WO2021189618A1 - Display support, display assembly, and method for manufacturing display support - Google Patents

Display support, display assembly, and method for manufacturing display support Download PDF

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Publication number
WO2021189618A1
WO2021189618A1 PCT/CN2020/090339 CN2020090339W WO2021189618A1 WO 2021189618 A1 WO2021189618 A1 WO 2021189618A1 CN 2020090339 W CN2020090339 W CN 2020090339W WO 2021189618 A1 WO2021189618 A1 WO 2021189618A1
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WO
WIPO (PCT)
Prior art keywords
display
metal sheet
chip
negative electrode
common metal
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PCT/CN2020/090339
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French (fr)
Chinese (zh)
Inventor
李炳锋
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深圳利亚德光电有限公司
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Publication of WO2021189618A1 publication Critical patent/WO2021189618A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Definitions

  • the present invention relates to the field of display, in particular to a display stand, a display assembly and a manufacturing method of the display stand.
  • LED display technology is becoming more and more mature. And because of the advantages of easy installation, reusability, and good display effect, LED display screens are loved by consumers, and are gradually used in various occasions, such as indoor and outdoor displays.
  • a group of RGB-LED chips includes: 1 red chip, 1 green chip, and 1 blue chip.
  • the positive pole of the red chip, the positive pole of the green chip, and the positive pole of the blue chip are commonly connected to one pin.
  • the negative pole of the red chip, the negative pole of the green chip, and the negative pole of the blue chip are respectively connected to one pin.
  • a group of RGB-LED chips constitutes a lamp point, so a lamp point includes four pins.
  • the main purpose of the present invention is to provide a display bracket, a display assembly, and a manufacturing method of the display bracket, so as to solve the problem of complicated processing caused by the need for more pads when connecting the display chip in the related art.
  • a display support for accommodating a plurality of display chips, each display chip includes a first chip unit and a second chip unit, and the display support includes: a base body A plurality of metal sheets are arranged on the substrate, and the plurality of metal sheets include a positive electrode common metal sheet and a first negative electrode common metal sheet; wherein, all the positive electrodes of at least two display chips are connected with the positive electrode common metal sheet, and the adjacent two The negative electrodes of the two first chip units of the display chip are connected to the first negative electrode with a common metal sheet.
  • the array arrangement includes a first direction and a second direction perpendicular to each other. In the first direction, adjacent All the positive electrodes of the two display chips are connected to a positive electrode common metal sheet, and in the second direction, the negative electrodes of the two first chip units of two adjacent display chips are connected to the first negative electrode common metal sheet.
  • the plurality of metal sheets further includes a second negative electrode common metal sheet, and the negative electrodes of two second chip units of two adjacent display chips are connected to the second negative electrode common metal sheet.
  • the second negative common metal sheet includes a first section and a second section, the first and second sections are arranged in a staggered manner in the first direction, and the first section is located at a distance from the center of the first negative common metal sheet. On the side, the second section is arranged corresponding to the first negative electrode common metal sheet.
  • each display chip further includes a third chip unit, the third chip unit is located between the first chip unit and the second chip unit, the plurality of metal sheets also includes a plurality of negative electrode independent metal sheets, and a plurality of third chip units It is connected to a plurality of negative electrode independent metal pieces in a one-to-one correspondence.
  • a concave portion is provided on the side of the first negative electrode common metal sheet away from the center of the base body.
  • the base body includes a first side wall and a second side wall, the first side wall and the second side wall are correspondingly arranged, and a plurality of metal sheets extend from the base body and are bent and arranged on the first side wall and the second side wall , The portions of the plurality of metal sheets located on the first side wall and the second side wall form a plurality of pins.
  • the base body has a front surface accommodating a plurality of display chips and a back surface opposite to the front surface, and the ends of the plurality of metal sheets extend to the back surface.
  • each display chip is mounted in one mounting hole, part of the first negative electrode common metal sheet, part of the second negative electrode common metal sheet, part of the negative electrode independent metal sheet, and part of the positive electrode common metal sheet Located within the range of the mounting hole.
  • a cross-shaped groove is provided on the front surface of the substrate, and the cross-shaped groove separates a plurality of mounting holes.
  • the cross-shaped groove is shared with the first negative electrode, the second negative electrode, and the positive electrode. Cross setting.
  • the material of the substrate is plastic
  • the display chip includes an LED chip.
  • a display assembly including a display bracket and a display chip arranged on the display bracket, the display bracket being the above-mentioned display bracket.
  • a method for manufacturing a display stand is used for manufacturing the above-mentioned display stand.
  • the manufacturing method includes the following steps: step S10: manufacturing a base body; step S20: placing a metal sheet In the base body; step S30: pour plastic, and the metal sheet is injection molded into the base body; step S40: the extension of the metal sheet is formed into a pin, and the pin is pressed onto the base body.
  • a manufacturing method of a display assembly is used to manufacture the above-mentioned display assembly.
  • the manufacturing method includes the following steps: Place it in the base body, pour plastic into it, and then inject the metal sheet into the base body. The extension of the metal sheet forms a pin. Finally, the pin is pressed onto the base body; the first display chip and the second display chip are pressed together.
  • the second display chip is installed inside the mounting hole, and the first display chip and the first negative electrode common metal sheet are connected through the first connection part, and the second display chip and the first negative electrode common metal sheet are connected through the second connection part; Fill the mounting hole of the display chip with epoxy resin glue or silicone glue; vacuumize the epoxy glue or silicone glue; put it into the oven to cure the glue.
  • each display chip includes a first chip unit and a second chip unit.
  • the display support includes a base body and a plurality of metal sheets arranged on the base body, and the plurality of metal sheets include a positive electrode common metal sheet and a first negative electrode common metal sheet.
  • All the positive electrodes of at least two display chips are connected with the positive electrode common metal sheet, and the negative electrodes of the two first chip units of the adjacent two display chips are connected with the first negative electrode common metal sheet, through the above-mentioned positive electrode common metal sheet and the first negative electrode
  • the common metal sheet effectively merges the positive and negative electrodes of the display chip before being led out of the base body of the display support, which can reduce the number of metal sheets, thereby reducing the number of solder joints, and reducing the complexity of processing. Therefore, the technical solution of the present application effectively solves the problem that the display chip in the related art requires more pads when connecting, which leads to complicated processing.
  • Fig. 1 shows a three-dimensional structural diagram of an embodiment of a display stand according to the present invention
  • FIG. 2 shows a schematic top view of the display bracket of FIG. 1;
  • Fig. 3 shows a schematic bottom view of the display stand of Fig. 1;
  • Fig. 4 shows a schematic diagram of the arrangement position of the metal sheet of the display bracket of Fig. 1;
  • FIG. 5 shows a perspective schematic diagram of the display bracket of FIG. 1
  • Fig. 6 shows an assembly schematic diagram of the display bracket of Fig. 1;
  • FIG. 7 shows a schematic flow chart of the embodiment of the manufacturing method of the display bracket of FIG. 1;
  • FIG. 8 shows a schematic flowchart of an embodiment of a method for manufacturing a display assembly.
  • the display bracket is used to accommodate a plurality of display chips, and each display chip includes a first chip unit U1 and a second chip unit U2, and the display bracket includes: a base 10 and Multiple metal sheets 20.
  • a plurality of metal sheets 20 are arranged on the substrate 10, and the plurality of metal sheets 20 include a positive electrode common metal sheet 21 and a first negative electrode common metal sheet 22; wherein, all the positive electrodes of at least two display chips are connected to the positive electrode common metal sheet 21, The negative electrodes of the two first chip units U1 of the two adjacent display chips are connected to the first negative common metal sheet 22.
  • the display bracket is used for accommodating four display chips, which are the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400.
  • the above-mentioned display chips are all LED chips.
  • the first chip unit U1 and the second chip unit U2 it also includes a third chip unit U3.
  • the first chip unit U1, the third chip unit U3, and the second chip unit U2 respectively correspond to RGB.
  • all the positive poles of the first display chip 100 that is, the positive pole of the first chip unit U1, the positive pole of the second chip unit U2, and the positive pole of the third chip unit U3 and the third display chip 300 All of the positive electrodes are connected to one of the positive electrode common metal sheets 21. All the positive electrodes of the second display chip 200 and all the positive electrodes of the fourth display chip 400 are connected to the other positive electrode common metal sheet 21. The negative electrode of the first chip unit U1 of the first display chip 100 and the negative electrode of the first chip unit U1 of the second display chip 200 are connected to one of the first negative electrode common metal sheets 22.
  • the negative electrode of the first chip unit U1 of the third display chip 300 and the negative electrode of the first chip unit U1 of the fourth display chip 400 are connected to another first negative electrode common metal sheet 22.
  • the positive electrode and the negative electrode of the display chip are effectively combined before being led out of the base 10 of the display support, which can reduce the number of metal sheets, thereby reducing the welding points.
  • the quantity reduces the complexity of processing. Therefore, the technical solution of the present embodiment effectively solves the problem that the display chip in the related art requires more pads when connecting, which leads to complicated processing.
  • the metal sheet 20 is also called a metal electrode, which can be copper or iron.
  • the thickness of the metal sheet 20 is between 0.1 mm and 0.5 mm.
  • the metal sheet 20 is plated with gold or silver to improve the conductivity of the metal sheet.
  • the four display chips are arranged in an array, and the direction of the array arrangement includes a first direction and a second direction perpendicular to each other.
  • first direction adjacent All the positive electrodes of the two display chips (that is, the first display chip 100 and the third display chip 300, or the second display chip 200 and the fourth display chip 400) are connected to a positive electrode common metal sheet 21, in the second direction,
  • the negative poles of the two first chip units U1 of two adjacent display chips that is, the first display chip 100 and the second display chip 200, or the third display chip 300 and the fourth display chip 400) are shared with the first negative electrode
  • the metal sheets 22 are connected.
  • the positive electrode common metal sheet 21 and the first negative electrode common metal sheet 22 are respectively arranged in the first direction and the second direction to make full use of the space on the display stand, and the positive electrode common metal sheet 21 and the first negative electrode common metal sheet 22 No overlap occurs, making the layout more reasonable.
  • the positive and negative electrodes of the second chip unit U2 and the positive and negative electrodes of the third chip unit U3 can both be connected to the metal sheet through electrode leads, and the electrode leads are gold wires or copper wires.
  • the anode of the first chip unit U1 is connected to the metal sheet through an electrode lead, and the electrode lead is a gold wire or a copper wire.
  • the negative electrode of the first chip unit U1 may be connected to the metal sheet through a solder joint.
  • the arrangement of this embodiment is a preferred embodiment, and the positive electrode common metal sheet and the first negative electrode common metal sheet can also be arranged in the same direction during actual design. At the same time, only one anode common metal sheet may be provided, and at this time, the anodes of the first display chip, the second display chip, the third display chip, and the fourth display chip are all connected to the anode common metal sheet.
  • the plurality of metal sheets 20 further include a second negative electrode common metal sheet 23, and two adjacent display chips (that is, the first display chip 100 and the second display chip 200, or The negative electrodes of the two second chip units U2 of the third display chip 300 and the fourth display chip 400) are connected to the second negative electrode common metal sheet 23.
  • the second negative electrode common metal sheet 23 further reduces the number of metal sheets 20, which makes the structure of the product simpler and allows the metal sheets to have a larger layout space.
  • the second negative electrode common metal sheet 23 includes a first section 231 and a second section 232.
  • the first section 231 and the second section 232 are staggered in the first direction, and the first section 231 is located on a side of the first negative common metal sheet 22 away from the center of the base 10, and the second section 232 is provided corresponding to the first negative common metal sheet 22.
  • the dislocation of the first section and the second section 232 in the first direction allows more options for the arrangement position of the metal sheet 20, which in turn makes the arrangement position of the metal sheet more reasonable.
  • each display chip further includes a third chip unit U3.
  • the third chip unit U3 is located between the first chip unit U1 and the second chip unit U2.
  • a plurality of negative electrode independent metal sheets 24 are included.
  • Each third chip unit U3 is connected to a separate negative electrode independent metal sheet 24.
  • the negative electrode independent metal sheet 24 can be individually connected to a single negative electrode, so that the arrangement of the metal sheet 20 is more reasonable.
  • there are four negative electrode independent metal sheets 24, and the four negative electrode independent metal sheets 24 are located at both ends in the first direction and the second direction.
  • the negative electrodes of the third chip unit U3 of the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400 are respectively connected to the adjacent negative electrode independent metal sheets 24.
  • the specific meaning of the aforementioned proximity is: for one of the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400, the negative electrode independent metal sheet 24 closest to it is selected. .
  • a third negative common metal sheet can also be provided.
  • the third negative common metal sheet replaces the negative independent metal sheet, and further integrates the negative electrode of the display chip, which can further reduce the metal The number of slices.
  • the arrangement of the metal sheets is more flexible and the structure is simpler.
  • a recess 221 is provided on the side of the first negative electrode common metal sheet 22 away from the center of the base body 10.
  • the concave portion 221 provides a space between the first negative electrode common metal sheet 22 and the second negative electrode common metal sheet 23 to prevent current interference.
  • the above-mentioned concave portion 221 is provided on the first negative electrode common metal sheet 22.
  • the base 10 includes a first side wall 11 and a second side wall 12, the first side wall 11 and the second side wall 12 are arranged correspondingly, and a plurality of metal sheets 20 are formed from
  • the base body 10 extends and is bent and arranged on the first side wall 11 and the second side wall 12.
  • the portions of the plurality of metal sheets 20 on the first side wall 11 and the second side wall 12 form a plurality of pins.
  • the pins are located on the first side wall 11 and the second side wall 12 of the base body 10 and are evenly arranged. The setting of the pins is convenient for the display bracket to connect to the PCB board, and it is easy to install.
  • Pin 1, pin 5, pin 6, and pin 10 are respectively part of four negative electrode independent metal sheets 24, and pin 2 and pin 4 are parts of two second negative electrode common metal sheets 23, respectively.
  • Pin 3 and pin 8 are respectively a part of two anode common metal sheets 21, and pin 7 and pin 9 are respectively a part of two first anode common metal sheets 22.
  • the first chip unit U1 of the first display chip 100 and the first chip unit U1 of the second display chip 200 are connected to the first negative common metal sheet 22 corresponding to pin 7, and the first display chip 100
  • the second chip unit U2 and the second chip unit U2 of the second display chip 200 are connected to the second negative common metal sheet 23 corresponding to the pin 2.
  • the third chip unit U3 of the first display chip 100 is connected to the negative electrode independent metal sheet 24 corresponding to pin 6, and the third chip unit U3 of the second display chip 200 is connected to the negative electrode independent metal sheet 24 corresponding to pin 1. All the anodes of the first display chip 100 and the third display chip 300 are connected to the anode common metal sheet 21 corresponding to the pin 8.
  • All the anodes of the second display chip 200 and the fourth display chip 400 are connected to the anode common metal sheet 21 corresponding to the pin 3.
  • the first chip unit U1 of the third display chip 300 and the first chip unit U1 of the fourth display chip 400 are connected to the first negative common metal sheet 22 corresponding to pin 9, and the second chip unit U2 of the third display chip 300 is connected to The second chip unit U2 of the fourth display chip 400 is connected to the second negative common metal sheet 23 corresponding to the pin 4.
  • the third chip unit U3 of the third display chip 300 is connected to the negative electrode independent metal sheet 24 corresponding to the pin 10
  • the third chip unit U3 of the fourth display chip 400 is connected to the negative electrode independent metal sheet 24 corresponding to the pin 5.
  • the plurality of metal sheets have an axisymmetric structure with respect to the central axis direction parallel to the second direction.
  • the base 10 has a front surface that accommodates a plurality of display chips and a back surface opposite to the front surface, and the ends of the plurality of metal sheets 20 extend to the back surface.
  • the above structure makes the position of the connection with the PCB board more flexible, thereby making the installation easier.
  • the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400 are respectively Installed in the four mounting holes 13, part of the first negative electrode common metal sheet 22, part of the second negative electrode common metal sheet 23, part of the negative electrode independent metal sheet 24 and part of the positive electrode common metal sheet 21 are located in the range of the mounting hole 13.
  • the display chip is mounted in the mounting hole 13, and the display chip is connected with a plurality of metal sheets 20 in the mounting hole.
  • the display chip is soldered inside the mounting hole 13, and the above-mentioned mounting hole 13 forms a light cup, which can make the light more concentrated and improve the display effect.
  • a cross-shaped groove 14 is provided on the front surface of the base 10, and the cross-shaped groove 14 separates the four mounting holes 13 from each other.
  • a negative common metal sheet 22, a second negative common metal sheet 23, and a positive common metal sheet 21 are arranged crosswise.
  • the cross-shaped groove 14 separates the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400 to avoid the mutual influence of light.
  • the cross-shaped groove 14 can play a role in draining water and reducing weight. And it effectively increases the heat dissipation area between the display chips.
  • the material of the base 10 is plastic.
  • the plastic can avoid light penetration, thereby improving the display effect of the LED chip, and the plastic is convenient for injection molding.
  • the metal bracket has good heat dissipation, and the metal bracket is provided with a light cup, which can improve the brightness of the finished product.
  • the present application also provides a display assembly.
  • an embodiment of the display assembly according to the present application includes a display support and a display chip arranged on the display support, and the display support is the above-mentioned display support. Since the above-mentioned display bracket has a simple structure and is easy to process, the display assembly with the display bracket also has this advantage.
  • the present application also provides a manufacturing method of a display stand. As shown in FIG. 7, the embodiment of the manufacturing method according to the present application is used to manufacture the above-mentioned display stand.
  • the manufacturing method includes the following steps:
  • Step S10 Making a base body, specifically a part of the base body, the structure of this part corresponds to the structure under the metal sheet shown in FIG. 1;
  • Step S20 placing the metal sheet 20 in the base body
  • Step S30 Pouring plastic, and the metal sheet 20 is injection molded into the base body to form a complete base body;
  • Step S40 the extension of the metal sheet 20 forms a pin, and the pin is pressed onto the base body.
  • a display stand is produced.
  • the use of a mold to inject the metal sheet into the base body makes the structure of the display bracket more stable and reliable.
  • the extension of the metal sheet 20 forms a pin to make the structure simpler.
  • the present application also provides a manufacturing method of a display component. As shown in FIG. 8, the embodiment of the manufacturing method according to the present application is used to manufacture the above-mentioned display component.
  • the manufacturing method includes the following steps:
  • Making the display bracket includes first making a base body, then placing the metal sheet 20 in the base body blank, pouring plastic, and then injecting the metal sheet 20 into the base body blank.
  • the extension of the metal sheet 20 forms a pin, and finally Press the pin 201 onto the base body;
  • the first display chip 100 and the second display chip 200 are installed inside the mounting hole 13, and the first display chip 100 is connected to the first negative electrode common metal sheet 22 through the first connection portion, and the second display chip is connected to the second display chip through the second connection portion.
  • the chip 200 shares the metal sheet 22 with the first negative electrode;
  • a display assembly is produced.
  • the use of a mold to inject the metal sheet into the base body makes the structure of the display bracket more stable and reliable.
  • the extension of the metal sheet 20 forms a pin to make the structure of the display assembly simpler.
  • the use of epoxy resin glue or silicone glue can effectively fix the display chip, and can make the light of the display chip not easy to diverge, and the light-gathering effect is good.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A display support, a display assembly, and a method for manufacturing the display support. The display support is used for accommodating multiple display chips, and each display chip comprises a first chip unit (U1) and a second chip unit (U2). The display support comprises a base body (10) and multiple metal sheets (20) disposed on the base body (10), wherein the multiple metal sheets (20) comprise positive electrode shared metal sheets (21) and first negative electrode shared metal sheets (22), all positive electrodes of at least two display chips are connected to the positive electrode shared metal sheets (21), and negative electrodes of two first chip units (U1) of two adjacent display chips are connected to the first negative electrode shared metal sheets (22). The problem of complex processing caused by a large number of pads required for welding four groups of RGB-LED chips in the related art is effectively solved.

Description

显示支架、显示组件以及显示支架的制作方法Display bracket, display assembly and manufacturing method of display bracket 技术领域Technical field
本发明涉及显示领域，具体而言，涉及一种显示支架、显示组件以及显示支架的制作方法。The present invention relates to the field of display, in particular to a display stand, a display assembly and a manufacturing method of the display stand.
背景技术Background technique
目前，LED显示屏技术越来越成熟。并且由于LED显示屏安装方便，可重复使用以及显示效果好等优点，被消费者所喜爱，进而逐渐被应用于各种场合，例如室内外展示等。At present, LED display technology is becoming more and more mature. And because of the advantages of easy installation, reusability, and good display effect, LED display screens are loved by consumers, and are gradually used in various occasions, such as indoor and outdoor displays.
在相关技术中，以RGB-LED芯片为例，一组RGB-LED芯片包括：1个红色芯片、1个绿色芯片、以及1个蓝色芯片。一组RGB-LED芯片中，红色芯片的正极、绿色芯片的正极以及蓝色芯片的正极共同连接至一个管脚。红色芯片的负极、绿色芯片的负极、以及蓝色芯片的负极分别连接至一个管脚。一组RGB-LED芯片构成一个灯点，因此一个灯点包括四个管脚。当一个灯点焊接至PCB板上时，PCB板上需有四个焊盘与之对应。当多个RGB-LED芯片焊接至PCB板上时，PCB板上需有4N个焊盘与之对应(N取整数)。In the related art, taking RGB-LED chips as an example, a group of RGB-LED chips includes: 1 red chip, 1 green chip, and 1 blue chip. In a group of RGB-LED chips, the positive pole of the red chip, the positive pole of the green chip, and the positive pole of the blue chip are commonly connected to one pin. The negative pole of the red chip, the negative pole of the green chip, and the negative pole of the blue chip are respectively connected to one pin. A group of RGB-LED chips constitutes a lamp point, so a lamp point includes four pins. When a light spot is soldered to the PCB board, there must be four pads corresponding to it on the PCB board. When multiple RGB-LED chips are soldered to the PCB board, 4N pads are required on the PCB board to correspond to them (N takes an integer).
根据上述分析可知，现有技术中的显示芯片在焊接至PCB板上时，焊接点较多，导致加工复杂。According to the above analysis, when the display chip in the prior art is soldered to the PCB board, there are many soldering points, which leads to complicated processing.
发明内容Summary of the invention
本发明的主要目的在于提供一种显示支架、显示组件以及显示支架的制作方法，以解决相关技术中的显示芯片连接时所需要的焊盘较多，导致加工复杂的问题。The main purpose of the present invention is to provide a display bracket, a display assembly, and a manufacturing method of the display bracket, so as to solve the problem of complicated processing caused by the need for more pads when connecting the display chip in the related art.
为了实现上述目的，根据本发明的第一个方面，提供了一种显示支架，用于容纳多个显示芯片，每个显示芯片均包括第一芯片单元和第二芯片单元，显示支架包括：基体；多个金属片，设置在基体上，多个金属片包括正极共用金属片和第一负极共用金属片；其中，至少两个显示芯片的所有正极与正极共用金属片连接，相邻的两个显示芯片的两个第一芯片单元的负极与第一负极共用金属片连接。In order to achieve the above objective, according to the first aspect of the present invention, a display support is provided for accommodating a plurality of display chips, each display chip includes a first chip unit and a second chip unit, and the display support includes: a base body A plurality of metal sheets are arranged on the substrate, and the plurality of metal sheets include a positive electrode common metal sheet and a first negative electrode common metal sheet; wherein, all the positive electrodes of at least two display chips are connected with the positive electrode common metal sheet, and the adjacent two The negative electrodes of the two first chip units of the display chip are connected to the first negative electrode with a common metal sheet.
进一步地，显示芯片为四个，正极共用金属片为两个，四个显示芯片呈阵列排布，阵列排布包括相互垂直的第一方向和第二方向，在第一方向上，相邻的两个显示芯片的所有正极与一个正极共用金属片连接，在第二方向上，相邻的两个显示芯片的两个第一芯片单元的负极与第一负极共用金属片连接。Further, there are four display chips, two anode common metal sheets, and the four display chips are arranged in an array. The array arrangement includes a first direction and a second direction perpendicular to each other. In the first direction, adjacent All the positive electrodes of the two display chips are connected to a positive electrode common metal sheet, and in the second direction, the negative electrodes of the two first chip units of two adjacent display chips are connected to the first negative electrode common metal sheet.
进一步地，多个金属片还包括第二负极共用金属片，相邻的两个显示芯片的两个第二芯片单元的负极与第二负极共用金属片连接。Further, the plurality of metal sheets further includes a second negative electrode common metal sheet, and the negative electrodes of two second chip units of two adjacent display chips are connected to the second negative electrode common metal sheet.
进一步地，第二负极共用金属片包括第一段和第二段，第一段和第二段在第一方向上错位设置，第一段位于第一负极共用金属片的远离基体的中心的一侧，第二段与第一负极共用金属片对应设置。Further, the second negative common metal sheet includes a first section and a second section, the first and second sections are arranged in a staggered manner in the first direction, and the first section is located at a distance from the center of the first negative common metal sheet. On the side, the second section is arranged corresponding to the first negative electrode common metal sheet.
进一步地，每个显示芯片还包括第三芯片单元，第三芯片单元位于第一芯片单元和第二芯片单元之间，多个金属片还包括多个负极独立金属片，多个第三芯片单元和多个负极独立金属片一一对应地连接。Further, each display chip further includes a third chip unit, the third chip unit is located between the first chip unit and the second chip unit, the plurality of metal sheets also includes a plurality of negative electrode independent metal sheets, and a plurality of third chip units It is connected to a plurality of negative electrode independent metal pieces in a one-to-one correspondence.
进一步地，第一负极共用金属片远离基体的中心的侧面上设置有凹部。Further, a concave portion is provided on the side of the first negative electrode common metal sheet away from the center of the base body.
进一步地，基体包括第一侧壁和第二侧壁，第一侧壁和第二侧壁对应设置，多个金属片从基体延伸出并弯折设置于第一侧壁和第二侧壁上，多个金属片位于第一侧壁上和第二侧壁上的部分形成多个管脚。Further, the base body includes a first side wall and a second side wall, the first side wall and the second side wall are correspondingly arranged, and a plurality of metal sheets extend from the base body and are bent and arranged on the first side wall and the second side wall , The portions of the plurality of metal sheets located on the first side wall and the second side wall form a plurality of pins.
进一步地，基体具有容纳多个显示芯片的正面和与正面相对的背面，多个金属片的端部延伸至背面上。Further, the base body has a front surface accommodating a plurality of display chips and a back surface opposite to the front surface, and the ends of the plurality of metal sheets extend to the back surface.
进一步地，基体上设置有多个安装孔，每个显示芯片安装于一个安装孔内，部分第一负极共用金属片、部分第二负极共用金属片、部分负极独立金属片以及部分正极共用金属片位于安装孔的范围内。Further, a plurality of mounting holes are provided on the substrate, and each display chip is mounted in one mounting hole, part of the first negative electrode common metal sheet, part of the second negative electrode common metal sheet, part of the negative electrode independent metal sheet, and part of the positive electrode common metal sheet Located within the range of the mounting hole.
进一步地，基体的正面上设置有十字形凹槽，十字形凹槽将多个安装孔分隔开，十字形凹槽与第一负极共用金属片、第二负极共用金属片以及正极共用金属片交叉设置。Further, a cross-shaped groove is provided on the front surface of the substrate, and the cross-shaped groove separates a plurality of mounting holes. The cross-shaped groove is shared with the first negative electrode, the second negative electrode, and the positive electrode. Cross setting.
进一步地，基体的材质为塑胶，显示芯片包括LED芯片。Further, the material of the substrate is plastic, and the display chip includes an LED chip.
根据本发明的第二个方面，提供了一种显示组件，包括显示支架及设置在显示支架上的显示芯片，显示支架为上述的显示支架。According to a second aspect of the present invention, there is provided a display assembly including a display bracket and a display chip arranged on the display bracket, the display bracket being the above-mentioned display bracket.
根据本发明的第三个方面，提供了一种显示支架的制作方法，制作方法用于制作上述的显示支架，制作方法包括以下步骤：步骤S10：制作基体坯体；步骤S20：将金属片放置于基体坯体中；步骤S30：灌入塑胶，金属片注塑于基体坯体中；步骤S40：金属片的延长段形成管脚，将管脚压合于基体坯体上。According to a third aspect of the present invention, there is provided a method for manufacturing a display stand. The manufacturing method is used for manufacturing the above-mentioned display stand. The manufacturing method includes the following steps: step S10: manufacturing a base body; step S20: placing a metal sheet In the base body; step S30: pour plastic, and the metal sheet is injection molded into the base body; step S40: the extension of the metal sheet is formed into a pin, and the pin is pressed onto the base body.
根据本发明的第四个方面，提供了一种显示组件的制作方法，制作方法用于制作上述的显示组件，制作方法包括以下步骤：制作显示支架，包括先制作基体坯体，再将金属片放置于基体坯体中，灌入塑胶，然后将金属片注塑于基体坯体中，金属片的延长段形成管脚，最后将管脚压合于基体坯体上；将第一显示芯片和第二显示芯片安装于安装孔的内部，并通过第一连接部连接第一显示芯片与第一负极共用金属片，通过第二连接部连接第二显示芯片与第一负极共用金属片；在安装有显示芯片的安装孔中填充环氧树脂胶水或硅胶胶水；对环氧树脂胶水或硅胶胶水进行抽真空处理；放入烤箱进行胶水固化。According to a fourth aspect of the present invention, there is provided a manufacturing method of a display assembly. The manufacturing method is used to manufacture the above-mentioned display assembly. The manufacturing method includes the following steps: Place it in the base body, pour plastic into it, and then inject the metal sheet into the base body. The extension of the metal sheet forms a pin. Finally, the pin is pressed onto the base body; the first display chip and the second display chip are pressed together. The second display chip is installed inside the mounting hole, and the first display chip and the first negative electrode common metal sheet are connected through the first connection part, and the second display chip and the first negative electrode common metal sheet are connected through the second connection part; Fill the mounting hole of the display chip with epoxy resin glue or silicone glue; vacuumize the epoxy glue or silicone glue; put it into the oven to cure the glue.
应用本发明的技术方案，显示支架上容纳有多个显示芯片，每个显示芯片包括第一芯片单元和第二芯片单元。显示支架包括基体和设置在基体上的多个金属片，多个金属片包括正 极共用金属片和第一负极共用金属片。至少两个显示芯片的所有正极与正极共用金属片连接，相邻的两个显示芯片的两个第一芯片单元的负极与第一负极共用金属片连接，通过上述正极共用金属片和第一负极共用金属片，有效地将显示芯片的正极和负极在引出至显示支架的基体外之前进行合并，这样能够减少金属片的数量，进而减少焊接点的数量，降低了加工的复杂程度。因此本申请的技术方案有效地解决相关技术中的显示芯片连接时所需要的焊盘较多，导致加工复杂的问题。Applying the technical solution of the present invention, a plurality of display chips are accommodated on the display bracket, and each display chip includes a first chip unit and a second chip unit. The display support includes a base body and a plurality of metal sheets arranged on the base body, and the plurality of metal sheets include a positive electrode common metal sheet and a first negative electrode common metal sheet. All the positive electrodes of at least two display chips are connected with the positive electrode common metal sheet, and the negative electrodes of the two first chip units of the adjacent two display chips are connected with the first negative electrode common metal sheet, through the above-mentioned positive electrode common metal sheet and the first negative electrode The common metal sheet effectively merges the positive and negative electrodes of the display chip before being led out of the base body of the display support, which can reduce the number of metal sheets, thereby reducing the number of solder joints, and reducing the complexity of processing. Therefore, the technical solution of the present application effectively solves the problem that the display chip in the related art requires more pads when connecting, which leads to complicated processing.
附图说明Description of the drawings
构成本申请的一部分的说明书附图用来提供对本发明的进一步理解，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：The drawings of the specification constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and the description thereof are used to explain the present invention, and do not constitute an improper limitation of the present invention. In the attached picture:
图1示出了根据本发明的显示支架的实施例的立体结构示意图；Fig. 1 shows a three-dimensional structural diagram of an embodiment of a display stand according to the present invention;
图2示出了图1的显示支架的俯视示意图；FIG. 2 shows a schematic top view of the display bracket of FIG. 1;
图3示出了图1的显示支架的仰视示意图；Fig. 3 shows a schematic bottom view of the display stand of Fig. 1;
图4示出了图1的显示支架的金属片的布置位置示意图；Fig. 4 shows a schematic diagram of the arrangement position of the metal sheet of the display bracket of Fig. 1;
图5示出了图1的显示支架的透视示意图；FIG. 5 shows a perspective schematic diagram of the display bracket of FIG. 1;
图6示出了图1的显示支架的装配示意图；Fig. 6 shows an assembly schematic diagram of the display bracket of Fig. 1;
图7示出了图1的显示支架的制造方法的实施例的流程示意图；以及FIG. 7 shows a schematic flow chart of the embodiment of the manufacturing method of the display bracket of FIG. 1; and
图8示出了显示组件的制造方法的实施例的流程示意图。FIG. 8 shows a schematic flowchart of an embodiment of a method for manufacturing a display assembly.
其中，上述附图包括以下附图标记：Among them, the above drawings include the following reference signs:
100、第一显示芯片；200、第二显示芯片；300、第三显示芯片；400、第四显示芯片；10、基体；11、第一侧壁；12、第二侧壁；13、安装孔；14、十字形凹槽；20、金属片；201、管脚；21、正极共用金属片；22、第一负极共用金属片；221、凹部；23、第二负极共用金属片；231、第一段；232、第二段；24、负极独立金属片；U1、第一芯片单元；U2、第二芯片单元；U3、第三芯片单元。100. The first display chip; 200. The second display chip; 300. The third display chip; 400. The fourth display chip; 10. The base body; 11. The first side wall; 12. The second side wall; 13. Mounting hole 14. Cross-shaped groove; 20, metal sheet; 201, pin; 21, positive electrode common metal sheet; 22, first negative electrode common metal sheet; 221, recess; 23, second negative electrode common metal sheet; 231, first One section; 232, the second section; 24, the negative electrode independent metal sheet; U1, the first chip unit; U2, the second chip unit; U3, the third chip unit.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.
如图1至图5所示，在本实施例中，显示支架用于容纳多个显示芯片，每个显示芯片均包括第一芯片单元U1和第二芯片单元U2，显示支架包括：基体10和多个金属片20。多个金 属片20设置在基体10上，多个金属片20包括正极共用金属片21和第一负极共用金属片22；其中，至少两个显示芯片的所有正极与正极共用金属片21连接，相邻的两个显示芯片的两个第一芯片单元U1的负极与第一负极共用金属片22连接。As shown in FIGS. 1 to 5, in this embodiment, the display bracket is used to accommodate a plurality of display chips, and each display chip includes a first chip unit U1 and a second chip unit U2, and the display bracket includes: a base 10 and Multiple metal sheets 20. A plurality of metal sheets 20 are arranged on the substrate 10, and the plurality of metal sheets 20 include a positive electrode common metal sheet 21 and a first negative electrode common metal sheet 22; wherein, all the positive electrodes of at least two display chips are connected to the positive electrode common metal sheet 21, The negative electrodes of the two first chip units U1 of the two adjacent display chips are connected to the first negative common metal sheet 22.
在本实施例中，显示支架用于容纳四个显示芯片，分别为第一显示芯片100、第二显示芯片200、第三显示芯片300以及第四显示芯片400，上述的显示芯片均为LED芯片，除了包括第一芯片单元U1和第二芯片单元U2以外，还包括第三芯片单元U3。作为一种优选实施方式，第一芯片单元U1、第三芯片单元U3以及第二芯片单元U2分别对应于RGB。正极共用金属片21为两个，第一负极共用金属片22也为两个。In this embodiment, the display bracket is used for accommodating four display chips, which are the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400. The above-mentioned display chips are all LED chips. In addition to the first chip unit U1 and the second chip unit U2, it also includes a third chip unit U3. As a preferred embodiment, the first chip unit U1, the third chip unit U3, and the second chip unit U2 respectively correspond to RGB. There are two positive electrode common metal sheets 21, and there are also two first negative electrode common metal sheets 22.
应用本实施例的技术方案，其中第一显示芯片100的所有正极(也即第一芯片单元U1的正极、第二芯片单元U2的正极以及第三芯片单元U3的正极)和第三显示芯片300的所有正极均与其中一个正极共用金属片21连接。第二显示芯片200的所有正极和第四显示芯片400的所有正极均与另一个正极共用金属片21连接。第一显示芯片100的第一芯片单元U1的负极和第二显示芯片200的第一芯片单元U1的负极与其中一个第一负极共用金属片22连接。第三显示芯片300的第一芯片单元U1的负极和第四显示芯片400的第一芯片单元U1的负极与另一个第一负极共用金属片22连接。通过上述正极共用金属片21和第一负极共用金属片22，有效地将显示芯片的正极和负极在引出至显示支架的基体10外之前合并，这样能够减少金属片的数量，进而减少了焊接点的数量，降低了加工的复杂程度。因此本实施例的技术方案有效地解决相关技术中的显示芯片连接时所需要的焊盘较多，导致加工复杂的问题。Applying the technical solution of this embodiment, all the positive poles of the first display chip 100 (that is, the positive pole of the first chip unit U1, the positive pole of the second chip unit U2, and the positive pole of the third chip unit U3) and the third display chip 300 All of the positive electrodes are connected to one of the positive electrode common metal sheets 21. All the positive electrodes of the second display chip 200 and all the positive electrodes of the fourth display chip 400 are connected to the other positive electrode common metal sheet 21. The negative electrode of the first chip unit U1 of the first display chip 100 and the negative electrode of the first chip unit U1 of the second display chip 200 are connected to one of the first negative electrode common metal sheets 22. The negative electrode of the first chip unit U1 of the third display chip 300 and the negative electrode of the first chip unit U1 of the fourth display chip 400 are connected to another first negative electrode common metal sheet 22. Through the above-mentioned positive electrode common metal sheet 21 and the first negative electrode common metal sheet 22, the positive electrode and the negative electrode of the display chip are effectively combined before being led out of the base 10 of the display support, which can reduce the number of metal sheets, thereby reducing the welding points. The quantity reduces the complexity of processing. Therefore, the technical solution of the present embodiment effectively solves the problem that the display chip in the related art requires more pads when connecting, which leads to complicated processing.
金属片20又称金属电极，可以为铜或铁，金属片20的厚度在0.1毫米至0.5毫米之间，金属片20上镀金或者镀银，以提高金属片的导电性能。The metal sheet 20 is also called a metal electrode, which can be copper or iron. The thickness of the metal sheet 20 is between 0.1 mm and 0.5 mm. The metal sheet 20 is plated with gold or silver to improve the conductivity of the metal sheet.
如图5和图6所示，在本实施例中，四个显示芯片呈阵列排布，阵列排布的方向包括相互垂直的第一方向和第二方向，在第一方向上，相邻的两个显示芯片(也即第一显示芯片100和第三显示芯片300，或者第二显示芯片200和第四显示芯片400)的所有正极与一个正极共用金属片21连接，在第二方向上，相邻的两个显示芯片(也即第一显示芯片100和第二显示芯片200，或者第三显示芯片300和第四显示芯片400)的两个第一芯片单元U1的负极与第一负极共用金属片22连接。在第一方向和第二方向上分别排布正极共用金属片21和第一负极共用金属片22使得显示支架上的空间得到充分的利用，并且正极共用金属片21和第一负极共用金属片22不会发生重叠，使得布局更加合理。在图5中，第二芯片单元U2的正极和负极以及第三芯片单元U3的正极和负极均可以通过电极引线与金属片连接，电极引线为金线或者铜线。第一芯片单元U1的正极通过电极引线与金属片连接，电极引线为金线或者铜线。第一芯片单元U1的负极可以通过焊点与金属片连接。As shown in FIG. 5 and FIG. 6, in this embodiment, the four display chips are arranged in an array, and the direction of the array arrangement includes a first direction and a second direction perpendicular to each other. In the first direction, adjacent All the positive electrodes of the two display chips (that is, the first display chip 100 and the third display chip 300, or the second display chip 200 and the fourth display chip 400) are connected to a positive electrode common metal sheet 21, in the second direction, The negative poles of the two first chip units U1 of two adjacent display chips (that is, the first display chip 100 and the second display chip 200, or the third display chip 300 and the fourth display chip 400) are shared with the first negative electrode The metal sheets 22 are connected. The positive electrode common metal sheet 21 and the first negative electrode common metal sheet 22 are respectively arranged in the first direction and the second direction to make full use of the space on the display stand, and the positive electrode common metal sheet 21 and the first negative electrode common metal sheet 22 No overlap occurs, making the layout more reasonable. In FIG. 5, the positive and negative electrodes of the second chip unit U2 and the positive and negative electrodes of the third chip unit U3 can both be connected to the metal sheet through electrode leads, and the electrode leads are gold wires or copper wires. The anode of the first chip unit U1 is connected to the metal sheet through an electrode lead, and the electrode lead is a gold wire or a copper wire. The negative electrode of the first chip unit U1 may be connected to the metal sheet through a solder joint.
当然，作为本领域技术人员可以知道，本实施例的排布方式属于优先的实施方式，实际设计时也可以将正极共用金属片和第一负极共用金属片布置在同一方向上。同时，还可以只设置一个正极共用金属片，此时将第一显示芯片、第二显示芯片、第三显示芯片以及第四显示芯片的正极均与该正极共用金属片连接。Of course, as those skilled in the art may know, the arrangement of this embodiment is a preferred embodiment, and the positive electrode common metal sheet and the first negative electrode common metal sheet can also be arranged in the same direction during actual design. At the same time, only one anode common metal sheet may be provided, and at this time, the anodes of the first display chip, the second display chip, the third display chip, and the fourth display chip are all connected to the anode common metal sheet.
如图4所示，在本实施例中，多个金属片20还包括第二负极共用金属片23，相邻的两个显示芯片(也即第一显示芯片100和第二显示芯片200，或者第三显示芯片300和第四显示芯片400)的两个第二芯片单元U2的负极与第二负极共用金属片23连接。通过第二负极共用金属片23进一步地减少了金属片20的数量，使得产品的结构更加简单，并使得金属片具有更大的布置空间。在本实施例中，第二负极共用金属片23为两个，相邻的两个显示芯片(也即第一显示芯片100和第二显示芯片200)中的两个第二芯片单元U2的负极与两个第二负极共用金属片23中的一个连接，另外两个相邻的显示芯片(即第三显示芯片300和第四显示芯片400)中的两个第二芯片单元U2的负极与两个中的另一个第二负极共用金属片23连接。As shown in FIG. 4, in this embodiment, the plurality of metal sheets 20 further include a second negative electrode common metal sheet 23, and two adjacent display chips (that is, the first display chip 100 and the second display chip 200, or The negative electrodes of the two second chip units U2 of the third display chip 300 and the fourth display chip 400) are connected to the second negative electrode common metal sheet 23. The second negative electrode common metal sheet 23 further reduces the number of metal sheets 20, which makes the structure of the product simpler and allows the metal sheets to have a larger layout space. In this embodiment, there are two second negative electrode common metal sheets 23, and the negative electrodes of two second chip units U2 in two adjacent display chips (that is, the first display chip 100 and the second display chip 200) It is connected to one of the two second negative electrode common metal sheets 23, and the negative electrodes of the two second chip units U2 in the other two adjacent display chips (that is, the third display chip 300 and the fourth display chip 400) are connected to two The other one of the second negative electrodes is connected to the common metal sheet 23.
如图4所示，在本实施例中，第二负极共用金属片23包括第一段231和第二段232，第一段231和第二段232在第一方向上错位设置，第一段231位于第一负极共用金属片22的远离基体10的中心的一侧，第二段232与第一负极共用金属片22对应设置。第一段和第二段232在第一方向上错位设置使得金属片20的布置位置具有更多的选择，进而使得金属片的布置位置更加合理。As shown in FIG. 4, in this embodiment, the second negative electrode common metal sheet 23 includes a first section 231 and a second section 232. The first section 231 and the second section 232 are staggered in the first direction, and the first section 231 is located on a side of the first negative common metal sheet 22 away from the center of the base 10, and the second section 232 is provided corresponding to the first negative common metal sheet 22. The dislocation of the first section and the second section 232 in the first direction allows more options for the arrangement position of the metal sheet 20, which in turn makes the arrangement position of the metal sheet more reasonable.
如图4所示，在本实施例中，每个显示芯片还包括第三芯片单元U3，第三芯片单元U3位于第一芯片单元U1和第二芯片单元U2之间，多个金属片20还包括多个负极独立金属片24。每个第三芯片单元U3连接一个单独的负极独立金属片24。负极独立金属片24能够单独连接单个负极，使得金属片20的排布方式更加合理。在本实施例中，负极独立金属片24为四个，四个负极独立金属片24位于第一方向和第二方向上的两端。第一显示芯片100、第二显示芯片200、第三显示芯片300以及第四显示芯片400的第三芯片单元U3的负极与分别与临近的负极独立金属片24连接。上述的临近的具体含义是：对于第一显示芯片100、第二显示芯片200、第三显示芯片300以及第四显示芯片400中的一个显示芯片而言，选择距离它最近的负极独立金属片24。As shown in FIG. 4, in this embodiment, each display chip further includes a third chip unit U3. The third chip unit U3 is located between the first chip unit U1 and the second chip unit U2. A plurality of negative electrode independent metal sheets 24 are included. Each third chip unit U3 is connected to a separate negative electrode independent metal sheet 24. The negative electrode independent metal sheet 24 can be individually connected to a single negative electrode, so that the arrangement of the metal sheet 20 is more reasonable. In this embodiment, there are four negative electrode independent metal sheets 24, and the four negative electrode independent metal sheets 24 are located at both ends in the first direction and the second direction. The negative electrodes of the third chip unit U3 of the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400 are respectively connected to the adjacent negative electrode independent metal sheets 24. The specific meaning of the aforementioned proximity is: for one of the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400, the negative electrode independent metal sheet 24 closest to it is selected. .
当然，在不设置第二负极共用金属片的方案中，需要设置更多的负极独立金属片，可以使每个显示芯片的第二芯片单元与负极独立金属片连接。Of course, in the solution where the second negative electrode common metal sheet is not provided, more negative electrode independent metal sheets need to be provided, so that the second chip unit of each display chip can be connected to the negative electrode independent metal sheet.
在图中未示出的实施例中，作为可行方案，还可以设置第三负极共用金属片，第三负极共用金属片取代负极独立金属片，进一步将显示芯片的负极进行整合，能够进一步减少金属片的数量。使得金属片的布置方式更加灵活，结构更加简单。In an embodiment not shown in the figure, as a feasible solution, a third negative common metal sheet can also be provided. The third negative common metal sheet replaces the negative independent metal sheet, and further integrates the negative electrode of the display chip, which can further reduce the metal The number of slices. The arrangement of the metal sheets is more flexible and the structure is simpler.
如图4所示，在本实施例中，第一负极共用金属片22远离基体10的中心的侧面上设置有凹部221。凹部221使得第一负极共用金属片22和第二负极共用金属片23之间具有间隔，防止产生电流干扰。上述的凹部221设置在第一负极共用金属片22上。As shown in FIG. 4, in this embodiment, a recess 221 is provided on the side of the first negative electrode common metal sheet 22 away from the center of the base body 10. The concave portion 221 provides a space between the first negative electrode common metal sheet 22 and the second negative electrode common metal sheet 23 to prevent current interference. The above-mentioned concave portion 221 is provided on the first negative electrode common metal sheet 22.
如图2和图3所示，在本实施例中，基体10包括第一侧壁11和第二侧壁12，第一侧壁11和第二侧壁12对应设置，多个金属片20从基体10延伸出并弯折设置于第一侧壁11和第二侧壁12上，多个金属片20位于第一侧壁11上和第二侧壁12上的部分形成多个管脚。在本实施例中管脚一共有十个，分别是管脚1-10，管脚位于基体10的第一侧壁11和第二侧壁12上，并均匀排布。管脚的设置便于显示支架连接PCB板，并且便于安装。管脚1、管脚5、管 脚6以及管脚10分别为四个负极独立金属片24的一部分，管脚2和管脚4分别为两个第二负极共用金属片23的一部分，管脚3和管脚8分别为两个正极共用金属片21的一部分，管脚7和管脚9分别为两个第一负极共用金属片22的一部分。As shown in Figures 2 and 3, in this embodiment, the base 10 includes a first side wall 11 and a second side wall 12, the first side wall 11 and the second side wall 12 are arranged correspondingly, and a plurality of metal sheets 20 are formed from The base body 10 extends and is bent and arranged on the first side wall 11 and the second side wall 12. The portions of the plurality of metal sheets 20 on the first side wall 11 and the second side wall 12 form a plurality of pins. In this embodiment, there are a total of ten pins, namely pins 1-10. The pins are located on the first side wall 11 and the second side wall 12 of the base body 10 and are evenly arranged. The setting of the pins is convenient for the display bracket to connect to the PCB board, and it is easy to install. Pin 1, pin 5, pin 6, and pin 10 are respectively part of four negative electrode independent metal sheets 24, and pin 2 and pin 4 are parts of two second negative electrode common metal sheets 23, respectively. Pin 3 and pin 8 are respectively a part of two anode common metal sheets 21, and pin 7 and pin 9 are respectively a part of two first anode common metal sheets 22.
在本实施例中，第一显示芯片100的第一芯片单元U1和第二显示芯片200的第一芯片单元U1与管脚7对应的第一负极共用金属片22连接，第一显示芯片100的第二芯片单元U2和第二显示芯片200的第二芯片单元U2与管脚2对应的第二负极共用金属片23连接。第一显示芯片100的第三芯片单元U3与管脚6对应的负极独立金属片24连接，第二显示芯片200的第三芯片单元U3与管脚1对应的负极独立金属片24连接。第一显示芯片100和第三显示芯片300的所有正极均与管脚8对应的正极共用金属片21连接。第二显示芯片200和第四显示芯片400的所有正极均与管脚3对应的正极共用金属片21连接。第三显示芯片300的第一芯片单元U1和第四显示芯片400的第一芯片单元U1与管脚9对应的第一负极共用金属片22连接，第三显示芯片300的第二芯片单元U2和第四显示芯片400的第二芯片单元U2与管脚4对应的第二负极共用金属片23连接。第三显示芯片300的第三芯片单元U3与管脚10对应的负极独立金属片24连接，第四显示芯片400的第三芯片单元U3与管脚5对应的负极独立金属片24连接。In this embodiment, the first chip unit U1 of the first display chip 100 and the first chip unit U1 of the second display chip 200 are connected to the first negative common metal sheet 22 corresponding to pin 7, and the first display chip 100 The second chip unit U2 and the second chip unit U2 of the second display chip 200 are connected to the second negative common metal sheet 23 corresponding to the pin 2. The third chip unit U3 of the first display chip 100 is connected to the negative electrode independent metal sheet 24 corresponding to pin 6, and the third chip unit U3 of the second display chip 200 is connected to the negative electrode independent metal sheet 24 corresponding to pin 1. All the anodes of the first display chip 100 and the third display chip 300 are connected to the anode common metal sheet 21 corresponding to the pin 8. All the anodes of the second display chip 200 and the fourth display chip 400 are connected to the anode common metal sheet 21 corresponding to the pin 3. The first chip unit U1 of the third display chip 300 and the first chip unit U1 of the fourth display chip 400 are connected to the first negative common metal sheet 22 corresponding to pin 9, and the second chip unit U2 of the third display chip 300 is connected to The second chip unit U2 of the fourth display chip 400 is connected to the second negative common metal sheet 23 corresponding to the pin 4. The third chip unit U3 of the third display chip 300 is connected to the negative electrode independent metal sheet 24 corresponding to the pin 10, and the third chip unit U3 of the fourth display chip 400 is connected to the negative electrode independent metal sheet 24 corresponding to the pin 5.
在本实施例中，多个金属片在相对于平行于第二方向的中心轴线方向上呈轴对称结构。In this embodiment, the plurality of metal sheets have an axisymmetric structure with respect to the central axis direction parallel to the second direction.
如图1至图3所示，在本实施例中，基体10具有容纳多个显示芯片的正面和与正面相对的背面，多个金属片20的端部延伸至背面上。通过上述结构使得与PCB板连接的位置更灵活，进而使得安装更加容易。As shown in FIGS. 1 to 3, in this embodiment, the base 10 has a front surface that accommodates a plurality of display chips and a back surface opposite to the front surface, and the ends of the plurality of metal sheets 20 extend to the back surface. The above structure makes the position of the connection with the PCB board more flexible, thereby making the installation easier.
如图2和图3所示，在本实施例中，基体10上设置有四个安装孔13，第一显示芯片100、第二显示芯片200、第三显示芯片300以及第四显示芯片400分别安装于四个安装孔13内，部分第一负极共用金属片22、部分第二负极共用金属片23、部分负极独立金属片24以及部分正极共用金属片21位于安装孔13的范围内。显示芯片安装到安装孔13内，显示芯片在安装孔内与多个金属片20进行连接。将显示芯片焊接在安装孔13内部，上述的安装孔13形成光杯，能够使光线更加集中，提高显示效果。As shown in FIGS. 2 and 3, in this embodiment, four mounting holes 13 are provided on the base 10, and the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400 are respectively Installed in the four mounting holes 13, part of the first negative electrode common metal sheet 22, part of the second negative electrode common metal sheet 23, part of the negative electrode independent metal sheet 24 and part of the positive electrode common metal sheet 21 are located in the range of the mounting hole 13. The display chip is mounted in the mounting hole 13, and the display chip is connected with a plurality of metal sheets 20 in the mounting hole. The display chip is soldered inside the mounting hole 13, and the above-mentioned mounting hole 13 forms a light cup, which can make the light more concentrated and improve the display effect.
如图1和图2所示，在本实施例中，基体10的正面上设置有十字形凹槽14，十字形凹槽14将四个安装孔13分隔开，十字形凹槽14与第一负极共用金属片22、第二负极共用金属片23以及正极共用金属片21交叉设置。十字形凹槽14将第一显示芯片100、第二显示芯片200、第三显示芯片300以及第四显示芯片400间隔开，避免光线互相影响。同时，十字形凹槽14能够起到排水和减重的作用。并且有效地增大了显示芯片之间的散热面积。As shown in Figures 1 and 2, in this embodiment, a cross-shaped groove 14 is provided on the front surface of the base 10, and the cross-shaped groove 14 separates the four mounting holes 13 from each other. A negative common metal sheet 22, a second negative common metal sheet 23, and a positive common metal sheet 21 are arranged crosswise. The cross-shaped groove 14 separates the first display chip 100, the second display chip 200, the third display chip 300, and the fourth display chip 400 to avoid the mutual influence of light. At the same time, the cross-shaped groove 14 can play a role in draining water and reducing weight. And it effectively increases the heat dissipation area between the display chips.
如图1和图5所示，在本实施例中，基体10的材质为塑胶。塑胶能够避免光穿透，进而提高了LED芯片的显示效果，同时塑胶便于注塑成型。As shown in FIGS. 1 and 5, in this embodiment, the material of the base 10 is plastic. The plastic can avoid light penetration, thereby improving the display effect of the LED chip, and the plastic is convenient for injection molding.
在本实施例中，焊接四组RGB-LED芯片仅需要10个焊盘；金属支架散热好，并且金属支架上设置有光杯，光杯可提高成品亮度。In this embodiment, only 10 soldering pads are required for soldering four groups of RGB-LED chips; the metal bracket has good heat dissipation, and the metal bracket is provided with a light cup, which can improve the brightness of the finished product.
本申请还提供了一种显示组件，如图6所示，根据本申请的显示组件的实施例包括显示支架及设置在显示支架上的显示芯片，显示支架为上述的显示支架。由于上述的显示支架的结构简单，加工容易，因此具有该显示支架的显示组件也具有该优点。The present application also provides a display assembly. As shown in FIG. 6, an embodiment of the display assembly according to the present application includes a display support and a display chip arranged on the display support, and the display support is the above-mentioned display support. Since the above-mentioned display bracket has a simple structure and is easy to process, the display assembly with the display bracket also has this advantage.
本申请还提供了一种显示支架的制作方法，如图7所示，根据本申请的制作方法的实施例用于制作上述的显示支架，制作方法包括以下步骤：The present application also provides a manufacturing method of a display stand. As shown in FIG. 7, the embodiment of the manufacturing method according to the present application is used to manufacture the above-mentioned display stand. The manufacturing method includes the following steps:
步骤S10：制作基体坯体，具体为基体的部分，该部分结构对应于图1中示出的金属片下方的结构；Step S10: Making a base body, specifically a part of the base body, the structure of this part corresponds to the structure under the metal sheet shown in FIG. 1;
步骤S20：将金属片20放置于基体坯体中；Step S20: placing the metal sheet 20 in the base body;
步骤S30：灌入塑胶，金属片20注塑于基体坯体中，形成完整的基体；Step S30: Pouring plastic, and the metal sheet 20 is injection molded into the base body to form a complete base body;
步骤S40：金属片20的延长段形成管脚，将管脚压合于基体坯体上。Step S40: the extension of the metal sheet 20 forms a pin, and the pin is pressed onto the base body.
通过上述的步骤，制作出显示支架。利用模具将金属片注塑于基体坯体中，使得显示支架的结构更加稳定可靠，同时金属片20的延伸段形成管脚使得结构更加简单。Through the above-mentioned steps, a display stand is produced. The use of a mold to inject the metal sheet into the base body makes the structure of the display bracket more stable and reliable. At the same time, the extension of the metal sheet 20 forms a pin to make the structure simpler.
本申请还提供了一种显示组件的制作方法，如图8所示，根据本申请的制作方法的实施例用于制作上述的显示组件，制作方法包括以下步骤：The present application also provides a manufacturing method of a display component. As shown in FIG. 8, the embodiment of the manufacturing method according to the present application is used to manufacture the above-mentioned display component. The manufacturing method includes the following steps:
制作显示支架，包括先制作基体坯体，再将金属片20放置于基体坯体中，灌入塑胶，然后将金属片20注塑于基体坯体中，金属片20的延长段形成管脚，最后将管脚201压合于基体坯体上；Making the display bracket includes first making a base body, then placing the metal sheet 20 in the base body blank, pouring plastic, and then injecting the metal sheet 20 into the base body blank. The extension of the metal sheet 20 forms a pin, and finally Press the pin 201 onto the base body;
将第一显示芯片100和第二显示芯片200安装于安装孔13的内部，并通过第一连接部连接第一显示芯片100与第一负极共用金属片22，通过第二连接部连接第二显示芯片200与第一负极共用金属片22；The first display chip 100 and the second display chip 200 are installed inside the mounting hole 13, and the first display chip 100 is connected to the first negative electrode common metal sheet 22 through the first connection portion, and the second display chip is connected to the second display chip through the second connection portion. The chip 200 shares the metal sheet 22 with the first negative electrode;
在安装有显示芯片的安装孔13中填充环氧树脂胶水或硅胶胶水；Fill the mounting hole 13 where the display chip is mounted with epoxy glue or silicone glue;
对环氧树脂胶水或硅胶胶水进行抽真空处理；Vacuum the epoxy glue or silicone glue;
放入烤箱进行胶水固化。Put it in the oven to cure the glue.
通过上述的步骤，制作出显示组件。利用模具将金属片注塑于基体坯体中，使得显示支架的结构更加稳定可靠，同时金属片20的延伸段形成管脚使得显示组件的结构更加简单。并且利用环氧树脂胶水或硅胶胶水能够有效地固定显示芯片，并能够使得显示芯片的光线不易发散，聚光效果好。Through the above steps, a display assembly is produced. The use of a mold to inject the metal sheet into the base body makes the structure of the display bracket more stable and reliable. At the same time, the extension of the metal sheet 20 forms a pin to make the structure of the display assembly simpler. And the use of epoxy resin glue or silicone glue can effectively fix the display chip, and can make the light of the display chip not easy to diverge, and the light-gathering effect is good.
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (13)

  1. 一种显示支架，用于容纳多个显示芯片，每个所述显示芯片均包括第一芯片单元(U1)和第二芯片单元(U2)，其特征在于，所述显示支架包括：A display bracket for accommodating a plurality of display chips, each of the display chips includes a first chip unit (U1) and a second chip unit (U2), characterized in that the display bracket includes:
    基体(10)；Base body (10);
    多个金属片(20)，设置在所述基体(10)上，多个所述金属片(20)包括正极共用金属片(21)和第一负极共用金属片(22)；A plurality of metal sheets (20) are arranged on the substrate (10), and the plurality of metal sheets (20) include a positive electrode common metal sheet (21) and a first negative electrode common metal sheet (22);
    其中，至少两个所述显示芯片的所有正极与所述正极共用金属片(21)连接，相邻的两个所述显示芯片的两个所述第一芯片单元(U1)的负极与所述第一负极共用金属片(22)连接。Wherein, all the positive electrodes of at least two of the display chips are connected with the positive electrode common metal sheet (21), and the negative electrodes of the two first chip units (U1) of the two adjacent display chips are connected to the The first negative electrode common metal piece (22) is connected.
  2. 根据权利要求1所述的显示支架，其特征在于，所述显示芯片为四个，所述正极共用金属片(21)为两个，四个所述显示芯片呈阵列排布，所述阵列排布包括相互垂直的第一方向和第二方向，在所述第一方向上，相邻的两个所述显示芯片的所有正极与一个所述正极共用金属片(21)连接，在所述第二方向上，相邻的两个所述显示芯片的两个第一芯片单元(U1)的负极与所述第一负极共用金属片(22)连接。The display stand according to claim 1, wherein the number of display chips is four, the number of the anode common metal sheet (21) is two, and the four display chips are arranged in an array, and the array is arranged in an array. The cloth includes a first direction and a second direction perpendicular to each other. In the first direction, all positive electrodes of two adjacent display chips are connected to one positive electrode common metal sheet (21), and in the first direction, In the two directions, the negative electrodes of the two first chip units (U1) of the two adjacent display chips are connected to the first negative common metal sheet (22).
  3. 根据权利要求2所述的显示支架，其特征在于，多个所述金属片(20)还包括第二负极共用金属片(23)，相邻的两个所述显示芯片的两个所述第二芯片单元(U2)的负极与所述第二负极共用金属片(23)连接。The display bracket according to claim 2, wherein the plurality of metal sheets (20) further comprise a second negative electrode common metal sheet (23), and two of the two adjacent display chips The negative electrode of the two-chip unit (U2) is connected with the second negative electrode common metal sheet (23).
  4. 根据权利要求3所述的显示支架，其特征在于，所述第二负极共用金属片(23)包括第一段(231)和第二段(232)，所述第一段(231)和所述第二段(232)在所述第一方向上错位设置，所述第一段(231)位于所述第一负极共用金属片(22)的远离所述基体(10)的中心的一侧，所述第二段(232)与所述第一负极共用金属片(22)对应设置。The display stand according to claim 3, wherein the second negative common metal sheet (23) comprises a first section (231) and a second section (232), and the first section (231) and the second section (232) The second section (232) is staggered in the first direction, and the first section (231) is located on the side of the first negative common metal sheet (22) away from the center of the base body (10) , The second section (232) is arranged corresponding to the first negative electrode common metal sheet (22).
  5. 根据权利要求3所述的显示支架，其特征在于，每个所述显示芯片还包括第三芯片单元(U3)，所述第三芯片单元(U3)位于所述第一芯片单元(U1)和所述第二芯片单元(U2)之间，多个所述金属片(20)还包括多个负极独立金属片(24)，多个所述第三芯片单元(U3)和多个所述负极独立金属片(24)一一对应地连接。The display stand according to claim 3, wherein each of the display chips further comprises a third chip unit (U3), and the third chip unit (U3) is located in the first chip unit (U1) and Between the second chip units (U2), the plurality of metal sheets (20) further include a plurality of negative electrode independent metal sheets (24), a plurality of the third chip units (U3) and a plurality of the negative electrodes The independent metal sheets (24) are connected in a one-to-one correspondence.
  6. 根据权利要求1所述的显示支架，其特征在于，所述第一负极共用金属片(22)远离所述基体(10)的中心的侧面上设置有凹部(221)。The display stand according to claim 1, wherein a concave portion (221) is provided on the side of the first negative electrode common metal sheet (22) away from the center of the base body (10).
  7. 根据权利要求5所述的显示支架，其特征在于，所述基体(10)包括第一侧壁(11)和第二侧壁(12)，所述第一侧壁(11)和所述第二侧壁(12)对应设置，多个所述金属片(20)从所述基体(10)延伸出并弯折设置于所述第一侧壁(11)和所述第二侧壁(12)上，多个所述金属片(20)位于所述第一侧壁(11)上和所述第二侧壁(12)上的部分形成多个管脚(201)。The display stand according to claim 5, wherein the base body (10) comprises a first side wall (11) and a second side wall (12), and the first side wall (11) and the second side wall (12) The two side walls (12) are arranged correspondingly, and a plurality of the metal sheets (20) extend from the base body (10) and are bent and arranged on the first side wall (11) and the second side wall (12). ), the portions of the plurality of metal sheets (20) located on the first side wall (11) and the second side wall (12) form a plurality of pins (201).
  8. 根据权利要求5所述的显示支架，其特征在于，所述基体(10)具有容纳多个所述显示芯片的正面和与所述正面相对的背面，多个所述金属片(20)的端部延伸至所述背面上。The display stand according to claim 5, characterized in that, the base body (10) has a front surface that accommodates a plurality of the display chips and a back surface opposite to the front surface, and the ends of a plurality of the metal sheets (20) The part extends to the back surface.
  9. 根据权利要求5所述的显示支架，其特征在于，所述基体(10)上设置有多个安装孔(13)，每个所述显示芯片安装于一个所述安装孔(13)内，部分所述第一负极共用金属片(22)、部分所述第二负极共用金属片(23)、部分所述负极独立金属片(24)以及部分所述正极共用金属片(21)位于所述安装孔(13)的范围内。The display stand according to claim 5, characterized in that the base body (10) is provided with a plurality of mounting holes (13), each of the display chips is mounted in one of the mounting holes (13), part of The first negative electrode common metal sheet (22), part of the second negative electrode common metal sheet (23), part of the negative electrode independent metal sheet (24), and part of the positive electrode common metal sheet (21) are located in the installation Within the range of the hole (13).
  10. 根据权利要求9所述的显示支架，其特征在于，所述基体(10)的正面上设置有十字形凹槽(14)，所述十字形凹槽(14)将多个所述安装孔(13)分隔开，所述十字形凹槽(14)与所述第一负极共用金属片(22)、所述第二负极共用金属片(23)以及所述正极共用金属片(21)交叉设置。The display stand according to claim 9, characterized in that a cross-shaped groove (14) is provided on the front surface of the base body (10), and the cross-shaped groove (14) connects a plurality of the mounting holes ( 13) Separate, the cross-shaped groove (14) crosses the first negative electrode common metal sheet (22), the second negative electrode common metal sheet (23), and the positive electrode common metal sheet (21) set up.
  11. 根据权利要求1所述的显示支架，其特征在于，所述基体(10)的材质为塑胶，所述显示芯片为LED芯片。The display stand according to claim 1, wherein the material of the base body (10) is plastic, and the display chip is an LED chip.
  12. 一种显示组件，包括显示支架及设置在所述显示支架上的显示芯片，其特征在于，所述显示支架为权利要求1至11中任一项所述的显示支架。A display assembly, comprising a display bracket and a display chip arranged on the display bracket, wherein the display bracket is the display bracket according to any one of claims 1 to 11.
  13. 一种显示支架的制作方法，其特征在于，所述制作方法用于制作权利要求1至11中任一项所述的显示支架，所述制作方法包括以下步骤：A manufacturing method of a display stand, characterized in that the manufacturing method is used to manufacture the display stand according to any one of claims 1 to 11, and the manufacturing method comprises the following steps:
    步骤S10：制作基体坯体；Step S10: making a base body;
    步骤S20：将金属片(20)放置于所述基体坯体中；Step S20: placing the metal sheet (20) in the base body;
    步骤S30：灌入塑胶，所述金属片(20)注塑于基体坯体中；Step S30: Pouring plastic, and the metal sheet (20) is injection molded into the base body;
    步骤S40：所述金属片(20)的延长段形成管脚(201)，将所述管脚(201)压合于基体坯体上。Step S40: The extension of the metal sheet (20) forms a pin (201), and the pin (201) is pressed onto the base body.
PCT/CN2020/090339 2020-03-26 2020-05-14 Display support, display assembly, and method for manufacturing display support WO2021189618A1 (en)

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