CN201129672Y

CN201129672Y - LED light source

Info

Publication number: CN201129672Y
Application number: CNU2007200080266U
Authority: CN
Inventors: 王文龙; 李嘉穗
Original assignee: XIAMEN GUANGPU TECHNOLOGY Co Ltd
Current assignee: XIAMEN GUANGPU ELECTRONICS CO Ltd
Priority date: 2007-08-21
Filing date: 2007-08-21
Publication date: 2008-10-08
Anticipated expiration: 2017-08-21

Abstract

The utility model discloses an LED light source, which comprises a plurality of LED chips which adopt matrix typed cascade and parallel pattern to be bond on a metal base plate, two pins are leaded out of the LED chips, and a package material is packed on an area for binding the metal base plate and forming an embedding layer. The integration technology of a plurality of LED chips can greatly increase the luminous distance and reduce the product bulk, further the heat can be directly dissipated from the metal base plate due to direct contact of the bottom of the LED chip and the base plate of metal material, thereby the dissipation problem can be solved, the light decay can be reduced greatly and the use life can be improved.

Description

Led light source

Technical field

The utility model relates to a kind of light source, refers to a kind of led light source especially.

Background technology

Led light source has a variety of, and the infrared LED light source is arranged, and the common LED light source is also arranged.And no matter be which kind of led light source, all be in clad, to coat a led chip, draw two pins again, then might a plurality ofly use together during use.The infrared LED light source that for example is used for shooting at night or photography, it is to adopt the infrared LED product of a plurality of discretes to be assembled on the printed circuit board (PCB) (pcb board), and is centered around the edge of camera lens, structure circlewise.But because this kind led light source is arranged in the annular section with some independently point source of lights, independently the led light source irradiation distance is limited for each, has only 60 meters usually; And existing led chip all is covered by in the clad of being made by epoxy resin, and heat dispersion is poor, causes its decay big, generally used about half a year, and irradiation distance promptly decays to 20 to 30 meters, so service life is shorter; Moreover each independent led light source all has certain volume, and after some LED were arranged into ring-type (or being arranged into other shape as required), volume was bigger, thereby has strengthened the volume that increases product, is unfavorable for the miniaturization of product.

The utility model content

The purpose of this utility model is to provide a kind of led light source, and it can significantly increase irradiation distance, reduces decay, improve the life-span, and can make the product miniaturization.

For achieving the above object, technical solution of the present utility model is:

A kind of led light source, it comprises some led chips, and these some led chips adopt the series and parallel mode of matrix form to be bundled on the metal substrate, and draw two pins, encapsulate on it with encapsulating material in the zone of metal substrate binding led chip more afterwards, form a clad.

Described led chip is the infrared LED chip.

Can be provided with one between described some led chips and the metal substrate again in order to carrying and be connected the slide holder of led chip.

Described slide holder comprises that the upper strata metal forming reaches layer insulating down.

The regional periphery of described aluminium base binding led chip, promptly the periphery of slide holder and clad is provided with an annular groove.

The regional periphery of described aluminium base binding led chip, promptly the periphery of slide holder and clad is provided with a boss.

Described metal substrate is an aluminium base.

The regional periphery of described aluminium base binding led chip is provided with an annular groove.

The regional periphery of described aluminium base binding led chip is provided with a boss.

After adopting such scheme, the utility model can reach following advantage:

1. because the utility model integrates a plurality of (several even hundreds of) led chip, and the mode of arranging with matrix is distributed on the aluminium base, its traditional relatively single led chip can reach long irradiation distance, can reach 200 meters usually.

2. because the bottom of led chip is direct and the substrate contacts of metal material, heat can directly be distributed by metal substrate, thereby has solved heat dissipation problem, so promptly can reduce light decay greatly, improves service life.

3. because the utility model adopts integrated technology, the mode that some led chips are arranged by matrix is evenly distributed on the aluminium base, and do not resemble the structure that adopts a plurality of discretes the traditional product, and therefore greatly reduced the volume of product, can make product reach subminaturization.

Description of drawings

Fig. 1 is the structural representation of the utility model first embodiment;

Fig. 2 is the A-A profile of Fig. 1;

Fig. 3 is that the utility model first embodiment led array is arranged schematic circuit;

Fig. 4 is the structural representation of the utility model second embodiment;

Fig. 5 is the structural representation of the utility model the 3rd embodiment;

Fig. 6 is the structural representation of the utility model the 4th embodiment;

Fig. 7 is the B-B profile of Fig. 6.

The specific embodiment

Led light source described in the utility model can be an infrared LED, also can be common LED.As shown in Figure 1, 2, this led light source comprises some led chips 1, these some led chips 1 adopt the series and parallel mode of matrix form to be bundled on the aluminium base 2, and can be provided with a slide holder 3 between these some led chips 1 and the aluminium base 2 again in order to carrying and be connected led chip 1, encapsulate on it with encapsulating material in the zone of aluminium base 2 binding led chips 1 more afterwards, form a clad 4, this encapsulating material can be epoxy resin etc.

As shown in Figure 3, it is the arrangement line principle of described led chip 1, and these some led chips 1 are arranged in some lines and file, and wherein line is series connection, and file is in parallel, and draws two pins 11 in two ends.

In addition, described slide holder 3 can comprise that upper strata metal forming (is best with the Copper Foil) reaches layer insulating down, and metal forming is in order to bind described led chip 1, and insulating barrier then plays the purpose of insulation.

Moreover described aluminium base 2 also can be other metal material, and main purpose is to substitute traditional pcb board, has solved the problem of heat radiation.

In addition, in the regional periphery of described aluminium base 2 binding led chips 1, promptly the periphery of slide holder 3 and clad 4 also is provided with an annular groove 21, and the setting of this annular groove 21 can prevent that aqueous vapor from entering clad 4, thereby prevents that led chip 1 from making moist.

As shown in Figure 4, it is the structural representation of the utility model second embodiment, and the led chip 1 of this embodiment is provided with each 6 row in length and breadth, totally 36.Again as shown in Figure 5, it is the structural representation of the utility model the 3rd embodiment, and the described led chip 1 of present embodiment is provided with 10 lines of 6 files, totally 60.The foregoing description explanation, the matrix of described led chip 1 columns in length and breadth can be provided with arbitrarily, and specifically, the utility model can only be provided with a horizontal row and be listed as the led chip of forming with series system 1, and the led chip 1 that a row file is formed with parallel way also can only be set.

For another example shown in Fig. 6,7, it is the utility model the 4th embodiment, the difference of this embodiment and first embodiment is: described groove 21 replaces with a boss 22, and it can reach equally and prevent that aqueous vapor from entering the purpose of clad 4, thereby can prevent that led chip 1 from making moist.

Claims

1, a kind of led light source, it is characterized in that: it comprises some led chips, these some led chips adopt the series and parallel mode of matrix form to be bundled on the metal substrate, and draw two pins, encapsulate on it with encapsulating material in the zone of metal substrate binding led chip more afterwards, form a clad.

2, led light source as claimed in claim 1 is characterized in that: described led chip is the infrared LED chip.

3, led light source as claimed in claim 1 or 2 is characterized in that: can be provided with one between described some led chips and the metal substrate again in order to carrying and be connected the slide holder of led chip.

4, led light source as claimed in claim 3 is characterized in that: described slide holder comprises that the upper strata metal forming reaches layer insulating down.

5, led light source as claimed in claim 3 is characterized in that: the regional periphery of described aluminium base binding led chip, promptly the periphery of slide holder and clad is provided with an annular groove.

6, led light source as claimed in claim 3 is characterized in that: the regional periphery of described aluminium base binding led chip, promptly the periphery of slide holder and clad is provided with a boss.

7, led light source as claimed in claim 1 or 2 is characterized in that: described metal substrate is an aluminium base.

8, led light source as claimed in claim 1 or 2 is characterized in that: the regional periphery of described aluminium base binding led chip is provided with an annular groove.

9, led light source as claimed in claim 1 or 2 is characterized in that: the regional periphery of described aluminium base binding led chip is provided with a boss.