CN203644817U - LED encapsulation structure - Google Patents
LED encapsulation structure Download PDFInfo
- Publication number
- CN203644817U CN203644817U CN201320866058.5U CN201320866058U CN203644817U CN 203644817 U CN203644817 U CN 203644817U CN 201320866058 U CN201320866058 U CN 201320866058U CN 203644817 U CN203644817 U CN 203644817U
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- CN
- China
- Prior art keywords
- led
- electrode
- substrate
- support
- led wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005538 encapsulation Methods 0.000 title abstract description 7
- 239000003292 glue Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 241000218202 Coptis Species 0.000 claims description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 7
- 238000007493 shaping process Methods 0.000 claims description 5
- 230000005496 eutectics Effects 0.000 claims description 2
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 6
- 230000001795 light effect Effects 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 229920000260 silastic Polymers 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 210000002189 macula lutea Anatomy 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model belongs to the technical field of semiconductor light source LED encapsulation and especially relates to an LED encapsulation structure. The LED encapsulation structure comprises a support, LED wafers, a fluorescent glue, a lens, a substrate and an electrode; the substrate and the electrode are disposed on the support respectively, the LED wafers are fixedly disposed on the substrate and are connected with the electrode, the periphery of the LED wafers is provided with a fully-enclosed first fence, the fluorescent glue coats surfaces of the LED wafers, the support is provided with a second fence, and the lens is connected to the support through a choke molding cover of the second fence. Through arrangement of the first fence, the dosage is saved when the surfaces of the LED wafers are coated with the fluorescent glue; LED wafers are stimulated to emit white light through the fluorescent glue, and chock molding of the lens is performed through the second fence, so the LED light effect and the light-emitting angle are improved, and light spots are uniform; and, compared with LEDs having similar structures in the prior art, the LED encapsulation structure has the advantages of less needed production equipment, the greatly improved yield rate, greatly improved automation and lowered cost.
Description
Technical field
The utility model belongs to semiconductor light sources LED encapsulation technology field, relates in particular to a kind of LED encapsulating structure.
Background technology
LED industry is one of industry attracting most attention in recent years, is developed so far, and that LED product has had is energy-conservation, power saving, high efficiency, the reaction time is fast, the life cycle time is long and not mercurous, have the advantages such as environmental benefit.But also more and more receiving publicity aspect the technological improvement of LED encapsulation, as shown in Figure 1, existing LED encapsulating structure comprises base material 11, LED wafer 12, wire 13 and packaging plastic 14.Described LED wafer 12 is fixed on described base material 11, and described LED wafer 12 connects conducting by described wire 13, and packaging plastic 14 covers LED wafer 12 and fills up support glue cup.There is following problem in above-mentioned structure: the light utilization efficiency that 1, LED wafer sends is low; 2, fluorescent material consumption is many, and 3, hot spot consistency is poor, secondary optical design limitation is large, as joined lens or reflector macula lutea is serious.
Utility model content
The purpose of this utility model is: for the deficiencies in the prior art, and provide a kind of LED encapsulating structure, the utility model the first enclosing the use amount of having saved fluorescent glue is set, the fluorescent glue excited white light that LED wafer is carried out by painting, lens enclose a grade choked flow shaping cover by second and are connected to support, have improved light efficiency utilance and the packaging efficiency of LED wafer; And required production equipment reduces, yield/automation all has significantly lifting, cost.
In order to achieve the above object, the utility model adopts following technical scheme: a kind of LED encapsulating structure, comprise support, LED wafer, fluorescent glue, lens, gold thread, substrate and electrode are arranged at respectively described support, described LED wafer is fixedly installed on described substrate and is connected with described electrode, the surrounding of described LED wafer is provided with the first enclosing of full encirclement, described fluorescent glue is coated on the surface of described LED wafer, described support is provided with the second enclosing, and described lens are connected to described support by the second choked flow shaping cover that encloses shelves.By the design of the first enclosing, save the use amount of fluorescent glue, the fluorescent glue excited white light that LED wafer is carried out by painting, has improved the light efficiency of LED wafer and has improved lighting angle, and hot spot uniformity.
One as LED encapsulating structure described in the utility model is improved, and described LED wafer uses fixing glue or eutectic mode to be fixed on described substrate.
One as LED encapsulating structure described in the utility model is improved, described electrode comprises positive electrode and negative electrode, described positive electrode and described negative electrode are arranged at respectively described substrate, and described positive electrode is connected with described LED wafer electric, and described negative electrode is connected with described LED wafer electric by gold thread.
One as LED encapsulating structure described in the utility model is improved, described electrode comprises positive electrode and negative electrode, described positive electrode and described negative electrode are arranged at respectively described substrate, and described positive electrode is all connected with described LED wafer electric by gold thread with described negative electrode.
One as LED encapsulating structure described in the utility model is improved, and described lens are set to transparent arc structure.
The method for packing of above-mentioned LED encapsulating structure, comprises the following steps: the first step, electrode is arranged on to the bottom of described support, then the first enclosing of full encirclement is set on substrate; Second step, LED wafer is fixed on to first encloses in shelves, described LED wafer is electrically connected with described electrode, by point gum machine, fluorescent glue is coated in equably to the surface of the LED wafer in described the first enclosing; Then lens are connected to support by the second choked flow shaping cover that encloses shelves.
With respect to prior art, method for packing of the present utility model is simple and practical, be convenient to realize suitability for industrialized production, and use a small amount of fluorescent glue just can reach excited white light object, save fluorescent glue consumption, be provided with transparent lens, improve the lighting angle of LED, improve luminous efficiency and hot spot uniformity.
Brief description of the drawings
Fig. 1 is the structural representation of prior art.
Fig. 2 is the structural representation of the utility model embodiment 1.
Fig. 3 is the vertical view of the utility model embodiment 1.
Fig. 4 is the front view of the utility model embodiment 1.
Fig. 5 is the structural representation of the utility model embodiment 2.
Embodiment
Below in conjunction with drawings and Examples, the utility model and beneficial effect thereof are elaborated, but embodiment of the present utility model is not limited to this.
Preferably, electrode 6 comprises positive electrode and negative electrode, and positive electrode and negative electrode are arranged at described substrate 5, and positive electrode is electrically connected with LED wafer 2, and negative electrode is electrically connected with LED wafer 2 by gold thread 8.
Preferably, substrate 5 is mixed and forms with plastics by metal architecture, and substrate 5 includes insulating barrier, and insulating barrier is the most crucial technology of substrate 5, mainly plays the function of bonding, insulation and moulding.The insulating barrier of substrate 5 is conductive barrier maximum in power model structure.Insulating barrier heat-conductive characteristic is better, and the diffusion of the heat that produces while being more conducive to device operation also just is more conducive to reduce the operating temperature of device, thereby reaches the power load that improves module, reduces volume, and life-saving, improves the objects such as power stage.
Other structure is identical with the structure of embodiment 1, repeats no more here.
The announcement of book and instruction according to the above description, the utility model those skilled in the art can also change and revise above-mentioned execution mode.Therefore, the utility model is not limited to above-mentioned embodiment, and any apparent improvement, replacement or modification that every those skilled in the art have done on basis of the present utility model all belong to protection range of the present utility model.In addition,, although used some specific terms in this specification, these terms just for convenience of description, do not form any restriction to the utility model.
Claims (5)
1. a LED encapsulating structure, it is characterized in that: comprise support, LED wafer, fluorescent glue, lens, substrate and electrode, described substrate and described electrode are arranged at respectively described support, described LED wafer is fixedly installed on described substrate and is electrically connected with described electrode, the surrounding of described LED wafer is provided with the first enclosing of full encirclement, described fluorescent glue is coated on the surface of described LED wafer, described support is provided with the second enclosing, and described lens are connected to described support by the second choked flow shaping cover that encloses shelves.
2. LED encapsulating structure according to claim 1, is characterized in that: described LED wafer fixing glue or eutectic mode are fixed on described substrate.
3. LED encapsulating structure according to claim 2, it is characterized in that: described electrode comprises positive electrode and negative electrode, described positive electrode and described negative electrode are arranged at respectively described substrate, described positive electrode is connected with described LED wafer electric, and described negative electrode is connected with described LED wafer electric by gold thread.
4. LED encapsulating structure according to claim 2, it is characterized in that: described electrode comprises positive electrode and negative electrode, described positive electrode and described negative electrode are arranged at respectively described substrate, and described positive electrode is all connected with described LED chip electrode by gold thread with described negative electrode.
5. LED encapsulating structure according to claim 1, is characterized in that: described lens are set to transparent arc structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320866058.5U CN203644817U (en) | 2013-12-26 | 2013-12-26 | LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320866058.5U CN203644817U (en) | 2013-12-26 | 2013-12-26 | LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203644817U true CN203644817U (en) | 2014-06-11 |
Family
ID=50876041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320866058.5U Expired - Lifetime CN203644817U (en) | 2013-12-26 | 2013-12-26 | LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203644817U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682048A (en) * | 2013-12-26 | 2014-03-26 | 东莞市港照照明科技有限公司 | LED (Light-Emitting Diode) package structure and package method |
-
2013
- 2013-12-26 CN CN201320866058.5U patent/CN203644817U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682048A (en) * | 2013-12-26 | 2014-03-26 | 东莞市港照照明科技有限公司 | LED (Light-Emitting Diode) package structure and package method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140611 |