CN110312348A - Bikini upside-down mounting constant-current driven chip and LED light - Google Patents
Bikini upside-down mounting constant-current driven chip and LED light Download PDFInfo
- Publication number
- CN110312348A CN110312348A CN201910729364.6A CN201910729364A CN110312348A CN 110312348 A CN110312348 A CN 110312348A CN 201910729364 A CN201910729364 A CN 201910729364A CN 110312348 A CN110312348 A CN 110312348A
- Authority
- CN
- China
- Prior art keywords
- lower margin
- upside
- copper foil
- bikini
- output pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 60
- 239000011889 copper foil Substances 0.000 claims abstract description 58
- 239000000203 mixture Substances 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 7
- 230000005496 eutectics Effects 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
Abstract
The invention discloses a kind of bikini upside-down mounting constant-current driven chips, the bikini upside-down mounting constant-current driven chip includes: circuit board, output pin, supply pin, lower margin and copper foil, the output pin, supply pin and lower margin are welded on the circuit board by copper foil, between the output pin and the lower margin, the supply pin is electrically connected the power supply pin with external constant current IC chip.Furthermore the invention also discloses a kind of LED light.The manufacturing cost that the present invention solves chip is high, and is not easy to the technical issues of radiating.
Description
Technical field
The present invention relates to chip field more particularly to a kind of bikini upside-down mounting constant-current driven chip and LED light.
Background technique
When previous LED constant current driving chip is mounted in LED light, it will usually chip are fixed on lamp plate in two forms
On.One is packaging body mode, and constant current chip is packaged into general integrated component and is encapsulated, such as SOT23/SOT89/TO252, then
This integrated component is welded on lamp plate with patch mode.Two be die bond routing mode, that is, formal dress chip form, by chip with
Elargol is fixed on lamp plate, then is connect the routing pad on chip with wiring board by metal routing.And Conventional flip eutectic
Mode can not use this technology herein because cost is too high.This two kinds of common technologies respectively have its own obvious disadvantage such as
Under:
Integrated component encapsulates pattern, after chip is via encapsulation, increases packaging cost, but benefit is the reliability meeting of chip
Increase.In addition the heat-sinking capability of case chip is limited to packaging body, and big packaging body, heat dissipation is preferable, but volume is big and at high cost.It is small
Packaging body, packaging cost is lower, but radiate it is poor.
How to make existing chip manufacturing at low cost, and being easy to radiate is technical problem urgently to be solved.
Summary of the invention
The main purpose of the embodiment of the present invention is to propose a kind of bikini upside-down mounting constant-current driven chip and LED light, with drop
Low chip manufacturing cost, and be easy to radiate.
The technical solution that the present invention solves above-mentioned technical problem is to provide a kind of bikini upside-down mounting constant-current driven chip, institute
Stating bikini upside-down mounting constant-current driven chip includes: circuit board, output pin, supply pin, lower margin and copper foil, the output pin,
Supply pin and lower margin are welded on the circuit board by copper foil, and the power supply pin is in the output pin and the lower margin
Between, the supply pin is electrically connected with external constant current IC chip.
Preferably, the supply pin is removable is divided into the first supply pin and second source foot, and first supply pin is welded on
The output pin side, the second source foot are welded on the lower margin side, first supply pin and second source foot electricity
Connection.
Preferably, the output pin is removable is divided into the first output pin and the second output pin, and the lower margin is removable to be divided into first
Lower margin and the second lower margin, in first output pin side, second lower margin is arranged described for the second output pin setting
First lower margin side, first supply pin and second source foot composition are integrally located at first output pin and the second output
Between whole and described first lower margin of foot composition and the entirety of the second lower margin composition.
Preferably, the settable N number of parallel connection of the bikini upside-down mounting constant-current driven chip, wherein N is just more than or equal to 2
Integer.
Preferably, there are identification marks at least one in the output pin, supply pin and lower margin.
Preferably, the copper foil includes the first copper foil, the second copper foil and third copper foil, and the output pin is logical
It crosses the first copper foil to be welded on the circuit board, the supply pin is welded on the circuit board by the second copper foil, institute
Lower margin is stated to connect on the circuit board by third copper foil weld tabs.
Preferably, the second copper foil width is less than the first copper foil width and third copper foil width.
In addition, driving core including any bikini upside-down mounting constant current among the above the present invention also provides a kind of LED light
Piece.
It is provided in an embodiment of the present invention for a kind of bikini upside-down mounting constant-current driven chip, the bikini upside-down mounting constant current driving
Chip includes: circuit board, output pin, supply pin, lower margin and copper foil, and the output pin, supply pin and lower margin pass through copper
Paillon is welded on the circuit board, and the power supply pin is between the output pin and the lower margin, the supply pin and outer
Connect the electrical connection of constant current IC chip.It is high to solve the manufacturing cost of chip, and it is not easy to the technical issues of radiating.
Detailed description of the invention
Fig. 1 is bikini upside-down mounting constant-current driven chip first embodiment schematic diagram of the present invention；
Fig. 2 is bikini upside-down mounting constant-current driven chip second embodiment schematic diagram of the present invention；
Fig. 3 is bikini upside-down mounting constant-current driven chip 3rd embodiment schematic diagram of the present invention；
Fig. 4 is bikini upside-down mounting constant-current driven chip fourth embodiment schematic diagram of the present invention；
Fig. 5 is second schematic diagram of bikini upside-down mounting constant-current driven chip fourth embodiment of the present invention.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 10 | Circuit board | 11 | Output pin |
| 12 | Supply pin | 13 | Lower margin |
| 14 | Copper foil | 111 | First output pin |
| 112 | Second output pin | 121 | First supply pin |
| 122 | Second source foot | 131 | First lower margin |
| 132 | Second lower margin | 141 | First copper foil |
| 142 | Second copper foil | 143 | Third copper foil |
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being related to " first ", " second " etc. in the present invention is used for description purposes only, and should not be understood as referring to
Show or imply its relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " are defined as a result,
Two " feature can explicitly or implicitly include at least one of the features.In addition, the technical solution between each embodiment can
It to be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when the combination of technical solution occurs
Conflicting or cannot achieve when, will be understood that the combination of this technical solution is not present, also not the present invention claims protection model
Within enclosing.
As shown in FIG. 1, FIG. 1 is bikini upside-down mounting constant-current driven chip first embodiment schematic diagrames of the present invention；The present embodiment
In a kind of bikini upside-down mounting constant-current driven chip is provided, the bikini upside-down mounting constant-current driven chip includes: circuit board 10, output
Foot 11, supply pin 12, lower margin 13 and copper foil 14, the output pin 11, supply pin 12 and lower margin 13 pass through copper foil 14
It is welded on the circuit board 10, the supply pin 12 is welded between the output pin 11 and the lower margin 13, the power supply
Foot 12 is electrically connected with external constant current IC chip.
It should be noted that bikini upside-down mounting constant-current driven chip proposed by the invention is that LED linear constant current drives core
Piece, in a manner of upside-down mounting bare chip, such as flip LED, by bare crystalline grain directly with tin through Reflow Soldering in a manner of patch, by chip
It is welded on PCB, to complete the mesh of the connection of route.
Upside-down mounting eutectic (Filp Chip) technology has developed for many years, but Conventional flip eutectic processing procedure is added in grain surface
Upper gold convex block (gold bumping) or tin projection (solder bumping), then be total to crystal grain in a manner of ultrasonic wave or high temperature
Crystalline substance is on PCB.This traditional approach advantage is to allow crystal grain to have more closer solder joint foot positions, but the disadvantage is that length is upper golden or tin
It is with high costs.
The upside-down mounting mode that the present invention uses is different from Conventional flip eutectic mode, using directly by conventional IC chip crystal grain table
The routing pad in face increases, then electroplated processing enables its pad and tin element eutectic.So can similar flip LED mode,
Driving chip is welded on PCB by the technology that (SMD) is adhered with conventional surface through Reflow Soldering.Such technology can great Fu be reduced to
Fill the complexity and cost of eutectic.Tin welding is penetrated in the circuit board additionally, due to the pad of large area, efficient can be incited somebody to action
What linear constant current IC chip generated is thermally conducted on circuit base plate, reaches very outstanding heat dissipation effect.
It is such in such a way that traditional tin welds crystal grain admittedly, pad must it is larger, advantage is rapid heat dissipation, and is just able to cooperate one
As the precision that is equipped with of patch.The disadvantage is that being the foot position that the chip of small size cannot allow to have too many.
Chip pin position cannot the application obstacle of technology, this technology be not appropriate for answering for other general multiway positions thus too much
Use chip.Special applications mode since chip pin position cannot be too many, and based on LED drive chip, the present invention propose that one is specific
Foot position arrangement so that chip be able to be suitable for LED driving lamp plate on.
Generally above there are the current regulator diode pattern of two foot positions and the pattern of three foot positions, three foot position basic patterns in basic application
The three foot positions (output, power supply, ground wire) proposed as the application.Diode pattern is exactly that output pin 11 and supply pin 12 is straight
It is connect in succession as a positive foot position, in addition a foot is negative foot position, i.e. 13, lower margin.
Because integrated circuit usually requires a fixed voltage as the power supply of operation, when this chip is manufactured with low pressure processing procedure
When, generally also in 2V or more, a small number of chips can be run this power supply with 1.5V.If with this chip of the process design of higher pressure
When, the demand of supply voltage will be higher.It is upper in application, if by supply pin 12 and output pin 11 and connect in use, this chip
Cross-pressure must could also work normally more than supply voltage.Though the method can facilitating chip foot position, bring height
The demand of cross-pressure, this will cause too big loss for the constant current of high current driving, or reduce the power work model of whole lamp
It encloses.
In the present embodiment, by providing a kind of bikini upside-down mounting constant-current driven chip, the bikini upside-down mounting constant current is driven
Dynamic chip includes: circuit board 10, output pin 11, supply pin 12, lower margin 13 and copper foil 14, the output pin 11, supply pin
12 and lower margin 13 be welded on the circuit board 10 by copper foil 14, the supply pin 12 is located at the output pin 11 and institute
It states between lower margin 13, the supply pin 12 is electrically connected with external constant current IC chip.Existing chip manufacturing cost is reduced, and
It is easy to radiate.
In addition, supply pin 12 are arranged in centre, so that the application bikini upside-down mounting constant-current driven chip can more parallel connections
It uses, does not have to wire jumper connection line, significantly simplify route.Output end and ground terminal have high current circulation on the line, and pendulum exists
14 area of copper foil can be used to extend outward for front and back end, increases 14 area of copper foil and is circulated with sharp high current.Power end can simultaneously
It is directly therefrom connected to, and this foot position magnitude of current is extremely low, is not required to broad copper foil path, and avoids integrated component or formal dress element is walked
Line troublesome problem；10 part of circuit board between supply pin 12 and output pin 11 and lower margin 13 is equipped with soldermask layer, prevents
It influences each other when source of welding current foot 12, lower margin 13 and output pin 11；
Three foot positions are minimum of applications foot position, and foot position is fewer, it is possible to reduce foot interdigit gap increases bonding pad area.Pad face
Product helps to radiate stronger greatly.
Bonding pad area maximize so that crystal grain light probability reduce, the behavior of bikini upside-down mounting constant-current driven chip not vulnerable to
Light evil influences.
Second embodiment of the invention is proposed based on first embodiment of the invention, please refers to attached drawing 2, and attached drawing 2 is the present invention three
Point type upside-down mounting constant-current driven chip second embodiment schematic diagram；The supply pin 12 is removable to be divided into the first supply pin 121 and second
Supply pin 122, first supply pin 121 are welded on 11 side of output pin, and the second source foot 122 is welded on described
13 side of lower margin, first supply pin 121 are electrically connected with second source foot 122.
It should be noted that in actual application, supply pin 12 be split as 2 foot positions (or more), electrical property
Upper is same circuit node.
In the present embodiment, supply pin 12 is split as the first supply pin 121 and second source foot 122, first power supply
Foot 121 is welded on 11 side of output pin, and the second source foot 122 is welded on 11 other side of output pin, and described
One supply pin 121 is electrically connected with second source foot 122, and the manufacturing cost of the application can be made low, and is easy to radiate.
Third embodiment of the invention is proposed based on second embodiment of the invention, and referring to figure 3., Fig. 3 is bikini of the present invention
Upside-down mounting constant-current driven chip 3rd embodiment schematic diagram；Further, the output pin 11 it is removable be divided into the first output pin 111 with
Second output pin 112, the lower margin 13 is removable to be divided into the first lower margin 131 and the second lower margin 132, and second output pin 112 is set
It sets in 111 side of the first output pin, the setting of the second lower margin 132 is in 131 side of the first lower margin, first electricity
What source foot 121 and second source foot 122 formed be integrally located at, and that first output pin 111 forms with the second output pin 112 is whole
Between body and the entirety of first lower margin 131 and the second lower margin 132 composition.
It should be noted that in actual application, can split output pin 11 becomes two, and lower margin 13 is split as two
A, principle is consistent with the principle that output pin 11, lower margin 13 are not split, is that supply pin 12 is arranged in output pin 11 and lower margin 13
Between.
In the present embodiment, the output pin 11 is removable is divided into the first output pin 111 and the second output pin 112, describedly
Foot 13 is removable to be divided into the first lower margin 131 and the second lower margin 132, and second output pin 112 is arranged in first output pin 111
Side, the setting of the second lower margin 132 is in 131 side of the first lower margin, first supply pin 121 and second source foot
The entirety for being integrally located at first output pin 111 and the second output pin 112 composition of 122 compositions and first lower margin 131
Between the entirety of the second lower margin 132 composition.Can make the manufacturing cost of the application reduces, and is easy to radiate.
- Fig. 5 referring to figure 4., Fig. 4 are bikini upside-down mounting constant-current driven chip fourth embodiment schematic diagram of the present invention；Fig. 5 is
Second schematic diagram of bikini upside-down mounting constant-current driven chip fourth embodiment of the present invention.This hair is proposed according to a third embodiment of the present invention
Bright fourth embodiment, further, the settable N number of parallel connection of bikini upside-down mounting constant-current driven chip, wherein N is to be greater than or wait
In 2 positive integer.
It should be noted that bikini upside-down mounting constant-current driven chip of the present invention is applied to multi-chip parallel wire when practical lamp plate
It is any in line structure (chip can be continuous in parallel without more of limitation) three foot positions (or more) foot position be split as 2 (or more) foot
, it is same circuit node in electrical property.
In the present embodiment, when parallel with one another between bikini upside-down mounting constant-current driven chip, supply pin 12 is remained
Between output pin 11 and lower margin 13.
Further, there are identification marks at least one in the output pin 11, supply pin 12 and lower margin 13.
In the present embodiment, pass through at least one presence identification mark in output pin 11, supply pin 12 and lower margin 13
Note, such as bevel edge, oblique angle or pad different size, recognize the application bikini upside-down mounting constant-current driven chip side with sharp patch device
To.
Further, the copper foil 14 includes the first copper foil 141, the second copper foil 142 and third copper foil
143, the output pin 11 is welded on the circuit board 10 by the first copper foil 141, and the supply pin 12 passes through the second bronze medal
Paillon 142 is welded on the circuit board 10, and the lower margin 13 is welded on the circuit board 10 by third copper foil 143.
It should be noted that a large amount of heat can be generated when electric current passes through the application bikini upside-down mounting constant-current driven chip,
Copper foil 14 is needed to radiate, the medium that furthermore copper foil 14 or electric current are transmitted.
It in the present embodiment, can by the first copper foil 141 of setting, the second copper foil 142 and third copper foil 143
Electric current is distributed by the heat generated when the application bikini upside-down mounting constant-current driven chip, to extend 3 points of the application
The service life of formula upside-down mounting constant-current driven chip.
Further, 142 width of the second copper foil is wide less than 141 width of the first copper foil and third copper foil 143
Degree.
It should be noted that the size of electric current can be sent out when electric current passes through the application bikini upside-down mounting constant-current driven chip
Raw deviation, the size of current when electric current passes through supply pin 12 be far smaller than by the electric current of output pin 11 and lower margin 13, because
Generated heat after the heat that this supply pin 12 generates after through electric current is far smaller than output pin 11 and lower margin 13 by electric current
Amount；Therefore second copper foil 142 (i.e. copper foil 14 used by supply pin 12) width be smaller than 141 width of the first copper foil and
The width of third copper foil 143.
In the present embodiment, by being arranged 142 width of the second copper foil less than 141 width of the first copper foil and third copper
143 width of paillon can save the production cost of the application bikini upside-down mounting constant-current driven chip.
Furthermore the present invention also provides a kind of LED light, including any bikini upside-down mounting constant-current driven chip among the above.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by anyone skilled in the art,
It should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with scope of protection of the claims
Subject to.
Claims (8)
1. a kind of bikini upside-down mounting constant-current driven chip, which is characterized in that the bikini upside-down mounting constant-current driven chip includes: electricity
Road plate, output pin, supply pin, lower margin and copper foil, the output pin, supply pin and lower margin are welded on institute by copper foil
It states on circuit board, the power supply pin is between the output pin and the lower margin, the supply pin and external constant current IC chip
Electrical connection.
2. bikini upside-down mounting constant-current driven chip as described in claim 1, which is characterized in that the supply pin is removable to be divided into
One supply pin and second source foot, first supply pin are welded on the output pin side, and the second source foot is welded on
The lower margin side, first supply pin are electrically connected with second source foot.
3. bikini upside-down mounting constant-current driven chip as claimed in claim 2, which is characterized in that the output pin is removable to be divided into
One output pin and the second output pin, the lower margin is removable to be divided into the first lower margin and the second lower margin, and the second output pin setting exists
First output pin side, the second lower margin setting is in first lower margin side, first supply pin and the second electricity
The entirety for being integrally located at first output pin and the second output pin composition of source foot composition and first lower margin and the second ground
Between the entirety of foot composition.
4. bikini upside-down mounting constant-current driven chip as claimed in claim 3, which is characterized in that the bikini upside-down mounting constant current is driven
The dynamic settable N number of parallel connection of chip, wherein N is the positive integer more than or equal to 2.
5. bikini upside-down mounting constant-current driven chip as described in claim 1, which is characterized in that the output pin, supply pin
And there are identification marks at least one in lower margin.
6. bikini upside-down mounting constant-current driven chip as described in claim 1, which is characterized in that the copper foil includes first
Copper foil, the second copper foil and third copper foil, the output pin are welded on the circuit board by the first copper foil, institute
It states supply pin to be welded on the circuit board by the second copper foil, the lower margin is welded on the circuit by third copper foil
On plate.
7. bikini upside-down mounting constant-current driven chip as described in claim 6, which is characterized in that the second copper foil width
Less than the first copper foil width and third copper foil width.
8. a kind of LED light, which is characterized in that drive core including bikini upside-down mounting constant current of any of claims 1-7
Piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910729364.6A CN110312348A (en) | 2019-08-07 | 2019-08-07 | Bikini upside-down mounting constant-current driven chip and LED light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910729364.6A CN110312348A (en) | 2019-08-07 | 2019-08-07 | Bikini upside-down mounting constant-current driven chip and LED light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110312348A true CN110312348A (en) | 2019-10-08 |
Family
ID=68082174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910729364.6A Pending CN110312348A (en) | 2019-08-07 | 2019-08-07 | Bikini upside-down mounting constant-current driven chip and LED light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110312348A (en) |
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|---|---|---|---|---|
| CN1359150A (en) * | 2002-01-15 | 2002-07-17 | 威盛电子股份有限公司 | Ball pin array package substrate and making method |
| CN1725930A (en) * | 2005-04-15 | 2006-01-25 | 杭州华为三康技术有限公司 | Printed circuit board |
| CN1725477A (en) * | 2005-05-12 | 2006-01-25 | 杭州华为三康技术有限公司 | Heat sink for ball single array packaged chip and its application |
| JP2012094704A (en) * | 2010-10-27 | 2012-05-17 | Ricoh Co Ltd | Semiconductor package |
| CN102469651A (en) * | 2010-11-11 | 2012-05-23 | 海洋王照明科技股份有限公司 | LED drive circuit and light fixture |
| CN205863213U (en) * | 2016-04-11 | 2017-01-04 | 江西省木林森光电科技有限公司 | A kind of encapsulating structure of LED drive chip |
| CN107275322A (en) * | 2017-06-27 | 2017-10-20 | 东莞市欧思科光电科技有限公司 | The luminous PLC technology LED in side with IC |
| CN210444537U (en) * | 2019-08-07 | 2020-05-01 | 深圳市鑫宇昊科技有限公司 | Three-point type flip constant-current driving chip and LED lamp |
-
2019
- 2019-08-07 CN CN201910729364.6A patent/CN110312348A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359150A (en) * | 2002-01-15 | 2002-07-17 | 威盛电子股份有限公司 | Ball pin array package substrate and making method |
| CN1725930A (en) * | 2005-04-15 | 2006-01-25 | 杭州华为三康技术有限公司 | Printed circuit board |
| CN1725477A (en) * | 2005-05-12 | 2006-01-25 | 杭州华为三康技术有限公司 | Heat sink for ball single array packaged chip and its application |
| JP2012094704A (en) * | 2010-10-27 | 2012-05-17 | Ricoh Co Ltd | Semiconductor package |
| CN102469651A (en) * | 2010-11-11 | 2012-05-23 | 海洋王照明科技股份有限公司 | LED drive circuit and light fixture |
| CN205863213U (en) * | 2016-04-11 | 2017-01-04 | 江西省木林森光电科技有限公司 | A kind of encapsulating structure of LED drive chip |
| CN107275322A (en) * | 2017-06-27 | 2017-10-20 | 东莞市欧思科光电科技有限公司 | The luminous PLC technology LED in side with IC |
| CN210444537U (en) * | 2019-08-07 | 2020-05-01 | 深圳市鑫宇昊科技有限公司 | Three-point type flip constant-current driving chip and LED lamp |
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