CN201549498U - Encapsulation structure of side-luminescence LED - Google Patents
Encapsulation structure of side-luminescence LED Download PDFInfo
- Publication number
- CN201549498U CN201549498U CN2009201882066U CN200920188206U CN201549498U CN 201549498 U CN201549498 U CN 201549498U CN 2009201882066 U CN2009201882066 U CN 2009201882066U CN 200920188206 U CN200920188206 U CN 200920188206U CN 201549498 U CN201549498 U CN 201549498U
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- Prior art keywords
- wafer
- red
- pin
- blue
- green
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The utility model discloses an encapsulation structure of a side-luminescence LED, which comprises a metal current-conducting plate 1, a cavity body 2, a red wafer 3, a green wafer 4, a blue wafer 5, a lead wire 6, wafer fixing glue 7 and six pins, wherein the pins are arranged on the metal current-conducting plate 1, the rectangular cavity body 2 is formed by compressing PPA plastics on a metal current-conducting layer 1. The red wafer 3, the green wafer 4 and the blue wafer 5 are arranged in a linear way, the red wafer 3 is arranged on the middle, each wafer is adhered onto the metal current-conducting plate 1 through the wafer fixing glue 7, and the wafer and the pins are welded by the lead wire 6 to form a circuit. Transparent silica gel resin 9 is poured into the rectangular cavity body 2 to be baked and solidified. The red, the green and the blue wafers are arranged in the linear way, so the limit of the space size and the requirement of the mixed color are satisfied. The mixed white light has high color rendering and high lighting effect.
Description
Technical field
The utility model relates to the encapsulating structure of a kind of LED, relates in particular to the encapsulating structure of the illuminated White LED of a kind of side, belongs to field of photoelectric technology.
Background technology
The led light source technology is applied to liquid crystal panel backlight and shows the field, mainly contains three kinds of application modes at present: straight-down negative three primary colors RGB-LED light source, the illuminated White LED light source of straight-down negative White LED light source and side.Straight-down negative and side are illuminated to be to describe the light emission direction of LED and the relation of light guide plate.The printing opacity direction of liquid crystal panel light guide plate is vertical with LCD screen, and self is parallel to LCD screen light guide plate.The light input direction of luminous element is called as the illuminated light source of side the light guide plate side, be positioned at the light guide plate one side parallel with light guide plate be directly-down light source.Though the illuminated led light source of side does not have regional adjustment capability, because light source is positioned at fuselage one side, therefore have the advantages that not take body thickness, be beneficial to the ultra-thin liquid crystal panel structure of exploitation.The illuminated White LED light source classical production process of side is a coating fluorescent powder on blue wafer, when fluorescent material is subjected to send sodium yellow after blue-light excited, blue light and yellow light mix form white light, and its color developing is lower, and the color of liquid crystal panel is shown certain influence.If on the basis of white light LEDs, add other color LED and solve this problem, again because the panel space size is limit solution that can not be perfect.Thus, manufacture and design a kind of illuminated White LED light source of side of high-color rendering, full gamut back lighting of realizing and become the key that solves this type of color reduction problem.
The utility model content
But the purpose of this utility model is to provide the encapsulating structure of the illuminated White LED of side of a kind of high-color rendering full gamut back lighting.
The purpose of this utility model is achieved by the following technical programs:
The encapsulating structure of the illuminated LED of a kind of side, comprise metallic conduction plate 1, cavity 2, wafer, gold thread 6, pin I 81, pin II 82, pin III83, pin IV84, pin V85, pin VI86, wafer is fixed on the metallic conduction plate 1 by crystal-bonding adhesive 7, gold thread 6 connecting wafers and metallic conduction plate 1, each pin is connected with circuit on being arranged on metallic conduction plate 1; Described wafer comprises red wafer 3, green wafer 4, blue wafer 5, metallic conduction plate 1 and cavity 2 are pressed into one, described red wafer 3, green wafer 4, blue wafer 5 are with red wafer 3 mode linear array placed in the middle, transparent silica gel resin 9 is poured in the cavity 2, covers described red wafer 3, green wafer 4, blue wafer 5 and gold thread 6.
The purpose of this utility model can also further realize by following technical measures:
The encapsulating structure of the illuminated LED of aforesaid a kind of side, wherein said cavity 2 be rectangle; The material of described cavity 2 is the PPA plastics.
The beneficial effects of the utility model are: by three kinds of white lights that wafer mixed of RGB three primary colors red, green, blue, have high-color rendering energy, high light-emitting efficiency.By adjusting drive circuit, can realize full color simultaneously, adopt the liquid crystal panel of this kind encapsulating structure, Show Color is bright-coloured.Three kinds of wafers of red, green, blue linearly arrange, and have taken into account the needs of bulk restriction and colour mixture, and the utility model can be widely used in lighting fields such as liquid crystal panel, advertising lamp box, can realize that the full gamut color shows to look, and the while also can dynamically be adjusted change color.
Description of drawings
Fig. 1 is a plan structure schematic diagram of the present utility model;
Fig. 2 is the A-A cutaway view Amplified image of Fig. 1.
Embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
As shown in Figure 1, the utility model comprises metallic conduction plate 1, cavity 2, red wafer 3, green wafer 4, blue wafer 5, gold thread 6, crystal-bonding adhesive 7, pin I 81, pin II 82, pin III83, pin IV84, pin V85, pin VI86, each pin is positioned on the metallic conduction plate 1, separately controls the luminescent wafer of three kinds of colors of red, green, blue separately.Red wafer 3, green wafer 4, blue wafer 5 are with red wafer 3 mode linear array placed in the middle, be fixed on the metallic conduction plate 1 by crystal-bonding adhesive 7 respectively, gold thread 6 connecting wafers and metallic conduction plate 1, each pin respectively be arranged on metallic conduction plate 1 on circuit be connected.Metallic conduction plate 1 and cavity 2 are pressed into one, weld gold thread 6 after, transparent silica gel resin 9 is poured in the cavity 2, covers described red wafer 3, green wafer 4, blue wafer 5, baking-curing outside is connected with circuit by 6 pins.Cavity 2 be rectangle, material is the PPA plastics.
The utility model promptly by three kinds of well-mixed white lights of wafer of red, green, blue, has high-color rendering energy, high light-emitting efficiency by the RGB three primary colors.By adjusting drive circuit, can realize full color simultaneously.Three kinds of wafers of red, green, blue are linearly arranged, and red wafer 3 is placed in the middle, have taken into account the needs of bulk restriction and colour mixture.
In addition to the implementation, the utility model can also have other execution modes, and all employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop in the protection range of the utility model requirement.
Claims (3)
1. the encapsulating structure of the illuminated LED of side, comprise metallic conduction plate (1), wafer, gold thread (6), pin I (81), pin II (82), pin III (83), pin IV (84), pin V (85), pin VI (86), described wafer is fixed on the metallic conduction plate (1) by crystal-bonding adhesive (7), described gold thread (6) connecting wafer and metallic conduction plate (1), described each pin is connected with circuit on being arranged on metallic conduction plate (1); It is characterized in that, also comprise cavity (2), described wafer comprises red wafer (3), green wafer (4), blue wafer (5), described metallic conduction plate (1) and cavity (2) are pressed into one, described red wafer (3), green wafer (4), blue wafer (5) are with red wafer (3) mode linear array placed in the middle, transparent silica gel resin (9) is poured in the cavity (2), covers described red wafer (3), green wafer (4), blue wafer (5) and gold thread (6).
2. the encapsulating structure of the illuminated LED of a kind of side as claimed in claim 1 is characterized in that, described cavity (2) be shaped as rectangle.
3. the encapsulating structure of the illuminated LED of a kind of side as claimed in claim 1 or 2 is characterized in that the material of described cavity (2) is the PPA plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201882066U CN201549498U (en) | 2009-10-13 | 2009-10-13 | Encapsulation structure of side-luminescence LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201882066U CN201549498U (en) | 2009-10-13 | 2009-10-13 | Encapsulation structure of side-luminescence LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201549498U true CN201549498U (en) | 2010-08-11 |
Family
ID=42604677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201882066U Expired - Fee Related CN201549498U (en) | 2009-10-13 | 2009-10-13 | Encapsulation structure of side-luminescence LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201549498U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913771A (en) * | 2016-05-05 | 2016-08-31 | 深圳市奥蕾达科技有限公司 | Lateral mounting type full-color LED package and LED transparent screen |
-
2009
- 2009-10-13 CN CN2009201882066U patent/CN201549498U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913771A (en) * | 2016-05-05 | 2016-08-31 | 深圳市奥蕾达科技有限公司 | Lateral mounting type full-color LED package and LED transparent screen |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100811 Termination date: 20121013 |