CN204614809U - Full-color LED encapsulation structure - Google Patents
Full-color LED encapsulation structure Download PDFInfo
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- CN204614809U CN204614809U CN201520168331.6U CN201520168331U CN204614809U CN 204614809 U CN204614809 U CN 204614809U CN 201520168331 U CN201520168331 U CN 201520168331U CN 204614809 U CN204614809 U CN 204614809U
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- electrode
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- metal substrate
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- square metal
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Abstract
The utility model discloses a kind of Full-color LED encapsulation structure, comprise square metal substrate, red wafer, green wafer, blue dies and encapsulation glue-line, wherein, square metal substrate comprises the first electrode, the second electrode, third electrode, the 4th electrode and heat dispersion substrate, first electrode, the second electrode, third electrode are formed by three corner cutting and separating of square metal substrate, and the 4th electrode is that another corner be connected as a single entity with described square metal substrate is formed; Encapsulation glue-line covers on square metal substrate and red wafer, green wafer, blue dies, with by fixing for the encapsulation of red wafer, green wafer and blue dies.The Full-color LED encapsulation structure that the utility model provides, structure is simple, and good heat dissipation effect, has anti-ultraviolet ageing simultaneously, avoids the effects such as outward appearance xanthochromia.
Description
Technical field
The utility model relates to LED mechanism, particularly relates to a kind of Full-color LED encapsulation structure.
Background technology
LED industry is one of industry attracted most attention in recent years, is developed so far, and LED product has had energy-conservation, power saving, high efficiency, the reaction time is fast, the life cycle time is long and not mercurous, have the advantages such as environmental benefit.
LED lamp bead is generally divided into direct insertion, SMD and high-power type, bonded LED lamp pearl generally needs epoxy encapsulation, and epoxy resin exists ultraviolet ageing and heat ageing problem, ultraviolet ageing and heat ageing problem make the outside xanthochromia of LED lamp bead, affect its useful life.Thus, under the utilization trend of LED high power, brightness and high-density packages, its heat dissipation problem and ultraviolet ageing face more and more acid test, will have a strong impact on the life-span of LED if do not solved in good time.
Utility model content
The purpose of this utility model is overcome deficiency of the prior art and provide a kind of Full-color LED encapsulation structure, and its structure is simple, good heat dissipation effect, have anti-ultraviolet ageing effect simultaneously.
The technical scheme that the utility model solution prior art problem adopts is: a kind of Full-color LED encapsulation structure, comprise square metal substrate, red wafer, green wafer, blue dies and encapsulation glue-line, wherein, described square metal substrate comprises the first electrode, the second electrode, third electrode, the 4th electrode and heat dispersion substrate, described first electrode, the second electrode, third electrode are formed by three corner cutting and separating of described square metal substrate, and described 4th electrode is that another corner be connected as a single entity with described square metal substrate is formed;
Described red wafer, green wafer and blue dies are fixedly installed on described heat dispersion substrate, the positive pole of described red wafer and described first Electrode connection, the positive pole of described green wafer and described second Electrode connection, the positive pole of described blue dies is connected with described third electrode, the negative pole of described red wafer, green wafer and blue dies and described 4th Electrode connection; Described encapsulation glue-line covers on described square metal substrate and red wafer, green wafer, blue dies, with by fixing for the encapsulation of described red wafer, green wafer and blue dies.
Preferably, described heat dispersion substrate is provided with multiple first glue filling opening, and described encapsulation glue-line forms the first fixed part in described first glue filling opening.
Preferably, described first electrode, the second electrode, third electrode and the 4th electrode are provided with multiple second glue filling opening, and described encapsulation glue-line forms the second fixed part in described second glue filling opening.
Preferably, described first glue filling opening and the second glue filling opening are that diameter first diminishes the receipts waist typed through hole becoming large afterwards.
Preferably, described square metal substrate is copper base.
Preferably, described encapsulation glue-line is the silica column with fluorescent material.
The beneficial effects of the utility model are: the Full-color LED encapsulation structure that the utility model provides, directly using square metal substrate as carrier, simultaneously, by this square metal substrate segmentation formation first electrode, second electrode, third electrode, 4th electrode and heat dispersion substrate, by red wafer, green wafer, blue dies is arranged on heat radiation wafer, and by its positive and negative electrode and the first corresponding electrode, second electrode, third electrode, 4th Electrode connection, encapsulating structure is formed finally by the encapsulation of encapsulation glue-line, the LED lamp bead that this structure is formed, by metal substrate as carrier, structure is simple, simultaneously, wafer directly contacts with metal substrate, less thermal resistance, heat is by metal substrate heat loss through conduction, reach better radiating effect.In addition, adopt silica column encapsulation, make its high-temperature resistant result better, simultaneously splendid to ultraviolet transmitance, avoid ultraviolet ageing to cause the problems such as outward appearance xanthochromia.
Accompanying drawing explanation
Fig. 1 is the vertical view of the utility model embodiment Full-color LED encapsulation structure;
Fig. 2 is the side view of the utility model embodiment Full-color LED encapsulation structure.
Reference numeral:
Square metal substrate 10;
First electrode 101;
Second electrode 102;
Third electrode 103;
Heat dispersion substrate 104;
Second glue filling opening 1011,1021,1031;
4th electrode 1041;
First glue filling opening 1042;
Solidification colloid 1012,1022,1032;
Red wafer 20;
Green wafer 21;
Blue dies 22;
Encapsulation glue-line 30.
The realization of the utility model object, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Be described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the utility model, and can not be interpreted as restriction of the present utility model.
In description of the present utility model, it is to be appreciated that term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or the implicit quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In description of the present utility model, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In addition, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be.
Shown in Fig. 2, the utility model embodiment provides a kind of Full-color LED encapsulation structure, comprises square metal substrate 10, red wafer 20, green wafer 21, blue dies 22 and encapsulation glue-line 30.
Concrete, square metal substrate 10 comprises the first electrode 101, second electrode 102, third electrode 103, the 4th electrode 1041 and heat dispersion substrate 104, described first electrode 101, second electrode 102, third electrode 103 are formed by three corner cutting and separating of described square metal substrate 10, and described 4th electrode 1041 is that another corner be connected as a single entity with described square metal substrate 10 is formed.Such as, in Fig. 1 example shown, the first electrode 101 is formed by " L " type cut-out excision isolation, and the second electrode 102 is formed by " L " type cut-out excision isolation, and third electrode 103 is formed by " L " type cut-out excision isolation.
Red wafer 20, green wafer 21 and blue dies 22 are fixedly installed on described heat dispersion substrate 104, the positive pole of red wafer 20 is connected with described first electrode 101, the positive pole of green wafer 21 is connected with described second electrode 102, the positive pole of blue dies 22 is connected with described third electrode 103, and the negative pole of red wafer 20, green wafer 21 and blue dies 22 is connected with described 4th electrode 1041.That is, first electrode 101 is as the positive pole feeder ear of red wafer 20, second electrode 102 is as the positive pole feeder ear of green wafer 21, and third electrode 103 is as the positive pole feeder ear of blue dies 22, and the 4th electrode 1041 is as the common negative pole feeder ear of red wafer 20, green wafer 21 and blue dies 22.
Encapsulation glue-line 30 covers on described square metal substrate 10 and red wafer 20, green wafer 21, blue dies 22, to encapsulate fixing by described red wafer 20, green wafer 21 and blue dies 22.Concrete, can adopt and inject potting resin in metal die inside, and by being cured it, to form this encapsulation glue-line 30.
It should be noted that, after " L " type cut-out is cut, this position then forms gap, when encapsulating glue-line 30 and covering on described square metal substrate 10 and red wafer 20, green wafer 21, blue dies 22, when encapsulating glue-line 30 and being uncured, packing colloid is flow regime, therefore can flow in the gap of the cut rear formation of " L " type cut-out, so, after encapsulation glue-line 30 solidifies, the solidification colloid 1012,1022,1032 of " L " type can in this gap, be formed.
In an embodiment of the present utility model, heat dispersion substrate 104 is provided with multiple first glue filling opening 1042, and described encapsulation glue-line 30 forms the first fixed part in described first glue filling opening 1042.Corresponding, the first electrode 101, second electrode 102, third electrode 103 and the 4th electrode 1041 are provided with multiple second glue filling opening 1011,1021,1031, and described encapsulation glue-line 30 forms the second fixed part in described second glue filling opening 1011,1021,1031.So, in encapsulation process, before uncured, potting resin has mobility, can flow in the first glue filling opening 1042, second glue filling opening 1011,1021,1031, carry out ultra-violet curing again, after solidification, correspondingly in the first glue filling opening 1042 and the second glue filling opening 1011,1021,1031 can form the first fixed part and the second fixed part.Because the first fixed part and the second fixed part are solidificated in the first glue filling opening 1042 and the second glue filling opening 1011,1021,1031, therefore, heat dispersion substrate 104 and the first electrode 101, second electrode 102, third electrode 103, the fastness of connection between the 4th electrode 1041 and encapsulation glue-line 30 and reliability can be improved.
In preferred embodiment of the present utility model, the first glue filling opening 1042 and the second glue filling opening 1011,1021,1031 are that diameter first diminishes the receipts waist typed through hole becoming large afterwards.So, the first fixed part formed after solidification and the second fixed part and coordinating between the first glue filling opening 1042 and the second glue filling opening 1011,1021,1031 more firm, further increase heat dispersion substrate 104 and the first electrode 101, second electrode 102, third electrode 103, the fastness of connection between the 4th electrode 1041 and encapsulation glue-line 30 and reliability.
Be understandable that, square metal substrate 10 is copper base, that is, square metal substrate 10 adopts copper material, copper has the highest thermal conductivity as outside desilver in metallic element, therefore, the heat of red wafer 20, green wafer 21, blue dies 22, by this copper base heat loss through conduction, can improve its radiating effect.
In addition, as preferably, encapsulation glue-line is the silica column with fluorescent material, and silica column has good high-temperature resistant result, simultaneously splendid to ultraviolet transmitance, avoids ultraviolet ageing to cause the problems such as outward appearance xanthochromia.
In sum, according to the Full-color LED encapsulation structure that the utility model provides, directly using square metal substrate 10 as carrier, simultaneously, this square metal substrate 10 is split formation first electrode 101, second electrode 102, third electrode 103, 4th electrode 1041 and heat dispersion substrate 104, by red wafer 20, green wafer 21, blue dies 22 is arranged on heat radiation wafer, and by its positive and negative electrode and the first corresponding electrode 101, second electrode 102, third electrode 103, 4th electrode 1041 connects, encapsulate finally by encapsulation glue-line 30 and form encapsulating structure, the LED lamp bead that this structure is formed, by metal substrate as carrier, structure is simple, simultaneously, wafer directly contacts with metal substrate, less thermal resistance, heat is by metal substrate heat loss through conduction, reach better radiating effect.In addition, adopt silica column encapsulation, make its high-temperature resistant result better, simultaneously splendid to ultraviolet transmitance, avoid ultraviolet ageing to cause the problems such as outward appearance xanthochromia.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Although illustrate and described embodiment of the present utility model above, be understandable that, above-described embodiment is exemplary, can not be interpreted as restriction of the present utility model, those of ordinary skill in the art when not departing from principle of the present utility model and aim can change, revise, replace and become above-described embodiment in scope of the present utility model.
Claims (6)
1. a Full-color LED encapsulation structure, it is characterized in that, comprise square metal substrate, red wafer, green wafer, blue dies and encapsulation glue-line, wherein, described square metal substrate comprises the first electrode, the second electrode, third electrode, the 4th electrode and heat dispersion substrate, described first electrode, the second electrode, third electrode are formed by three corner cutting and separating of described square metal substrate, and described 4th electrode is that another corner be connected as a single entity with described square metal substrate is formed;
Described red wafer, green wafer and blue dies are fixedly installed on described heat dispersion substrate, the positive pole of described red wafer and described first Electrode connection, the positive pole of described green wafer and described second Electrode connection, the positive pole of described blue dies is connected with described third electrode, the negative pole of described red wafer, green wafer and blue dies and described 4th Electrode connection; Described encapsulation glue-line covers on described square metal substrate and red wafer, green wafer, blue dies, with by fixing for the encapsulation of described red wafer, green wafer and blue dies.
2. Full-color LED encapsulation structure according to claim 1, is characterized in that, described heat dispersion substrate is provided with multiple first glue filling opening, and described encapsulation glue-line forms the first fixed part in described first glue filling opening.
3. Full-color LED encapsulation structure according to claim 2, is characterized in that, described first electrode, the second electrode, third electrode and the 4th electrode are provided with multiple second glue filling opening, and described encapsulation glue-line forms the second fixed part in described second glue filling opening.
4. Full-color LED encapsulation structure according to claim 3, is characterized in that, described first glue filling opening and the second glue filling opening are that diameter first diminishes the receipts waist typed through hole becoming large afterwards.
5. Full-color LED encapsulation structure according to claim 1, is characterized in that, described square metal substrate is copper base.
6. Full-color LED encapsulation structure according to claim 1, is characterized in that, described encapsulation glue-line is the silica column with fluorescent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520168331.6U CN204614809U (en) | 2015-03-23 | 2015-03-23 | Full-color LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520168331.6U CN204614809U (en) | 2015-03-23 | 2015-03-23 | Full-color LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
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| CN204614809U true CN204614809U (en) | 2015-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520168331.6U Expired - Fee Related CN204614809U (en) | 2015-03-23 | 2015-03-23 | Full-color LED encapsulation structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913771A (en) * | 2016-05-05 | 2016-08-31 | 深圳市奥蕾达科技有限公司 | Lateral mounting type full-color LED package and LED transparent screen |
| WO2021129542A1 (en) * | 2019-12-25 | 2021-07-01 | 佛山市国星光电股份有限公司 | Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel |
-
2015
- 2015-03-23 CN CN201520168331.6U patent/CN204614809U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913771A (en) * | 2016-05-05 | 2016-08-31 | 深圳市奥蕾达科技有限公司 | Lateral mounting type full-color LED package and LED transparent screen |
| WO2021129542A1 (en) * | 2019-12-25 | 2021-07-01 | 佛山市国星光电股份有限公司 | Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150902 Termination date: 20170323 |
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| CF01 | Termination of patent right due to non-payment of annual fee |