CN207427560U - A kind of PCB pad structures of compatible circuit - Google Patents
A kind of PCB pad structures of compatible circuit Download PDFInfo
- Publication number
- CN207427560U CN207427560U CN201721239700.1U CN201721239700U CN207427560U CN 207427560 U CN207427560 U CN 207427560U CN 201721239700 U CN201721239700 U CN 201721239700U CN 207427560 U CN207427560 U CN 207427560U
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- CN
- China
- Prior art keywords
- circuit
- pad
- dew copper
- copper pad
- perforate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a kind of PCB pad structures of compatible circuit, including wiring board and steel mesh, the wiring board is equipped with the first circuit and second circuit, first circuit is equipped with the first dew copper pad of non-lid green oil, the second circuit is equipped with the second dew copper pad of non-lid green oil, the first dew copper pad, second dew copper pad is disposed adjacent, the steel mesh is equipped with brush tin cream perforate, the brush tin cream perforate is located at the described first dew copper pad, on second dew copper pad, the first dew copper pad and the second dew copper pad are respectively positioned within the brush tin cream perforate and non-intersect with the brush tin cream perforate.The beneficial effects of the utility model are:Can compatible circuit be realized by pad, effectively reduce cost.
Description
Technical field
The utility model is related to pad structure more particularly to a kind of PCB pad structures of compatible circuit.
Background technology
All it is to go to solve by 0 Ohmic resistance during general compatible circuit design, and is done with the pad of PCB design in itself simultaneous
Hold seldom, be at most also the connection of two pads or do not connect and do compatibility.
As shown in Figure 1 to Figure 2, Fig. 1 is compatible circuit schematic diagram, network A by resistance R1 and R2 connect respectively network B and
C;As patch R1, when R2 is not pasted, network A connection network B;When R1 is not pasted, and pastes R2, network A connection network C.Filled black in Fig. 2
Region is shakedown copper.
In order to be compatible with alternative network connection, it is necessary to using two pads of R1 and R2 in above, it is also necessary to paste resistance, cost
It is higher.
The content of the invention
In order to solve the problems in the prior art, the utility model provides a kind of PCB pad structures of compatible circuit.
The utility model provides a kind of PCB pad structures of compatible circuit, including wiring board and steel mesh, the wiring board
The first circuit and second circuit are equipped with, first circuit is equipped with the first dew copper pad of non-lid green oil, second electricity
Road is equipped with the second dew copper pad of non-lid green oil, and the first dew copper pad, the second dew copper pad are disposed adjacent, the steel mesh
Brush tin cream perforate is equipped with, the brush tin cream perforate is on the described first dew copper pad, the second dew copper pad, first dew
Copper pad and the second dew copper pad are respectively positioned within the brush tin cream perforate and non-intersect with the brush tin cream perforate.
As further improvement of the utility model, first circuit, the upper and lower ends of second circuit are respectively equipped with ground
Spread copper.
As further improvement of the utility model, the brush tin cream perforate is equipped with tin paste layer, the first dew brazing
Disk, the second dew copper pad are connected by the tin paste layer.
As further improvement of the utility model, first circuit, the first dew copper pad correspond, and described first
Circuit is at least all the way.
As further improvement of the utility model, the second circuit, the second dew copper pad correspond, and described second
Circuit is at least all the way.
The beneficial effects of the utility model are:Through the above scheme, can compatible circuit be realized by pad, effectively reduced
Cost.
Description of the drawings
Fig. 1 is compatible circuit schematic diagram of the prior art.
Fig. 2 is compatible circuit pad schematic diagram of the prior art.
Fig. 3 is a kind of schematic diagram of the PCB pad structures of compatible circuit of the utility model.
Fig. 4 is a kind of connection diagram of the PCB pad structures of compatible circuit of the utility model.
Fig. 5 is a kind of schematic diagram of the one-to-two of the PCB pad structures of compatible circuit of the utility model.
Fig. 6 is a kind of one point three of schematic diagram of the PCB pad structures of compatible circuit of the utility model.
Fig. 7 is a kind of one point three of schematic diagram of the PCB pad structures of compatible circuit of the utility model.
Fig. 8 is a kind of one point four of schematic diagram of the PCB pad structures of compatible circuit of the utility model.
Fig. 9 is a kind of one point four of schematic diagram of the PCB pad structures of compatible circuit of the utility model.
Specific embodiment
The utility model is described in further detail for explanation and specific embodiment below in conjunction with the accompanying drawings.
As shown in Figure 3 to Figure 4, the PCB pad structures of a kind of compatible circuit, including wiring board and steel mesh, the wiring board
It is equipped with the first circuit 1 and second circuit 2, first circuit 1 is equipped with the first dew copper pad 3 of non-lid green oil, and described the
Two circuits 2 are equipped with the second dew copper pad 4 of non-lid green oil, and the first dew copper pad 3, second reveals copper pad 4 and is disposed adjacent,
The steel mesh is equipped with brush tin cream perforate 6, and the brush tin cream perforate 6 is located at the described first dew copper pad 3, second and reveals copper pad 4
On, the first dew copper pad 3 and second reveals copper pad 4 and is respectively positioned within the brush tin cream perforate 6 and is opened with the brush tin cream
Hole 6 is non-intersect.
As shown in Figure 3 to Figure 4, first circuit 1, the upper and lower ends of second circuit 2 are respectively equipped with shakedown copper 5.
As shown in Figure 3 to Figure 4, the brush tin cream perforate 6 is equipped with tin paste layer, and the first dew copper pad 3, second reveals copper
Pad 4 is connected by the tin paste layer, when having brushed tin cream and crossing stove, since the first dew copper pad 3, second reveals between copper pad 4
Away from close, and tin cream is entirely to cover, so left and right dew copper pad can be connected by tin.
It is the compatible circuit design of one-to-two in Fig. 5, network C is connected what either network D was connected with network E with network E
Compatible design.When network C is needed to be connected with network E, the dew copper pad of C and E is only brushed in steel mesh design, does not brush the dew copper of D networks
Pad ensures that network C and the pad of network E are connected by scolding tin after crossing stove, and is not attached to the pad of network D.
It is designed in Fig. 6,7 for one point three of compatible circuit, wherein above and below figure is the design method of two kinds of pads,
The design method that can certainly have other similar.
It is designed in Fig. 8,9 for one point four of compatible circuit, wherein above and below figure is the design method of two kinds of pads,
The design method that can certainly have other similar.
A kind of PCB pad structures of compatible circuit provided by the utility model can pass through the change design of pad, Ke Yijian
The circuit compatibility for holding 1 road to multichannel designs.0 ohm of material can be saved and save cloth plate suqare on plate.
A kind of PCB pad structures of compatible circuit provided by the utility model are mainly used in PCB design cabling field,
It solves to reduce cloth plate suqare as far as possible during pcb board design compatible circuit;It is generally often compatible to need to increase by two 0 ohm of electricity all the way
Resistance, is not only that increased resistance has cost, in addition can also occupy PCB goods of furniture for display rather than for use areas, at least to occupy the encapsulating face of two 0201
Product.
The above content is combine specific preferred embodiment further detailed description of the utility model, it is impossible to
Assert that the specific implementation of the utility model is confined to these explanations.For the ordinary skill of the utility model technical field
For personnel, without departing from the concept of the premise utility, several simple deduction or replace can also be made, should all be regarded
To belong to the scope of protection of the utility model.
Claims (5)
1. a kind of PCB pad structures of compatible circuit, it is characterised in that:Including wiring board and steel mesh, the wiring board is equipped with
First circuit and second circuit, first circuit are equipped with the first dew copper pad of non-lid green oil, are set on the second circuit
There is the second dew copper pad of non-lid green oil, the first dew copper pad, the second dew copper pad are disposed adjacent, and the steel mesh is equipped with
Brush tin cream perforate, the brush tin cream perforate is on the described first dew copper pad, the second dew copper pad, the first dew copper pad
It is respectively positioned on the second dew copper pad within the brush tin cream perforate and non-intersect with the brush tin cream perforate.
2. the PCB pad structures of compatible circuit according to claim 1, it is characterised in that:First circuit, the second electricity
The upper and lower ends on road are respectively equipped with shakedown copper.
3. the PCB pad structures of compatible circuit according to claim 1, it is characterised in that:It is set in the brush tin cream perforate
There is tin paste layer, the first dew copper pad, the second dew copper pad are connected by the tin paste layer.
4. the PCB pad structures of compatible circuit according to claim 1, it is characterised in that:First circuit, the first dew
Copper pad corresponds, and first circuit is at least all the way.
5. the PCB pad structures of compatible circuit according to claim 1, it is characterised in that:The second circuit, the second dew
Copper pad corresponds, and the second circuit is at least all the way.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721239700.1U CN207427560U (en) | 2017-09-26 | 2017-09-26 | A kind of PCB pad structures of compatible circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721239700.1U CN207427560U (en) | 2017-09-26 | 2017-09-26 | A kind of PCB pad structures of compatible circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207427560U true CN207427560U (en) | 2018-05-29 |
Family
ID=62314022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201721239700.1U Expired - Fee Related CN207427560U (en) | 2017-09-26 | 2017-09-26 | A kind of PCB pad structures of compatible circuit |
Country Status (1)
Country | Link |
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CN (1) | CN207427560U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107529272A (en) * | 2017-09-26 | 2017-12-29 | 北京海杭通讯科技有限公司 | A kind of PCB pad structures of compatible circuit |
CN110501567A (en) * | 2019-08-01 | 2019-11-26 | RealMe重庆移动通信有限公司 | A kind of power consumption test device |
-
2017
- 2017-09-26 CN CN201721239700.1U patent/CN207427560U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107529272A (en) * | 2017-09-26 | 2017-12-29 | 北京海杭通讯科技有限公司 | A kind of PCB pad structures of compatible circuit |
CN110501567A (en) * | 2019-08-01 | 2019-11-26 | RealMe重庆移动通信有限公司 | A kind of power consumption test device |
CN110501567B (en) * | 2019-08-01 | 2022-07-19 | RealMe重庆移动通信有限公司 | Power consumption testing device |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180529 Termination date: 20200926 |