of conductive channels in the substrate, so that at least one part of the first welding pads can be electrically connected with at least one part of the second welding pads through the plurality of conductive channels;

an insulating body molding step S22: covering a part of the substrate with an insulating material to form an insulating body, wherein two opposite ends of the insulating body are respectively recessed to form a first groove and a second groove;

a driving chip fixing step S23: welding and fixing a driving chip fixed with a plurality of welding balls on a plurality of second welding pads;

a molding step S24: filling a packaging adhesive in the second groove, and curing the packaging adhesive to form a packaging adhesive, wherein the packaging adhesive seals the second groove;

a die bonding step S25: welding and fixing at least one light-emitting chip fixed with a plurality of welding balls on a plurality of first welding pads;

a transparent colloid forming step S26: and filling a transparent adhesive in the first groove, and curing the transparent adhesive to form a transparent adhesive, wherein the transparent adhesive seals the first groove.

Two opposite wide sides of the substrate referred to in the substrate fabricating step S11 and the substrate fabricating step S21 are referred to as the first mounting surface and the second mounting surface in the foregoing embodiment; the plurality of first pads and the plurality of second pads referred to in the substrate fabricating step S11 and the substrate fabricating step S21 are pads respectively disposed on the first mounting surface and the second mounting surface in the foregoing embodiment. The related description of the first mounting surface, the second mounting surface, the pads disposed thereon and the like in the foregoing embodiments can also be applied to the present embodiment. The light emitting units manufactured by the first and second embodiments of the method for manufacturing each light emitting unit of the display device of the present invention are as shown in fig. 5.

Please refer to fig. 12, which is a flowchart illustrating a method for fabricating each light emitting unit of the display device according to a third embodiment of the present invention.

A base molding step S31: covering a plurality of lead frames by an insulating material, and respectively recessing two opposite ends of the insulating body into a first groove and a second groove, respectively exposing two opposite side surfaces of each lead frame to the first groove and the second groove, and partially exposing each lead frame to the insulating body;

a die bonding step S32: fixing a plurality of light emitting diode chips on the parts of the lead frames exposed out of the first grooves, so that the light emitting diode chips are positioned in the first grooves;

a wire bonding step S33: the plurality of light emitting diode chips are electrically connected with the plurality of lead frames through a plurality of metal leads so as to electrically connect the plurality of light emitting diode chips with the plurality of lead frames;

a transparent colloid forming step S34: filling a transparent adhesive in the first groove, and curing the transparent adhesive to form a transparent adhesive, wherein the transparent adhesive seals the first groove;

a driving chip fixing step S35: fixing a driving chip on the parts of the lead frames exposed out of the first grooves, and enabling the driving chip to be located in the second grooves;

a wire bonding step S36: the driving chip is electrically connected with the lead frames through a plurality of metal leads, and the driving chip can be electrically connected with the plurality of light-emitting diode chips through the lead frames;

a molding step S37: and filling a packaging adhesive in the second groove, and curing the packaging adhesive to form a packaging adhesive, wherein the packaging adhesive seals the second groove.

Please refer to fig. 13, which is a flowchart illustrating a method for fabricating each light emitting unit of the display device according to a fourth embodiment of the present invention.

A base molding step S41: covering a plurality of lead frames by an insulating material, and respectively recessing two opposite ends of the insulating body into a first groove and a second groove, respectively exposing two opposite side surfaces of each lead frame to the first groove and the second groove, and partially exposing each lead frame to the insulating body;

a driving chip fixing step S42: fixing a driving chip on the parts of the lead frames exposed out of the first grooves, and enabling the driving chip to be located in the second grooves;

a wire bonding step S43: the driving chip is electrically connected with the lead frames through a plurality of metal leads, and the driving chip can be electrically connected with the plurality of light-emitting diode chips through the lead frames;

a molding step S44: filling a packaging adhesive in the second groove, and curing the packaging adhesive to form a packaging adhesive, wherein the packaging adhesive seals the second groove;

a die bonding step S45: fixing a plurality of light emitting diode chips on the parts of the lead frames exposed out of the first grooves, so that the light emitting diode chips are positioned in the first grooves;

a wire bonding step S46: the plurality of light emitting diode chips are electrically connected with the plurality of lead frames through a plurality of metal leads so as to electrically connect the plurality of light emitting diode chips with the plurality of lead frames;

a transparent colloid forming step S47: and filling a transparent adhesive in the first groove, and curing the transparent adhesive to form a transparent adhesive, wherein the transparent adhesive seals the first groove.

A light-emitting unit manufactured by the method of manufacturing a light-emitting unit according to the third embodiment of the present invention is as shown in fig. 8 and 9; in contrast, the embodiments described in the foregoing embodiments corresponding to fig. 8 and 9 can also be applied to the present embodiment.

According to the display device of the present invention, since the driving chip is disposed inside each light emitting unit, and the driving chip and the light emitting chip are disposed on opposite sides of the insulating body, the minimum size of each light emitting unit can be reduced to 0.5 mm by 0.5 mm, and the distance (pitch) between every two adjacent light emitting units of the display device can be reduced to 0.6 mm.

Claims

1. A display device, comprising:

a plurality of light emitting units, each of the light emitting units comprising:

the packaging structure comprises an insulating body, a first sealing layer, a second sealing layer and a packaging adhesive, wherein two opposite ends of the insulating body are respectively recessed to form a first groove and a second groove;

the substrate is arranged in the insulating body, the opposite wide side surfaces of the substrate are respectively defined as a first mounting surface and a second mounting surface, the first mounting surface is correspondingly exposed out of the first groove, the second mounting surface is correspondingly exposed out of the second groove, and the substrate comprises a plurality of conductive channels;

at least one light emitting chip which is fixedly arranged on the first mounting surface, is correspondingly positioned in the first groove and is coated by the light-transmitting colloid;

the driving chip is fixedly arranged on the second mounting surface, electrically connected with the light-emitting chip through the plurality of conductive channels, and coated in the packaging colloid without being exposed out of the insulating body or the packaging colloid;

the pins are partially exposed out of the insulating body, part of the pins are electrically connected with the light-emitting chip, and part of the pins are electrically connected with the driving chip;

the circuit main board is fixedly arranged on the light-emitting units, and the light-emitting units are arranged at intervals; and

the processing unit is fixedly arranged on the circuit main board and is electrically connected with each light-emitting unit through the circuit main board, and the processing unit can independently control the brightness or color temperature of the light beams emitted by each light-emitting unit.

2. The display device according to claim 1, wherein the light emitting chip is electrically connected to a conductive wiring structure formed on the first mounting surface through a plurality of metal wires; or the light-emitting chip is connected with a plurality of welding pads arranged on the first mounting surface through a welding body.

3. The display device according to claim 1 or 2, wherein the driving chip is electrically connected to the conductive wiring structure disposed on the second mounting surface through a plurality of metal wires; or the driving chip is connected with a plurality of welding pads arranged on the second mounting surface through welding bodies.

4. The display apparatus of claim 1, wherein the encapsulant is a light transmissive structure or a light opaque structure.

5. The display device of claim 1, wherein each of said light emitting units has three of said light emitting chips, which are a first light emitting diode chip, a second light emitting diode chip and a third light emitting diode chip, said first light emitting diode chip being capable of emitting a light beam having a wavelength of 610 nm to 780 nm; the second light-emitting diode chip can emit light beams with the wavelength of 500 nanometers to 570 nanometers; the third light-emitting diode chip can emit light beams with the wavelength of 450-495 nanometers; the irradiation range of any one of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip can be partially overlapped with the irradiation range of at least one of the rest light-emitting diode chips; the light beams emitted by the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip can be mixed into a light-mixed light beam; the processing unit can control any one of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip of each light-emitting unit so as to control the brightness or the color temperature of the mixed light beam.

6. The display device of claim 1, wherein the circuit board comprises only four electrical layer structures, which are a first signal layer structure, a power layer structure, a second signal layer structure and a ground layer structure.

7. A display device, comprising:

the two opposite side surfaces of each lead frame are respectively exposed out of the first groove and the second groove, and part of each lead frame is exposed out of the insulating body;

the plurality of light-emitting chips are fixedly arranged on the parts of the plurality of lead frames, which are exposed out of the first grooves, are correspondingly positioned in the first grooves, and are electrically connected with at least one part of the lead frames through a plurality of first metal leads; the plurality of light-emitting chips and the plurality of first metal wires are coated by the light-transmitting colloid; and

the driving chip is fixedly arranged on the parts of the lead frames, which are exposed out of the second grooves, and is electrically connected with at least one part of the lead frames through a plurality of second metal leads; the plurality of driving chips and the plurality of second metal wires are coated by the packaging colloid; the driving chip is electrically connected with the plurality of light-emitting chips through the plurality of second metal wires and the lead frame electrically connected with the second metal wires;

the processing unit is fixedly arranged on the circuit main board and is electrically connected with each light-emitting unit through the circuit main board, and the processing unit can independently control the brightness or color temperature of the light beam emitted by each light-emitting unit.

8. The display apparatus as claimed in claim 7, wherein the encapsulant is a light transmissive structure or a light opaque structure.

9. The display device as claimed in claim 7, wherein the light emitting unit has three of the light emitting chips, which are a first light emitting diode chip, a second light emitting diode chip and a third light emitting diode chip, respectively, the first light emitting diode chip being capable of emitting a light beam having a wavelength of 610 nm to 780 nm; the second light-emitting diode chip can emit light beams with the wavelength of 500 nanometers to 570 nanometers; the third light-emitting diode chip can emit light beams with the wavelength of 450-495 nanometers; the irradiation range of any one of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip can be partially overlapped with the irradiation range of at least one of the rest light-emitting diode chips; the light beams emitted by the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip can be mixed into a light-mixed light beam; the processing unit can control any one of the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip of each light-emitting unit so as to control the brightness or the color temperature of the mixed light beam.

10. The display device of claim 7, wherein the circuit board comprises only four electrical layers, which are a first signal layer, a power layer, a second signal layer and a ground layer.