CN102013219A - Led display board and led display - Google Patents
Led display board and led display Download PDFInfo
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- CN102013219A CN102013219A CN201010613355XA CN201010613355A CN102013219A CN 102013219 A CN102013219 A CN 102013219A CN 201010613355X A CN201010613355X A CN 201010613355XA CN 201010613355 A CN201010613355 A CN 201010613355A CN 102013219 A CN102013219 A CN 102013219A
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Abstract
The invention discloses an LED display board and an LED display. The LED display board comprises a circuit board (1), one or more driving chips (2) and one or more LED lamps (3), wherein a die (21) of each driving chip (2) is directly loaded on the first outer surface of the circuit board (1) or is embedded in the circuit board (1) for processing the received data signal; and a wick (31) of each LED lamp (3) is directly loaded on the second outer surface of the circuit board (1) for receiving and displaying the processed data signal. The invention can realize the LED display device with higher resolution and integration level, simultaneously effectively reduces the probability of deformation of the circuit board and reduces the negative effects caused by welding.
Description
Technical field
The present invention relates to a kind of LED display board and light-emitting diode display.
Background technology
Existing LED display device comprises the substrate of a circuit board 1 (PCB) and is arranged on components and parts on two skins of this substrate, one of them skin is to be connected on the pcb board material as the mode of independent packing forms by welding by the LED lamp, another skin by the connector of constant-current driven chip and various data-signals be welded in circuit board 1 (PCB) go up this two skins simultaneously again circuit by circuit board 1 (PCB) middle layer is connected realize the inside connection with realize Presentation Function being connected of peripheral circuit.
Fig. 1 is the structural representation according to the LED display board of correlation technique; Fig. 2 is the structural representation according to the chip for driving in the LED display board of correlation technique; Fig. 3 is the structural representation according to the LED lamp in the LED display board of correlation technique.
As depicted in figs. 1 and 2, in the prior art LED display device is that chip for driving tube core 21 with single chip for driving 2 is connected on the chip for driving leg 6 by chip for driving pin leads 22 substantially, and then is welded on by chip for driving leg 6 and realizes on the circuit board 1.Because it is big that the requirement of welding technology, the PCB encapsulation welding tray of chip for driving 2 require to do, otherwise can't finish good welding, and present PCB processing technology also can not be accomplished very little precision.So just limited the realization of high density, closely spaced LED display device.
As shown in figures 1 and 3, use the mostly development and differentiation on the Discrete device packaging technical foundation of LED encapsulation technology in the LED lamp in the prior art, the crystal of the LED wick 31 on the LED lamp 3 can be welded on the circuit board 1 by LED leg 7.Because this design makes that the outline packages of LED lamp is bigger, and can't produce the LED lamp encapsulation of smaller szie, make and on the unit area that can't be implemented under the situation that LED encapsulates separately on the circuit board 1, more LED lamp is installed, limited the closely spaced realization of LED display device.
Simultaneously, because present technology is to be welded on the electronic circuit board surface with Individual components, wiring board local heating difference causes the wiring board distortion like this, and adopts solder technology can cause as warpage, leaks bad problems such as welding, connect weldering.
At present, cause to realize the high problem of LED display device, cost of manufacture of high integration, do not propose effective solution at present as yet at correlation technique LED lamp and chip for driving need be welded on the circuit board by leg.
Summary of the invention
At correlation technique LED lamp and chip for driving need be welded on the circuit board by leg, cause to realize the high problem of LED display device, cost of manufacture of high integration, do not propose effective problem as yet at present and propose the present invention, for this reason, fundamental purpose of the present invention is to provide a kind of LED display board and light-emitting diode display, to address the above problem.
To achieve these goals, according to an aspect of the present invention, provide a kind of LED display board, this LED display board comprises: circuit board; One or more chip for driving directly are loaded in the chip for driving tube core of each chip for driving on first outside surface of circuit board or are embedded in the circuit board, are used to handle the data-signal that receives; One or more LED lamps directly are loaded in the LED wick of each LED lamp on second outside surface of circuit board, be used to receive and display process after data-signal.
Further, chip for driving comprises: the chip for driving tube core, and external on first outside surface of circuit board; One or more chip for driving pin leads, first end of each chip for driving pin leads is connected with the chip for driving tube core, and second end directly is connected so that the chip for driving tube core directly is loaded on first outside surface with circuit board.
Further, second end of each chip for driving pin leads is connected with the circuit junction of circuit board inside by the metal connection.
Further, chip for driving comprises: the chip for driving tube core is embedded in the circuit board; One or more chip for driving pin leads, first end of each chip for driving pin leads is connected with the chip for driving tube core, and second end is connected with the circuit junction of circuit board inside.
Further, the LED lamp comprises: the LED wick, and external on second outside surface of circuit board; One or more LED wick pin leads, first end of each LED wick pin leads is connected with the LED wick, and second end directly is connected so that the LED wick directly is loaded on second outside surface with circuit board.
Further, second end of each LED wick pin leads is connected with the circuit junction of circuit board inside by the metal connection.
Further, one or more LED lamps are distributed on second outside surface of circuit board according to preset space length.
Further, preset space length is smaller or equal to 2mm.
Further, the LED display board also comprises: connector, first end of connector are connected on first outside surface of circuit board, and second end is connected with external unit to receive data-signal, and data-signal comprises viewdata signal and image control signal.
Further, the LED display board also comprises: the chip for driving packaging system, be loaded on first outside surface of circuit board, and be used to encapsulate chip for driving; LED lamp packaging system is loaded on second outside surface of circuit board, is used for the packaged LED lamp.
To achieve these goals, according to a further aspect in the invention, provide a kind of light-emitting diode display, this light-emitting diode display comprises above-mentioned any one LED display board.
By the present invention, adopt circuit board; One or more chip for driving directly are loaded in the chip for driving tube core of each chip for driving on first outside surface of circuit board or are embedded in the circuit board, are used to handle the data-signal that receives; One or more LED lamps, the LED wick of each LED lamp directly is loaded on second outside surface of circuit board, be used to receive and display process after data-signal, the LED lamp and the chip for driving that have solved correlation technique need be welded on the circuit board by leg, cause to realize the high problem of LED display device, cost of manufacture of high integration, and then saved the space of electronic circuit, realized more high resolving power, the effect of the LED display device of high integration more.Simultaneously, effectively reduce the probability of circuit board distortion, also reduced the harmful effect that welding brings.
Description of drawings
Accompanying drawing described herein is used to provide further understanding of the present invention, constitutes the application's a part, and illustrative examples of the present invention and explanation thereof are used to explain the present invention, do not constitute improper qualification of the present invention.In the accompanying drawings:
Fig. 1 is the structural representation according to the LED display board of correlation technique;
Fig. 2 is the structural representation according to the chip for driving in the LED display board of correlation technique;
Fig. 3 is the structural representation according to the LED lamp in the LED display board of correlation technique;
Fig. 4 is the structural representation according to the LED display board of the embodiment of the invention one;
Fig. 5 is the structural representation according to the LED display board of the embodiment of the invention two;
Fig. 6 is the structural representation according to the chip for driving in the embodiment of the invention one or two the LED display board;
Fig. 7 is the structural representation according to the LED display board of the embodiment of the invention three; And
Fig. 8 is the structural representation according to the LED lamp in the embodiment of the invention one or three the LED display board.
Embodiment
Need to prove that under the situation of not conflicting, embodiment and the feature among the embodiment among the application can make up mutually.Describe the present invention below with reference to the accompanying drawings and in conjunction with the embodiments in detail.
Fig. 4 is the structural representation according to the LED display board of the embodiment of the invention one.As shown in Figure 4, this LED display board comprises: circuit board 1; One or more chip for driving 2 directly are loaded in the chip for driving tube core 21 of each chip for driving 2 on first outside surface of circuit board 1 or are embedded in the circuit board 1, are used to handle the data-signal that receives; One or more LED lamps 3 directly are loaded in the LED wick 31 of each LED lamp 3 on second outside surface of circuit board 1, be used to receive and display process after data-signal.
Be implemented in the chip for driving tube core 21 that directly connects each chip for driving 2 on PCB circuit board 1 first outside surface in the above embodiment of the present invention, and do not need by other medium chip for driving tube core 21 to be connected on this first outside surface, perhaps directly this chip for driving 2 is built in the circuit board 1, also the wick of each LED lamp 3 can be installed directly on second outside surface of circuit board 1 simultaneously, and not need LED wick 31 to be connected on this second outside surface by other medium.By above-mentioned implementation, owing to saved subelement, making on the circuit board 1 can highdensity integrated more chip for driving 2 and LED lamp 3, has improved the service efficiency of circuit board 1, has promptly realized more high resolving power, the LED display device of high integration more.
Because the present invention has replaced in traditional prior art, use solder technology that the chip for driving tube core 21 of chip for driving 2 and/or the LED wick 31 of LED lamp 3 are connected on the circuit board 1, therefore, avoided welding, connect problems such as weldering owing to weld the warpage, the leakage that cause, also avoided circuit board 1 because the problem on deformation that solder technology causes makes the radiating surface of entire circuit plate 1 as the device heat.
The chip for driving of using in the embodiment of the invention one 2 can comprise: chip for driving tube core 21, and external on first outside surface of circuit board 1; One or more chip for driving pin leads 22, first end of each chip for driving pin leads 22 is connected with chip for driving tube core 21, and second end directly is connected so that chip for driving tube core 21 directly is loaded on first outside surface with circuit board 1.Preferably, second end of each chip for driving pin leads 22 connects by metal and is connected with the circuit junction of circuit board 1 inside, and wherein, it can be that the spun gold weldering connects or the high temperature compacting that this metal connects.Adopt the metal interconnection technique to make chip for driving tube core 21 be connected among this embodiment with circuit board 1, this embodiment has reduced the thickness of circuit board 1, improved the degree of accuracy of technology, and because tie point is little, effectively saved the space of circuit board 1, avoided the pin leads of chip for driving tube core 21 to be drawn pin simultaneously, effectively reduced owing to drawing the problems of Signal Integrity that pin electric capacity, inductive effect cause.
The chip for driving of using in the embodiment of the invention one 2 also can be to comprise: chip for driving tube core 21 is embedded in the circuit board 1; One or more chip for driving pin leads 22, first end of each chip for driving pin leads 22 is connected with chip for driving tube core 21, and second end is connected with the circuit junction of circuit board 1 inside.This chip for driving tube core 21 is embedded in the circuit board 1, makes the thickness of circuit board 1 reduce, saved the space on circuit board 1 surface simultaneously.
Preferably, the LED lamp 3 in the above embodiment of the present invention one can comprise: LED wick 31, and external on second outside surface of circuit board 1; One or more LED wick pin leads 32, first end of each LED wick pin leads 32 is connected with LED wick 31, and second end directly is connected so that LED wick 31 directly is loaded on second outside surface with circuit board 1.Preferably, second end of each LED wick pin leads 32 connects by metal and is connected with the circuit junction of circuit board 1 inside, and wherein, it can be that the spun gold weldering connects or the high temperature compacting that this metal connects.This embodiment makes the distance between each LED lamp 3 dwindle, and realizes the more LED lamp 3 of can arranging on the circuit board 1, has improved the pixel and the resolution of equipment.
One or more LED lamps 3 in this embodiment one can be distributed in according to preset space length on second outside surface of circuit board 1.Preferably, this preset space length is in the scope smaller or equal to 2mm.
The LED display board of the above embodiment of the present invention can also comprise: connector 4, first end of this connector 4 is connected on first outside surface of circuit board 1, second end is connected with external unit to receive data-signal, and data-signal comprises viewdata signal and image control signal.
As shown in Figure 4, the LED display board can also comprise: the chip for driving packaging system, be loaded on first outside surface of circuit board 1, and be used to encapsulate chip for driving 2; LED lamp 3 packaging systems are loaded on second outside surface of circuit board 1, are used for packaged LED lamp 3.
Fig. 5 is the structural representation according to the LED display board of the embodiment of the invention two; Fig. 6 is the structural representation according to the chip for driving 2 in the embodiment of the invention one or two the LED display board.
As shown in Figure 5, this LED display board can comprise: circuit board 1; And one or more chip for driving 2, the chip for driving tube core 21 of each chip for driving 2 directly is loaded on first outside surface of circuit board 1 or is embedded in the circuit board 1, be used to handle the data-signal that receives.
This programme realization chip for driving tube core 21 directly is encapsulated in the electronic circuit board surface by the semiconductor integrated technology or is embedded in the electronic circuit board.To realize littler spacing, more highdensity LED display device design.This directly the semiconductor element of chip for driving 2, directly be made on the electronic circuit board, not only reduced the device occupation space after the single encapsulation, and saved welding and used the shared space of encapsulation welding tray, so just can more effectively design and utilize the space, better realize little spacing, highdensity LED display device.
LED display board as shown in Figure 5 can also comprise: one or more LED particulate units, each LED particulate units is connected on second outside surface of circuit board 1, is used to receive the data-signal after also display driver chip 2 is handled.Each LED particulate units can comprise separately: the LED crystal; The LED leg, first end of this LED leg is connected with the LED crystal, and second end is connected on second outside surface of circuit board 1.
The key point of the foregoing description two is that chip for driving 2 is that substrate directly embeds circuit board 1 or is packaged in the surface of circuit board 1 with the electronic circuit board, realize that chip for driving 2 and circuit board 1 integrate, reduced the thickness of LED display board, obtained high density, closely spaced display device, the led display device that realizes with the method is saved the real space of electronic circuit board more, can accomplish littler spacing, more high resolving power, the led display device of high integration more.Owing to reduced welding step, with regard to the effective bad problem that causes of welding that reduced.As warpage, leak problems such as welding, connect weldering, also needn't consider owing to solder technology restriction at present the problem that whether can realize.
LED display board as shown in Figure 5 can also comprise: chip for driving 2 packaging systems, be used to encapsulate the chip for driving 2 of embodiment two, and play a protective role.
In addition, the LED display board of the embodiment of the invention (also can be called the LED display panel) is more conducive to the heat sinking function of circuit board 1, wick and chip for driving 2 directly embed or encapsulate in the circuit board, the heat that makes each components and parts produce is a radiating surface with whole wiring board, wiring board local heating is roughly the same like this, has avoided the circuit board distortion.
As shown in Figure 6, the chip for driving of using in the embodiment of the invention one and two 2 can comprise: chip for driving tube core 21, and external on first outside surface of circuit board 1; One or more chip for driving pin leads 22, first end of each chip for driving pin leads 22 is connected with chip for driving tube core 21, and second end directly is connected so that chip for driving tube core 21 directly is loaded on first outside surface with circuit board 1.Preferably, second end of each chip for driving pin leads 22 connects by metal and is connected with the circuit junction of circuit board 1 inside, and wherein, it can be that the spun gold weldering connects or the high temperature compacting that this metal connects.Adopt the metal interconnection technique to make chip for driving tube core 21 be connected among this embodiment with circuit board 1, this embodiment has reduced the thickness of circuit board 1, improved the degree of accuracy of technology, and because tie point is little, effectively saved the space of circuit board 1, avoided the pin leads of chip for driving tube core 21 to be drawn pin simultaneously, effectively reduced owing to drawing the problems of Signal Integrity that pin electric capacity, inductive effect cause.
As shown in Figure 6, the chip for driving of using in the embodiment of the invention one and two 2 also can be to comprise: chip for driving tube core 21 is embedded in the circuit board 1; One or more chip for driving pin leads 22, first end of each chip for driving pin leads 22 is connected with chip for driving tube core 21, and second end is connected with the circuit junction of circuit board 1 inside.This chip for driving tube core 21 is embedded in the circuit board 1, makes the thickness of circuit board 1 reduce, saved the space on circuit board 1 surface simultaneously.
The foregoing description two has been realized following effect: the heat dissipation problem that effectively solves the chip for driving 2 of LED display device; Effectively saved the PCB space, making more, high density, more closely spaced LED display device are achieved; Save welding technology, effectively avoided the bad problem that causes by welding; Because chip for driving 2 directly is packaged on the wiring board, has avoided drawing pin, therefore effectively reduced by drawing pin electric capacity, inductive effect, the problems of Signal Integrity that causes; Simultaneously, can reduce the volume of led display device effectively, weight, the LED display device is frivolous, nimble.
Fig. 7 is the structural representation according to the LED display board of the embodiment of the invention three; And Fig. 8 is the structural representation according to the LED lamp 3 in the embodiment of the invention one or three the LED display board.
As shown in Figure 7, the LED display board among this embodiment three comprises: circuit board 1; One or more LED lamps 3 directly are loaded in the LED wick 31 of each described LED lamp 3 on second outside surface of described circuit board 1, be used to receive and display process after data-signal.
The key point of the foregoing description three is that the chip of the LED wick 31 of LED lamp 3 is the surface that substrate directly is packaged in circuit board 1 with the electronic circuit board, the LED wick 31 of realizing LED lamp 3 integrates with circuit board 1, to obtain the LED high density, closely spaced display device, save the real space of electronic circuit board more with the led display device of the method realization, can accomplish littler spacing, more high resolving power, the led display device of high integration more.Owing to reduced welding step, with regard to the effective bad problem that causes of welding that reduced.As warpage, leak problems such as welding, connect weldering, also needn't consider owing to solder technology restriction at present the problem that whether can realize.
LED display board among the embodiment three as shown in Figure 7 can also comprise: one or more chip for driving 2, connect (for example welding) on first outside surface of circuit board 1, and the data-signal after being used for process data signal and sending processing is to LED lamp 3.
This display board can also comprise: LED lamp packaging system, be loaded on second outside surface of circuit board 1, and be used for packaged LED lamp 3.
As shown in Figure 8, the LED lamp 3 in the above embodiment of the present invention one and three can comprise: LED wick 31, and external on second outside surface of circuit board 1; One or more LED wick pin leads 32, first end of each LED wick pin leads 32 is connected with LED wick 31, and second end directly is connected so that LED wick 31 directly is loaded on second outside surface with circuit board 1.Preferably, second end of each LED wick pin leads 32 connects by metal and is connected with the circuit junction of circuit board 1 inside, and wherein, it can be that the spun gold weldering connects or the high temperature compacting that this metal connects.This embodiment makes the distance between each LED lamp 3 dwindle, and realizes the more LED lamp 3 of can arranging on the circuit board 1, has improved the pixel and the resolution of equipment.
One or more LED lamps 3 in this embodiment one and three can be distributed in according to preset space length on second outside surface of circuit board 1.Preferably, this preset space length is in the scope smaller or equal to 2mm.
The little spacing of among this embodiment this (less than 2mm) LED display device has realized that a kind of electronic circuit overall package device of the LED of comprising wick 31 and the chip for driving 2 and connector 4 common combinations that are welded on this kind device form, and the electronic-circuit device that wherein comprises LED wick 31 is synthetic by making overall package by the circuit board 1 (PCB) and superincumbent LED wick 31 circuit boards 1 of arranging.
As shown in Figure 8, LED display board in the above embodiment of the present invention one and three is realized the little spacing LED display device of design, being loaded on the circuit board 1 (PCB) of electronic-circuit device that will comprise LED wick 31, can arrange a plurality of LED wicks 31 according to the mode equidistant (less than 2mm) of matrix on the aspect in two outer layer surfaces of this circuit board 1, and on another outer layer surface, can weld the connector 4 of constant-current driven chip 2 and various data-signals.It is to be connected by the circuit that the connector on the circuit board 14 installs therewith by extraneous power supply, viewdata signal, image control signal that the image display function of the little spacing display device of LED is realized, come timesharing to be passed to be encapsulated on the LED wick 31 on the circuit board 1 (PCB) by analysis of 2 pairs of data of chip for driving on this device and processing capacity, thereby make 31 luminous the realizations images demonstrations of LED wick.
The foregoing description three has been realized following effect: the form that the LED wick 31 and the circuit board 1 of matrix array formula are unified to encapsulate; The pixel that realizes the LED display device is little spacing (less than 2mm); The heat radiation of LED display board is faster; The LED display device is thinner; LED lamp 3 does not need to encapsulate one by one.
The present invention also provides a kind of light-emitting diode display, and this light-emitting diode display comprises any the LED display board in the foregoing description.
As can be seen from the above description, the present invention has realized following technique effect: realize making the display device of extra small spacing (for example following spacing of 2mm) pixel, and the display device of the spacing of smaller szie; Make that the heat radiation of LED display board is faster; Reduced the thickness of LED display device.
The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various changes and variation.Within the spirit and principles in the present invention all, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (11)
1. a LED display board is characterized in that, comprising:
Circuit board (1);
One or more chip for driving (2) directly are loaded in the chip for driving tube core (21) of each described chip for driving (2) on first outside surface of described circuit board (1) or are embedded in the described circuit board (1), are used to handle the data-signal that receives;
One or more LED lamps (3) directly are loaded in the LED wick (31) of each described LED lamp (3) on second outside surface of described circuit board (1), be used to receive and display process after described data-signal.
2. LED display board according to claim 1 is characterized in that, described chip for driving (2) comprising:
Described chip for driving tube core (21), external on described first outside surface of described circuit board (1);
One or more chip for driving pin leads (22), first end of each described chip for driving pin leads (22) is connected with described chip for driving tube core (21), and second end directly is connected so that described chip for driving tube core (21) directly is loaded on described first outside surface with described circuit board (1).
3. LED display board according to claim 2 is characterized in that, second end of each described chip for driving pin leads (22) connects with the circuit junction of described circuit board (1) inside by metal and is connected.
4. LED display board according to claim 1 is characterized in that, described chip for driving (2) comprising:
Described chip for driving tube core (21) is embedded in the described circuit board (1);
One or more chip for driving pin leads (22), first end of each described chip for driving pin leads (22) is connected with described chip for driving tube core (21), and second end is connected with the circuit junction of described circuit board (1) inside.
5. according to each described LED display board among the claim 1-4, it is characterized in that described LED lamp (3) comprising:
Described LED wick (31), external on described second outside surface of described circuit board (1);
One or more LED wick pin leads (32), first end of each described LED wick pin leads (32) is connected with described LED wick (31), and second end directly is connected so that described LED wick directly is loaded on described second outside surface with described circuit board (1).
6. LED display board according to claim 5 is characterized in that, second end of each described LED wick pin leads (32) connects with the circuit junction of described circuit board (1) inside by metal and is connected.
7. LED display board according to claim 6 is characterized in that, one or more described LED lamps (3) are distributed on described second outside surface of described circuit board (1) according to preset space length.
8. LED display board according to claim 7 is characterized in that described preset space length is smaller or equal to 2mm.
9. LED display board according to claim 8, it is characterized in that, described LED display board also comprises: connector (4), first end of described connector (4) is connected on described first outside surface of described circuit board (1), second end is connected with external unit to receive described data-signal, and described data-signal comprises viewdata signal and image control signal.
10. LED display board according to claim 1 is characterized in that, described LED display board also comprises:
The chip for driving packaging system is loaded on described first outside surface of described circuit board (1), is used to encapsulate described chip for driving;
LED lamp packaging system is loaded on described second outside surface of described circuit board (1), is used to encapsulate described LED lamp.
11. a light-emitting diode display is characterized in that, comprising: each described LED display board among the claim 1-10.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010613355XA CN102013219A (en) | 2010-12-29 | 2010-12-29 | Led display board and led display |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010613355XA CN102013219A (en) | 2010-12-29 | 2010-12-29 | Led display board and led display |
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| CN102013219A true CN102013219A (en) | 2011-04-13 |
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| CN103021288A (en) * | 2012-12-12 | 2013-04-03 | 长春希达电子技术有限公司 | Packaging integrating three-in-one LED (Light Emitting Diode) display unit |
| CN103198770A (en) * | 2013-04-01 | 2013-07-10 | 长春希达电子技术有限公司 | Integrated display unit board of color LED (light emitting diode) display screen and manufacture method thereof |
| CN103208240A (en) * | 2013-04-01 | 2013-07-17 | 长春希达电子技术有限公司 | Integrated LED (light emitting diode) display unit panel with large viewing angle |
| CN103208241A (en) * | 2013-04-02 | 2013-07-17 | 长春希达电子技术有限公司 | Double-face composite LED (light-emitting diode) display unit plate and packaging method thereof |
| CN103208239A (en) * | 2013-04-01 | 2013-07-17 | 长春希达电子技术有限公司 | LED (light emitting diode) display unit panel with shading films |
| CN109683393A (en) * | 2019-01-21 | 2019-04-26 | 武汉天马微电子有限公司 | Display module and display device |
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| CN103208239A (en) * | 2013-04-01 | 2013-07-17 | 长春希达电子技术有限公司 | LED (light emitting diode) display unit panel with shading films |
| CN103198770B (en) * | 2013-04-01 | 2015-04-08 | 长春希达电子技术有限公司 | Integrated display unit board of color LED (light emitting diode) display screen and manufacture method thereof |
| CN103208239B (en) * | 2013-04-01 | 2015-04-15 | 长春希达电子技术有限公司 | LED (light emitting diode) display unit panel with shading films |
| CN103208241A (en) * | 2013-04-02 | 2013-07-17 | 长春希达电子技术有限公司 | Double-face composite LED (light-emitting diode) display unit plate and packaging method thereof |
| CN109683393A (en) * | 2019-01-21 | 2019-04-26 | 武汉天马微电子有限公司 | Display module and display device |
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Application publication date: 20110413 |