CN208923183U - A kind of LED light source component and display screen - Google Patents
A kind of LED light source component and display screen Download PDFInfo
- Publication number
- CN208923183U CN208923183U CN201821775540.7U CN201821775540U CN208923183U CN 208923183 U CN208923183 U CN 208923183U CN 201821775540 U CN201821775540 U CN 201821775540U CN 208923183 U CN208923183 U CN 208923183U
- Authority
- CN
- China
- Prior art keywords
- luminescence unit
- bonding pad
- pad
- light source
- polar region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED light source component and display screens, the light source device includes substrate, the substrate front side is equipped with multiple luminescence units, each luminescence unit includes three LED chips, crystal bonding area, public polar region, the first bonding pad, the second bonding pad and third bonding pad, and public polar region, the first bonding pad, the second bonding pad and the third bonding pad of each luminescence unit are electrically connected by via hole with the pad that substrate back is arranged in；Resistance tin layers are equipped between two neighboring pad, the resistance tin layers can be green oil protrusion, be also possible to be made using other insulating materials, and the insulation for stopping scolding tin to flow is raised.The display screen includes multiple LED light source components.The resistance tin layers that the utility model passes through the setting certain altitude between two adjacent pads of substrate back, when light source device is welded, scolding tin can be stopped to be flowed between two neighboring pad, to play the role of preventing the two neighboring pad of substrate to be shorted.
Description
Technical field
The utility model relates to LED light source component technical field, more specifically to a kind of LED light source component and by
Display screen composed by multiple LED light source components.
Background technique
Currently on the market, there are four pin, a common end and three gated ends for single RGB lamp bead configuration, will be multiple
When RGB lamp bead combines to form a light source device, those skilled in the art are to reduce the external port of light source device, and conventional does
Method is that two RGB lamp beads adjacent in the same light source device associate, and this design method is common in small-sized light source
Device.
In existing small-sized light source device, in order to guarantee that the pad of light source device has sufficiently large space to meet welding need
It asks, generally LED chip and pad are arranged in substrate tow sides by those skilled in the art, while by the connection of the overwhelming majority
Route is also disposed at substrate front side, so can guarantee that the pad of substrate back has enough spaces.But due to cost etc. because
The size of element, substrate itself is subject to certain restrictions, and the distance between described two neighboring pad is minimum, is easy when being welded
Two neighboring pad is caused to occur being shorted phenomenon.
Utility model content
Technical problem to be solved by the utility model is: two neighboring pad in light source device how to be prevented to be shorted.
The solution that the utility model solves its technical problem is:
A kind of LED light source component, including substrate, the substrate front side are equipped with multiple luminescence units, and each luminescence unit is equal
Including three LED chips, crystal bonding area, public polar region, the first bonding pad, the second bonding pad and third bonding pad, described in three
LED chip is fixed on crystal bonding area, and first LED chip is electrically connected with public polar region and the first bonding pad respectively, and second
A LED chip is electrically connected with public polar region and the second bonding pad respectively, third LED chip respectively with public polar region and
Third bonding pad is electrically connected, public polar region, the first bonding pad, the second bonding pad and the third bonding pad of each luminescence unit
It is electrically connected by via hole with the pad that substrate back is arranged in；The pad is distributed in substrate edges position, two neighboring weldering
It is equipped with resistance tin layers between disk, the resistance tin layers can be that green oil is raised, it are also possible to be made using other insulating materials,
Insulation protrusion for stopping scolding tin to flow.
As a further improvement of the above technical scheme, the resistance tin layers altitude range is 10um to 25um.
As a further improvement of the above technical scheme, there are four the luminescence unit is set, respectively the first luminescence unit,
Second luminescence unit, third luminescence unit and the 4th luminescence unit；
The public polar region of first luminescence unit is connected with the public polar region of third luminescence unit, and described second shines
The public polar region of unit is connected with the public polar region of the 4th luminescence unit；The third bonding pad of first luminescence unit and the
The third bonding pad of two luminescence units is connected, the third bonding pad of the third luminescence unit and the third of the 4th luminescence unit
Bonding pad is connected；
The public polar region of first luminescence unit and the public polar region of third luminescence unit, the public polar region of the second luminescence unit
With the public polar region of the 4th luminescence unit, the third bonding pad of the first luminescence unit and the second luminescence unit third bonding pad,
The third bonding pad of third luminescence unit and the third bonding pad of the 4th luminescence unit, the first luminescence unit the first bonding pad,
Second bonding pad of the first luminescence unit, the first bonding pad of the second luminescence unit, the second bonding pad of the second luminescence unit,
First bonding pad of three luminescence units, the second bonding pad of third luminescence unit, the first bonding pad of the 4th luminescence unit, the 4th
Second bonding pad of luminescence unit passes through the via hole pad different from substrate back respectively and is connected.
As a further improvement of the above technical scheme, the crystal bonding area in each luminescence unit electrically connects with third bonding pad
It connects, third LED chip is single electrode chip, and the bottom electrode of third LED chip and crystal bonding area are electrically connected, third
The top electrodes of LED chip and public polar region are electrically connected.
As a further improvement of the above technical scheme, the bonding pad area that the public polar region of the luminescence unit is connected is
Not less than 0.15mm*0.2mm, pad face that the luminescence unit crystal bonding area, the first bonding pad and the second bonding pad are connected
Product is no more than 0.3mm*0.5mm.
As a further improvement of the above technical scheme, each pad is symmetrically disposed in substrate back.
As a further improvement of the above technical scheme, the substrate back is equipped with polarity mark, and the polarity mark is excellent
It is selected as triangle.
As a further improvement of the above technical scheme, the substrate front side is covered with encapsulation glue-line, the encapsulation glue-line
Thickness be greater than substrate thickness.
As a further improvement of the above technical scheme, the encapsulation bondline thickness is 0.25mm to 0.4mm, the substrate
With a thickness of 0.1mm to 0.35mm.
As a further improvement of the above technical scheme, ink layer is covered in the connection line of the substrate.
The utility model also discloses a kind of display screen simultaneously, including LED light source device described in multiple any one of the above
Part.
The beneficial effects of the utility model are: the utility model between two adjacent pads of substrate back by being arranged
The resistance tin layers of certain altitude can stop scolding tin to be flowed between two neighboring pad when light source device is welded,
To play the role of preventing the two neighboring pad of substrate to be shorted.
Detailed description of the invention
It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly described.Obviously, described attached drawing is a part of the embodiment of the utility model, rather than complete
Portion's embodiment, those skilled in the art without creative efforts, can also be obtained according to these attached drawings it
His design scheme and attached drawing.
Fig. 1 is the light source device front schematic view of the utility model；
Fig. 2 is the light source device schematic rear view of the utility model.
Specific embodiment
It is carried out below with reference to technical effect of the embodiment and attached drawing to the design of the utility model, specific structure and generation
It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment
It is a part of the embodiment of the utility model, rather than whole embodiments, it is based on the embodiments of the present invention, the skill of this field
Art personnel other embodiments obtained without creative efforts belong to the model of the utility model protection
It encloses.In addition, all connection relationships being previously mentioned in text, not singly refer to that component directly connects, and referring to can be according to specific implementation feelings
Condition, by adding or reducing connection auxiliary, Lai Zucheng more preferably connection structure.Each technical characteristic in the invention,
It can be with combination of interactions under the premise of not conflicting conflict.
Referring to Fig.1~Fig. 2, the utility model discloses a kind of LED light source component, including substrate 5,5 front of substrate
Equipped with multiple luminescence units, each luminescence unit includes three LED chips 51, crystal bonding area 52, the connection of public polar region 53, first
Area 54, the second bonding pad 55 and third bonding pad, three LED chips 51 are fixed on crystal bonding area 52, first LED core
Piece 51 is electrically connected with public polar region 53 and the first bonding pad 54 respectively, second LED chip 51 respectively with public polar region 53
And second bonding pad 55 be electrically connected, third LED chip 51 electrically connects with public polar region 53 and third bonding pad respectively
It connects, the public polar region 53 of each luminescence unit, the first bonding pad 54, the second bonding pad 55 and third bonding pad pass through via hole 6
It is electrically connected with the pad 7 that 5 back side of substrate is arranged in；7 precedence partition of pad is in 5 marginal position of substrate, two neighboring weldering
Resistance tin layers 8 are equipped between disk 7, the resistance tin layers 8 can be green oil protrusion, be also possible to be made using other insulating materials
, the insulation protrusion for stopping scolding tin to flow.
It should be noted that three LED chips 51 described herein refer to individually issuing feux rouges, green light, blue light
LED chip, as be specifically which LED chip as described first, second, third LED chip 51, this technology
Method is not limited this.
Specifically, the resistance tin that the utility model passes through the setting certain altitude between two adjacent pads 7 of 5 back side of substrate
Layer 8, when light source device is welded, can stop scolding tin to be flowed between two neighboring pad 7, prevent base to play
There is the effect being shorted in the two neighboring pad 7 of plate 5.
It is further used as preferred embodiment, the utility model has specific requirement to the height of the resistance tin layers 8,
Hinder the height of tin layers 8 it is insufficient when, it is difficult to play the effect for stopping scolding tin flowing, when resistance tin layers 8 are excessively high, difficulty of processing and be processed into
This can all be significantly improved, while also will affect welding effect.By test of many times, 8 height model of resistance tin layers described in the utility model
It encloses for 10um to 25um.
It is further used as preferred embodiment, in order to reduce the external connectivity port of entire light source device, i.e. pad 7
Quantity, in specific embodiment of the present invention, there are four the luminescence unit is set, respectively the first luminescence unit 1, second hair
Light unit 2, third luminescence unit 3 and the 4th luminescence unit 4；
The public polar region 53 of first luminescence unit 1 is connected with the public polar region 53 of third luminescence unit 3, and described
The public polar region 53 of two luminescence units 2 is connected with the public polar region 53 of the 4th luminescence unit 4；First luminescence unit 1
Third bonding pad is connected with the third bonding pad of the second luminescence unit 2, the third bonding pad of the third luminescence unit 3 and the
The third bonding pad of four luminescence units 4 is connected；
The public polar region 53 of the public polar region 53 of first luminescence unit 1 and third luminescence unit 3, the second luminescence unit 2
The public polar region 53 of public polar region 53 and the 4th luminescence unit 4, the third bonding pad of the first luminescence unit 1 and the second luminescence unit
2 third bonding pad, the third bonding pad of the third bonding pad of third luminescence unit 3 and the 4th luminescence unit 4, the first luminous list
First bonding pad 54 of member 1, the second bonding pad 55 of the first luminescence unit 1, the first bonding pad 54 of the second luminescence unit 2, the
Second connection of the second bonding pad 55 of two luminescence units 2, the first bonding pad 54 of third luminescence unit 3, third luminescence unit 3
Area 55, the first bonding pad 54 of the 4th luminescence unit 4, the 4th luminescence unit 4 the second bonding pad 55 respectively pass through via hole 6 and base
The different pad 7 in 5 back side of plate is connected.
It should be noted that luminescence unit described in the utility model not only can be set to four, can also be arranged
A for 4N (N is greater than 1), every four luminescence units form a functional module.
Above-mentioned is the connection type of each luminescence unit in the utility model, and entire light source device externally provides 12 welderings
Disk 7.
It is further used as preferred embodiment, in specific embodiment of the present invention, consolidating in each luminescence unit
Crystalline region 52 and third bonding pad are electrically connected, i.e., the described crystal bonding area 52 is actually referred to third bonding pad with a piece of line areas
Domain, third LED chip 51 are single electrode chips, and the bottom electrode of third LED chip 51 and crystal bonding area 52 are electrically connected, the
The top electrodes of three LED chips 51 and public polar region 53 are electrically connected, and during the manufacturing, can be reduced conducting wire and (be used
In realize LED chip 51 and public polar region 53, the first bonding pad 54 and the second bonding pad 55 electric connection) quantity, subtract
Few production process, improves production efficiency.
Be further used as preferred embodiment, in specific embodiment of the present invention, the luminescence unit it is public
7 area of pad that polar region 53 is connected is not less than 0.15mm*0.2mm, the luminescence unit crystal bonding area 52, the first bonding pad 54
And second 7 area of pad that is connected of bonding pad 55 be no more than 0.3mm*0.5mm.In the present embodiment, the luminous list
7 area of pad that the public polar region 53 of member is connected is greater than the luminescence unit crystal bonding area 52, the first bonding pad 54 and second
7 area of pad that bonding pad 55 is connected.
It is further used as preferred embodiment, in specific embodiment of the present invention, each pad 7 is symmetrically
Setting effectively simplifies the design of downstream product connection structure corresponding with light source device at 5 back side of substrate.
It is further used as preferred embodiment, in specific embodiment of the present invention, 5 back side of substrate is equipped with pole
Property label 9, the polarity mark 9 be preferably triangle, by LED chip 51 be placed on substrate 5 after complete encapsulation can be formed
One complete light source device when light source device is mounted on the wiring board of downstream product by the later period again, passes through the polarity mark
The setting of note 9, the identification convenient for peripheral vision ancillary equipment to 5 placement direction of substrate.
It is further used as preferred embodiment, in specific embodiment of the present invention, 5 front of substrate is covered with
Glue-line is encapsulated, the thickness of the encapsulation glue-line is greater than the thickness of substrate, and the encapsulation bondline thickness is 0.25mm to 0.4mm, institute
Substrate 5 is stated with a thickness of 0.1mm to 0.35mm, the encapsulation glue-line is by primarily serving the function of protective substrate 5 and LED chip 51
Can, improve the service life of light source device.
It is further used as preferred embodiment, is covered with ink layer, the utility model in the connection line of the substrate 5
In specific embodiment, it is covered with ink layer in the connection line of the substrate 5, by the setting of the ink layer, is effectively protected
The connection line of substrate 5 is protected, and prevents connection line from aoxidizing, influences the electric connection effect between luminescence unit.
The utility model also discloses a kind of display screen simultaneously, including LED light source component described in any one of the above.
The better embodiment of the utility model is illustrated above, but the invention be not limited to it is described
Embodiment, those skilled in the art can also make various equivalent changes without departing from the spirit of the present invention
Type or replacement, these equivalent variation or replacement are all included in the scope defined by the claims of the present application.
Claims (11)
1. a kind of LED light source component, it is characterised in that: including substrate (5), substrate (5) front is equipped with multiple luminescence units,
Each luminescence unit includes three LED chips (51), crystal bonding area (52), public polar region (53), the first bonding pad (54), second
Bonding pad (55) and third bonding pad, three LED chips (51) are fixed on crystal bonding area (52), first LED chip
(51) respectively with public polar region (53) and the first bonding pad (54) be electrically connected, second LED chip (51) respectively with it is public
Polar region (53) and the second bonding pad (55) are electrically connected, third LED chip (51) respectively with public polar region (53) and the
Three bonding pads are electrically connected, the public polar region (53) of each luminescence unit, the first bonding pad (54), the second bonding pad (55) and
Pad (7) of the third bonding pad by via hole (6) and setting at substrate (5) back side is electrically connected；Between two neighboring pad (7)
Equipped with resistance tin layers (8).
2. a kind of LED light source component according to claim 1, it is characterised in that: resistance tin layers (8) altitude range is
10um to 25um.
3. a kind of LED light source component according to claim 1, it is characterised in that: there are four the luminescence unit is set, respectively
For the first luminescence unit (1), the second luminescence unit (2), third luminescence unit (3) and the 4th luminescence unit (4)；
The public polar region (53) of first luminescence unit (1) is connected with the public polar region (53) of third luminescence unit (3), institute
The public polar region (53) for stating the second luminescence unit (2) is connected with the public polar region (53) of the 4th luminescence unit (4)；Described first
The third bonding pad of luminescence unit (1) is connected with the third bonding pad of the second luminescence unit (2), the third luminescence unit
(3) third bonding pad is connected with the third bonding pad of the 4th luminescence unit (4)；
The public polar region (53) of first luminescence unit (1) and public polar region (53), second luminescence unit of third luminescence unit (3)
(2) public polar region (53) and the public polar region (53) of the 4th luminescence unit (4), the third bonding pad of the first luminescence unit (1)
With the third bonding pad of the second luminescence unit (2), the third bonding pad of third luminescence unit (3) and the 4th luminescence unit (4)
Third bonding pad, the first bonding pad (54) of the first luminescence unit (1), the second bonding pad (55) of the first luminescence unit (1),
The first bonding pad (54) of two luminescence units (2), the second bonding pad (55) of the second luminescence unit (2), third luminescence unit (3)
The first bonding pad (54), the second bonding pad (55) of third luminescence unit (3), the 4th luminescence unit (4) the first bonding pad
(54), the second bonding pad (55) of the 4th luminescence unit (4) passes through via hole (6) pad (7) different from substrate (5) back side respectively
It is connected.
4. a kind of LED light source component according to claim 1 or 3, it is characterised in that: the crystal bonding area in each luminescence unit
(52) it is electrically connected with third bonding pad, third LED chip (51) is single electrode chip, the bottom of third LED chip (51)
Portion's electrode and crystal bonding area (52) are electrically connected, and the top electrodes of third LED chip (51) and public polar region (53) are electrically connected.
5. a kind of LED light source component according to claim 4, it is characterised in that: the public polar region of the luminescence unit
(53) pad (7) area connected is not less than 0.15mm*0.2mm, the luminescence unit crystal bonding area (52), the first bonding pad
(54) and the second bonding pad (55) pad (7) area for being connected is no more than 0.3mm*0.5mm.
6. a kind of LED light source component according to claim 1, it is characterised in that: each pad (7) is symmetrically arranged
At substrate (5) back side.
7. a kind of LED light source component according to claim 1, it is characterised in that: substrate (5) back side is equipped with polarity mark
Remember (9).
8. a kind of LED light source component according to claim 1, it is characterised in that: substrate (5) front is covered with encapsulation
The thickness of glue-line, the encapsulation glue-line is greater than the thickness of substrate (5).
9. a kind of LED light source component according to claim 8, it is characterised in that: the encapsulation bondline thickness is 0.25mm
To 0.4mm, the substrate (5) is with a thickness of 0.1mm to 0.35mm.
10. a kind of LED light source component according to claim 1, it is characterised in that: in the connection line of the substrate (5)
It is covered with ink layer.
11. a kind of display screen, it is characterised in that: including the described in any item LED light source components of multiple claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821775540.7U CN208923183U (en) | 2018-10-30 | 2018-10-30 | A kind of LED light source component and display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821775540.7U CN208923183U (en) | 2018-10-30 | 2018-10-30 | A kind of LED light source component and display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208923183U true CN208923183U (en) | 2019-05-31 |
Family
ID=66711074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821775540.7U Active CN208923183U (en) | 2018-10-30 | 2018-10-30 | A kind of LED light source component and display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208923183U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111162066A (en) * | 2020-01-24 | 2020-05-15 | 昆山泓冠光电科技有限公司 | Backlight light source |
| CN112164327A (en) * | 2020-09-23 | 2021-01-01 | 广东晶科电子股份有限公司 | Mini LED device and module easy to identify |
| CN113328029A (en) * | 2020-02-28 | 2021-08-31 | 惠州市聚飞光电有限公司 | LED packaging device |
| WO2021189618A1 (en) * | 2020-03-26 | 2021-09-30 | 深圳利亚德光电有限公司 | Display support, display assembly, and method for manufacturing display support |
-
2018
- 2018-10-30 CN CN201821775540.7U patent/CN208923183U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111162066A (en) * | 2020-01-24 | 2020-05-15 | 昆山泓冠光电科技有限公司 | Backlight light source |
| CN113328029A (en) * | 2020-02-28 | 2021-08-31 | 惠州市聚飞光电有限公司 | LED packaging device |
| WO2021189618A1 (en) * | 2020-03-26 | 2021-09-30 | 深圳利亚德光电有限公司 | Display support, display assembly, and method for manufacturing display support |
| CN112164327A (en) * | 2020-09-23 | 2021-01-01 | 广东晶科电子股份有限公司 | Mini LED device and module easy to identify |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208923183U (en) | A kind of LED light source component and display screen | |
| CN206558500U (en) | Light-emitting component, backlight source module and electronic equipment | |
| US9312304B2 (en) | LED illuminating device comprising light emitting device including LED chips on single substrate | |
| CN107924962A (en) | Light-emitting component and the display device with the light-emitting component | |
| CN208570653U (en) | A kind of LED display unit group and display panel | |
| CN105609621A (en) | 360-degree light source packaging device | |
| CN103098247A (en) | Light-emitting device and manufacturing method for light-emitting device | |
| CN102478172A (en) | Illumination apparatus | |
| CN207818609U (en) | A kind of flip-chip die bond structure | |
| CN107705723A (en) | All-colour LED surface mount device | |
| CN207637835U (en) | A kind of full-color COB display screens lamp bead encapsulation welding tray structure | |
| CN106876556A (en) | A kind of back sticking type paster LED for being exclusively used in transparency carrier | |
| CN210092076U (en) | COB light source based on flip chip | |
| TWI236166B (en) | Side structure of a bare LED and backlight module thereof | |
| CN208923191U (en) | A kind of the rgb light source device and display screen of low optical crosstalk | |
| CN106898605B (en) | A kind of IC implanted paster LED being exclusively used in transparent substrate | |
| CN207427560U (en) | A kind of PCB pad structures of compatible circuit | |
| CN109411588A (en) | It is a kind of to mount LED element, transparent display screen mould group and its production method in parallel | |
| CN204884446U (en) | LED display screen | |
| CN211238246U (en) | RGBW integrated circuit encapsulation lamp pearl | |
| CN211957638U (en) | IMD Mini LED packaging device | |
| CN208923121U (en) | A kind of rgb light source device and display screen | |
| CN208352292U (en) | A kind of LED charactrons | |
| CN207637842U (en) | A kind of indoor display LED packagings of high contrast | |
| CN205960018U (en) | Novel base plate structure and application |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |