CN106299096B - Side-mounted positive-lighting LED, lamp strip and high-transmittance display screen - Google Patents
Side-mounted positive-lighting LED, lamp strip and high-transmittance display screen Download PDFInfo
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- CN106299096B CN106299096B CN201610885787.3A CN201610885787A CN106299096B CN 106299096 B CN106299096 B CN 106299096B CN 201610885787 A CN201610885787 A CN 201610885787A CN 106299096 B CN106299096 B CN 106299096B
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- led
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- lamp strip
- primary
- display screen
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- 238000002834 transmittance Methods 0.000 title description 4
- 239000000758 substrate Substances 0.000 claims description 27
- 239000011521 glass Substances 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 238000004806 packaging method and process Methods 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 5
- 239000011324 bead Substances 0.000 description 13
- 239000011159 matrix material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000003321 amplification Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
The utility model provides a positive luminous LED of side subsides, lamp strip and high transmissivity screen, the LED chip bonding is on the LED base member, the side dress pin sets up side by side the LED base member side, the lamp strip includes lamp strip base plate and more than one above-mentioned positive luminous LED of side subsides, the arrangement is provided with multiunit pad on the lamp strip base plate, be equipped with a plurality of pad units that set up side by side on every group pad, the welding of the side dress pin of LED is on the pad of lamp strip base plate, the display screen includes more than one above-mentioned LED lamp strip, amplifier board and connecting plate, more than one LED lamp strip sets up side by side, the amplifier board is connected with each lamp strip, the input is amplified drive signal and is given the lamp strip, the connecting plate is used for supplementary connection lamp strip. According to the LED lamp panel, the LED packaging pins are arranged on the side face of the LED side by side, so that the LED pins are contacted with the lamp panel from point contact to surface contact, the heat conducting surface is increased, and the heat dissipation problem of the LED can be effectively solved; meanwhile, consistency is solved, and fidelity of the picture is guaranteed to the greatest extent.
Description
Technical Field
The invention discloses an LED, in particular a side-mounted positive-lighting LED, a lamp strip and a high-transmittance screen, and belongs to the field of novel LED packaging technology and transparent display screens.
Background
An LED is also called a light emitting diode, and is an emerging light emitting device, which has advantages of small volume, high light emitting brightness, energy saving, and electricity saving, and is widely used in various illuminations, especially in LED display screens.
The traditional LED display screen is characterized in that the packaged dot matrix LED lamp panel is welded on one side of a circuit board, a driving circuit is welded on the other side of the circuit board, and the structure cannot meet the requirement of LED heat dissipation, so that the LED display screen is usually installed outdoors, and when the LED display screen is applied indoors, due to the heat dissipation requirement, the brightness can only be reduced, and the highlighting cannot be achieved.
Along with the continuous development of LED display screen, the transparent display screen appears now, namely LED is the bar welding on banding lamp plate, forms the LED lamp strip, and certain space is separated between lamp strip and the lamp strip, and its structure is similar to the fence, has certain transparent effect, and although it is equipped with certain gap between the lamp strip, can dispel the heat, but it still can not satisfy high-power LED's heat dissipation requirement, can't solve stability, the uniformity that traditional LED lamp pearl both sides structure brought.
In order to enhance the heat dissipation effect of the LED display screen, a series of LED heat dissipation structures have been invented, such as:
(1) The LED is welded on the lamp panel, the driving circuit is arranged on the driving panel, and the lamp driving separation type structure is realized, but the heat dissipation effect is still not ideal;
(2) Welding the LED on the side surface of the lamp panel to enable pins at two ends of the LED to be respectively welded on two sides of the lamp panel, wherein the contact area between the LED pins and the lamp panel is too small to quickly conduct heat generated by the LED to the lamp panel; stability cannot be well solved;
(3) The lamp panel side is provided with the notch, so that the lamp panel side is seen to be square-wave-shaped, the lamp panel side is also seen to be like a great wall, the LED is welded in the notch of the lamp panel side, so that the contact area between the LED lamp beads and the lamp panel is increased, pins at two ends of the LED are respectively welded at two sides of the lamp panel, and the heat dissipation requirement of the LED and the stability of the display screen can not be met.
Disclosure of Invention
Aiming at the defect that the LED lamp in the prior art cannot meet the heat radiation requirement, consistency, stability and fidelity, the invention provides a side-mounted positive-lighting LED, a lamp strip and a high-transmittance display screen, wherein LED packaging pins are arranged on the side face of the LED side by side, so that the LED pins are contacted with the lamp plate from point contact to surface contact, the heat conduction surface is increased, and the problems of heat radiation, consistency, stability and fidelity of the LED can be effectively solved;
the technical scheme adopted for solving the technical problems is as follows: a side-mounted positive-lighting LED comprises an LED matrix, a chip and side-mounted pins, the chip is bonded on the LED matrix, and the side-mounted pins are arranged on the side face of the LED matrix side by side.
The LED lamp strip comprises a lamp strip substrate and more than one side-mounted positive-lighting LED, wherein a plurality of groups of bonding pads are arranged on the lamp strip substrate, a plurality of bonding pad units which are arranged side by side are arranged on each group of bonding pads, and side-mounted pins of the LEDs are welded on the bonding pads of the lamp strip substrate, so that the consistency of the lamp strip is improved and the quality performance of the lamp strip is stabilized.
The utility model provides a LED display screen, the display screen includes more than one above-mentioned LED lamp strip, amplification board and connecting plate, and more than one LED lamp strip sets up side by side, and the amplification board is connected with each lamp strip, and the input is amplified drive signal and is given the lamp strip, and the connecting plate is used for assisting the individual customization display module assembly that the lamp strip equipment becomes various sizes, different shape requirements, thereby furthest has improved the penetrating rate of screen and has reached transparent daylighting effect.
The technical scheme adopted by the invention for solving the technical problems further comprises the following steps:
the side-mounted pins are arranged along the long side direction of the LED substrate.
Two side-mounted pins are correspondingly arranged on one chip, or one pin is correspondingly arranged on one chip, and one or more common pins are arranged for all chips or some chips.
The side-mounted pins are L-shaped and extend to the bottom of the LED matrix to form bottom pins which are arranged side by side.
The side-mounted pins are concave and are arranged at the bottom and two sides of the LED substrate.
And a through hole is arranged on the lamp strip at the position corresponding to the bonding pad.
The front end of the LED lamp strip is fixedly arranged a front glass (or acrylic) baffle is arranged.
The rear end of the LED light bar is fixedly provided with a rear glass (or acrylic) baffle.
The beneficial effects of the invention are as follows: according to the LED lamp strip, the LED packaging pins are arranged on the side face of the LED side by side, so that the LED pins are contacted with the lamp plate from point contact to surface contact, the heat conducting surface is increased, the heat dissipation problem of the LED can be effectively solved, meanwhile, the display consistency is ensured, and the fidelity is provided.
The invention will be further described with reference to the drawings and detailed description.
Drawings
Fig. 1 is a schematic perspective view of a preferred embodiment of an LED according to the present invention.
Fig. 2 is a schematic view of another perspective structure of the preferred embodiment of the LED of the present invention.
Fig. 3 is a schematic side view of a preferred embodiment of the LED of the present invention.
Fig. 4 is a schematic view of the bottom structure of the preferred embodiment of the LED of the present invention.
Fig. 5 is a schematic diagram of an internal package lead structure of an LED according to a preferred embodiment of the present invention.
Fig. 6 is a schematic perspective view of a light bar substrate according to the present invention.
Fig. 7 is a schematic front view of the light bar of the present invention.
Fig. 8 is a schematic side view of the light bar of the present invention.
Fig. 9 is a schematic diagram of a front view of a display screen according to the present invention.
Fig. 10 is a schematic perspective view of a display screen according to the present invention.
FIG. 11 is a schematic view showing an exploded structure of a display screen according to the present invention.
In the figure, a 1-LED matrix, a 2-side mounting pin, a 3-lens, a 4-bottom pin, a 5-common pin, a 6-first primary color pin, a 7-second primary color pin, an 8-third primary color pin, a 9-light bar substrate, a 10-bonding pad, a 11-light bead, a 12-amplifying plate, a 13-connecting plate, a 14-front glass baffle and a 15-rear glass baffle.
Detailed Description
This example is a preferred embodiment of the present invention, and other principles and basic structures are the same as or similar to those of this example, and all fall within the scope of the present invention.
Referring to fig. 1 to 5, the LED of the present invention mainly includes an LED substrate 1, a chip and side-mounted pins 2, wherein the chip is bonded on the LED substrate 1, and the side-mounted pins 2 are arranged on the side of the LED substrate 1. In this embodiment, the LED substrate 1 is rectangular, and the side-mounted pins 2 may be disposed along the long side direction of the LED substrate 1, so as to maximize the width of the side-mounted pins 2 and achieve the fastest heat dissipation.
In this embodiment, the number of the side-mounted pins 2 is specifically set according to the number of chips, and two pins may be set corresponding to one chip, or one pin may be set corresponding to one chip, and then one common pin is set for all chips. In this embodiment, a three-color LED is specifically described by taking an example, where four pins are provided on an LED substrate 1, and the four pins are a common pin 5, a first primary pin 6, a second primary pin 7 and a third primary pin 8, in this embodiment, the common pin 5 is in an inverted "L" shape, the first primary pin 6 is disposed below the right side of the common pin 5, the second primary pin 7 and the third primary pin 8 are disposed on the left side of the common pin 5, the second primary pin 7 is disposed above the third primary pin 8, the common pin 5, the first primary pin 6, the second primary pin 7 and the third primary pin 8 are respectively LED out and connected to a side-mounted pin 2, the first primary is connected between the common pin 5 and the first primary pin 6, the second primary is connected between the common pin 5 and the second primary pin 7, and the third primary is connected between the common pin 5 and the third primary pin 8. In specific implementation, two pins may be disposed corresponding to one primary color, for example, six pins are disposed for a three-color LED, which is not described herein.
In this embodiment, the side-mounted pins 2 may be L-shaped and extend to the bottom of the LED matrix to form bottom pins 4, and the bottom pins 4 are arranged side by side at the bottom of the LED matrix 1, so that the present invention can realize both side welding and bottom welding, and the usage mode is more flexible. In this embodiment, the bottom pin 4 may be further extended to the other side, so that the entire pin is in a "concave" shape, and may be optionally mounted on both sides, thereby increasing flexibility in use.
Referring to fig. 6, fig. 7 and fig. 8, a plurality of groups of bonding pads 10 are arranged on a light bar substrate 9, each group of bonding pads 10 is provided with a plurality of bonding pads arranged side by side, the number of bonding pads can be specifically set according to the number of side-mounted pins 2 of the used LEDs, in this embodiment, three-color LEDs of 4 side-mounted pins 2 are used for specific explanation, and the number of bonding pads in each group is 4. The side-mounted pins 2 of the lamp beads 11 are welded on the bonding pads 10 of the lamp strip substrate 9 to form a lamp strip. In this embodiment, a via hole (not shown) is disposed on the light bar substrate 9 corresponding to the bonding pad 10, and a plurality of via holes can be disposed corresponding to one bonding pad 10, so that the heat emitted by the LED can be quickly conducted to the other side of the light bar substrate 9 through the via hole, and the heat can be quickly removed.
The invention also protects an LED display screen, and please refer to fig. 9, 10 and 11. The display screen is formed by arranging a plurality of light bars side by side, and in the embodiment, the light bars are perpendicular to the light emitting surface of the display screen, so in the invention, the light emitting surface of the display screen is taken as the front surface, the light beads 11 are arranged on the side surface of the light bar substrate 9, and a certain gap is arranged between the light bars, so that light behind the display screen can penetrate through the gap, and a transparent screen effect is formed. The display screen comprises a plurality of lamp strips, an amplifying plate 12 and a connecting plate 13, wherein the amplifying plate 12 and the connecting plate 13 are perpendicular to the lamp strips, the amplifying plate 12 is connected with each lamp strip, amplified driving signals are input to the lamp strips, the LED lamp beads 11 on the lamp strips are driven to emit light, and the connecting plate 13 is used for assisting in connecting the lamp strips and plays a role in assisting in fixing. In this embodiment, a front glass baffle 14 is fixedly mounted on the front end surface of the display screen, and a rear glass baffle 15 is mounted on the rear end surface of the display screen.
The invention mainly relates to a novel packaging pin arrangement applied to a transparent LED display screen, wherein the novel packaging pins of lamp beads are positioned on the side surfaces of the lamp beads, the lamp beads applied to an LED display module are fixed on the front surface of a PCB and linearly arranged on a driving board surface to form 90-degree SMT positive luminescence, the lamp beads are directly fixed on the upper part of the driving PCB in a linear shape, the novel packaging pins of the bottom surface of the lamp beads are horizontally arranged on the front surface of the driving PCB, the board surface of the driving PCB is perpendicular to the board surface of the glass board, a fixing piece is fixed on a frame, a transparent glass board with high transparency or a powerful fixing hardware frame is used as a mounting main body, and the driving PCB is transversely arranged on the glass board, so that the shielding of the driving PCB to light rays can be greatly reduced, the transparency of the LED display module is improved, and meanwhile, the pixel density of the LED display module is improved by fixing a plurality of lamp beads on the board surface of the linearly arranged lamp beads.
The novel lamp bead packaging pin provided by the invention can directly reduce the space, improve the density and improve the transparent LED display module so as to meet the market demand for the LED display module with high pixel density and high permeability.
Claims (4)
1. A side-mounted positive-lighting LED lamp strip is characterized in that: the LED comprises an LED substrate, a chip and side-mounted pins, wherein the chip is bonded on the LED substrate, the side-mounted pins are arranged side by side on the side of the LED substrate, four pins are arranged on the LED substrate and are respectively a public pin, a first primary pin, a second primary pin and a third primary pin, the public pin is in an inverted L shape, the first primary pin is arranged below the right side of the public pin, the second primary pin and the third primary pin are arranged on the left side of the public pin, the second primary pin is arranged above the third primary pin, the public pin, the first primary pin, the second primary pin and the third primary pin are respectively LED out and connected to one side-mounted pin, the first primary LED is connected between the public pin and the first primary pin, the second primary LED is connected between the public pin and the second pin, the third primary pin is connected between the public pin, one public pin is arranged for all chips in the side-mounted LED, the lamp strip substrate is provided with a plurality of bonding pads, the bonding pads are arranged side by side, the bonding pads are arranged on the LED substrate, the bonding pads are arranged on the side-mounted side of the LED substrate, the bonding pads are arranged on the side-mounted pads, and the LED substrate is provided with the bonding pads, and the bonding pads are arranged on the side pads, and are corresponding to the LED substrate.
2. An LED display screen, characterized by: the display screen comprises more than one LED light bar, an amplifying board and a connecting board, wherein the LED light bars are arranged side by side, the amplifying board is connected with each light bar, amplified driving signals are input to the light bars, and the connecting board is used for assisting in connecting the light bars.
3. The LED display screen of claim 2, wherein: the front end of the LED light bar is fixedly provided with a front glass or acrylic baffle.
4. The LED display screen of claim 2, wherein: the rear end of the LED lamp strip is fixedly arranged is provided with a rear glass or acrylic baffle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610885787.3A CN106299096B (en) | 2016-10-11 | 2016-10-11 | Side-mounted positive-lighting LED, lamp strip and high-transmittance display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610885787.3A CN106299096B (en) | 2016-10-11 | 2016-10-11 | Side-mounted positive-lighting LED, lamp strip and high-transmittance display screen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106299096A CN106299096A (en) | 2017-01-04 |
| CN106299096B true CN106299096B (en) | 2023-08-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610885787.3A Active CN106299096B (en) | 2016-10-11 | 2016-10-11 | Side-mounted positive-lighting LED, lamp strip and high-transmittance display screen |
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| Country | Link |
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| CN (1) | CN106299096B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913771A (en) * | 2016-05-05 | 2016-08-31 | 深圳市奥蕾达科技有限公司 | Lateral mounting type full-color LED package and LED transparent screen |
| CN206584960U (en) * | 2016-10-11 | 2017-10-24 | 黄福强 | A kind of side patch positive luminescence LED lamp bar and LED display |
-
2016
- 2016-10-11 CN CN201610885787.3A patent/CN106299096B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913771A (en) * | 2016-05-05 | 2016-08-31 | 深圳市奥蕾达科技有限公司 | Lateral mounting type full-color LED package and LED transparent screen |
| CN206584960U (en) * | 2016-10-11 | 2017-10-24 | 黄福强 | A kind of side patch positive luminescence LED lamp bar and LED display |
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| Publication number | Publication date |
|---|---|
| CN106299096A (en) | 2017-01-04 |
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