JP2007059371A - Luminaire using led - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a luminaire using LEDs which can suppress the temperature rise of LED chips, of enhancing the optical output, and of reducing the cost of a circuit board. <P>SOLUTION: This luminaire using LEDs is provided with a metallic luminaire body 90 formed into a bottomed cylindrical shape with one surface opened; a plurality of LED chip units 1, each having an LED chip and a pair of lead terminals 42 and 43 with respective electrodes, respectively electrically connected thereto and arranged in the luminaire body 90; an insulation layer interlaid between the LED chip units 1 and the bottom wall 90a of the luminaire body 90 for electrically insulating them from each other and making them thermally couple with each other; and a circuit board 20, which is arranged in the luminaire body 90 and on which a circuit pattern 22 for feeding power to the respective LED chip units 1 is formed, and a plurality of window holes 23 for respectively inserting the respective LED chips 1 are formed therein. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a lighting fixture using LEDs.

  Conventionally, LED chips are combined with LED chips and phosphors (fluorescent pigments, fluorescent dyes, etc.) as wavelength conversion materials that are excited by light emitted from the LED chips and emit light of a different emission color from the LED chips. Research and development of light-emitting devices that emit light of a color different from the color of the light is being conducted in various places. As this type of light-emitting device, for example, a white light-emitting device (generally called a white LED) that obtains white light (white light emission spectrum) by combining an LED chip that emits blue light or ultraviolet light and a phosphor. Has been commercialized.

  In addition, with the recent increase in output of white LEDs, research and development for expanding white LEDs into lighting applications has become active, but the above-mentioned white LEDs require a relatively large light output, such as general lighting. Since the desired light output cannot be obtained with a single white LED, the main body of the device has an LED unit (LED module) in which a plurality of white LEDs are mounted on a single circuit board. In general, a light transmitting plate that transmits white light from each white LED is disposed on the one surface side of the instrument body so as to obtain a desired light output (for example, Patent Documents). 1). In addition, in the lighting fixture disclosed by the said patent document 1, the some lens which controls the light distribution from each white LED is formed in the said translucent board.

  Conventionally, in an LED unit including a plurality of LED chips and a circuit board on which each LED chip is mounted, the increase in the junction temperature of each LED chip is suppressed and the input power is increased to increase the light output. In order to achieve this, a structure for efficiently radiating the heat generated in the light emitting portion of each LED chip to the outside has been proposed (see, for example, Patent Documents 2 and 3).

  In the LED unit disclosed in Patent Document 2, as shown in FIG. 31, a metal substrate in which a power supply circuit pattern 303 is formed on a metal plate 301 via an insulating resin layer 302 is used as the circuit substrate 300. The heat generated in each LED chip 10 ′ is transferred to the metal plate 301 via the heat transfer member 310. Here, each LED chip 10 ′ is a GaN-based blue LED chip formed on one surface side of a crystal growth substrate made of a sapphire substrate whose light-emitting portion made of a GaN-based compound semiconductor material is an insulator, and a circuit board The other surface of the crystal growth substrate is a light extraction surface.

In the LED unit disclosed in Patent Document 3, as shown in FIG. 32, a circuit pattern for power feeding is formed on a metal plate 301 via an insulating resin layer 302 as a circuit board 300 as in the configuration of FIG. A metal substrate on which 303 is formed is adopted so that heat generated in each LED chip 10 ″ is transferred to the metal plate 301. Here, each LED chip 10 ″ is placed on one surface side. An anode electrode is formed and a cathode electrode is formed on the other surface side, and an electrode closer to the circuit board 300 of the anode electrode and the cathode electrode is electrically connected to the first conductor plate 312. In addition, the electrode far from the circuit board 300 is electrically connected to the second conductor plate 313 via a bonding wire 314 made of a fine metal wire, and the first conductor plate Respectively 12 and second conductive plate 313 is bonded to the circuit pattern 303 of the circuit board 300. Further, Patent Document 3 describes that nickel is used as a material for the circuit pattern 303 and that the area of the circuit pattern 303 is widened so that the circuit board 300 is also used as a reflector of a lighting fixture.
JP 2003-59332 A JP 2003-168829 A (paragraph [0030] and FIG. 6) JP 2001-203396 A (FIG. 6)

  By the way, in the lighting fixture using the LED unit having the configuration shown in FIG. 31 or FIG. 32, the fixture body is made of metal, and the metal plate 301 in the circuit board 300 of the LED unit is thermally coupled to the fixture body. However, in order to ensure lightning surge resistance, for example, a sheet-like insulating member is interposed between the metal plate 301 of the circuit board 300 and the metal instrument body. It is necessary to increase the thermal resistance from the light emitting portion of each LED chip 10 ′, 10 ″ to the main body of the instrument, and to prevent the junction temperature of each LED chip 10 ′, 10 ″ from exceeding the maximum junction temperature. It is necessary to limit the input power to the chips 10 ′ and 10 ″, and it is difficult to increase the optical output.

  Further, in the lighting fixture using the LED unit having the configuration shown in FIGS. 31 and 32, in order to reduce the thermal resistance from the LED chips 10 ′ and 10 ″ to the fixture body, the LED chips 10 ′ and 10 ″ are moved to the LED chips 10 ′ and 10 ″. Since it is necessary to use a metal substrate (metal base printed wiring board) as the circuit board 300 on which the power supply circuit pattern 303 is formed, the cost increases.

  The present invention has been made in view of the above reasons, and its purpose is to use an LED that can suppress the temperature rise of the LED chip, increase the light output, and reduce the cost of the circuit board. To provide an instrument.

  The invention of claim 1 includes a metal instrument body, a plurality of LED chip units having a pair of lead terminals to which the LED chip and each electrode of the LED chip are electrically connected, an LED chip unit and the instrument body, And an insulating layer that electrically insulates the two and thermally couples them, and a plurality of windows through which each LED chip unit is inserted while a circuit pattern for feeding power to each LED chip unit is formed And a circuit board disposed on the same side as each LED chip unit with respect to the instrument body.

  According to the present invention, the heat resistance from the light emitting part of the LED chip to the fixture body can be reduced and heat dissipation can be improved and the temperature rise of the junction temperature of the LED chip can be suppressed compared to the conventional case, so that the input power can be increased. Therefore, it is possible to reduce the cost of the circuit board because a circuit board that is less expensive than a metal substrate, such as a glass epoxy board, can be used as the circuit board. .

  The invention of claim 2 is the invention of claim 1, further comprising a translucent member that is disposed on the opposite side of the circuit board from the surface facing the instrument body and transmits visible light from the LED chip units. A mirror that reflects visible light is formed on a surface of the circuit board facing the light transmissive member.

  According to the present invention, the visible light totally reflected by the translucent member among the visible light radiated from each LED chip unit is reflected by the mirror, so that the light output can be further increased.

  According to a third aspect of the present invention, in the second aspect of the present invention, the circuit board is formed by forming the circuit pattern and the mirror on a surface facing the light transmitting member.

  According to the present invention, since the circuit pattern and the mirror are separate, the degree of freedom in pattern design of the circuit pattern is increased, and materials for the circuit pattern and the mirror can be appropriately selected. The light output can be further increased by selecting a material with higher reflectivity.

  According to a fourth aspect of the present invention, in the second aspect of the present invention, the circuit board is characterized in that the circuit pattern is formed on a side opposite to a surface facing the light transmitting member.

  According to the present invention, since the circuit pattern and the mirror are separate, the degree of freedom in pattern design of the circuit pattern is increased, and materials for the circuit pattern and the mirror can be appropriately selected. The light output can be further increased by selecting a material with higher reflectivity. Further, the surface area of the mirror can be increased as compared with the invention of claim 3, and the light output can be further increased.

  According to a fifth aspect of the present invention, in any of the second to fourth aspects of the present invention, the mirror is made of aluminum.

  According to the present invention, the reflectance of light having a wavelength in the visible light region is higher than in the case where nickel is conventionally used as the material of the mirror.

  According to a sixth aspect of the present invention, in the second to fifth aspects of the present invention, the instrument body is formed in a disk shape having a housing recess for housing the LED chip units and the circuit board on one side thereof. An electric wire insertion hole for inserting a power supply wire electrically connected to the circuit board at a central portion is formed through the bottom portion of the housing recess at the central portion of the instrument body.

  According to this invention, it is not necessary to provide a space for routing the electric wire in the housing recess of the instrument body, and the instrument body can be thinned.

  The invention of claim 7 is the invention of claim 6, wherein a plurality of attachment screws for attaching the instrument body to the construction material are inserted from the one surface side into the peripheral portion of the storage recess in the instrument body. The instrument has an opening window through which a screw insertion hole is provided and exposes the light emitting surface side of the translucent member so as to cover the peripheral portion of the housing recess and each mounting screw on the one surface side of the instrument body. A frame-shaped decorative cover attached to the main body is provided, and the decorative cover is made of metal.

  According to the present invention, a plurality of screw insertion holes for inserting a plurality of attachment screws for attaching the instrument main body to the construction material from the one surface side are provided in the periphery of the storage recess in the instrument main body. Therefore, for example, the appliance body can be attached to a construction material such as a ceiling material using an attachment screw, and the peripheral portion of the storage recess and the attachment screws are covered on the one surface side of the appliance body. Since the frame-shaped decorative cover attached to the instrument body is provided, the mounting screw can be prevented from being seen from the one surface side of the instrument body, the appearance can be improved, and the decorative cover is provided. Is made of metal, heat dissipation can be improved compared to the case where the decorative cover is made of synthetic resin, and the junction temperature of the LED chip is increased. More can be suppressed.

  According to an eighth aspect of the present invention, in the first to seventh aspects of the present invention, the translucent member distributes light emitted from the LED chip unit to each of the portions facing the LED chip units. And a portion other than each lens portion is made of metal.

  According to this invention, since the translucent member has a lens portion for controlling the light distribution of the light emitted from the LED chip unit at each of the parts facing the LED chip units, The light distribution of the light emitted from each LED chip unit can be controlled, and the portions other than the lens portions of the light transmitting member are formed of metal, so that the entire light transmitting member is synthesized. Compared with the case where it forms with resin, glass, etc., heat dissipation can be improved and the temperature rise of the junction temperature of the said LED chip can be suppressed more.

  According to a ninth aspect of the present invention, in the first to eighth aspects of the invention, the LED chip unit is made of a heat conductive material, the heat transfer plate on which the LED chip is mounted, the LED chip and the heat transfer plate, And a submount member that relaxes the stress acting on the LED chip due to the difference between the linear expansion coefficients of the two, and each of the electrodes of the LED chip on the surface opposite to the heat transfer plate side A pair of conductor patterns connected to each other, and a window hole exposing the submount member extending in the thickness direction and laminated on the heat transfer plate, each conductor pattern having the lead terminal It is characterized by comprising.

  According to this invention, the LED chip unit is made of a heat conductive material, and is interposed between the LED chip and the heat transfer plate between the heat transfer plate on which the LED chip is mounted and the linear expansion coefficient difference between the two. And a submount member that alleviates the stress acting on the LED chip. Therefore, the heat generated in the LED chip in each LED chip unit is efficiently radiated through the submount member and the heat transfer plate. The stress acting on the LED chip due to the difference in linear expansion coefficient between the LED chip and the heat transfer plate can be relieved, and the LED chip is provided on the surface opposite to the heat transfer plate side. A pair of conductor patterns electrically connected to each of the electrodes are provided, and a window hole exposing the submount member is provided in the thickness direction and laminated on the heat transfer plate. Comprising a insulating substrate, since each of the conductor patterns constituting the lead terminal, the insulation distance between the fixture body and the lead terminals can be lengthened, and the reliability is improved.

  According to the first aspect of the present invention, the temperature rise of the LED chip can be suppressed, the light output can be increased, and the cost of the circuit board can be reduced.

(Embodiment 1)
Hereinafter, the lighting fixture of this embodiment is demonstrated, referring FIGS.

  The lighting fixture of the present embodiment is used as, for example, a spotlight, and is a metal (with respect to an arm 112 having one end coupled to a rotating base 110 fixed on a support base 100 using a shaft screw 111 ( For example, an instrument body 90 made of a metal having a high thermal conductivity such as Al or Cu is coupled using a coupling screw 113.

  The instrument main body 90 is formed in a bottomed cylindrical shape (in this embodiment, a bottomed cylindrical shape) whose one surface (front surface) is open, and a plurality of LED chip units (light emitting devices) 1 are accommodated therein. Here, in the instrument main body 90, each LED chip unit 1 is mounted on the bottom wall 90a via an insulating layer 80 made of a green sheet, and the opening is closed by the front cover 91. The front cover 91 includes a translucent plate 91 a made of a disk-shaped glass plate and an annular window frame 91 b that holds the translucent plate 91 a, and the window frame 91 b is attached to the instrument main body 90. . Note that the insulating layer 80 is not limited to an unsintered ceramic body formed into a sheet shape such as a green sheet, and for example, a thermosetting fixing material (for example, an epoxy resin) may be used. The translucent plate 91a is not limited to a glass substrate, but may be formed of a translucent material, and controls the light distribution of light emitted from each LED chip unit 1 to the translucent plate 91a. You may provide the lens to perform integrally.

  By the way, each LED chip unit 1 arranged in the appliance main body 90 is electrically connected by the circuit board 20 arranged in the appliance main body 90. In addition, the outer periphery shape of the circuit board 20 is formed in a shape in which a circular portion is notched and a linear portion is provided.

  The circuit board 20 is composed of a glass epoxy board in which a circuit pattern 22 for supplying power to each LED chip unit 1 is formed on one surface side in the thickness direction, and a plurality of rectangular shapes through which each LED chip unit 1 is inserted. A shaped window hole 23 is provided in the thickness direction. In the present embodiment, the above-described translucent plate 91a is disposed away from the circuit board 20 on the opposite side of the circuit board 20 from the surface facing the instrument body 90, and transmits visible light from each LED chip unit 1. A translucent member to be transmitted is configured.

  Here, the circuit pattern 22 on the circuit board 20 is designed to connect a plurality of LED chip units 1 in parallel, and solder or the like is applied to the circuit patterns 22 at both ends of the parallel circuit of the plurality of LED chip units 1. A power supply wire (not shown) composed of lead wires connected by the wire is inserted into a wire insertion hole 90c penetrating through the bottom wall 90a of the instrument body 90, and is shown in a parallel circuit of the plurality of LED chip units 1. Power is supplied from the power supply circuit that does not. As the power supply circuit, for example, a power supply circuit having a rectifier circuit composed of a diode bridge that rectifies and smoothes the AC output of an AC power supply such as a commercial power supply and a smoothing capacitor that smoothes the output of the rectifier circuit is employed. That's fine. Moreover, in this embodiment, although the several LED chip unit 1 in the instrument main body 90 is connected in parallel, the connection relation of the several LED chip unit 1 does not specifically limit, For example, it connects in series. You may make it, and you may combine a serial connection and a parallel connection.

  The LED chip unit 1 includes a rectangular plate-shaped LED chip 10, a chip mounting member 41 that is formed in a rectangular plate shape larger than the chip size of the LED chip 10 and on which the LED chip 10 is mounted, and one side of the chip mounting member 41. A strip-shaped lead terminal 42 that is continuously formed integrally with the edge, a T-shaped lead terminal 43 that is spaced apart from the other side edge of the chip mounting member 41, and an LED that is disposed so as to surround the LED chip 10. A reflector (reflector) 50 that reflects light emitted from the side surface of the chip 10 to the front of the LED chip 10 (upward in FIG. 3), and a protective cover 60 that is attached to the front side of the reflector 50 so as to cover the LED chip 10. And.

  The chip mounting member 41 and the lead terminals 42 and 43 are formed using a lead frame made of a metal plate (for example, a copper plate), and the chip mounting member 41 and the lead terminals 42 and 43 have insulating properties. The inner lead portions 42a and 43a of the lead terminals 42 and 43 and the chip mounting member 41 are disposed inside the holding frame 45 at the same time and integrally formed with a holding frame 45 made of a synthetic resin molded product having a rectangular frame shape. Outer lead portions 42 b and 43 b of the lead terminals 42 and 43 are arranged outside the holding frame 45. Here, the above-described insulating layer 80 is interposed between the chip mounting member 41 and the lead terminals 42 and 43 and the instrument main body 90, and the insulating layer 80 includes the chip mounting member 41 and the lead terminals 42 and 43. And the instrument body 90 are electrically insulated and thermally coupled. The lead terminals 42 and 43 are electrically connected to the outer lead portions 42b and 43b via the joint portions 95 made of solder with the circuit pattern 22 of the circuit board 20. In the present embodiment, the holding frame 45, the chip mounting member 41, the lead terminals 42 and 43, the reflector 50, the protective cover 60, and the insulating layer 80 constitute a package of the LED chip 10. . In this embodiment, the insulating layer 80 is provided for each LED chip unit 1, but one green sheet slightly smaller than the bottom wall 90 a of the instrument main body 90 is attached to the plurality of LED chip units 1. May be shared.

  The material of the lead frame is not limited to copper, and may be phosphor bronze, for example. In this embodiment, the chip mounting member 41 and the lead terminals 42 and 43 are formed integrally with the holding frame 45 at the same time. However, the holding frame 45 is not necessarily provided, and the chip mounting member 41 and the lead terminal 42 are not necessarily provided. There is also no need to form a continuous integral. However, when the chip mounting member 41 and the lead terminal 42 are continuously formed integrally and the above-described holding frame 45 is provided, the LED chip unit 1 can be easily handled as an individual component at the time of assembly or the like. There is an advantage that an individual test can be easily performed before the unit 1 is mounted on the instrument main body 90.

  The LED chip 10 is a GaN-based blue LED chip that emits blue light, and is a conductive substrate made of an n-type SiC substrate that has a lattice constant and a crystal structure close to GaN as a crystal growth substrate and has conductivity compared to a sapphire substrate. The light-emitting portion 12 is formed of a GaN-based compound semiconductor material on the main surface side of the conductive substrate 11 and has a laminated structure portion having, for example, a double hetero structure. ), A cathode electrode (n electrode) which is a cathode side electrode (not shown) is formed on the back surface of the conductive substrate 11, and is shown on the surface of the light emitting unit 12 (the outermost surface on the main surface side of the conductive substrate 11). An anode electrode (p electrode) which is an electrode on the anode side that is not to be formed is formed. In short, the LED chip 10 has an anode electrode formed on one surface side and a cathode electrode formed on the other surface side. The cathode electrode and the anode electrode are composed of a laminated film of a Ni film and an Au film, but the material of the cathode electrode and the anode electrode is not particularly limited, and a material capable of obtaining good ohmic characteristics For example, Al or the like may be employed.

  In the present embodiment, the one lead terminal 42 constitutes a cathode side lead terminal, and the other lead terminal 43 constitutes an anode side lead terminal. In the present embodiment, the LED chip 10 is mounted on the chip mounting member 41 so that the light emitting unit 12 of the LED chip 10 is farther from the chip mounting member 41 than the conductive substrate 11. You may make it mount in the chip mounting member 41 so that 12 may become the side near the chip mounting member 41 rather than the electroconductive board | substrate 11. FIG. Considering the light extraction efficiency, it is desirable to arrange the light emitting unit 12 on the side away from the chip mounting member 41. However, in this embodiment, the conductive substrate 11 and the light emitting unit 12 have the same refractive index. Therefore, even if the light emitting unit 12 is disposed on the side close to the chip mounting member 41, the light extraction loss does not become too large.

  In addition, the reflector 50 has a circular frame-like shape and is formed in a shape in which the opening area increases as the distance from the LED chip 10 increases in the thickness direction of the LED chip 10, and has a sheet shape having an insulating property. The lead terminals 42 and 43 are fixed by a fixing material 55 made of an adhesive film. The outer peripheral shape of the reflector 50 and the fixing material 55 is formed in a rectangular shape that is slightly smaller than the inner peripheral shape of the holding frame 45.

  Here, as a material of the reflector 50, a material (for example, Al) having a relatively high reflectance with respect to light emitted from the LED chip 10 (here, blue light) may be employed. Note that a circular opening 55 a corresponding to the opening of the reflector 50 is formed in the fixing material 55. Further, it is desirable to form a sealing portion inside the reflector 50 by potting a transparent sealing resin (for example, silicone resin) that seals the LED chip 10.

  The protective cover 60 has a dome-shaped cover portion 62 disposed so that its center is located on the center line along the thickness direction of the LED chip 10, and continuously protrudes sideways from the periphery of the opening of the cover portion 62. An annular positioning rib 61a is projected from the peripheral portion of the surface of the flange portion 61 on the reflector 50 side so that the flange portion 61 can be stably positioned with respect to the reflector 50. Yes. Note that the protective cover 60 may be bonded to the reflector 50 using, for example, an adhesive (for example, a silicone resin, an epoxy resin, or the like).

  The protective cover 60 is formed of a mixture in which a transparent material such as a silicone resin and a particulate yellow phosphor that emits broad yellow light when excited by the blue light emitted from the LED chip 10 are mixed. It is composed of goods. Therefore, the LED chip unit 1 in the present embodiment also serves as a color conversion member in which the protective cover 60 is excited by the light emitted from the LED chip 10 and emits light of a color different from the emission color of the LED chip 10. The LED chip unit 1 as a whole constitutes a white LED that outputs white light composed of combined light of blue light emitted from the LED chip 10 and light emitted from the yellow phosphor. The transparent material used as the material of the protective cover 60 is not limited to a silicone resin, and for example, an acrylic resin, an epoxy resin, glass, or the like may be employed. The phosphor mixed with the transparent material used as the material of the protective cover 60 is not limited to the yellow phosphor. For example, white light can be obtained by mixing a red phosphor and a green phosphor. Further, when the emission color of the LED chip 10 is the same as the desired emission color of the LED chip unit 1, it is not necessary to mix a phosphor with the transparent material.

  By the way, in this embodiment, the blue LED chip whose emission color is blue is adopted as the LED chip 10 as described above, and the SiC substrate is adopted as the conductive substrate 11, but GaN is used instead of the SiC substrate. A substrate may be used. When a SiC substrate or a GaN substrate is used, as can be seen from Table 1 below, when a sapphire substrate that is an insulator is used as a substrate for crystal growth as in Patent Document 2 above. In comparison, the crystal growth substrate has a high thermal conductivity and a low thermal resistance. Further, the light emission color of the LED chip 10 is not limited to blue, and may be, for example, red or green. That is, the material of the light-emitting portion 12 of the LED chip 10 is not limited to the GaN-based compound semiconductor material, and a GaAs-based compound semiconductor material, a GaP-based compound semiconductor material, or the like may be employed according to the emission color of the LED chip 10. Further, the conductive substrate 11 is not limited to the SiC substrate, and may be appropriately selected from, for example, a GaAs substrate and a GsP substrate according to the material of the light emitting unit 12.

  Further, the LED chip 10 is formed in a rectangular plate shape larger than the chip size of the LED chip 10 on the above-described chip mounting member 41, and the linear expansion coefficient between the LED chip 10 and the chip mounting member 41 that also serves as a heat transfer plate. It is mounted via a submount member 30 that relieves stress acting on the LED chip 10 due to the difference. The submount member 30 has not only a function of relieving the stress but also a heat conduction function of transferring heat generated in the LED chip 10 to a range wider than the chip size of the LED chip 10 in the chip mounting member 41. The surface area of the chip mounting member 41 on the LED chip 10 side is desirably sufficiently larger than the surface area of the LED chip 10 on the chip mounting member 41 side. For example, in order to efficiently perform waste heat from the 0.3-1.0 mm square LED chip 10, the contact area between the chip mounting member 41 and the insulating layer 80 is increased, and the heat of the LED chip 10 is wide. It is preferable to reduce the thermal resistance so as to conduct heat uniformly over the entire area, and the area of the surface on the LED chip 10 side of the chip mounting member 41 formed using the lead frame is defined as the chip mounting member in the LED chip 10. It is desirable that the surface area on the 41st side be 10 times or more. Here, the submount member 30 only needs to have the function of relieving the stress, and the thickness dimension is made smaller than the thickness dimension of the circuit board in the LED unit described in Patent Documents 1 to 3 above. Therefore, the heat resistance can be reduced by adopting a material having a relatively large thermal conductivity.

  In this embodiment, CuW is adopted as the material of the submount member 30. In the LED chip 10, the cathode electrode has the inner lead portion of the one lead terminal 42 via the submount member 30 and the chip mounting member 41. 42a, and the anode electrode is electrically connected to the inner lead portion 43a of the other lead terminal 43 through a bonding wire 14 made of a fine metal wire (for example, a gold fine wire, an aluminum fine wire, etc.). Yes. The lead wires 93 are electrically connected to the outer lead portions 42b and 43b of the lead terminals 42 and 43 through joints 95 made of solder, respectively.

  The material of the submount member 30 is not limited to CuW. For example, as can be seen from Table 2 below, the material of the submount member 30 is a material whose linear expansion coefficient is relatively close to 6H—SiC which is the material of the conductive substrate 11 and whose thermal conductivity is relatively high. For example, W, AlN, composite SiC, Si, or the like may be employed. However, when an insulator such as AlN or composite SiC is adopted as the submount member 30, for example, an appropriate conductor pattern to be bonded to the anode electrode is provided on the surface of the submount member 30 on the LED chip 10 side. The conductor pattern and the inner lead portion 42a of the one lead terminal 42 may be electrically connected via a bonding wire.

  Here, when the material of the chip mounting member 41 is Cu, if CuW or W is adopted as the submount member 30, the submount member 30 and the chip mounting member 41 can be directly joined. As shown in Table 3, compared to the case where the submount member 30 and the chip mounting member 41 are bonded using a brazing material, the bonding area between the submount member 30 and the chip mounting member 41 can be increased and the submount member can be increased. The thermal resistance of the joint between 30 and the chip mounting member 41 can be reduced. The LED chip 10 and the submount member 30 are bonded using lead-free solder such as AuSn or SnAgCu.

  Further, when W is used as the material of the submount member 30 and the submount member 30 and the chip mounting member 41 are directly joined, as shown in Table 4 below, the submount member 30 and the chip mounting member 41 are made of silver. Compared with the case where it joins using brazing, thermal conductivity becomes large and thermal resistance can be reduced. When the material of the chip mounting member 41 is Cu and AlN, composite SiC, or the like is adopted as the material of the submount member 30, the chip mounting member 41 and the submount member 30 are made of lead such as AuSn and SnAgCu. What is necessary is just to join using free solder.

  By the way, in the lighting fixture using LED of this embodiment, the mirror which consists of reflective films (for example, metal films, such as Al film) which reflects visible light in the surface facing the translucent board 91a in the above-mentioned circuit board 20. FIG. Since visible light totally reflected by the light transmitting plate 91a is reflected by the mirror 24 out of visible light emitted from each LED chip unit 1, compared with the case where the mirror 24 is not provided. The light output can be further increased. Here, since the circuit board 20 has the circuit pattern 22 and the mirror 24 separately formed on the side facing the translucent plate 91a, the circuit pattern 22 has a high degree of freedom in pattern design and the circuit pattern. Since the material of each of the mirror 22 and the mirror 24 can be appropriately selected, the light output can be further increased by selecting a material having a higher reflectivity as the material of the mirror 24. For example, if Al is used as the material of the mirror 24, , The reflectance of light having a wavelength in the visible light region can be increased and the light output can be increased as compared with the case where Ni is employed. In addition, although Au is employ | adopted as a material of the circuit pattern 22, not only Au but Cu etc. may be employ | adopted, for example.

  In the lighting fixture using the LED of the present embodiment described above, the insulating layer 80 such as a green sheet does not pass through the circuit board 300 shown in FIGS. Therefore, the circuit board 300 of the LED unit shown in FIGS. 31 and 32 is placed on the bottom wall 90a of the instrument body 90 via a sheet-like insulating member. Compared to the configuration of a conventional lighting fixture that is thermally coupled to each other, the distance from the light emitting portion 12 of the LED chip 10 to the fixture main body 90 and the thermal resistance can be reduced to improve heat dissipation, and the light emitting portion 12 of the LED chip 10 is improved. Therefore, the input power can be increased and the optical output can be increased. Moreover, when using it with the same light output as the structure of the lighting fixture using the conventional LED, compared with the structure of the lighting fixture using the conventional LED, the junction temperature of the LED chip 10 can be reduced and the lifetime of the LED chip 10 can be reduced. There is an advantage that becomes longer.

  Moreover, in the luminaire using the LED of the present embodiment, it is not necessary to use a conventional metal substrate (metal base printed wiring board) as the circuit board 20, and for example, compared with a metal substrate such as a glass epoxy substrate. Since an inexpensive circuit board can be employed, the cost of the circuit board 20 can be reduced.

  As described above, the submount member 30 interposed between the LED chip 10 and the chip mounting member 41 has a relatively small difference in linear expansion coefficient between the LED chip 10 and the chip mounting member 41. The distance between the LED chip 10 and the bottom wall 90a of the metal instrument main body 90 is smaller when the submount member 30 is not interposed between the LED chip 10 and the chip mounting member 41. The heat resistance from the light emitting part 12 of the LED chip 10 to the instrument main body 90 can be further reduced and the heat dissipation is further improved, so that the light output can be further increased.

(Embodiment 2)
The structure of the lighting fixture using LED of this embodiment is as substantially the same as Embodiment 1, Comprising: As shown in FIGS. 6-8, the structure of the LED chip unit 1 is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted. Although not shown, the present embodiment also includes a front cover 91 (see FIG. 4) similar to that of the first embodiment.

  In the LED chip unit 1 in the present embodiment, instead of providing the chip mounting member 41, the lead terminals 42 and 43, and the holding frame 45 in the first embodiment, a rectangular plate-like conductive material on which the LED chip 10 is mounted on one surface side. Mounting having lead terminals 73 and 73 formed of a conductive pattern that is formed through an insulating film 72 on the one surface side of the plate 71 and the conductive plate 71 and electrically connected to the anode electrode and the cathode electrode of the LED chip 10. A substrate (chip mounting member) 70 is provided, and the submount member 30 is interposed between the conductive plate 71 functioning as a heat transfer plate and the LED chip 10, and the conductive plate 71 and the bottom wall 90 a of the instrument main body 90. And the like in that an insulating layer 80 is interposed therebetween. In addition, as a material of the conductive plate 71, for example, a material having conductivity and a relatively high thermal conductivity such as copper and phosphor bronze may be adopted. As a material of the lead terminals 73 and 73, for example, Copper may be used. Moreover, since the electroconductive plate 71 should just have the thickness similar to the lead frame which mounts the LED chip 10, the thickness dimension is the thickness dimension of the circuit board in the LED unit described in the said patent documents 1-3. It can be made smaller than

  Further, in the present embodiment, the reflector 50 is integrally provided with a placement portion 51 on which an annular positioning rib 61 a protruding from the flange portion 61 of the protective cover 60 is placed, and the protective cover 60 is attached to the reflector 50. Can be positioned stably.

  In the present embodiment, an anode electrode (not shown) on one surface side (the upper surface side in FIG. 7) of the LED chip 10 is connected to one end portion (inner lead portion) of one lead terminal 73 via the bonding wire 14. The cathode electrode (not shown) on the other surface side (lower surface side in FIG. 7) of the LED chip 10 is electrically connected to one end portion (inner lead portion) of the other lead terminal 73 through the bonding wire 14. The other end of each lead terminal 73 is electrically connected to the circuit pattern 22 of the circuit board 20 via a joint 95 made of solder. In the present embodiment, the chip mounting member 70, the reflector 50, and the protective cover 60 constitute the LED chip 10 package.

  Also in the lighting fixture using the LED of the present embodiment described above, as in the first embodiment, the heat resistance from the light emitting portion 12 of the LED chip 19 to the fixture body 90 can be reduced compared to the conventional case, and the heat dissipation is improved. In addition, since the temperature rise of the junction temperature of the LED chip 10 can be suppressed, the input power can be increased to increase the light output, and the circuit board 20 can be compared to a metal board such as a glass epoxy board. Since an inexpensive circuit board can be employed, the cost of the circuit board 20 can be reduced.

  Here, as described above, the submount member 30 interposed between the LED chip 10 and the conductive plate 71 of the chip mounting member 70 has a difference in linear expansion coefficient between the LED chip 10 and the conductive plate 71. When the LED chip 10 and the conductive plate 71 are not interposed, the LED chip 10 and the bottom wall 90a of the metal instrument body 90 are not necessarily provided. The distance between the LED chip 10 is shortened, the thermal resistance from the light emitting part 12 of the LED chip 10 to the instrument body 90 can be further reduced, and the heat dissipation is further improved, so that the light output is further increased. Can be planned.

  Also in this embodiment, the LED chip unit 1 can be easily handled as an individual part during assembly or the like, and the individual inspection can be easily performed before each LED chip unit 1 is mounted on the instrument main body 90. There is.

(Embodiment 3)
The structure of the lighting fixture using LED of this embodiment is as substantially the same as Embodiment 1, Comprising: As shown in FIGS. 9-11, the structure of the circuit board 20 is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted. Although not shown, the present embodiment also includes a front cover 91 (see FIG. 4) similar to that of the first embodiment.

  The circuit board 20 in the present embodiment is different in that a circuit pattern 22 is formed on the side opposite to the surface facing the translucent plate 91a (see FIG. 4). Here, the connection part with each LED chip unit 1 in the circuit pattern 22 is extended along the inner surface of the window hole 23 to the surface facing the translucent plate 91a, and is connected via a joint portion 95 made of solder or the like. The lead terminals 42 and 43 are electrically connected.

  Therefore, in the luminaire using the LED of the present embodiment, the surface area of the mirror 24 formed on the surface of the circuit board 20 facing the translucent plate 91a can be increased as compared with the first embodiment, and the light output can be increased. Can be further increased. Note that the circuit board 20 in this embodiment may be used instead of the circuit board 20 in the second embodiment.

(Embodiment 4)
Hereinafter, the lighting fixture using LED of this embodiment is demonstrated, referring FIGS. 12-25. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted suitably.

  The lighting fixture using the LED of the present embodiment is a ceiling light, and a fixture body 190 made of metal (for example, a metal having high thermal conductivity such as Al or Cu) attached to a construction material 180 such as a ceiling material. I have. The instrument main body 190 is formed in a disk shape as shown in FIGS. 12 to 15 and opens in a circular shape on one surface (the lower surface of FIG. 12A) on the opposite side of the instrument main body 190 from the construction material 180 side. A recess 191 is formed, and a storage recess 192 that houses a plurality (eight in the present embodiment) of LED chip units 1 and the disk-shaped circuit board 20 is formed on the inner bottom surface of the recess 191. ing. Here, the circuit board 20 is formed with a plurality of (eight in the present embodiment) circular window holes 23 (see FIG. 25) through which a part of each LED chip unit 1 is inserted. A circuit pattern 22 (see FIG. 25A) for supplying power to the LED chip unit 1 is formed on one surface side facing the inner bottom surface of the housing recess 192 of the main body 190. It is arranged on the same side as each LED chip unit 1. Note that the circuit pattern 22 in FIG. 25A is formed so that eight LED chip units 1 are connected in series.

  A columnar embedded portion 193 inserted into a circular mounting hole 181 formed in the construction material 180 projects from the central portion of the other surface of the instrument main body 190 (the upper surface in FIG. 12A). The instrument main body 190 has a wire insertion hole 194 for introducing the electric wires 96, 96 for supplying power to the circuit board 20 into the storage recess 192, and the front end surface of the embedded portion 193 and the inner bottom surface of the storage recess 192. It penetrates in the site | part between the center part of. In short, the instrument main body 190 has a wire insertion hole 194 penetrating through the bottom of the storage recess 192. In addition, each electric wire 96, 96 is detachably connected to the first connector for output of a separate power supply unit (not shown) at the other end opposite to the one end connected to the circuit board 20. A second connector 97 is provided.

  On the other hand, the circuit board 20 has a pair of wire connecting through-hole wirings 26 and 26 (see FIG. 25) for electrically connecting the power feeding wires 96 and 96 formed at the center. Each wire connecting through-hole wiring 26, 26 is formed across the inner surface of the through-hole penetrating in the thickness direction of the circuit board 20 and the periphery of the through-hole on both surfaces of the circuit board 20. The electric wires 96, 96 are connected by using. Therefore, it is not necessary to provide a space for routing the electric wires 96 in the housing recess 192 of the instrument main body 190, and the instrument main body 190 can be thinned. Note that each electric wire connecting through-hole wiring 26, 26 is connected to the circuit pattern 22 on the one surface side of the circuit board 20.

  Here, the LED chip unit 1 will be described with reference to FIGS.

  The LED chip unit 1 includes an LED chip 10, a mounting substrate 120 on which the LED chip 10 is mounted, a frame 140 that surrounds the LED chip 10 on the mounting surface side of the LED chip 10 on the mounting substrate 120, A sealing portion 150 made of a translucent material (sealing resin) that seals the LED chip 10 and the bonding wires 14 and 14 connected to the LED chip 10 on the inside, and a shape that overlaps the sealing portion 150 and the frame body 140 And a lens 160 that is formed by molding together with a transparent material a phosphor that is excited by light emitted from the LED chip 10 and emits light of a color different from the emission color of the LED chip 10. The dome-shaped color conversion member 1 is disposed in such a manner that an air layer 180 is formed between the light emitting surface 160b of the lens and the outer surface of the frame 140. Has a 0 and.

  The mounting substrate 120 is provided with a metal plate 121 and lead patterns 123 and 123 including a pair of conductor patterns electrically connected to both electrodes (not shown) of the LED chip 10 on the surface opposite to the metal plate 121 side. Insulating substrate 122 made of a glass epoxy (FR4) substrate laminated on metal plate 121, and window hole 124 is provided at a portion corresponding to LED chip 10 in insulating substrate 122. The generated heat can be transferred to the metal plate 121 without passing through the insulating substrate 122. Here, although Cu is adopted as the material of the metal plate 121, any metal material having a relatively high thermal conductivity may be used, and not only Cu but also Al or the like may be adopted. In the LED chip unit 1 according to the present embodiment, the metal plate 121 constitutes a heat transfer plate made of a heat conductive material and on which the LED chip 10 is mounted, and the lead patterns 123 and 123 correspond to each of the LED chips 10. A lead terminal electrically connected to each electrode is configured.

  Further, the metal plate 121 and the insulating substrate 122 are a bonding metal layer 125 (FIG. 20 and FIG. 24) made of a metal material (here, Cu) formed on the surface of the insulating substrate 122 facing the metal plate 121. Fixed) via Each lead pattern 123, 123 is composed of a laminated film of a Cu film, a Ni film, and an Ag film. On the surface of the insulating substrate 122 opposite to the metal plate 121 side, a resist layer 126 (see FIG. 24) made of a white resin is laminated so as to cover the lead patterns 123, 123. A circular opening window 126a for exposing the inner lead portions 123a and 123a of the lead patterns 123 and 123 is formed at the center portion, and the outer lead portions 123b and 123b of the lead patterns 123 and 123 are exposed at the peripheral portions. Circular opening windows 126b and 126b to be formed are formed.

  In addition, the LED chip 10 is formed on the metal plate 121 in the shape of a rectangular plate having a size larger than the chip size of the LED chip 10, and the difference in linear expansion coefficient between the LED chip 10 and the metal plate 21 that is a heat transfer plate. It is mounted via a submount member 30 that relieves stress acting on the LED chip 10 due to the above. The submount member 30 has not only a function of relieving the stress but also a heat conduction function of transferring heat generated in the LED chip 10 to a range wider than the chip size of the LED chip 10 in the metal plate 121. . In the present embodiment, AlN having a relatively high thermal conductivity and insulation is used as the material of the submount member 30, and the LED chip 10 has the cathode electrode on the LED chip 10 side of the submount member 30. A conductive pattern 31 (see FIG. 23) provided on the surface and connected to the cathode electrode and electrically connected to one lead pattern 123 via a bonding wire 14 made of a fine metal wire (for example, a gold fine wire, an aluminum fine wire, etc.) The anode electrode is electrically connected to the other lead pattern 123 through the bonding wire 14. The LED chip 10 and the submount member 30 may be bonded using, for example, solder such as SnPb, AuSn, SnAgCu, or silver paste, but may be bonded using lead-free solder such as AuSn, SnAgCu. It is preferable. In the submount member 30, a reflective film (for example, a laminated film of a Ni film and an Ag film) 32 that reflects light emitted from the LED chip 10 is formed around the conductor pattern 31.

  The material of the submount member 30 is not limited to AlN, and any material may be used as long as the linear expansion coefficient is relatively close to 6H—SiC that is the material of the conductive substrate 11 and the heat conductivity is relatively high. Si or the like may be employed. In this embodiment, since the LED chip 10 is mounted on the metal plate 121 via the submount member 30, heat generated in the LED chip 10 can be efficiently radiated via the submount member 130 and the metal plate 121. In addition, the stress acting on the LED chip 10 due to the difference in linear expansion coefficient between the LED chip 10 and the metal plate 121 can be reduced.

  As the translucent material of the sealing portion 150 described above, a silicone resin is used, but not limited to a silicone resin, an acrylic resin or the like may be used.

  On the other hand, the frame 140 has a cylindrical shape and is formed of a transparent resin molded product, and a silicone resin is adopted as the transparent resin used for the molded product. In short, in the present embodiment, the frame 140 is formed of a light transmissive material having a linear expansion coefficient equal to that of the light transmissive material of the sealing portion 150. Here, in this embodiment, after the frame body 140 is fixed to the mounting substrate 120, the light-transmitting material of the sealing section 150 is filled (potted) inside the frame body 140, and is thermally cured. 150 is formed. In the case where acrylic resin is used instead of silicone resin as the translucent material of the sealing portion 150, it is desirable that the frame body 140 be formed of a molded product of acrylic resin. Further, the frame body 140 is disposed on the side opposite to the metal plate 121 side of the insulating substrate 122 so as to surround the LED chip 10 and the submount member 30.

  The lens 160 is composed of a biconvex lens in which each of the light incident surface 160a and the light emitting surface 160b on the sealing portion 150 side is formed in a convex curved surface shape. Here, the lens 160 is formed of a molded product of silicone resin, and the refractive index is the same as that of the sealing portion 150. However, the lens 160 is not limited to the molded product of silicone resin. You may comprise by the molded article of resin.

  By the way, the lens 160 has a light exit surface 160b having a convex curved surface shape that does not totally reflect the light incident from the light entrance surface 160a at the boundary between the light exit surface 160b and the air layer 180 described above. Here, the lens 160 is disposed so that the optical axis of the lens 160 is positioned on the center line of the light emitting unit 12 along the thickness direction of the LED chip 10. The light emitted from the side surface of the LED chip 10 propagates through the sealing portion 150 and the air layer 180 to reach the color conversion member 170 and does not excite the phosphor of the color conversion member 170 or collide with the phosphor. Or the color conversion member 170 is transmitted.

  The color conversion member 170 includes a transparent material such as silicone resin and a particulate yellow phosphor that emits broad yellow light when excited by the blue light emitted from the LED chip 10 and transmitted through the sealing portion 150. It is comprised by the molded article of the mixed mixture. Therefore, the LED chip unit 1 in the present embodiment obtains white light by emitting the blue light emitted from the LED chip 10 and the light emitted from the yellow phosphor through the outer surface 170b of the color conversion member 170. be able to. Note that the transparent material used as the material of the color conversion member 170 is not limited to the silicone resin, and for example, an acrylic resin, an epoxy resin, glass, or the like may be employed. Further, the phosphor mixed with the transparent material used as the material of the color conversion member 170 is not limited to the yellow phosphor. For example, white light can be obtained by mixing a red phosphor and a green phosphor.

  Here, the color conversion member 170 has an inner surface 170 a formed along the light emitting surface 160 b of the lens 160. Therefore, the distance between the light emitting surface 160b in the normal direction and the inner surface 170a of the color conversion member 170 is a substantially constant value regardless of the position of the light emitting surface 160b of the lens 160. Note that the color conversion member 170 is formed so that the thickness along the normal direction is uniform regardless of the position. The color conversion member 170 may be fixed at the periphery of the opening to the insulating substrate 122 via a joint (not shown) made of, for example, an adhesive (for example, silicone resin, epoxy resin, etc.).

  In the LED chip unit 1 according to the present embodiment, the submount member 30 is formed in a flat plate shape having a larger planar size than the LED chip 10 as described above, and around the conductor pattern 31 serving as a bonding portion of the LED chip 10. A reflective film 32 that reflects light emitted from the side surface of the LED chip 10 is provided, and the surface of the reflective film 32 is farther from the metal plate 121 than the edge of the color conversion member 170 on the insulating substrate 122 side. Since the thickness dimension is set so as to be positioned, the light emitted from the side surface of the LED chip 10 can be prevented from being absorbed by the insulating substrate 122 and the light extraction efficiency to the outside can be improved. In addition, light emitted from the side surface of the LED chip 10 is emitted through the joint between the color conversion member 170 and the insulating substrate 122. Is the can be prevented, it is possible to reduce the color unevenness, thereby improving the light output by improving the external light coupling efficiency.

  Here, the LED chip 10 is disposed at the center of the submount member 30 such that each side in a plan view intersects one of a pair of diagonal lines of the submant member 30. The light radiated from the respective side surfaces to the submount member 30 side can be efficiently reflected by the reflection film 32, and the light output can be improved by improving the light extraction efficiency to the outside. In the present embodiment, the LED chip 10 and the submant member 30 have substantially the same center axis along the thickness direction, and each side in the plan view of the LED chip 10 is the one diagonal line of the submount member 30. And an angle of about 45 degrees. Further, in the present embodiment, the mounting substrate 120 has a laminated structure of the above-described metal plate 121 and the insulating substrate 122. Therefore, compared to the first embodiment, the instrument main body 190 and the lead pattern 123 as a lead terminal, The insulation distance between the two can be increased, and the reliability is improved.

  Further, in the LED chip unit 1 according to the present embodiment, the color conversion member 170 is arranged in such a manner that an air layer 180 is formed between the light emitting surface 160b of the lens 160 and the frame body 140. Since the conversion member 170 does not need to be in close contact with the lens 160 and the frame body 140, it is possible to suppress a decrease in yield due to the dimensional accuracy and positioning accuracy of the color conversion member 170. In the LED chip unit 1 according to the present embodiment, since the air layer 180 is formed between the color conversion member 170 and the lens 160, the color conversion member 170 is deformed when an external force is applied to the color conversion member 170. Accordingly, the possibility of contact with the lens 160 is reduced, and the stress generated in the color conversion member 170 due to the external force is suppressed from being transmitted to the LED chip 10 and the bonding wires 14 and 14 through the lens 160 and the sealing portion 150. In addition, there is an advantage that the reliability is improved because the light emission characteristics of the LED chip 10 and the bonding wires 14 and 14 are not easily broken by the external force. In addition, since the air layer 180 is formed between the color conversion member 170 and the lens 160, there is an advantage that moisture in the external atmosphere hardly reaches the LED chip 10.

  Further, since the air layer 180 is formed between the color conversion member 170 and the lens 160, the color conversion member 170 is emitted from the LED chip 10 and enters the color conversion member 170 through the sealing portion 150 and the lens 160. Of the light scattered by the yellow phosphor particles in 170, the amount of light scattered toward the lens 160 side and transmitted through the lens 160 can be reduced, and the light extraction efficiency to the outside of the LED chip unit 1 as a whole can be improved. There is an advantage.

  Each LED chip unit 1 described above is mounted on the inner bottom surface of the housing recess 192 of the instrument body 190 via an insulating layer 80 made of, for example, a green sheet. Therefore, also in the lighting fixture using the LED of this embodiment, similarly to the other embodiments, the temperature rise of the LED chip 10 can be suppressed, the light output can be increased, and the cost of the circuit board 20 can be reduced. It becomes possible.

  By the way, the above-mentioned window hole 23 in the circuit board 20 shown in FIG. 25 is formed in a circular shape having an opening size through which the color conversion member 170 of the LED chip unit 1 can be inserted. 23, a unit connection through hole for electrically connecting the outer lead portion 123b and the circuit pattern 22 to a portion overlapping each outer lead portion 123b of the LED chip unit 1 using a brazing material such as solder. A wiring 27 is formed. Each unit connecting through-hole wiring 27 is formed across the inner surface of the through-hole penetrating in the thickness direction of the circuit board 20 and the periphery of the through-hole on both surfaces of the circuit board 20. Is connected to the circuit pattern 22 on the one surface side. Note that a mirror 24 (see FIG. 9) may be provided on the surface of the circuit board 20 facing a light transmitting member 200 described later, as in the second embodiment, or a white resist layer may be provided as a light reflecting film. You may do it.

  Further, a plurality of (in this embodiment, two) mounting screws 198 for attaching the tool main body 190 to the construction material 180 are inserted into the above-described instrument main body 190 from the one surface side (in this embodiment). Two) screw insertion holes 195 are provided in a portion between the inner bottom surface of the recess 191 and the other surface of the instrument main body 190. Therefore, the instrument body 190 can be attached to the construction material 180 such as a ceiling material using the attachment screw 198.

  In addition, the circuit board 20 includes a translucent member 200 that is disposed on the opposite side to the inner surface of the housing recess 192 of the instrument main body 190 and transmits visible light from each LED chip unit 1.

  The translucent member 200 is formed of a molded product of a translucent material (for example, acrylic resin), and is separated from the circuit board 20 on the other surface side of the circuit board 20 as shown in FIGS. And an annular side plate portion 202 that continuously and integrally protrudes from the peripheral edge of the front plate portion 201 toward the inner bottom surface of the housing recess 191 of the instrument main body 190. Further, the instrument body 190 is formed with two screw insertion holes 197 through which a fixing screw 199 for fixing the translucent member 200 is inserted, and the translucent member 200 is formed from the other surface side of the instrument body 190. Two boss portions 203 each having a screw hole 204 into which a distal end portion of a fixing screw 199 inserted into the screw insertion hole 197 of the instrument main body 190 is screwed are integrally formed. A notch 28 is formed at a portion corresponding to each boss 203 in the peripheral portion of the circuit board 20.

  Moreover, the lighting fixture using LED of this embodiment has the circular opening window 211 (refer FIG. 18) which exposes the light-projection surface side (lower surface side of Fig.12 (a)) of the translucent member 200. FIG. A frame-shaped decorative cover 210 attached to the instrument main body 190 is provided on the one surface side of the instrument main body 190 so as to cover the peripheral portion of the storage recess 192 and the mounting screws 198. Accordingly, if the decorative cover 210 is attached to the instrument body 190 after the instrument body 190 is attached to the construction material 180 using the attachment screws 198, the attachment screws are not visible from the one surface side of the instrument body 190, so that the appearance is good. can do. Here, the decorative cover 210 is formed using an elastic synthetic resin (for example, PBT, ABS, etc.), and a plurality of engagements that engage with the plurality of engagement holes 196 formed in the instrument body 190, respectively. A stop projection 212 protrudes from the surface facing the instrument body 190. That is, the decorative cover 210 is attached to the instrument main body 190 by inserting the respective locking projections 212 into the respective engagement holes 196 of the instrument main body 190 and engaging with the peripheral portions of the respective engagement holes 196. .

  By the way, although the above-mentioned decorative cover 210 is comprised by the synthetic resin molded article, if the decorative cover 210 is formed with a metal, heat dissipation will be improved compared with the case where the decorative cover 210 is formed with synthetic resin. The temperature rise of the junction temperature of the LED chip 10 can be further suppressed. In the case where the decorative cover 210 is formed of metal, for example, a structure that is attached to the instrument main body 190 using a leaf spring may be adopted, and the decorative cover 210 may be detachable from the instrument main body 190. It is possible to adopt a structure that is screwed into 190 and attachable to and detachable from the instrument body 190.

  By the way, as for the above-mentioned translucent member 200, although the front-plate part 201 becomes a flat plate shape, as shown in FIG. 17, LED chip unit 1 is each in each site | part which opposes each LED chip unit 1, respectively. If the molded article is made of a translucent material (for example, acrylic resin, glass, etc.) having a lens portion 205 for controlling the light distribution of light emitted from the LED chip, the light distribution of each LED chip unit 1 is distributed. Can be controlled. Here, each lens unit 205 is a Fresnel lens, and has a recess 206 that houses the color conversion member 70 of the LED chip unit 1 and is arranged so that the optical axis coincides with the lens 160 of the LED chip unit 1. The Each lens unit 205 has a function of reflecting light incident from the inner side surface 206b of the recess 206 by the outer side surface 205b and guiding it to the light emitting surface 205a side of the lens unit 205.

  In addition, in the translucent member 200 having the configuration shown in FIG. 17, if a portion other than each lens portion 205 is formed of metal, heat is radiated as compared to the case where the entire translucent member 200 is formed of synthetic resin, glass, or the like. Therefore, the temperature increase of the junction temperature of the LED chip 10 can be further suppressed.

(Embodiment 5)
As shown in FIGS. 26 and 27, the lighting fixture using the LED of this embodiment is different from the fourth embodiment in the shape of the metal fixture body 290, and the configuration of the LED chip unit 1 is the same as that in the fourth embodiment. It is. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 4, and description is abbreviate | omitted.

  The instrument body 290 in the present embodiment is formed in a band plate shape (elongated rectangular plate shape), and a plurality of (eight in the illustrated example) LED chip units 1 and the band plate circuit board 20 are formed on one surface. A storage recess 290a is formed for storing the storage. Here, the plurality of LED chip units 1 are arranged in parallel at a predetermined interval in the longitudinal direction of the instrument body 290. Each LED chip unit 1 is mounted on the inner bottom surface of the housing recess 290a of the instrument body 290 via an insulating layer 80 (see FIG. 20) made of, for example, a green sheet, as in the fourth embodiment.

  A circuit pattern (not shown) for connecting the LED chip units 1 in series is formed on the surface of the circuit board 20 facing the inner bottom surface of the housing recess 290a, and an electric wire insertion hole (not shown) of the instrument body 290 is formed. The electric wire (not shown) introduced into the storage recess 290a through the device is appropriately connected. Similarly to the fourth embodiment, one window hole 23 and two unit connecting through-hole wirings 27 are formed on the circuit board 20 for each portion corresponding to each LED chip unit 1.

  Thus, also in the lighting fixture using the LED of this embodiment, similarly to the fourth embodiment, the temperature rise of the LED chip 10 can be suppressed, the light output can be increased, and the cost of the circuit board 20 can be reduced. become. In addition, as the circuit board 20 in this embodiment, you may use not only a glass epoxy board | substrate but a flexible printed wiring board (FPC), for example.

(Embodiment 6)
The basic configuration of the lighting fixture using the LED of this embodiment is substantially the same as that of the fifth embodiment. In the fifth embodiment, all the LED chip units 1 in the fixture main body 290 are connected by one circuit board 20. In contrast, in the present embodiment, as shown in FIGS. 28 to 30, all LED chip units 1 are connected using a plurality of circuit boards 20. In the present embodiment, two LED chip units 1 arranged in parallel in the longitudinal direction of the instrument body 290 are connected by one circuit board 20, and a lead wire (not shown) is provided between the circuit boards 20 arranged in the longitudinal direction. ). Since other configurations are the same as those of the fifth embodiment, the description thereof is omitted.

  In other embodiments, one circuit board 20 may be divided into a plurality of circuit boards and connected as appropriate.

  In each of the above embodiments, a glass epoxy substrate is exemplified as the circuit board 20. However, for example, a ceramic MID board is used to protrude toward the instrument main body at a portion that does not overlap with the LED chip unit 1. If a contact portion is provided, heat dissipation can be further improved.

FIG. 3 is a schematic exploded perspective view showing a main part of the first embodiment. It is a principal part schematic perspective view in the same as the above. It is a principal part schematic sectional drawing in the same as the above. It is a schematic side view partially broken in the same as the above. It is a principal part disassembled perspective view in the same as the above. FIG. 6 is a schematic exploded perspective view showing a main part of a second embodiment. It is a principal part schematic sectional drawing in the same as the above. It is a principal part disassembled perspective view in the same as the above. FIG. 6 is a schematic exploded perspective view showing a main part of a third embodiment. It is a principal part schematic perspective view in the same as the above. It is a principal part schematic sectional drawing in the same as the above. Embodiment 4 is shown, (a) is a schematic front view partly broken, and (b) is a schematic bottom view. The instrument main body same as the above is shown, (a) is a top view, (b) is A-A 'sectional drawing of (a). The instrument main body in the same as the above is shown, (a) is a sectional view partly broken, (b) is a plan view of the main part. It is a perspective view of the instrument main body in the same as the above. The translucent member in the same as above is shown, (a) is a plan view, (b) is a partially broken cross-sectional view, and (c) is a main part cross-sectional view. The other structural example of the translucent member in the same is shown, (a) is a top view, (b) is sectional drawing. The decorative cover in the above is shown, (a) is a plan view, (b) is a cross-sectional view taken along the line A-A 'of (a). It is a perspective view of the decorative cover in the same as the above. It is a schematic sectional drawing of the state which mounted the LED chip unit in the same as the instrument main body. It is a principal part exploded perspective view same as the above. It is a principal part top view of the LED chip unit same as the above. It is a perspective view of the submount member same as the above. The insulating board | substrate in the same as the above is shown, (a) is a top view, (b) is an A-B-C-D sectional view of (a), and (c) is a partially broken bottom view. The circuit board in the same as above is shown, (a) is a plan view and (b) is a bottom view. Embodiment 5 is shown, (a) is a schematic perspective view, (b) is a principal part enlarged view of (a). It is a general | schematic disassembled perspective view which shows the same as the above. FIG. 10 is a schematic perspective view showing a sixth embodiment. It is a principal part expansion perspective view same as the above. It is a general | schematic disassembled perspective view which shows the same as the above. It is a schematic sectional drawing of the LED unit which shows a prior art example. It is a schematic block diagram of the LED unit which shows another prior art example.

Explanation of symbols

1 LED chip unit (light emitting device)
DESCRIPTION OF SYMBOLS 10 LED chip 11 Conductive board 12 Light emission part 20 Circuit board 22 Circuit pattern 23 Window hole 24 Mirror 42 Lead terminal 43 Lead terminal 80 Insulating layer 90 Instrument main body 90a Bottom wall 91 Front cover 91a Translucent plate 91b Window frame

Claims (9)

  A metal instrument body, a plurality of LED chip units each having an LED chip and a pair of lead terminals to which the respective electrodes of the LED chip are electrically connected, and the LED chip unit and the instrument body interposed between both An insulating layer that electrically insulates and thermally couples them, and a circuit pattern for supplying power to each LED chip unit are formed, and a plurality of window holes through which each LED chip unit is inserted are formed in the instrument body. On the other hand, the lighting fixture using LED characterized by including the circuit board arrange | positioned on the same side as each LED chip unit.   The circuit board includes a translucent member that is disposed on the opposite side of the surface facing the instrument body and transmits visible light from each LED chip unit, and visible light is disposed on the surface of the circuit board facing the translucent member. The illumination fixture using LED according to claim 1, wherein a mirror that reflects light is formed.   3. The lighting apparatus using LEDs according to claim 2, wherein the circuit board is formed with the circuit pattern and the mirror on a surface facing the light transmitting member.   The lighting device using an LED according to claim 2, wherein the circuit board is formed with the circuit pattern on a side opposite to a surface facing the translucent member.   The said mirror is formed with aluminum, The lighting fixture using LED in any one of Claim 2 thru | or 4 characterized by the above-mentioned.   The appliance body is formed in a disk shape having a storage recess for storing the LED chip units and the circuit board on one side, and a power supply electric wire electrically connected to the circuit board at the center of the circuit board is provided. 6. The lighting fixture using LED according to claim 2, wherein a wire insertion hole to be inserted is formed through a bottom portion of the storage recess at a central portion of the fixture main body.   A plurality of screw insertion holes through which a plurality of attachment screws for attaching the instrument main body to the construction material are inserted from the one surface side in a peripheral portion of the storage recess in the instrument main body, and light of the translucent member A frame-shaped decorative cover that has an opening window that exposes the exit surface side and is attached to the instrument body so as to cover a peripheral portion of the housing recess and each mounting screw on the one surface side of the instrument body; The lighting fixture using LED according to claim 6, wherein the decorative cover is made of metal.   The translucent member has a lens part for controlling the light distribution of the light emitted from the LED chip unit at each part facing the LED chip unit, and parts other than the lens parts are made of metal. A lighting fixture using the LED according to any one of claims 1 to 7, wherein the lighting fixture is formed.   The LED chip unit is made of a heat conductive material, and is interposed between the LED chip and the heat transfer plate between the LED chip and the heat transfer plate. And a pair of conductor patterns electrically connected to the respective electrodes of the LED chip on the surface opposite to the heat transfer plate side and exposing the submount member 9. The semiconductor device according to claim 1, further comprising: an insulating substrate having a window hole penetrating in a thickness direction and laminated on a heat transfer plate, and each conductor pattern constitutes the lead terminal. A lighting apparatus using the LED according to claim 1.

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