CN105913771A - Lateral mounting type full-color LED package and LED transparent screen - Google Patents
Lateral mounting type full-color LED package and LED transparent screen Download PDFInfo
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- CN105913771A CN105913771A CN201610291750.8A CN201610291750A CN105913771A CN 105913771 A CN105913771 A CN 105913771A CN 201610291750 A CN201610291750 A CN 201610291750A CN 105913771 A CN105913771 A CN 105913771A
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- 239000002184 metal Substances 0.000 claims abstract description 43
- 239000011324 bead Substances 0.000 claims abstract description 33
- 239000000084 colloidal system Substances 0.000 claims abstract description 10
- 210000003734 kidney Anatomy 0.000 claims description 20
- 238000005538 encapsulation Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 13
- 238000010276 construction Methods 0.000 claims description 10
- 238000012856 packing Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 238000013461 design Methods 0.000 claims description 6
- 230000004438 eyesight Effects 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000035515 penetration Effects 0.000 abstract description 7
- 238000003908 quality control method Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a lamp bar type LED transparent display screen, and provides a lateral mounting type full-color LED package and an LED transparent screen. Lateral mounting type LED packaged LED lamp beads are designed to be of a structure of a surface mount device (SMD), and each lateral mounting type LED packaged LED lamp bead comprises an electrode metal sheet, a main body frame, LED chips, multiple leads and package colloid. According to the full-color LED display device, the size is small, a lamp bar PCB of the LED transparent display screen is parallel to the sight line of the human eyes due to the fact that a lateral mounting mode is adopted, the penetration rate of a screen body of the LED transparent display screen is not limited by the size of the PCB and reaches a higher value, the point spacing distance specification can be smaller, and the reliability is higher; when display modules are assembled, high-speed automated mounting of an SMT can be achieved, the production efficiency is high, and quality control is easy to achieve.
Description
Technical field
The present invention relates to a kind of light emitting diode (LED) display screen technology field, particularly relate to a kind of light bar type LED(Light-Emitting Diode) transparent display screen.
Background technology
In recent years, along with electronic circuit surface mounting technology SMT(Surface
Mount Technology) development, to surface mount SMD(Surface Mounted Devices) product that light emitting diode (LED) display screen is relevant is widely used.nullWherein LED transparent screen is because having decoration、Display and good light transmission are favored by numerous commercial centers，Each LED display producer is one after another on the basis of existing surface mount (SMD) LED packing forms，Design diversified LED transparent screen，If Chinese Patent Application No. is 201410332313.7，Filing date on July 14th, 2014，Invention entitled transparent screen，Main contents relate to a kind of transparent screen，Including outside framework and the polylith Transparence Display module being arranged on outside framework，Transparence Display module includes the first pcb board and printing opacity lower panel，First pcb board is arranged on printing opacity lower panel，First pcb board includes the second pcb board and the multiple strip pcb boards sequentially becoming array and being arranged on the second pcb board both sides，Strip pcb board is provided with control voltage transformation module，DC high voltage is converted into DC low-voltage by voltage transformation module，And provide electric energy for constant-current driven module and control module，Control module controls constant-current driven module work，Constant-current driven module drives the work of paster LED lamp，Invention have employed outside framework and polylith Transparence Display module，There is heavy and light、Easy to assembly、Brightness height and light transmittance advantages of higher，In an embodiment，Described paster LED lamp bead is the SMD lamp bead of SMD3535RGB used，Take up room to reduce.
With reference to Fig. 1, Fig. 1 is the technical matters schematic diagram showing prior art LED transparent screen, the light-emitting area of the paster LED lamp bead used due to existing LED transparent screen product and the opposing parallel setting in paster face of pcb board, the pcb board space of necessity is taken needed for paster face, two adjacent pcb boards, its paster LED lamp interval is more than 14 mm guarantee transparent screen light transmittances, and therefore, existing transparent screen is difficult to more closely spaced specification and light transmittance and is limited by pcb board area.
With reference to Fig. 2, Fig. 2 is the first the improving technology process schematic representation showing prior art LED transparent screen, in order to improve the high transmission rate of transparent screen, the first improving technology technique uses the mode as far as possible reducing strip pcb board area, but reduce the area of strip pcb board, circuit on pcb board can be caused compact to design, cause the problems such as circuit heat radiation, not only increase design difficulty, and elongated strip pcb board is producing, installation process is easier to bending damage, transparent screen product needed consolidates strip pcb board structure by increase light penetrating panel and prevents it from damaging, this makes again to add transparent screen body construction weight and installation, the difficulty safeguarded, and the mounting condition of the more difficult various complexity of adaptation and environment.
With reference to Fig. 3, Fig. 3 is the second improving technology process schematic representation showing prior art LED transparent screen, the second improving technology technique have employed the mode that strip pcb board is vertical with LED light-emitting area, but this technical matters is clearly difficult to realize paster LED lamp bead the high-speed automated paster of SMT, can only therefore cause production efficiency to be greatly reduced by craft or use special fixture etc. to weld, quality control difficulty.
Summary of the invention
The present invention is to solve prior art and the problems referred to above of improving technology technique thereof, therefore it is an object of the present invention to provide the SMD all-colour LED encapsulation of a kind of side and LED transparent screen, the LED lamp bead of this side adopting surface mounted LED encapsulation has features designed to the structure of surface mount device (SMD), the full-color LED display device of the present invention not only volume is little, owing to using side paster mode, the lamp bar pcb board of LED transparent display screen is parallel with human eye sight, realize LED transparent display screen screen body Penetration ration not limited by pcb board size, and Penetration ration reaches higher, dot spacing specification can be accomplished less, reliability is higher；When assembling display module, it is possible to achieve the high-speed automated paster of SMT, production efficiency is high and is prone to quality control.
The technical problem of the present invention is solved by following technical scheme: the SMD all-colour LED encapsulation of a kind of side, it includes electrode metal sheet, main body frame, LED chip, a plurality of leads and packing colloid, this electrode metal sheet has rectangular frame, in framework, stamped hollow out processes, form four cube electrode regions of word order, this main body frame uses Shooting Technique one-body molded, it is positioned at the rectangular frame of electrode metal sheet, in rectangular structure, four cube electrode regions of parcel yi word pattern arrangement, described main body frame is divided into the body base in electrode metal sheet side, main body Lamp cup with relative opposite side, described main body Lamp cup has kidney slot structure, four cube electrodes of electrode metal sheet are exposed bottom kidney slot.
Preferably, described kidney slot is inverted trapezoidal structure, and the sidewall of kidney slot surrounding has away from body base direction and to the inclined-plane of surrounding side-wall outer side inclination, and this inclined-plane is conducive to the light beam radiation scope that LED chip produces.
Preferably, described four cube electrodes are respectively defined as R-electrode, G-electrode, B-electrode and+electrode.
Further, described LED chip includes red LED chip, green LED chip and blue-light LED chip, and LED chip is placed on four cube electrode metal coverings exposed bottom kidney slot respectively.
Preferably, described red LED chip and green LED chip be arranged on+the exposed metal covering of electrode on, blue-light LED chip is arranged on the metal covering that G-electrode is exposed.
Further, described four cube electrodes are connected by the positive pole of described a plurality of leads with the negative pole of described red LED chip, the negative pole of described green LED chip, the negative pole of described blue-light LED chip and described three LED chip respectively.
Further; the described LED chip of protection and the transparent enclosure colloid of described a plurality of leads is poured in described kidney slot; described packing colloid is in kidney slot interruption-forming kidney-shaped plane; this kidney-shaped plane is the one side away from body base; described kidney-shaped plane is the light-emitting area of LED lamp bead, and the plane of described light-emitting area the most described kidney-shaped notch is generally flush with, outwardly or be inwardly recessed.
Further, described four cube electrodes all stretch out outside described main body frame, and clipped cutting separates with the rectangular frame of electrode metal sheet, and to a lateral buckling of body base, become four outside pins.
Preferably, described four bending pins form a plane, and this plane is the paster face of LED lamp bead, and described paster face is mutually perpendicular to described light-emitting area, has the angle of 90 °.
Preferably, described four pins are respectively defined as R-pin, G-pin, B-pin and+pin.
Preferably, described electrode metal sheet is the construction unit constituting a LED lamp bead, and several construction unit row, column are arranged on a block of metal plate, and several construction unit peripheries are sheet metal frame, this sheet metal frame is provided with hole, multiple location, facilitates the production in enormous quantities of LED lamp bead.
Further, after the SMD all-colour LED in described side has encapsulated, multiple LED lamp bead row, column are arranged on a block of metal plate.
Preferably, multiple LED lamp bead are stamped come off after braid, in order to realize SMT paster.
Further, the plurality of LED lamp bead side paster is in the edge of pcb board, and the light-emitting area of LED lamp bead is vertical with pcb board.
Preferably, pcb board is strip pcb board, coordinates the circuit design of strip pcb board, forms LED transparent screen lamp bar.
Further, when described LED transparent screen lamp bar is watched in human eye front, parallel with human eye sight, multiple LED transparent screen lamp bars coordinate the external circuit board such as keyset to connect to control, and combined and spliced become LED transparent screen.
The full-color LED display device of the present invention not only volume is little, uses side paster mode, and strip pcb board is parallel with human eye sight, it is achieved screen body Penetration ration is not limited by pcb board size, and Penetration ration reaches higher, and dot spacing specification can be accomplished less, and reliability is high；When assembling display module, it is possible to achieve the high-speed automated assembling of SMD, production efficiency is high and is prone to quality control.
Accompanying drawing explanation
Fig. 1 is the technical matters schematic diagram showing prior art LED transparent screen.
Fig. 2 is the first the improving technology process schematic representation showing prior art LED transparent screen.
Fig. 3 is the second improving technology process schematic representation showing prior art LED transparent screen.
The electrode metal sheet front view of a kind of side SMD all-colour LED encapsulation that Fig. 4 provides for one embodiment of the invention.
The main body frame side view of a kind of side SMD all-colour LED encapsulation that Fig. 5 provides for one embodiment of the invention and front view.
The metallic plate front view of a kind of side SMD all-colour LED encapsulation that Fig. 6 provides for one embodiment of the invention.
The LED lamp bead axonometric chart of a kind of side SMD all-colour LED encapsulation that Fig. 7 provides for one embodiment of the invention.
The LED transparent screen lamp bar partial schematic diagram of a kind of side SMD all-colour LED encapsulation that Fig. 8 provides for one embodiment of the invention.
Detailed description of the invention
Below, in conjunction with accompanying drawing, the preferred embodiments of the present invention are described in detail.
With reference to Fig. 4-8, the present embodiment provides the LED lamp bead 5 of a kind of side SMD all-colour LED encapsulation, and it includes electrode metal sheet 3, main body frame 2, red LED chip 13, green LED chip 12, blue-light LED chip the 11, first lead-in wire the 41, second lead-in wire the 42, the 3rd lead-in wire the 43, the 4th lead-in wire the 44, the 5th lead-in wire 45 and packing colloid (not shown).
With reference to Fig. 4, electrode metal sheet 3 has rectangular frame 302, and in framework, stamped hollow out processes, and forms four cube electrode regions 301 of word order.
With reference to Fig. 5, main body frame 2 uses Shooting Technique one-body molded, it is positioned at the rectangular frame 302 of electrode metal sheet 3, in rectangular structure, four cube electrode regions 301 of parcel yi word pattern arrangement, this main body frame 2 is divided into the body base 21 in electrode metal sheet 3 side, main body Lamp cup 22 with relative opposite side, this main body Lamp cup 22 has kidney slot 23 structure, four cube electrode regions 301 of electrode metal sheet 3 are exposed bottom this kidney slot 23, this kidney slot 23 is inverted trapezoidal structure, the sidewall of kidney slot 23 surrounding has away from body base 21 direction and to the inclined-plane of surrounding side-wall outer side inclination, this inclined-plane is conducive to red LED chip 13, the light beam radiation scope that green LED chip 12 and blue-light LED chip 11 produce.Four cube electrode regions 301 are respectively defined as R-electrode 31, G-electrode 32, B-electrode 33 and+electrode 30.
With reference to Fig. 7, red LED chip 13 and green LED chip 12 be arranged on+the exposed metal covering of electrode 30 on, blue-light LED chip 11 is arranged on the metal covering that G-electrode 32 is exposed.
The negative level of red LED chip 13 41 is connected with R-electrode 31 by the first lead-in wire, and positive level is direct to be connected with+electrode 30.
The negative level of green LED chip 12 42 is connected with G-electrode 32 by the second lead-in wire, and positive level goes between by the 5th and 45 is connected with+electrode 30.
The negative level of blue-light LED chip 11 44 is connected with B-electrode 33 by the 4th lead-in wire, and positive level goes between by the 3rd and 43 is connected with+electrode 30.
Protection red LED chip 13, green LED chip 12 and blue-light LED chip 11 and the transparent enclosure colloid (not shown) of first lead-in wire the 41, second lead-in wire the 42, the 3rd lead-in wire the 43, the 4th lead-in wire the 44, the 5th lead-in wire 45 is poured in kidney slot 23; packing colloid is in kidney slot interruption-forming kidney-shaped plane; this kidney-shaped plane is the one side away from body base; described kidney-shaped plane is the light-emitting area of LED lamp bead 5, and the plane of described light-emitting area the most described kidney-shaped notch is generally flush with, outwardly or be inwardly recessed.
R-electrode 31, G-electrode 32, B-electrode 33 and+electrode 30 all stretch out outside main body frame 2, clipped cutting separates with the rectangular frame 302 of electrode metal sheet, and to a lateral buckling of body base 31, become four outside pins, be followed successively by R-pin 311, G-pin 321, B-pin 331 and+pin 301.The plane that four bending pins are formed, this place plane is the paster face of LED lamp bead 5, and this paster face is mutually perpendicular to light-emitting area, has the angle of 90 °.
With reference to Fig. 6, electrode metal sheet 3 is the construction unit constituting a LED lamp bead 5, and several construction unit row, column are arranged on a block of metal plate 7, and several construction unit peripheries are sheet metal frame 71, this sheet metal frame 71 is provided with hole, multiple location 70, facilitates the production in enormous quantities of LED lamp bead 5.
After the SMD all-colour LED in side has encapsulated, multiple LED lamp bead 5 row, column are arranged on a block of metal plate 7, multiple LED lamp bead 5 are stamped come off after braid, in order to realize SMT paster.
With reference to Fig. 8, the plurality of LED lamp bead 5 side paster is in the edge of pcb board 6, and the light-emitting area of LED lamp bead 5 is vertical with pcb board.
Pcb board 6 is strip pcb board, coordinates the circuit design of pcb board 6, forms LED transparent screen lamp bar 8.
When LED transparent screen lamp bar 8 is watched in human eye front, parallel with human eye sight, LED transparent screen lamp bar 8 coordinates the external circuit board such as keyset to connect to control, and combined and spliced becomes LED transparent display screen.
The LED lamp bead not only volume of the side SMD all-colour LED encapsulation of the present invention is little, use side paster mode, strip pcb board is parallel with human eye sight, realize LED transparent display screen screen body Penetration ration not limited by pcb board size, and Penetration ration reaches higher, dot spacing specification can be accomplished less, and reliability is high；When assembling display module, it is possible to achieve the high-speed automated assembling of SMD, production efficiency is high and is prone to quality control.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (8)
1. a side SMD all-colour LED encapsulation, it includes electrode metal sheet, main body frame, LED chip, a plurality of leads and packing colloid, this electrode metal sheet has rectangular frame, in framework, stamped hollow out processes, form four cube electrode regions of word order, this main body frame uses Shooting Technique one-body molded, it is positioned at the rectangular frame of electrode metal sheet, in rectangular structure, four cube electrode regions of parcel yi word pattern arrangement, described main body frame is divided into the body base in electrode metal sheet side, main body Lamp cup with relative opposite side, described main body Lamp cup has kidney slot structure, four cube electrodes of electrode metal sheet are exposed bottom kidney slot.
2. the SMD all-colour LED in side as claimed in claim 1 encapsulation, described kidney slot is inverted trapezoidal structure, the sidewall of kidney slot surrounding has away from body base direction and to the inclined-plane of surrounding side-wall outer side inclination, and this inclined-plane is conducive to the light beam radiation scope that LED chip produces.
3. the SMD all-colour LED in side as claimed in claim 1 encapsulation, described four cube electrodes are respectively defined as R-electrode, G-electrode, B-electrode and+electrode, described LED chip includes red LED chip, green LED chip and blue-light LED chip, and LED chip is placed on four cube electrode metal coverings exposed bottom kidney slot respectively.
4. the SMD all-colour LED in side as claimed in claim 3 encapsulation, described red LED chip and green LED chip be arranged on+the exposed metal covering of electrode on, blue-light LED chip is arranged on the metal covering that G-electrode is exposed, and described four cube electrodes are connected with the positive pole of the negative pole of described red LED chip, the negative pole of described green LED chip, the negative pole of described blue-light LED chip and described three LED chip by a plurality of leads respectively.
5. the side SMD all-colour LED encapsulation as described in claim 1-4; the described LED chip of protection and the transparent enclosure colloid of described a plurality of leads is poured in described kidney slot; described packing colloid is in kidney slot interruption-forming kidney-shaped plane; this kidney-shaped plane is the one side away from body base; described kidney-shaped plane is the light-emitting area of LED lamp bead, and the plane of described light-emitting area the most described kidney-shaped notch is generally flush with, outwardly or be inwardly recessed.
6. the side SMD all-colour LED encapsulation as described in claim 1-4, described four cube electrodes all stretch out outside described main body frame, clipped cutting separates with the rectangular frame of electrode metal sheet, and to a lateral buckling of body base, become four outside pins, described four pins are respectively defined as R-pin, G-pin, B-pin and+pin, the plane that described four bending pins are formed, this plane is the paster face of LED lamp bead, described paster face is mutually perpendicular to described light-emitting area, has the angle of 90 °.
7. the side SMD all-colour LED encapsulation as described in claim 1-6, described electrode metal sheet is the construction unit constituting a LED lamp bead, several construction unit row, column are arranged on a block of metal plate, several construction unit peripheries are sheet metal frame, this sheet metal frame is provided with hole, multiple location, and after the SMD all-colour LED in described side has encapsulated, multiple LED lamp bead row, column are arranged on a block of metal plate, multiple LED lamp bead are stamped come off after braid, in order to realize SMT paster.
8. the side SMD all-colour LED encapsulation as described in claim 1-7, the plurality of LED lamp bead side paster is in the edge of pcb board, the light-emitting area of LED lamp bead is vertical with pcb board, pcb board is strip pcb board, coordinates the circuit design of strip pcb board, forms LED transparent screen lamp bar, when described LED transparent screen lamp bar is watched in human eye front, parallel with human eye sight, multiple LED transparent screen lamp bars coordinate the external circuit board such as keyset to connect to control, and combined and spliced become LED transparent screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610291750.8A CN105913771A (en) | 2016-05-05 | 2016-05-05 | Lateral mounting type full-color LED package and LED transparent screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610291750.8A CN105913771A (en) | 2016-05-05 | 2016-05-05 | Lateral mounting type full-color LED package and LED transparent screen |
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| Publication Number | Publication Date |
|---|---|
| CN105913771A true CN105913771A (en) | 2016-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610291750.8A Pending CN105913771A (en) | 2016-05-05 | 2016-05-05 | Lateral mounting type full-color LED package and LED transparent screen |
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| CN (1) | CN105913771A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN109166468A (en) * | 2018-09-07 | 2019-01-08 | 深圳市光祥科技股份有限公司 | LED transparent screen mould group and LED transparent screen |
| CN113411990A (en) * | 2021-06-16 | 2021-09-17 | 珠海中京电子电路有限公司 | Manufacturing method of LED transparent screen mainboard |
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| CN113411990A (en) * | 2021-06-16 | 2021-09-17 | 珠海中京电子电路有限公司 | Manufacturing method of LED transparent screen mainboard |
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Application publication date: 20160831 |