CN207427560U - A kind of PCB pad structures of compatible circuit - Google Patents

A kind of PCB pad structures of compatible circuit Download PDF

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Publication number
CN207427560U
CN207427560U CN201721239700.1U CN201721239700U CN207427560U CN 207427560 U CN207427560 U CN 207427560U CN 201721239700 U CN201721239700 U CN 201721239700U CN 207427560 U CN207427560 U CN 207427560U
Authority
CN
China
Prior art keywords
circuit
pad
dew copper
copper pad
perforate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721239700.1U
Other languages
Chinese (zh)
Inventor
姚军徽
伍威铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Haihang Communication Technology Co Ltd
Original Assignee
Beijing Haihang Communication Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Haihang Communication Technology Co Ltd filed Critical Beijing Haihang Communication Technology Co Ltd
Priority to CN201721239700.1U priority Critical patent/CN207427560U/en
Application granted granted Critical
Publication of CN207427560U publication Critical patent/CN207427560U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a kind of PCB pad structures of compatible circuit, including wiring board and steel mesh, the wiring board is equipped with the first circuit and second circuit, first circuit is equipped with the first dew copper pad of non-lid green oil, the second circuit is equipped with the second dew copper pad of non-lid green oil, the first dew copper pad, second dew copper pad is disposed adjacent, the steel mesh is equipped with brush tin cream perforate, the brush tin cream perforate is located at the described first dew copper pad, on second dew copper pad, the first dew copper pad and the second dew copper pad are respectively positioned within the brush tin cream perforate and non-intersect with the brush tin cream perforate.The beneficial effects of the utility model are:Can compatible circuit be realized by pad, effectively reduce cost.

Description

A kind of PCB pad structures of compatible circuit
Technical field
The utility model is related to pad structure more particularly to a kind of PCB pad structures of compatible circuit.
Background technology
All it is to go to solve by 0 Ohmic resistance during general compatible circuit design, and is done with the pad of PCB design in itself simultaneous Hold seldom, be at most also the connection of two pads or do not connect and do compatibility.
As shown in Figure 1 to Figure 2, Fig. 1 is compatible circuit schematic diagram, network A by resistance R1 and R2 connect respectively network B and C;As patch R1, when R2 is not pasted, network A connection network B;When R1 is not pasted, and pastes R2, network A connection network C.Filled black in Fig. 2 Region is shakedown copper.
In order to be compatible with alternative network connection, it is necessary to using two pads of R1 and R2 in above, it is also necessary to paste resistance, cost It is higher.
The content of the invention
In order to solve the problems in the prior art, the utility model provides a kind of PCB pad structures of compatible circuit.
The utility model provides a kind of PCB pad structures of compatible circuit, including wiring board and steel mesh, the wiring board The first circuit and second circuit are equipped with, first circuit is equipped with the first dew copper pad of non-lid green oil, second electricity Road is equipped with the second dew copper pad of non-lid green oil, and the first dew copper pad, the second dew copper pad are disposed adjacent, the steel mesh Brush tin cream perforate is equipped with, the brush tin cream perforate is on the described first dew copper pad, the second dew copper pad, first dew Copper pad and the second dew copper pad are respectively positioned within the brush tin cream perforate and non-intersect with the brush tin cream perforate.
As further improvement of the utility model, first circuit, the upper and lower ends of second circuit are respectively equipped with ground Spread copper.
As further improvement of the utility model, the brush tin cream perforate is equipped with tin paste layer, the first dew brazing Disk, the second dew copper pad are connected by the tin paste layer.
As further improvement of the utility model, first circuit, the first dew copper pad correspond, and described first Circuit is at least all the way.
As further improvement of the utility model, the second circuit, the second dew copper pad correspond, and described second Circuit is at least all the way.
The beneficial effects of the utility model are:Through the above scheme, can compatible circuit be realized by pad, effectively reduced Cost.
Description of the drawings
Fig. 1 is compatible circuit schematic diagram of the prior art.
Fig. 2 is compatible circuit pad schematic diagram of the prior art.
Fig. 3 is a kind of schematic diagram of the PCB pad structures of compatible circuit of the utility model.
Fig. 4 is a kind of connection diagram of the PCB pad structures of compatible circuit of the utility model.
Fig. 5 is a kind of schematic diagram of the one-to-two of the PCB pad structures of compatible circuit of the utility model.
Fig. 6 is a kind of one point three of schematic diagram of the PCB pad structures of compatible circuit of the utility model.
Fig. 7 is a kind of one point three of schematic diagram of the PCB pad structures of compatible circuit of the utility model.
Fig. 8 is a kind of one point four of schematic diagram of the PCB pad structures of compatible circuit of the utility model.
Fig. 9 is a kind of one point four of schematic diagram of the PCB pad structures of compatible circuit of the utility model.
Specific embodiment
The utility model is described in further detail for explanation and specific embodiment below in conjunction with the accompanying drawings.
As shown in Figure 3 to Figure 4, the PCB pad structures of a kind of compatible circuit, including wiring board and steel mesh, the wiring board It is equipped with the first circuit 1 and second circuit 2, first circuit 1 is equipped with the first dew copper pad 3 of non-lid green oil, and described the Two circuits 2 are equipped with the second dew copper pad 4 of non-lid green oil, and the first dew copper pad 3, second reveals copper pad 4 and is disposed adjacent, The steel mesh is equipped with brush tin cream perforate 6, and the brush tin cream perforate 6 is located at the described first dew copper pad 3, second and reveals copper pad 4 On, the first dew copper pad 3 and second reveals copper pad 4 and is respectively positioned within the brush tin cream perforate 6 and is opened with the brush tin cream Hole 6 is non-intersect.
As shown in Figure 3 to Figure 4, first circuit 1, the upper and lower ends of second circuit 2 are respectively equipped with shakedown copper 5.
As shown in Figure 3 to Figure 4, the brush tin cream perforate 6 is equipped with tin paste layer, and the first dew copper pad 3, second reveals copper Pad 4 is connected by the tin paste layer, when having brushed tin cream and crossing stove, since the first dew copper pad 3, second reveals between copper pad 4 Away from close, and tin cream is entirely to cover, so left and right dew copper pad can be connected by tin.
It is the compatible circuit design of one-to-two in Fig. 5, network C is connected what either network D was connected with network E with network E Compatible design.When network C is needed to be connected with network E, the dew copper pad of C and E is only brushed in steel mesh design, does not brush the dew copper of D networks Pad ensures that network C and the pad of network E are connected by scolding tin after crossing stove, and is not attached to the pad of network D.
It is designed in Fig. 6,7 for one point three of compatible circuit, wherein above and below figure is the design method of two kinds of pads, The design method that can certainly have other similar.
It is designed in Fig. 8,9 for one point four of compatible circuit, wherein above and below figure is the design method of two kinds of pads, The design method that can certainly have other similar.
A kind of PCB pad structures of compatible circuit provided by the utility model can pass through the change design of pad, Ke Yijian The circuit compatibility for holding 1 road to multichannel designs.0 ohm of material can be saved and save cloth plate suqare on plate.
A kind of PCB pad structures of compatible circuit provided by the utility model are mainly used in PCB design cabling field, It solves to reduce cloth plate suqare as far as possible during pcb board design compatible circuit;It is generally often compatible to need to increase by two 0 ohm of electricity all the way Resistance, is not only that increased resistance has cost, in addition can also occupy PCB goods of furniture for display rather than for use areas, at least to occupy the encapsulating face of two 0201 Product.
The above content is combine specific preferred embodiment further detailed description of the utility model, it is impossible to Assert that the specific implementation of the utility model is confined to these explanations.For the ordinary skill of the utility model technical field For personnel, without departing from the concept of the premise utility, several simple deduction or replace can also be made, should all be regarded To belong to the scope of protection of the utility model.

Claims (5)

1. a kind of PCB pad structures of compatible circuit, it is characterised in that:Including wiring board and steel mesh, the wiring board is equipped with First circuit and second circuit, first circuit are equipped with the first dew copper pad of non-lid green oil, are set on the second circuit There is the second dew copper pad of non-lid green oil, the first dew copper pad, the second dew copper pad are disposed adjacent, and the steel mesh is equipped with Brush tin cream perforate, the brush tin cream perforate is on the described first dew copper pad, the second dew copper pad, the first dew copper pad It is respectively positioned on the second dew copper pad within the brush tin cream perforate and non-intersect with the brush tin cream perforate.
2. the PCB pad structures of compatible circuit according to claim 1, it is characterised in that:First circuit, the second electricity The upper and lower ends on road are respectively equipped with shakedown copper.
3. the PCB pad structures of compatible circuit according to claim 1, it is characterised in that:It is set in the brush tin cream perforate There is tin paste layer, the first dew copper pad, the second dew copper pad are connected by the tin paste layer.
4. the PCB pad structures of compatible circuit according to claim 1, it is characterised in that:First circuit, the first dew Copper pad corresponds, and first circuit is at least all the way.
5. the PCB pad structures of compatible circuit according to claim 1, it is characterised in that:The second circuit, the second dew Copper pad corresponds, and the second circuit is at least all the way.
CN201721239700.1U 2017-09-26 2017-09-26 A kind of PCB pad structures of compatible circuit Expired - Fee Related CN207427560U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721239700.1U CN207427560U (en) 2017-09-26 2017-09-26 A kind of PCB pad structures of compatible circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721239700.1U CN207427560U (en) 2017-09-26 2017-09-26 A kind of PCB pad structures of compatible circuit

Publications (1)

Publication Number Publication Date
CN207427560U true CN207427560U (en) 2018-05-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721239700.1U Expired - Fee Related CN207427560U (en) 2017-09-26 2017-09-26 A kind of PCB pad structures of compatible circuit

Country Status (1)

Country Link
CN (1) CN207427560U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107529272A (en) * 2017-09-26 2017-12-29 北京海杭通讯科技有限公司 A kind of PCB pad structures of compatible circuit
CN110501567A (en) * 2019-08-01 2019-11-26 RealMe重庆移动通信有限公司 A kind of power consumption test device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107529272A (en) * 2017-09-26 2017-12-29 北京海杭通讯科技有限公司 A kind of PCB pad structures of compatible circuit
CN110501567A (en) * 2019-08-01 2019-11-26 RealMe重庆移动通信有限公司 A kind of power consumption test device
CN110501567B (en) * 2019-08-01 2022-07-19 RealMe重庆移动通信有限公司 Power consumption testing device

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180529

Termination date: 20200926