CN208460766U - A kind of LED display unit group and display panel - Google Patents
A kind of LED display unit group and display panel Download PDFInfo
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- CN208460766U CN208460766U CN201821137709.6U CN201821137709U CN208460766U CN 208460766 U CN208460766 U CN 208460766U CN 201821137709 U CN201821137709 U CN 201821137709U CN 208460766 U CN208460766 U CN 208460766U
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Abstract
The utility model discloses a kind of LED display unit groups, including n × m pixel unit array；Each pixel unit includes four LED luminescence chips in 2 × 2 array arrangements, respectively first kind LED luminescence chip, the second class LED luminescence chip, third class LED luminescence chip and the 4th class LED luminescence chip, there are three types of different luminescent colors for four LED luminescence chip tools；Two LED luminescence chips of identical luminescent color are diagonally arranged in each pixel unit；At least in one-row pixels unit, the pole A of at least one similar LED luminescence chip links together, and connects with the corresponding pole A pin；And/or in an at least column pixel unit, the pole B of at least one similar LED luminescence chip links together, and is electrically connected with the corresponding pole B pin.The LED display unit group is applied to LED display panel, and in the display panel, the LED luminescence chip of adjacent 2 × 2 array arrangement of composition of any four forms a pixel unit, so that the spacing of adjacent pixel unit is reduced, the resolution of display panel is higher.
Description
Technical field
The utility model embodiment is related to LED display technique more particularly to a kind of LED display unit group and display panel.
Background technique
LED display panel (display screen) is made of multiple independent LED luminescence units of array arrangement, and Fig. 1 is existing skill
The structural schematic diagram of the luminescence unit of art, as shown in Figure 1, each luminescence unit 10 includes the LED hair of three different luminescent colors
The LED luminescence chip of optical chip 11,12 and 13, three different luminescent colors constitutes a pixel unit.Fig. 2 is the prior art
The structural schematic diagram of display panel, as shown in Fig. 2, the display panel is formed by several 10 array arrangements of luminescence unit.Parsing
Degree is an important parameter of display panel, and the quantity for the pixel unit that unit area can be presented on display panel is more, solution
Analysis degree is higher, and the image information of display is abundanter, more clear, and visual effect is better.
As shown in Fig. 2, a luminescence unit 10 is only capable of constituting a pixel unit 20 (such as void in existing display panel
Shown in line circle).Although corresponding luminescence unit size also constantly contracts as LED display is fast-developing towards small spacing
Small, the quantity for the pixel unit that unit area can be presented on display panel can be more, still, are limited to technology today level,
Realize pixel unit spacing in P1.0mm hereinafter, the volume production of especially P0.6mm LED display panel below is also extremely difficult.This
Outside, each pixel unit is made of three luminescence chips, occupies certain space, even if technology is developed, luminescence chip can
Accomplish smaller, but it still occupies certain space, and the physical size of luminescence unit and pixel unit spacing is made to reach capacity, can not
It is small again, and then the pixel unit presented on display panel unit area reaches physics limit.
Utility model content
The utility model provides a kind of LED display unit group, is applied to display panel, to improve the parsing of display panel
Degree.
In a first aspect, the utility model embodiment provides a kind of LED display unit group, which includes:
The pixel unit array being made of n row, m column pixel unit, n and m are the positive integer more than or equal to 2；
Each pixel unit includes four LED luminescence chips in 2 × 2 array arrangements, and respectively first kind LED shines core
Piece, the second class LED luminescence chip, third class LED luminescence chip and the 4th class LED luminescence chip, four LED luminescence chips have
Three kinds of different luminescent colors；In each pixel unit, two LED luminescence chips of identical luminescent color are diagonally arranged；
LED luminescence chip includes the pole A and the pole B, and the polarity of the pole A and the pole B is opposite；
At least in one-row pixels unit, the pole A of at least one similar LED luminescence chip links together, and with the corresponding pole A
Pin connection；And/or
In an at least column pixel unit, the pole B of at least one similar LED luminescence chip links together, and with the corresponding pole B
Pin electrical connection.
Optionally, in every row pixel unit, the pole A of at least one similar LED luminescence chip links together, and with it is corresponding
The connection of the pole A pin.
Optionally, the pole B of each LED luminescence chip and the pole the B pin of the LED luminescence chip are electrically connected in each column pixel unit
It connects.
Optionally, in each column pixel unit, the pole B of at least one similar LED luminescence chip links together, and with the column picture
The corresponding pole B pin is electrically connected in plain unit.
Optionally, the pole A of all LED luminescence chips links together in each pixel unit, and with the pixel unit pair
The pole the A pin electrical connection answered.
Optionally, each pixel unit further includes the total pole an A pad, the first pole a B pad, the 2nd pole a B weldering
Disk, the 3rd pole a B pad and the 4th pole a B pad；Wherein first kind LED luminescence chip and the 4th class LED luminescence chip
Luminescent color having the same；
The total pole A pad, the first pole B pad, the 2nd pole B pad, the 3rd pole B pad and the 4th pole B pad are formed in one absolutely
The front of edge substrate；The pole A pin and the pole B pin are formed in the back side of insulating substrate；
The pole A of four LED luminescence chips is connected on the pad of the total pole A, first kind LED luminescence chip, the second class LED hair
The pole B of optical chip, third class LED luminescence chip and the 4th class LED luminescence chip is connected to the first pole B pad, the 2nd pole B
On pad, the 3rd pole B pad and the 4th pole B pad.
Optionally, in each pixel unit:
At least one LED luminescence chip is flip-chip, and the pole A and the pole B of flip LED chips are located at and LED luminescence chip
The opposite side of emission side；
The pole A of flip LED luminescence chip is fixed on the pad of the total pole A, and the pole B is fixed on the pad of the corresponding pole B.
Optionally, in each pixel unit:
Four LED luminescence chips are flip-chip, first kind LED luminescence chip, the second class LED luminescence chip, third class
The pole A of LED luminescence chip and the 4th class LED luminescence chip is separately fixed on the pad of the total pole A, first kind LED luminescence chip,
The pole B of two class LED luminescence chips, third class LED luminescence chip and the 4th class LED luminescence chip is separately fixed at the weldering of the first pole B
On disk, the 2nd pole B pad, the 3rd pole B pad and the 4th pole B pad.
Optionally,
In i-th row pixel unit, the total pole the A pad electrical connection of m pixel unit, and i-th with LED display unit group
The electrical connection of the pole A pin；
In jth column pixel unit, the first pole the B pad electrical connection of n pixel unit, and the jth with LED display unit group
A first pole B pin electrical connection；The 2nd pole the B pad electrical connection of n pixel unit, and with j-th of LED display unit group the
The electrical connection of two pole B pins；The 3rd pole the B pad electrical connection of n pixel unit, and j-th of the 3rd B with LED display unit group
The electrical connection of pole pin；The 4th pole the B pad electrical connection of n pixel unit, and draw with j-th of the 4th poles B of LED display unit group
Foot electrical connection；
The n pole A pin and the 4m pole B pin are located on the back side of insulating substrate；
Wherein, 1≤i≤n, 1≤j≤m, i, j are integer.
Optionally, n=2, m=2；The total pole A pad, the first pole B pad, the 2nd pole B pad, the 3rd pole B pad and the 4th B
By metallic vias, pin directly corresponding with the insulating substrate back side is located at is electrically connected pole pad, or is passed through metallic vias and be located at
The metal routing at insulating substrate front and/or back side copolar pin corresponding with the insulating substrate back side is located at or the pole B pin are electrically connected
It connects.
Optionally, in every row pixel unit:
The total pole the A pad of two pixel units is connected by being located at the positive first front metal cabling of insulating substrate, total A
Pole pad extends to the back side of insulating substrate by metallic vias, and the first back metal by being located at the insulating substrate back side is walked
The line pole A pin connection corresponding with the row pixel unit.
Optionally, the luminescent color of four LED luminescence chips is respectively selected from any one of red, green and blue, and two
The luminescent color of the LED luminescence chip of a identical luminescent color is red.
Second aspect, the utility model embodiment additionally provide a kind of display panel, which includes that this is practical new
Any LED display unit group of type first aspect.
LED display unit group provided by the embodiment of the utility model, by encapsulating n × m pixel unit together, at least
In one-row pixels unit, the pole A of at least one similar LED luminescence chip links together, and connects with the corresponding pole A pin；With/
Or in an at least column pixel unit, the pole B of at least one similar LED luminescence chip links together, and electric with the corresponding pole B pin
Connection increases the volume of single display unit group, reduces the pin number for being fixed to and connecting on pcb board with pcb board, convenient solid
Fixed operation, improves fixed efficiency；Each pixel unit includes four LED luminescence chips in 2 × 2 array arrangements, four LED hairs
Optical chip tool is there are three types of different luminescent colors, and in each pixel unit, two LED luminescence chips of identical luminescent color are diagonally set
It sets, which is applied to LED display panel, in the display panel, adjacent 2 × 2 array of the composition row of any four
The LED luminescence chip of cloth forms a pixel unit, so that the spacing of adjacent pixel unit is reduced, the resolution of display panel is more
Height, image information is richer, apparent, and visual effect is more preferable.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the luminescence unit of the prior art；
Fig. 2 is the structural schematic diagram of the display panel of the prior art；
Fig. 3 is the schematic diagram of LED display unit group provided by the embodiment of the utility model；
Fig. 4 is a kind of internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment；
Fig. 5 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment；
Fig. 6 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment；
Fig. 7 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment；
Fig. 8 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment；
Fig. 9 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment；
Figure 10 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment；
Figure 11 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment；
Figure 12 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment；
Figure 13 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment；
Figure 14 is a kind of front wiring figure of LED display unit group provided by the embodiment of the utility model；
Figure 15 is the back wiring figure of LED display unit group in Figure 14；
Figure 16 is a kind of schematic diagram of LED display panel provided by the embodiment of the utility model.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein
Described specific embodiment is used only for explaining the utility model, rather than the restriction to the utility model.It further needs exist for
It is bright, part relevant to the utility model is illustrated only for ease of description, in attached drawing rather than entire infrastructure.
The utility model embodiment provides a kind of LED display unit group, which includes:
The pixel unit array being made of n row, m column pixel unit, n and m are the positive integer more than or equal to 2；
Each pixel unit includes four LED luminescence chips in 2 × 2 array arrangements, and respectively first kind LED shines core
Piece, the second class LED luminescence chip, third class LED luminescence chip and the 4th class LED luminescence chip, four LED luminescence chips have
Three kinds of different luminescent colors；In each pixel unit, two LED luminescence chips of identical luminescent color are diagonally arranged；
LED luminescence chip includes the pole A and the pole B, and the polarity of the pole A and the pole B is opposite；
At least in one-row pixels unit, the pole A of at least one similar LED luminescence chip links together, and with the corresponding pole A
Pin connection；And/or
In an at least column pixel unit, the pole B of at least one similar LED luminescence chip links together, and with the corresponding pole B
Pin electrical connection.
The embodiment of the utility model is illustrated below by some specific examples of embodiment, the utility model is implemented
In example and subsequent embodiment, it is equal to 2 with m and n, with the cathode of A extremely LED luminescence chip, the anode of B extremely LED luminescence chip
For, the embodiment of the utility model is illustrated.It should be noted that n and m may be greater than or the positive integer equal to 2,
LED luminescence chip is also possible to A extremely anode, and B extremely cathode equally can be realized the technical solution of the utility model, herein
It repeats no more.
Fig. 3 is the schematic diagram of LED display unit group provided by the embodiment of the utility model, as shown in figure 3, the LED is shown
Unit group 100 includes four pixel unit P of 2 × 2 array arrangements, this four pixel units are also referred to as physical picture element unit.Often
A physical picture element unit includes four LED luminescence chips in 2 × 2 array arrangements, respectively a first kind LED luminescence chip
101,102, third class LED luminescence chips 103 of a second class LED luminescence chip and a 4th class LED luminescence chip
104, four LED luminescence chips tool is there are three types of different luminescent colors, in each pixel unit P, two LED of identical luminescent color
Luminescence chip is diagonally arranged, illustratively, 104 luminescent color of first kind LED luminescence chip 101 and the 4th class LED luminescence chip
It is identical, and diagonal setting.In each pixel unit, the arrangement position of LED luminescence chip is identical.
The circuit connecting mode of LED luminescence chip can be as shown in Fig. 4 to Figure 13 in LED display unit group.
Fig. 4 is a kind of internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment, optionally,
As shown in figure 4, the cathode of two kinds of similar LED luminescence chips is correspondingly connected with together in every row pixel unit, and with corresponding yin
The connection of pole pin；In each column pixel unit, the anode of a similar LED luminescence chip links together, and draws with corresponding anode
Foot electrical connection.Illustratively, in every row pixel unit, the yin of two first kind LED luminescence chips 101 links together, and with
The corresponding negative electrode pin N1 of first kind LED luminescence chip 101 is electrically connected in the column pixel unit, the luminous core of two the second class LED
The yin of piece 102 links together, and negative electrode pin N2 corresponding with the second class LED luminescence chip 102 in column pixel unit electricity
Connection, the cathode of remaining LED luminescence chip are electrically connected with the negative electrode pin N of corresponding LED luminescence chip；Two in each column pixel unit
The anode of a first kind LED luminescence chip 101 links together, and with first kind LED luminescence chip 101 in the column pixel unit
Corresponding negative electrode pin M1 electrical connection；The anode of remaining LED luminescence chip is electrically connected with the negative electrode pin M of the LED luminescence chip.
In this way, the LED display unit group 100 includes 12 negative electrode pins and 14 negative electrode pins, totally 26 pins.
Fig. 5 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment, optional
, as shown in figure 5, the cathode of four LED luminescence chips of each pixel unit links together in every row pixel unit, and with
The corresponding negative electrode pin N2 electrical connection of row pixel unit is corresponded to, i.e., the cathode of all LED luminescence chips connects in every row pixel unit
It connects on the same negative electrode pin N2.In each column pixel unit, anode and the LED luminescence chip of each LED luminescence chip
Negative electrode pin M electrical connection, i.e., each LED luminescence chip are correspondingly arranged on a negative electrode pin M.In this way, the LED display unit group
100 include 2 negative electrode pins and 16 negative electrode pins, totally 18 pins.
Fig. 6 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment, optional
, as shown in fig. 6, the cathode of four LED luminescence chips of each pixel unit links together in every row pixel unit, and with
The corresponding negative electrode pin N2 electrical connection of row pixel unit is corresponded to, i.e., the cathode of all LED luminescence chips connects in every row pixel unit
It connects on the same negative electrode pin N2.In each column pixel unit, a kind of anode of similar LED luminescence chip links together.Show
Example property, the anode of two first kind LED luminescence chips 101 links together in each column pixel unit, and with the column pixel list
The corresponding negative electrode pin M1 of first kind LED luminescence chip 101 is electrically connected in member；The anode of remaining LED luminescence chip and corresponding LED
The negative electrode pin M of luminescence chip is electrically connected.In this way, the LED display unit group 100 includes that 2 negative electrode pins and 14 anodes draw
Foot, totally 16 pins.
Fig. 7 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment, optional
, as shown in fig. 7, the cathode of four LED luminescence chips of each pixel unit links together in every row pixel unit, and with
The corresponding negative electrode pin N2 electrical connection of row pixel unit is corresponded to, i.e., the cathode of all LED luminescence chips connects in every row pixel unit
It connects on the same negative electrode pin N2.In each column pixel unit, the anode of two kinds of similar LED luminescence chips is correspondingly connected with one
It rises.Illustratively, the anode of two first kind LED luminescence chips 101 links together, and with the first kind in the column pixel unit
The corresponding negative electrode pin M1 of LED luminescence chip 101 electrical connection；The anode of two the second class LED luminescence chips 102 is connected to one
It rises, and negative electrode pin M2 corresponding with the second class LED luminescence chip 102 in the column pixel unit is electrically connected；Remaining LED shines core
The anode of piece is electrically connected with the negative electrode pin M of corresponding LED luminescence chip.In this way, the LED display unit group 100 includes 2 cathodes
Pin and 12 negative electrode pins, totally 14 pins.
Fig. 8 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment, optional
, as shown in figure 8, the cathode of four LED luminescence chips of each pixel unit links together in every row pixel unit, and with
The corresponding negative electrode pin N2 electrical connection of row pixel unit is corresponded to, i.e., the cathode of all LED luminescence chips connects in every row pixel unit
It connects on the same negative electrode pin N2.In each column pixel unit, the anode of three kinds of similar LED luminescence chips is correspondingly connected with one
It rises.Illustratively, the anode of two first kind LED luminescence chips 101 links together, and with the first kind in the column pixel unit
The corresponding negative electrode pin M1 of LED luminescence chip 101 electrical connection；The anode of two the second class LED luminescence chips 102 is connected to one
It rises, and negative electrode pin M2 corresponding with the second class LED luminescence chip 102 in the column pixel unit is electrically connected；Two third class LED
The anode of luminescence chip 103 links together, and anode corresponding with third class LED luminescence chip 103 in the column pixel unit
Pin M3 electrical connection；The anode of remaining LED luminescence chip is electrically connected with the negative electrode pin M of corresponding LED luminescence chip.In this way, should
LED display unit group 100 includes 2 negative electrode pins and 10 negative electrode pins, totally 12 pins.
Fig. 9 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment, optional
, as shown in figure 9, the cathode of four LED luminescence chips of each pixel unit links together in every row pixel unit, and with
The corresponding negative electrode pin N2 electrical connection of row pixel unit is corresponded to, i.e., the cathode of all LED luminescence chips connects in every row pixel unit
It connects on the same negative electrode pin N2.In each column pixel unit, the anode of two first kind LED luminescence chips 101 is correspondingly connected with
Together, and negative electrode pin M1 corresponding with first kind LED luminescence chip 101 in the column pixel unit is electrically connected；Two second
The anode of class LED luminescence chip 102 links together, and corresponding with the second class LED luminescence chip 102 in the column pixel unit
Negative electrode pin M2 electrical connection；The anode of two third class LED luminescence chips 103 links together, and in the column pixel unit
The corresponding negative electrode pin M3 of third class LED luminescence chip 103 electrical connection；The anode connection of two the 4th class LED luminescence chips 104
Together, and negative electrode pin M4 corresponding with the 4th class LED luminescence chip 104 in the column pixel unit is electrically connected.In this way, should
LED display unit group 100 includes 2 negative electrode pins and 8 negative electrode pins, totally 10 pins.
Figure 10 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment, optional
, as shown in Figure 10, the cathode of all LED luminescence chips links together in each pixel unit, and with the pixel unit pair
The negative electrode pin N3 electrical connection answered, i.e., each pixel unit are correspondingly arranged on a negative electrode pin N3.In each column pixel unit, one
The anode of the similar LED luminescence chip of kind links together.Illustratively, the luminous core of two first kind LED in each column pixel unit
The anode of piece 101 links together, and negative electrode pin M1 corresponding with first kind LED luminescence chip 101 in the column pixel unit
Electrical connection；The anode of remaining LED luminescence chip is electrically connected with the negative electrode pin M of corresponding LED luminescence chip.In this way, the LED is shown
Unit group 100 includes 4 negative electrode pins and 14 negative electrode pins, totally 18 pins.
Figure 11 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment, optional
, as shown in figure 11, the cathode of all LED luminescence chips links together in each pixel unit, and with the pixel unit pair
The negative electrode pin N3 electrical connection answered, i.e., each pixel unit are correspondingly arranged on a negative electrode pin N3.In each column pixel unit, two
The anode of the similar LED luminescence chip of kind is correspondingly connected with together.Illustratively, the anode of two first kind LED luminescence chips 101
It links together, and negative electrode pin M1 corresponding with first kind LED luminescence chip 101 in the column pixel unit is electrically connected；Two
The anode of second class LED luminescence chip 102 links together, and right with the second class LED luminescence chip 102 in the column pixel unit
The negative electrode pin M2 electrical connection answered；The anode of remaining LED luminescence chip is electrically connected with the negative electrode pin M of corresponding LED luminescence chip.
In this way, the LED display unit group 100 includes 4 negative electrode pins and 12 negative electrode pins, totally 16 pins.
Figure 12 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment, optional
, as shown in figure 12, the cathode of all LED luminescence chips links together in each pixel unit, and with the pixel unit pair
The negative electrode pin N3 electrical connection answered, i.e., each pixel unit are correspondingly arranged on a negative electrode pin N3.In each column pixel unit, three
The anode of the similar LED luminescence chip of kind is correspondingly connected with together.Illustratively, the anode of two first kind LED luminescence chips 101
It links together, and negative electrode pin M1 corresponding with first kind LED luminescence chip 101 in the column pixel unit is electrically connected；Two
The anode of second class LED luminescence chip 102 links together, and right with the second class LED luminescence chip 102 in the column pixel unit
The negative electrode pin M2 electrical connection answered；The anode of two third class LED luminescence chips 103 links together, and with the column pixel list
The corresponding negative electrode pin M3 of third class LED luminescence chip 103 is electrically connected in member；The anode of remaining LED luminescence chip and corresponding LED
The negative electrode pin M of luminescence chip is electrically connected.In this way, the LED display unit group 100 includes that 4 negative electrode pins and 10 anodes draw
Foot, totally 14 pins.
Figure 13 is another internal circuit configuration schematic diagram of LED display unit group in the utility model embodiment, optional
, as shown in figure 13, the cathode of all LED luminescence chips links together in each pixel unit, and with the pixel unit pair
The negative electrode pin N3 electrical connection answered, i.e., each pixel unit are correspondingly arranged on a negative electrode pin N3.In each column pixel unit, two
The anode of a first kind LED luminescence chip 101 links together, and with first kind LED luminescence chip 101 in the column pixel unit
Corresponding negative electrode pin M1 electrical connection；The anode of two the second class LED luminescence chips 102 links together, and with the column pixel
The corresponding negative electrode pin M2 electrical connection of second class LED luminescence chip 102 in unit；The sun of two third class LED luminescence chips 103
Pole links together, and negative electrode pin M3 corresponding with third class LED luminescence chip 103 in the column pixel unit is electrically connected；Two
The anode of a 4th class LED luminescence chip 104 links together, and with the 4th class LED luminescence chip 104 in the column pixel unit
Corresponding negative electrode pin M4 electrical connection.In this way, the LED display unit group 100 includes 4 negative electrode pins and 8 negative electrode pins, altogether
12 pins.
It should be noted that the circuit connecting mode of LED luminescence chip is practical new to this in above-mentioned LED display unit group
The exemplary illustration of type, those skilled in the art can carry out various apparent variations and adjustment to connection type in foregoing circuit
Without departing from the protection scope of the utility model.
Figure 14 is a kind of front wiring figure of LED display unit group provided by the embodiment of the utility model, and Figure 15 is Figure 14
The back wiring figure of middle LED display unit group, the internal circuit configuration of the LED display unit group as shown in the utility model Fig. 9,
Optionally, with reference to Figure 14 and Figure 15, each pixel unit further includes 120, first anode pads of a common cathode pad
121,122, third anode pads 123 of a second plate pad and the 4th anode bond pad 124；The wherein first kind
LED luminescence chip 101 and the luminescent color having the same of the 4th class LED luminescence chip 104, and diagonal setting.
Common cathode pad 120, first anode pad 121, second plate pad 122, third anode pad 123 and the 4th sun
Pole pad 124 is formed in the front of an insulating substrate 110；Negative electrode pin and negative electrode pin are formed in the back side of insulating substrate 110.
The cathode of four LED luminescence chips is connected on common cathode pad, first kind LED luminescence chip 101, the second class
The anode of LED luminescence chip 102, third class LED luminescence chip 103 and the 4th class LED luminescence chip 104 is connected to first
In anode bond pad 121, second plate pad 122, third anode pad 123 and the 4th anode bond pad 124.
Optionally, in each pixel unit, at least one LED luminescence chip is flip-chip, the cathode of flip LED chips
It is located at the side opposite with LED luminescence chip emission side with anode.Illustratively, as shown in figure 14, four LED luminescence chips are equal
For flip-chip, first kind LED luminescence chip 101, the second class LED luminescence chip 102, third class LED luminescence chip 103 and
The cathode of four class LED luminescence chips 104 is separately fixed on common cathode pad 120, first kind LED luminescence chip 101, the second class
The anode of LED luminescence chip 102, third class LED luminescence chip 103 and the 4th class LED luminescence chip 104 is separately fixed at first
In anode bond pad 121, second plate pad 122, third anode pad 123 and the 4th anode bond pad 124.Specifically, LED shines
The electrode of chip can be fixed on corresponding pad by conductive materials such as conductive silver glue or tin creams.
4 and Figure 15 are continued to refer to figure 1, in one-row pixels unit, the common cathode pad 120 of two pixel units is electrically connected
It connects, and negative electrode pin N3 corresponding with the row pixel unit is electrically connected；
In same row pixel unit, the first anode pad 121 of two pixel units is electrically connected, and with the column pixel unit
The first anode pin M1 electrical connection；The second plate pad 122 of two pixel units is electrically connected, and with the column pixel unit
Second plate pin M2 electrical connection；The third anode pad 123 of two pixel units is electrically connected, and the with the column pixel unit
Three negative electrode pin M3 electrical connection；The 4th anode bond pad 124 electrical connection of two pixel units, and the with the column pixel unit the 4th
Negative electrode pin M4 electrical connection；2 negative electrode pins and 8 negative electrode pins are located on the back side of insulating substrate 110.
Optionally, common cathode pad 120, first anode pad 121, second plate pad 122, third anode pad 123
By metallic vias, pin directly corresponding with 110 back side of insulating substrate is located at is electrically connected with the 4th anode bond pad 124, or is passed through
Metallic vias and draw positioned at the metal routing at the front of insulating substrate 110 and/or the back side with positioned at 110 back side of insulating substrate is corresponding
Foot electrical connection.
Illustratively, with reference to Figure 14 and Figure 15, in every row pixel unit:
The common cathode pad 120 of two pixel units is by being located at the positive first front metal cabling of insulating substrate 110
131 connections, common cathode pad 120 extend to the back side of insulating substrate 110 by metallic vias, and by being located at insulating substrate
The negative electrode pin N3 connection corresponding with the row pixel unit of the first back metal cabling 141 at 110 back sides.
In first row pixel unit:
Positioned at the first anode pad 121, third anode pad 123 and the 4th anode bond pad 124 of the first row pixel unit
The back side of insulating substrate 110 is extended to by metallic vias respectively, and is carried on the back respectively by being located at the second of 110 back side of insulating substrate
Face metal routing 142, third back metal cabling 143 and the 4th back metal cabling 144 respectively with the column pixel unit
One negative electrode pin M1, third anode pin M3 and the 4th negative electrode pin M4 connection, positioned at the first sun of the pixel unit of the second row
Pole pad 121, third anode pad 123 and the 4th anode bond pad 124 respectively by metallic vias directly with the column pixel unit
First anode pin M1, third anode pin M3 and the 4th negative electrode pin M4 connection；
Positioned at the first row pixel unit second plate pad 122 by metallic vias directly with the column pixel unit the
Two negative electrode pin M2 connections, the second plate pad 122 positioned at the second row pixel unit extend to insulation base by metallic vias
The back side of plate 110, and the of the 5th back metal cabling 145 by being located at 110 back side of insulating substrate and the column pixel unit
Two negative electrode pin M2 connections.
In secondary series pixel unit:
Positioned at the first anode pad 121, second plate pad 122 and the 4th anode bond pad of the pixel unit of the first row
124 is directly positive with first anode pin M1, the second plate pin M2 of the column pixel unit and the 4th by metallic vias respectively
Pole pin M4 connection；Positioned at the first anode pad 121, second plate pad 122 and the 4th anodic bonding of the second row pixel unit
Disk 124 extends to the back side of insulating substrate 110 by metallic vias respectively, and respectively by being located at 110 back side of insulating substrate
6th back metal cabling 146, the 7th back metal cabling 147 and the 8th back metal cabling 148 respectively with the column pixel list
First anode pin M1, the second plate pin M2 of member and the 4th negative electrode pin M4 connection,
The back of insulating substrate 110 is extended to by metallic vias positioned at the third anode pad 123 of the first row pixel unit
Face, and the third anode pin of the 9th back metal cabling 149 and the column pixel unit by being located at 110 back side of insulating substrate
M3 connection；Positioned at the second row pixel unit third anode pad 123 by metallic vias directly with the column pixel unit the
Three negative electrode pin M3 connections.
The back wiring figure that a kind of feasible LED display unit group is only shown in Figure 15, in fact, also can according to need
Other wire laying modes are set, back metal cabling and Pin locations can be carried out for a person skilled in the art various bright
Aobvious variation and readjustment is without departing from the protection scope of the utility model.
Optionally, the luminescent color of four LED luminescence chips is respectively selected from any one of red, green and blue, and two
The luminescent color of the LED luminescence chip of a identical luminescent color is red.The LED of two identical luminescent colors why is selected to send out
Optical chip is emitting red light chip, is because the brightness of emitting red light chip is weaker relative to green and blue luminescence chip two
A emitting red light chip is used to improve the brightness of red light, reaches the white balance of display panel.Certainly, according to the actual situation, two
The luminescent color of the LED luminescence chip of a identical luminescent color is also possible to green or blue.
It connects and is filled with the first insulating materials in the metallic vias of pad and pin, the first insulating materials includes resin (PCB
A kind of common vinyl ester resin of industry) or green oil, the upper and lower surface without departing from insulating substrate 110 of the first insulating materials,
Filling in this way is advantageous in that when the encapsulation of device below, reinforces the binding force of packaging plastic and insulating substrate 110, improves close
Sealing property.
The back side of insulating substrate 110 is equipped with the second insulating materials (not shown), and the covering of the second insulating materials is located at exhausted
The back metal cabling at 110 back side of edge substrate, the second insulating materials include white oil, resin or green oil etc., play insulation and protection
Effect.
Figure 16 is a kind of schematic diagram for LED display panel that the utility model embodiment two provides, and as shown in figure 16, this is aobvious
Show that panel includes the array that LED display unit group 100 is formed as shown in several Figure 14.In this way, in the calculation of system software
Under method, adjacent physical picture element unit P forms new pixel unit P ', any two are adjacent by sharing LED luminescence chip
(including two neighboring physical picture element on two physical picture element unit P and column direction adjacent on line direction in physical picture element unit P
Unit P), adjacent LED luminescence chip forms a new pixel unit P '.As shown in figure 15, on line direction, adjacent two
In physical picture element unit P, the second class LED luminescence chip 102 of one of physical picture element unit and the 4th class LED luminescence chip
104 is new with first kind LED luminescence chip 101 and third class LED luminescence chip 103 formation one of another physical picture element unit
Pixel unit P '；On column direction, in two adjacent physical picture element units, the third class of one of physical picture element unit
The first kind LED luminescence chip of LED luminescence chip 103 and the 4th class LED luminescence chip 104 and another physical picture element unit
101 and second class LED luminescence chip 102 formed a new pixel unit P '.In this way, 2 × 2 gusts of composition that any four are adjacent
The LED luminescence chip of column arrangement forms a pixel unit, is reduced to the pixel unit spacing that can be presented on display panel not
The half of point spacing when co-used chip reaches pixel unit number and realizes multiplication in same space, improves LED display surface
The resolution of plate.
In addition, LED display panel is made of multiple LED display unit groups of array arrangement, when forming display panel, need
The pin of multiple LED display unit groups is fixed on pcb board.The utility model embodiment is by by n × m pixel unit
Encapsulate together, at least in one-row pixels unit, the pole A of at least one similar LED luminescence chip links together, and with corresponding A
The connection of pole pin；And/or in an at least column pixel unit, the pole B of at least one similar LED luminescence chip links together, and with
The electrical connection of the corresponding pole B pin, increase the volume of single display unit group, reduces to be fixed to connecting on pcb board with pcb board
Pin number facilitates fixed operation, improves fixed efficiency.
LED display unit group provided by the embodiment of the utility model, each pixel unit include in 2 × 2 array arrangements
Four LED luminescence chips, four LED luminescence chips tool is there are three types of different luminescent colors, in each pixel unit, identical luminous face
Two LED luminescence chips of color are diagonally arranged, which is applied to LED display panel, in the display panel, appoint
The LED luminescence chip of four adjacent 2 × 2 array arrangements of composition of meaning forms a pixel unit, so that adjacent pixel unit
Spacing is reduced, and the resolution of display panel is higher, and image information is richer, apparent, and visual effect is more preferable.In addition, being formed
When display panel, facilitate fixed operation, improves fixed efficiency.
The utility model embodiment additionally provides any institute in a kind of display panel, including the utility model above-described embodiment
The LED display unit group stated.Illustratively, Figure 16 is a kind of signal of LED display panel provided by the embodiment of the utility model
Figure.
Note that above are only the preferred embodiment and institute's application technology principle of the utility model.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, is able to carry out for a person skilled in the art various bright
Aobvious variation, readjustment and substitution is without departing from the protection scope of the utility model.Therefore, although passing through above embodiments
The utility model is described in further detail, but the utility model is not limited only to above embodiments, is not departing from
It can also include more other equivalent embodiments in the case that the utility model is conceived, and the scope of the utility model is by appended
Scope of the claims determine.
Claims (13)
1. a kind of LED display unit group characterized by comprising
The pixel unit array being made of n row, m column pixel unit, n and m are the positive integer more than or equal to 2；
Each pixel unit includes four LED luminescence chips in 2 × 2 array arrangements, and respectively first kind LED shines core
Piece, the second class LED luminescence chip, third class LED luminescence chip and the 4th class LED luminescence chip, four LED luminescence chips
There are three types of different luminescent colors for tool；In each pixel unit, two LED luminescence chips of identical luminescent color are diagonally set
It sets；
LED luminescence chip includes the pole A and the pole B, and the polarity of the pole A and the pole B is opposite；
At least in one-row pixels unit, the pole A of at least one similar LED luminescence chip links together, and with the corresponding pole A pin
Connection；And/or
In an at least column pixel unit, the pole B of at least one similar LED luminescence chip links together, and with the corresponding pole B pin
Electrical connection.
2. display unit group according to claim 1, which is characterized in that in every row pixel unit, at least one similar LED hair
The pole A of optical chip links together, and connects with the corresponding pole A pin.
3. display unit group according to claim 1, which is characterized in that each LED luminescence chip in each column pixel unit
The pole B be electrically connected with the pole the B pin of the LED luminescence chip.
4. display unit group according to claim 1, which is characterized in that in each column pixel unit, at least one similar LED hair
The pole B of optical chip links together, and is electrically connected with the corresponding pole B pin in the column pixel unit.
5. display unit group according to claim 3 or 4, which is characterized in that the luminous core of all LED in each pixel unit
The pole A of piece links together, and A corresponding with pixel unit pole pin is electrically connected.
6. display unit group according to claim 1, which is characterized in that each pixel unit further includes a total A
Pole pad, the first pole a B pad, the 2nd pole a B pad, the 3rd pole a B pad and the 4th pole a B pad；Wherein
First kind LED luminescence chip and the 4th class LED luminescence chip luminescent color having the same；
The total pole the A pad, the first pole B pad, the 2nd pole B pad, the 3rd pole B pad and the 4th pole B pad are formed in one absolutely
The front of edge substrate；The pole A pin and the pole B pin are formed in the back side of the insulating substrate；
The pole A of four LED luminescence chips is connected on the total pole the A pad, the first kind LED luminescence chip,
The pole B of two class LED luminescence chips, third class LED luminescence chip and the 4th class LED luminescence chip is connected to the first B
On pole pad, the 2nd pole B pad, the 3rd pole B pad and the 4th pole B pad.
7. display unit group according to claim 6, which is characterized in that in each pixel unit:
At least one LED luminescence chip is flip-chip, and the pole A and the pole B of the flip LED chips are located to shine with the LED
The opposite side in chip light emitting side；
The pole A of the flip LED luminescence chip is fixed on the total pole the A pad, and the pole B is fixed on the pad of the corresponding pole B.
8. display unit group according to claim 7, which is characterized in that in each pixel unit:
Four LED luminescence chips are flip-chip, the first kind LED luminescence chip, the second class LED luminescence chip, third class
The pole A of LED luminescence chip and the 4th class LED luminescence chip is separately fixed on the total pole the A pad, the first kind LED hair
Optical chip, the second class LED luminescence chip, third class LED luminescence chip and the 4th class LED luminescence chip the pole B be separately fixed at
On first pole B pad, the 2nd pole B pad, the 3rd pole B pad and the 4th pole B pad.
9. display unit group according to claim 8, which is characterized in that
In i-th row pixel unit, the total pole the A pad electrical connection of m pixel unit, and i-th with the LED display unit group
The electrical connection of the pole A pin；
In jth column pixel unit, the first pole the B pad electrical connection of n pixel unit, and the jth with the LED display unit group
A first pole B pin electrical connection；The 2nd pole the B pad electrical connection of n pixel unit, and the jth with the LED display unit group
A 2nd pole B pin electrical connection；The 3rd pole the B pad electrical connection of n pixel unit, and the jth with the LED display unit group
A 3rd pole B pin electrical connection；The 4th pole the B pad electrical connection of n pixel unit, and the jth with the LED display unit group
A 4th pole B pin electrical connection；
N A pole pin and the 4m pole B pin are located on the back side of the insulating substrate；
Wherein, 1≤i≤n, 1≤j≤m, i, j are integer.
10. LED display unit group according to claim 9, which is characterized in that the n=2, m=2；The total pole the A pad,
First pole B pad, the 2nd pole B pad, the 3rd pole B pad and the 4th pole B pad are by metallic vias directly and positioned at described exhausted
The corresponding pin electrical connection of edge substrate back, or the gold by metallic vias and positioned at the insulating substrate front and/or the back side
Belong to cabling copolar pin corresponding with the insulating substrate back side is located at or the pole B pin is electrically connected.
11. LED display unit group according to claim 10, which is characterized in that in every row pixel unit:
The total pole the A pad of two pixel units is connected by being located at the positive first front metal cabling of the insulating substrate, institute
The back side that the total pole A pad extends to the insulating substrate by metallic vias is stated, and by being located at the insulating substrate back side
The pole the A pin connection corresponding with the row pixel unit of first back metal cabling.
12. LED display unit group according to claim 1, which is characterized in that the luminous face of four LED luminescence chips
Color is respectively selected from any one of red, green and blue, and the luminescent color of the LED luminescence chip of two identical luminescent colors is
It is red.
13. a kind of display panel, which is characterized in that including any LED display unit group of claim 1-12.
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| CN201821137709.6U CN208460766U (en) | 2018-07-17 | 2018-07-17 | A kind of LED display unit group and display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108831903A (en) * | 2018-07-17 | 2018-11-16 | 佛山市国星光电股份有限公司 | A kind of LED display unit group and display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108831903A (en) * | 2018-07-17 | 2018-11-16 | 佛山市国星光电股份有限公司 | A kind of LED display unit group and display panel |
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