CN106449938A - LED patch bracket - Google Patents
LED patch bracket Download PDFInfo
- Publication number
- CN106449938A CN106449938A CN201610877503.6A CN201610877503A CN106449938A CN 106449938 A CN106449938 A CN 106449938A CN 201610877503 A CN201610877503 A CN 201610877503A CN 106449938 A CN106449938 A CN 106449938A
- Authority
- CN
- China
- Prior art keywords
- rack body
- millimeters
- substrate
- led
- degree
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Abstract
The invention discloses an LED patch bracket, which comprises a bracket body, wherein a bowl is arranged in the bracket body; a plurality of LED chips can be arranged at the bottom of the bowl of the bracket body and the bowl can be filled with fluorescent glue after the LED chips are arranged; the inner side surface of the bowl of the bracket body is of an inverted trapezoidal structure; the range of the included angle between two transverse sides of the inverted trapezoidal structure is 108-110 degrees; the range of the included angle between two vertical sides of the inverted trapezoidal structure is 135-137 degrees; a plurality of insulated and isolated substrates are fixedly arranged at the bottom of the bracket body; the substrate comprises a positive substrate, a negative substrate and a plurality of chip substrates capable of installing the LED chips arranged between the positive substrate and the negative substrate; the positive substrate and the negative substrate are arranged at two ends of the bottom of the bracket body; the back surfaces of the substrates all are provided with bonding pads capable of welding leads; and the LED chips are connected in series or in parallel through the leads welded on the bonding pads.
Description
Technical field
The present invention relates to the technical field of LED lamp bead support, particularly to a kind of LED patch support.
Background technology
The corner of the bowl of LED patch support on the market is generally the form of the straight line straight angle now, leads to corner
Brightness loss larger, reduce light efficiency, and the form of the straight line straight angle have impact on luminous uniformity.In addition, present city
The lighting angle of the LED patch support on face is less, leads to irradiated area relatively narrower, have impact on luminous light efficiency.In addition, present city
The substrate of the rack body bottom on face is generally monolithic construction, and substrate, in addition to fixing LED chip, also acts as heat conduction and heat radiation
Effect, when monoblock type substrate is fixed with multiple LED chip, is unfavorable for the heat derives of LED chip and distributes, and, when
When multiple LED chips need serial or parallel connection, lead can only be welded on the electrode of chip, easily because two weldering power, pressure
The excessive grade of power causes to LED chip to damage.In addition, the width ratio of the bowl bottom of LED patch support on the market is more wide and long
Degree is then shorter, and when LED chip is fixed to bowl bottom, some light that LED chip sends can be irradiated to bowl bottom thus leading
Cause light loss, and when fixing multiple LED chip, luminous overlapping situation easily occur and causes light loss to affect brightness,
And, the folding quality of the then shorter LED patch support of the more wide and long degree of width ratio is general, is susceptible to damage.
Therefore, how to realize a kind of novel and reasonable structure, effectively reduce light loss and improve light efficiency, improve uniform illumination
Degree, lighting angle is big, and irradiated area is wide, and radiating efficiency is high, and LED chip is played a protective role, and folding quality is strong, is not susceptible to
The LED patch support damaging is technical problem urgently to be resolved hurrily in the industry.
Content of the invention
The main object of the present invention is to provide a kind of LED patch support it is intended to realize a kind of novel and reasonable structure, effectively subtracts
Few light loss and raising light efficiency, improve uniform illumination degree, lighting angle is big, irradiated area is wide, radiating efficiency is high, to LED chip
Play a protective role, folding quality is strong, be not susceptible to the LED patch support damaging.
The present invention proposes a kind of LED patch support, including inside be provided with the rack body of bowl, the bowl bottom of rack body
Portion can be provided with some LED chips, and can be packed into fluorescent glue in bowl after installing LED chip；In the bowl of rack body
Side is in inverted trapezoidal structure, and the setting scope of the angle in both lateral sides face of inverted trapezoidal structure is 108 degree to 110 degree, inverted trapezoidal
The setting scope of the angle of vertical two sides of structure is 135 degree to 137 degree；It is mutual that the bottom of rack body is installed with several
Between the substrate that is dielectrically separated from, substrate includes the positive electrode substrate at the bottom two ends located at rack body, negative electrode substrate, also includes setting
Some chip substrates installing LED chip between positive electrode substrate and negative electrode substrate, substrate back is equipped with solderable drawing
The pad of line, between LED chip, the lead by being welded on pad carries out serial or parallel connection.
Preferably, the angle in the both lateral sides face of inverted trapezoidal structure is set to 109.2 degree, and the angle of vertical two sides is
136.4 degree.
Preferably, the corner of inverted trapezoidal structure is set to the curved corner being conducive to improving light efficiency and Luminescence Uniformity.
Preferably, the setting scope of the length of rack body is 80 millimeters to 84 millimeters, the setting of the width of rack body
Scope is 26 millimeters to 30 millimeters, and the setting scope of the height of rack body is 6 millimeters to 7 millimeters.
Preferably, the width of rack body upper end edgewise is 2 millimeters, and the width of rack body lower end edgewise is 10 millimeters.
Preferably, positive electrode substrate, negative electrode substrate, chip substrate are made of metal, and surface is provided with plating silver layer.
Preferably, rack body is made up of plastic cement.
The bowl medial surface of this rack body is in inverted trapezoidal structure, and the corner of inverted trapezoidal structure is set to curved corner, arc
Shape corner advantageously reduces the reflection loss rate of the brightness of corner, can improve Luminescence Uniformity simultaneously.In addition, this bowl
The angle in both lateral sides face of inverted trapezoidal structure setting scope be 108 degree to 110 degree, the vertical two sides of inverted trapezoidal structure
Angle setting scope be 135 degree to 137 degree.In the present embodiment, the angle in the both lateral sides face of inverted trapezoidal structure is set to
109.2 degree, the angle of vertical two sides is 136.4 degree.With respect to like product on the market, lighting angle becomes big, effectively expands
Big irradiated area, is favorably improved the luminous flux of LED chip, is conducive to improving luminous light efficiency.In addition, the bottom of this rack body
Portion is installed with the substrate that several are dielectrically separated from each other, and substrate includes the positive pole base at the bottom two ends located at rack body
Plate, negative electrode substrate, also include some chip substrates installing LED chip between positive electrode substrate and negative electrode substrate, base
Back is equipped with the pad of solderable lead, and between LED chip, the lead by being welded on pad is connected or simultaneously
Connection.It is the version of multisection type between substrate, accordingly even when during fixing two or more LED chip, can be pacified with by stages
Dress LED chip, the heat conduction and heat radiation effect of substrate is given full play to, and heat conduction and heat radiation efficiency high effectively reduces light decay, and effectively prolongs
The service life of long LED chip, and, in fixing multiple LED chip, the serial or parallel connection between LED chip passes through welding
Connecting, lead is directly welded on the pad of substrate back it is not necessary to lead is welded to LED lead on pad
On the electrode of chip, bonding more firm stable, it is prevented effectively from and LED chip is caused damage because two weldering power, pressure are excessive etc.
Wound, serves the effect of protection LED chip, reduces the risk that bonding wire brings.In addition, the rack body of this LED patch support
The setting scope of length is 80 millimeters to 84 millimeters, and the setting scope of the width of rack body is 26 millimeters to 30 millimeters, support
The setting scope of the height of body is 6 millimeters to 7 millimeters.In the present embodiment, the length of rack body is set to 82 millimeters, and width sets
For 28 millimeters, highly it is set to 6.5 millimeters.So, the extended length of this rack body, and width constriction, LED chip is fixed to
During bowl bottom, the light that LED chip sends can greatly reduce light loss substantially towards external exposure, as fixing multiple LED
During chip, also can avoid the occurrence of the situation of luminous overlap, effectively reduce light loss, be conducive to improving light utilization.In addition,
The width of frame body upper end edgewise is 2 millimeters, and the width of rack body lower end edgewise is 10 millimeters, this rack body lower end edgewise
Wider than existing product.Plus rack body lengthen and bottom constriction structure design, be conducive to improve product folding resistance
Can, reduce because of the too narrow and frangible easily broken problem of the lower end edgewise of rack body, be not susceptible to damage, durable in use.The present invention
Achieve a kind of novel and reasonable structure, effectively reduce light loss and improve light efficiency, improve uniform illumination degree, lighting angle is big, shine
Penetrate area wide, radiating efficiency is high, and LED chip is played a protective role, folding quality is strong, the LED paster being not susceptible to damage props up
Frame.
Brief description
Fig. 1 is a kind of one of perspective view of an embodiment of present invention LED patch support；
Fig. 2 is the two of the perspective view of an embodiment of the present invention a kind of LED patch support；
Fig. 3 is a kind of positive structure schematic of an embodiment of present invention LED patch support；
Fig. 4 is a kind of one of side structure perspective view of an embodiment of present invention LED patch support；
Fig. 5 is the two of the side structure perspective view of an embodiment of the present invention a kind of LED patch support.
The realization of the object of the invention, functional characteristics and advantage will be described further in conjunction with the embodiments referring to the drawings.
Specific embodiment
It should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
A kind of one embodiment of LED patch support of the present invention referring to figs. 1 to Fig. 5, is proposed, including inside be provided with bowl
Rack body 100, the bowl bottom of rack body 100 can be provided with some LED chips, and installs in bowl after LED chip
Fluorescent glue can be packed into.
The bowl medial surface of rack body 100 is in inverted trapezoidal structure.The corner of inverted trapezoidal structure is set to be conducive to improving
The curved corner 101 of light efficiency and Luminescence Uniformity.The corner of the bowl of LED patch support on the market is generally straight line now
The form of the straight angle, lead to corner brightness lose larger, reduce light efficiency, and the form of the straight line straight angle have impact on luminous
Uniformity.And this bowl medial surface is in inverted trapezoidal structure, the corner of inverted trapezoidal structure is set to curved corner 101, and arc turns
Angle 101 advantageously reduces the reflection loss rate of the brightness of corner, can improve Luminescence Uniformity simultaneously.
The lighting angle of LED patch support on the market is less now, leads to irradiated area relatively narrower, have impact on luminous light
Effect.And the setting scope of the angle in both lateral sides face of the inverted trapezoidal structure of this bowl is 108 degree to 110 degree, inverted trapezoidal structure
The angle of vertical two sides setting scope be 135 degree to 137 degree.In the present embodiment, the both lateral sides face of inverted trapezoidal structure
Angle be set to 109.2 degree, the angle of vertical two sides is 136.4 degree.With respect to like product on the market, lighting angle becomes big
, effectively expand irradiated area, be favorably improved the luminous flux of LED chip, be conducive to improving luminous light efficiency.
Now the substrate of rack body bottom on the market is generally monolithic construction, substrate in addition to fixing LED chip,
Also act as the effect of heat conduction and heat radiation, when monoblock type substrate is fixed with multiple LED chip, be unfavorable for the heat derives of LED chip
And distribute, and, when multiple LED chips need serial or parallel connection, lead can only be welded on the electrode of chip, easy because
LED chip is caused damage for two weldering power, pressure are excessive etc..And to be installed with several mutual for the bottom of this rack body 100
Between the substrate that is dielectrically separated from, substrate includes the positive electrode substrate 102 at the bottom two ends located at rack body 100, negative electrode substrate
103, also include some chip substrates 104 installing LED chip between positive electrode substrate 102 and negative electrode substrate 103, base
Back is equipped with the pad 105 of solderable lead, and between LED chip, the lead by being welded on pad 105 is gone here and there
Connection or in parallel.It is the version of multisection type between substrate, accordingly even when during fixing two or more LED chip, can be with subregion
Between installing LED chip, the heat conduction and heat radiation effect of substrate is given full play to, and heat conduction and heat radiation efficiency high effectively reduces light decay, and
Effectively extend the service life of LED chip, and, in fixing multiple LED chip, the serial or parallel connection between LED chip leads to
Cross the lead being welded on pad 105 to connect, lead is directly welded on the pad 105 of substrate back it is not necessary to incite somebody to action
Lead is welded on the electrode of LED chip, bonding more firm stable, and it is right because two weldering power, pressure are excessive etc. to be prevented effectively from
LED chip causes to damage, and serves the effect of protection LED chip, reduces the risk that bonding wire brings.
Positive electrode substrate 102, negative electrode substrate 103, chip substrate 104 are made of metal, heat conduction and heat radiation efficiency high, and surface sets
There is plating silver layer.Plating silver layer can lift the adhesive strength of lead, can also improve luminosity, be also prevented from substrate table
Face aoxidizes.
The more wide and long degree of width ratio of the bowl bottom of LED patch support on the market is then shorter, and LED chip is fixed to bowl
During cup bottom, some light that LED chip sends can be irradiated to bowl bottom thus leading to light loss, and as fixing multiple LED
During chip, luminous overlapping situation easily occurs and causes light loss to affect brightness, and, the more wide and long degree of width ratio is then relatively
The folding quality of short LED patch support is general, is susceptible to damage.And the length of the rack body 100 of this LED patch support
Setting scope be 80 millimeters to 84 millimeters, the setting scope of the width of rack body 100 is 26 millimeters to 30 millimeters, support this
The setting scope of the height of body 100 is 6 millimeters to 7 millimeters.In the present embodiment, the length of rack body 100 is set to 82 millimeters, wide
Degree is set to 28 millimeters, is highly set to 6.5 millimeters.So, the extended length of this rack body 100, and width constriction, LED core
When piece is fixed to bowl bottom, the light that LED chip sends can greatly reduce light loss towards external exposure substantially, works as fixation
During multiple LED chip, also can avoid the occurrence of the situation of luminous overlap, effectively reduce light loss, be conducive to improving light utilization.
In addition, the width of rack body 100 upper end edgewise is 2 millimeters, the width of rack body 100 lower end edgewise is 10 millimeters, this
Frame body 100 lower end edgewise is wider than existing product.Lengthen plus rack body 100 and bottom constriction structure design, have
Beneficial to the folding quality improving product, reduce because of the too narrow and frangible easily broken problem of the lower end edgewise of rack body 100, be difficult to send out
Raw damage, durable in use.
Rack body 100 is made up of plastic cement.
Present invention achieves a kind of novel and reasonable structure, effectively reduce light loss and improve light efficiency, improve uniform illumination degree,
Lighting angle is big, and irradiated area is wide, and radiating efficiency is high, and LED chip is played a protective role, and folding quality is strong, is not susceptible to damage
Bad LED patch support.
The foregoing is only the preferred embodiments of the present invention, not thereby limit the scope of the claims of the present invention, every utilization
The equivalent structure transformation that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other related technology necks
Domain, is included within the scope of the present invention.
Claims (7)
1. a kind of LED patch support is it is characterised in that include the internal rack body being provided with bowl, the institute of described rack body
State bowl bottom and some LED chips can be installed, and fluorescent glue can be packed in described bowl after described LED chip is installed；
The described bowl medial surface of described rack body is in inverted trapezoidal structure, the angle in the both lateral sides face of described inverted trapezoidal structure
Setting scope be 108 degree to 110 degree, the setting scope of the angle of vertical two sides of described inverted trapezoidal structure is for 135 degree extremely
137 degree；
The bottom of described rack body is installed with the substrate that several are dielectrically separated from each other, and described substrate is included located at described
The positive electrode substrate at bottom two ends of rack body, negative electrode substrate, also include located at described positive electrode substrate and described negative electrode substrate it
Between some chip substrates installing described LED chip, described substrate back is equipped with the pad of solderable lead, described
Between LED chip, the described lead by being welded on described pad carries out serial or parallel connection.
2. a kind of LED patch support according to claim 1 is it is characterised in that the both lateral sides of described inverted trapezoidal structure
The angle in face is set to 109.2 degree, and the angle of vertical two sides is 136.4 degree.
3. a kind of LED patch support according to claim 1 and 2 is it is characterised in that the corner of described inverted trapezoidal structure
It is set to the curved corner being conducive to improving light efficiency and Luminescence Uniformity.
4. a kind of LED patch support according to claim 3 is it is characterised in that the setting of the length of described rack body
Scope is 80 millimeters to 84 millimeters, and the setting scope of the width of described rack body is 26 millimeters to 30 millimeters, and described support is originally
The setting scope of the height of body is 6 millimeters to 7 millimeters.
5. a kind of LED patch support according to claim 4 is it is characterised in that the width of described rack body upper end edgewise
Spend for 2 millimeters, the width of described rack body lower end edgewise is 10 millimeters.
6. a kind of LED patch support according to claim 5 is it is characterised in that described positive electrode substrate, described negative pole base
Plate, described chip substrate are made of metal, and surface is provided with plating silver layer.
7. a kind of LED patch support according to claim 6 is it is characterised in that described rack body is made up of plastic cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610877503.6A CN106449938A (en) | 2016-10-09 | 2016-10-09 | LED patch bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610877503.6A CN106449938A (en) | 2016-10-09 | 2016-10-09 | LED patch bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106449938A true CN106449938A (en) | 2017-02-22 |
Family
ID=58173019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610877503.6A Pending CN106449938A (en) | 2016-10-09 | 2016-10-09 | LED patch bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449938A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108289406A (en) * | 2018-03-28 | 2018-07-17 | 澳洋集团有限公司 | A kind of easy adjustable type installing mechanism for single-chip LED patches |
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| CN101567411A (en) * | 2009-05-26 | 2009-10-28 | 晶科电子（广州）有限公司 | Flip-chip integrated encapsulation structure of LED and method thereof |
| CN103367602A (en) * | 2012-03-27 | 2013-10-23 | 信越化学工业株式会社 | Substrate for optical semiconductor device and method for manufacturing the same, and optical semiconductor device and method for manufacturing the same |
| CN204558528U (en) * | 2015-05-08 | 2015-08-12 | 安徽盛烨电子有限公司 | A kind of LED lead frame |
| CN205050871U (en) * | 2015-10-15 | 2016-02-24 | 东莞市良友五金制品有限公司 | LED paster support of double chip pad formula |
| CN205069675U (en) * | 2015-10-08 | 2016-03-02 | 大连德豪光电科技有限公司 | Big power LED packaging structure |
| CN105913771A (en) * | 2016-05-05 | 2016-08-31 | 深圳市奥蕾达科技有限公司 | Lateral mounting type full-color LED package and LED transparent screen |
| CN206059428U (en) * | 2016-10-09 | 2017-03-29 | 李鹤荣 | A kind of LED patch supports |
-
2016
- 2016-10-09 CN CN201610877503.6A patent/CN106449938A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101567411A (en) * | 2009-05-26 | 2009-10-28 | 晶科电子（广州）有限公司 | Flip-chip integrated encapsulation structure of LED and method thereof |
| CN103367602A (en) * | 2012-03-27 | 2013-10-23 | 信越化学工业株式会社 | Substrate for optical semiconductor device and method for manufacturing the same, and optical semiconductor device and method for manufacturing the same |
| CN204558528U (en) * | 2015-05-08 | 2015-08-12 | 安徽盛烨电子有限公司 | A kind of LED lead frame |
| CN205069675U (en) * | 2015-10-08 | 2016-03-02 | 大连德豪光电科技有限公司 | Big power LED packaging structure |
| CN205050871U (en) * | 2015-10-15 | 2016-02-24 | 东莞市良友五金制品有限公司 | LED paster support of double chip pad formula |
| CN105913771A (en) * | 2016-05-05 | 2016-08-31 | 深圳市奥蕾达科技有限公司 | Lateral mounting type full-color LED package and LED transparent screen |
| CN206059428U (en) * | 2016-10-09 | 2017-03-29 | 李鹤荣 | A kind of LED patch supports |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108289406A (en) * | 2018-03-28 | 2018-07-17 | 澳洋集团有限公司 | A kind of easy adjustable type installing mechanism for single-chip LED patches |
| CN108289406B (en) * | 2018-03-28 | 2024-04-09 | 澳洋集团有限公司 | A easy adjustable formula installation mechanism for single chip LED paster |
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| PB01 | Publication | ||
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Application publication date: 20170222 |