JP4552798B2 - LED lighting device - Google Patents

LED lighting device Download PDF

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JP4552798B2
JP4552798B2 JP2005216384A JP2005216384A JP4552798B2 JP 4552798 B2 JP4552798 B2 JP 4552798B2 JP 2005216384 A JP2005216384 A JP 2005216384A JP 2005216384 A JP2005216384 A JP 2005216384A JP 4552798 B2 JP4552798 B2 JP 4552798B2
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lens
led chip
light
color conversion
conversion unit
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JP2007035882A (en
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卓也 中谷
洋二 浦野
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Panasonic Corp
Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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Description

本発明は、ＬＥＤチップ（発光ダイオードチップ）を利用したＬＥＤ照明装置に関するものである。   The present invention relates to an LED lighting device using an LED chip (light emitting diode chip).

従来から、ＬＥＤチップとＬＥＤチップから放射された光によって励起されてＬＥＤチップとは異なる発光色の光を放射する波長変換材料としての蛍光材料とを組み合わせてＬＥＤチップの発光色とは異なる色合いの光を出す発光装置の研究開発が各所で行われている（例えば、特許文献１）。なお、この種の発光装置としては、例えば、青色光あるいは紫外光を放射するＬＥＤチップと蛍光体とを組み合わせて白色の光（白色光の発光スペクトル）を得る白色発光装置（一般的に白色ＬＥＤと呼ばれている）の商品化がなされている。   Conventionally, an LED chip and a fluorescent material that is excited by light emitted from the LED chip and emits light of a different emission color from the LED chip are combined with a light emitting color different from that of the LED chip. Research and development of light-emitting devices that emit light are performed in various places (for example, Patent Document 1). In addition, as this kind of light emitting device, for example, a white light emitting device (generally a white LED) that obtains white light (white light emission spectrum) by combining an LED chip that emits blue light or ultraviolet light and a phosphor. Has been commercialized).

上記特許文献１には、例えば、図５に示すように、青色の光を放射するＬＥＤチップ１０’と、ＬＥＤチップ１０’が実装される実装基板２０’であって厚み方向の一面側にＬＥＤチップ１０’を収納する収納凹所２０ａ’が形成された実装基板２０’と、収納凹所２０ａ’に充填されＬＥＤチップ１０’を封止した封止樹脂からなる封止部３０’と、黄色蛍光体を樹脂とともに成形した成形品であって封止部３０’を覆う形で実装基板２０’に固着されたシート状の色変換部材１４０’とを備えた発光装置１’が開示されている。なお、図５の発光装置１’では、実装基板２０’と色変換部材１４０’とでパッケージを構成している。   In Patent Document 1, for example, as shown in FIG. 5, an LED chip 10 ′ that emits blue light and a mounting substrate 20 ′ on which the LED chip 10 ′ is mounted, A mounting substrate 20 ′ in which a housing recess 20a ′ for housing the chip 10 ′ is formed, a sealing portion 30 ′ made of a sealing resin filled in the housing recess 20a ′ and sealing the LED chip 10 ′, and yellow There is disclosed a light emitting device 1 ′ that is a molded product obtained by molding a phosphor together with a resin and includes a sheet-like color conversion member 140 ′ fixed to a mounting substrate 20 ′ so as to cover a sealing portion 30 ′. . In the light emitting device 1 ′ of FIG. 5, a package is configured by the mounting substrate 20 ′ and the color conversion member 140 ′.

ところで、図５に示すような発光装置１’を用いたＬＥＤ照明装置としては、例えば、図６に示すように、回路基板５０’上に発光装置１’を実装し、発光装置１’から放射された光の配光を制御するレンズ６０’を発光装置１’に光軸が一致する形で配置したものが提案されている。
特開２００３−４６１３３号公報 By the way, as an LED lighting device using the light emitting device 1 ′ as shown in FIG. 5, for example, as shown in FIG. 6, the light emitting device 1 ′ is mounted on the circuit board 50 ′ and emitted from the light emitting device 1 ′. A lens 60 ′ for controlling the light distribution of the emitted light is arranged on the light emitting device 1 ′ so that the optical axes thereof coincide with each other.
JP 2003-46133 A

ところで、図６に示したＬＥＤ照明装置においては、ＬＥＤチップ１０’がパッケージングされた発光装置１’により白色の照明色を得ているので、照明色が青色のＬＥＤ照明装置を他品種として展開するには、色変換部材１４０’を用いることなくＬＥＤチップ１０’がパッケージングされた発光装置を用意する必要があり、照明色が白色の品種と青色の品種とで異なる発光装置が必要となって、コストが高くなるという不具合があった。   By the way, in the LED illumination device shown in FIG. 6, since the white illumination color is obtained by the light emitting device 1 ′ in which the LED chip 10 ′ is packaged, the LED illumination device having a blue illumination color is developed as another type. In order to achieve this, it is necessary to prepare a light emitting device in which the LED chip 10 'is packaged without using the color conversion member 140', and light emitting devices having different illumination colors for white and blue types are required. There was a problem that the cost was high.

本発明は上記事由に鑑みて為されたものであり、その目的は、従来に比べて低コスト化を図れるＬＥＤ照明装置を提供することにある。   This invention is made | formed in view of the said reason, The objective is to provide the LED illuminating device which can aim at cost reduction compared with the past.

請求項１の発明は、可視光を放射するＬＥＤチップと、該ＬＥＤチップが実装された回路基板と、前記ＬＥＤチップを封止する封止部と、少なくとも前記ＬＥＤチップから放射された光の配光を制御するレンズであって前記回路基板との間で前記ＬＥＤチップを封止する前記封止部を囲む形で前記回路基板に封着されたレンズとを備え、前記レンズは、透明材料と前記ＬＥＤチップから放射された光によって励起されて前記ＬＥＤチップの発光色とは異なる色の光を放射する蛍光材料とで構成されるドーム状の色変換部が一体化されてなり、前記色変換部と前記封止部との間に空気層を備えてなることを特徴とする。 The invention of claim 1 includes a LED chip to emit visible light, and a circuit board to which the L ED chip is mounted, and a sealing portion for sealing the LED chip, emitted from least the L ED chips and a lens for controlling the distribution of light and a said circuitry said LED chip lens is sealed to the circuitry substrate to surround the sealing portion for sealing between the substrate, the lenses, the color conversion section shaped dome and fluorescent material Ru consists of emitting light of a color different from the luminescent color of the being excited by the light emitted L ED chips from a transparent material wherein L ED chip It is integrated and an air layer is provided between the color conversion part and the sealing part .

この発明によれば、レンズが回路基板との間でＬＥＤチップを囲む形で回路基板に封着され、しかも、透明材料とＬＥＤチップから放射された光によって励起されてＬＥＤチップの発光色とは異なる色の光を放射する蛍光材料とで構成される色変換部がレンズに一体化されているので、回路基板とレンズとでＬＥＤチップのパッケージが構成されるから、パッケージングされたＬＥＤチップを用意する必要がなく低コスト化を図れ、あらかじめ色変換部が一体化されたレンズと色変換部が一体化されていないレンズとを用意しておくことで、ＬＥＤチップから放射される光と色変換部の蛍光材料から放射される光との混色光を照明光とするＬＥＤ照明装置と、ＬＥＤチップから放射される光を照明光とするＬＥＤ照明装置とで、パッケージングされていないＬＥＤチップを共用でき、低コスト化を図れる。また、ＬＥＤチップを封止する封止部と、色変換部との間に空気層が形成されていることにより、封止部と色変換部とを密着させる場合に比べて組立性を向上させることもできる。 According to the present invention, the lens is sealed to the circuit board so as to surround the LED chip with the circuit board, and is excited by the light emitted from the transparent material and the LED chip and the light emission color of the LED chip is Since the color conversion unit composed of fluorescent materials that emit light of different colors is integrated with the lens, the package of the LED chip is composed of the circuit board and the lens. There is no need to prepare them, and the cost can be reduced. By preparing a lens with an integrated color converter and a lens with no integrated color converter, the light and color emitted from the LED chip are prepared. An LED illumination device that uses mixed color light with light emitted from the fluorescent material of the conversion unit as illumination light, and an LED illumination device that uses light emitted from the LED chip as illumination light. We are able to share the LED chips do not, thereby the cost. In addition, since an air layer is formed between the sealing portion for sealing the LED chip and the color conversion portion, the assemblability is improved as compared with the case where the sealing portion and the color conversion portion are brought into close contact with each other. You can also

請求項２の発明は、請求項１の発明において、前記色変換部は、前記レンズに埋設され該レンズに一体化されてなることを特徴とする。 The invention of claim 2 is the invention of claim 1, wherein the color conversion unit, characterized by comprising integrated in the buried該Re lens in the lens.

この発明によれば、前記色変換部と前記レンズとが別部品である場合に比べて部品点数を削減でき、部品の管理コストを低減できる。   According to this invention, the number of parts can be reduced compared to the case where the color conversion unit and the lens are separate parts, and the management cost of the parts can be reduced.

請求項３の発明は、前記色変換部は、前記レンズに接着することで前記レンズに一体化されてなることを特徴とする。   The invention according to claim 3 is characterized in that the color conversion section is integrated with the lens by being bonded to the lens.

この発明によれば、所望の照明色にかかわらず前記レンズの共通化を図れコストを低減できる。   According to the present invention, the lens can be shared regardless of the desired illumination color, and the cost can be reduced.

請求項１の発明では、従来に比べて低コスト化を図れるという効果がある。   The invention of claim 1 has an effect that the cost can be reduced as compared with the prior art.

（参考例１）
本参考例のＬＥＤ照明装置は、図１に示すように、可視光を放射するＬＥＤチップ１０と、ＬＥＤチップ１０が実装された回路基板５０と、透明材料とＬＥＤチップ１０から放射された光によって励起されてＬＥＤチップ１０の発光色とは異なる色の光を放射する蛍光材料とで構成される色変換部４０と、ＬＥＤチップ１０から放射された光および上記蛍光材料から放射された光の配光を制御するレンズ６０とを備えている。 (Reference Example 1 )
As shown in FIG. 1, the LED lighting device according to this reference example includes an LED chip 10 that emits visible light, a circuit board 50 on which the LED chip 10 is mounted, a transparent material, and light emitted from the LED chip 10. A color conversion unit 40 composed of a fluorescent material that is excited and emits light of a color different from the emission color of the LED chip 10, and the arrangement of the light emitted from the LED chip 10 and the light emitted from the fluorescent material And a lens 60 for controlling light.

回路基板５０は、金属板５１上に絶縁層５２を介して対となる導体パターン５３，５３が形成された金属基板を採用しており、ＬＥＤチップ１０で発生した熱が金属板５１に伝熱されるようになっている。なお、金属板５１の材料としてはＣｕを採用しているが、熱伝導率の比較的高い金属材料であればよく、Ｃｕに限らず、Ａｌなどを採用してもよい。   The circuit board 50 employs a metal board on which a pair of conductor patterns 53 and 53 are formed on the metal plate 51 via an insulating layer 52, and heat generated in the LED chip 10 is transferred to the metal board 51. It is supposed to be. In addition, although Cu is employ | adopted as a material of the metal plate 51, what is necessary is just a metal material with comparatively high heat conductivity, and not only Cu but Al etc. may be employ | adopted.

ＬＥＤチップ１０は、青色光を放射するＧａＮ系青色ＬＥＤチップであり、結晶成長用基板としてサファイア基板に比べて格子定数や結晶構造がＧａＮに近く且つ導電性を有するｎ形のＳｉＣ基板からなる導電性基板１１を用いており、導電性基板１１の主表面側にＧａＮ系化合物半導体材料により形成されて例えばダブルへテロ構造を有する積層構造部からなる発光部１２がエピタキシャル成長法（例えば、ＭＯＶＰＥ法など）により成長され、導電性基板１１の裏面に図示しないカソード側の電極であるカソード電極（ｎ電極）が形成され、発光部１２の表面（導電性基板１１の主表面側の最表面）に図示しないアノード側の電極であるアノード電極（ｐ電極）が形成されている。要するに、ＬＥＤチップ１０は、一表面側にアノード電極が形成されるとともに他表面側にカソード電極が形成されている。上記カソード電極および上記アノード電極は、Ｎｉ膜とＡｕ膜との積層膜により構成してあるが、上記カソード電極および上記アノード電極の材料は特に限定するものではなく、良好なオーミック特性が得られる材料であればよく、例えば、Ａｌなどを採用してもよい。なお、本参考例では、ＬＥＤチップ１０の発光部１２が導電性基板１１よりも金属板５１から離れた側となるように金属板５１に実装されているが、ＬＥＤチップ１０の発光部１２が導電性基板１１よりも金属板５１に近い側となるように金属板５１に実装するようにしてもよい。 The LED chip 10 is a GaN-based blue LED chip that emits blue light, and is a conductive substrate made of an n-type SiC substrate that has a lattice constant and a crystal structure close to GaN as a crystal growth substrate and has conductivity compared to a sapphire substrate. The light emitting portion 12 formed of a GaN-based compound semiconductor material and having, for example, a double hetero structure is formed on the main surface side of the conductive substrate 11 by an epitaxial growth method (for example, MOVPE method). ), A cathode electrode (n electrode) which is a cathode side electrode (not shown) is formed on the back surface of the conductive substrate 11, and is shown on the surface of the light emitting unit 12 (the outermost surface on the main surface side of the conductive substrate 11). An anode electrode (p electrode) which is an electrode on the anode side that is not to be formed is formed. In short, the LED chip 10 has an anode electrode formed on one surface side and a cathode electrode formed on the other surface side. The cathode electrode and the anode electrode are composed of a laminated film of a Ni film and an Au film, but the material of the cathode electrode and the anode electrode is not particularly limited, and a material capable of obtaining good ohmic characteristics For example, Al or the like may be employed. In this reference example, the light emitting unit 12 of the LED chip 10 is mounted on the metal plate 51 so as to be on the side farther from the metal plate 51 than the conductive substrate 11. May be mounted on the metal plate 51 so as to be closer to the metal plate 51 than the conductive substrate 11.

また、ＬＥＤチップ１０は、上述の金属板５１に、ＬＥＤチップ１０のチップサイズよりも大きなサイズの矩形板状に形成されＬＥＤチップ１０と金属板５１との線膨張率の差に起因してＬＥＤチップ１０に働く応力を緩和するサブマウント部材８０を介して実装されている。サブマウント部材８０は、上記応力を緩和する機能だけでなく、ＬＥＤチップ１０で発生した熱を金属板５１においてＬＥＤチップ１０のチップサイズよりも広い範囲に伝熱させる熱伝導機能を有している。本参考例では、サブマウント部材８０の材料として熱伝導率が比較的高く且つ絶縁性を有するＡｌＮを採用しており、ＬＥＤチップ１０は、上記カソード電極がサブマウント部材８０におけるＬＥＤチップ１０側の表面に設けられ上記カソード電極と接続される電極パターン（図示せず）および金属細線（例えば、金細線、アルミニウム細線など）からなるボンディングワイヤ１４を介して一方の導体パターン５３と電気的に接続され、上記アノード電極がボンディングワイヤ１４を介して他方の導体パターン５３と電気的に接続されている。なお、ＬＥＤチップ１０とサブマウント部材８０とは、ＡｕＳｎ、ＳｎＡｇＣｕなどの鉛フリー半田を用いて接合されている。 The LED chip 10 is formed on the metal plate 51 in the shape of a rectangular plate having a size larger than the chip size of the LED chip 10, and the LED chip 10 is caused by a difference in linear expansion coefficient between the LED chip 10 and the metal plate 51. It is mounted via a submount member 80 that relieves stress acting on the chip 10. The submount member 80 has not only a function of relieving the stress, but also a heat conduction function of transferring heat generated in the LED chip 10 to a range wider than the chip size of the LED chip 10 in the metal plate 51. . In this reference example, AlN having a relatively high thermal conductivity and insulation is used as the material of the submount member 80, and the LED chip 10 has the cathode electrode on the LED chip 10 side of the submount member 80. And electrically connected to one conductor pattern 53 via a bonding wire 14 made of an electrode pattern (not shown) provided on the surface of the electrode and connected to the cathode electrode and a fine metal wire (for example, a gold fine wire, an aluminum fine wire, etc.) The anode electrode is electrically connected to the other conductor pattern 53 via the bonding wire 14. The LED chip 10 and the submount member 80 are bonded using lead-free solder such as AuSn or SnAgCu.

サブマウント部材８０の材料はＡｌＮに限らず、線膨張率が導電性基板１１の材料である６Ｈ−ＳｉＣに比較的近く且つ熱伝導率が比較的高い材料であればよく、例えば、複合ＳｉＣなどを採用してもよい。   The material of the submount member 80 is not limited to AlN, and any material may be used as long as the linear expansion coefficient is relatively close to 6H—SiC that is the material of the conductive substrate 11 and the heat conductivity is relatively high. May be adopted.

色変換部４０は、シリコーン樹脂のような透明材料とＬＥＤチップ１０から放射された青色光によって励起されてブロードな黄色系の光を放射する粒子状の黄色蛍光体からなる蛍光材料とを混合した混合物によりドーム状に形成されている。したがって、本参考例のＬＥＤ照明装置では、ＬＥＤチップに図示しない電源部から電力を供給することにより、ＬＥＤチップ１０から青色光が放射されるとともに色変換部４０の黄色蛍光体からブロードな黄色系の光が放射されるので、ＬＥＤチップ１０からの光と黄色蛍光体からの光との混色光が色変換部４０から出射されレンズ６０を通して外部へ出射される。ここにおいて、電源部としては、例えば、交流電源を整流平滑するダイオードブリッジからなる整流回路と、整流回路の出力を平滑する平滑コンデンサとを備えた構成のものを採用すればよい。 The color conversion unit 40 is a mixture of a transparent material such as a silicone resin and a fluorescent material made of particulate yellow phosphor that is excited by blue light emitted from the LED chip 10 and emits broad yellow light. It is formed in a dome shape by the mixture. Therefore, in the LED lighting device of the present reference example, by supplying power from a power supply unit (not shown) to the LED chip, blue light is emitted from the LED chip 10 and the yellow phosphor that is broad from the yellow phosphor of the color conversion unit 40. Therefore, the mixed color light of the light from the LED chip 10 and the light from the yellow phosphor is emitted from the color conversion unit 40 and is emitted to the outside through the lens 60. Here, as the power supply unit, for example, a configuration including a rectifier circuit including a diode bridge that rectifies and smoothes an AC power supply and a smoothing capacitor that smoothes the output of the rectifier circuit may be employed.

色変換部４０の材料として用いる透明材料は、シリコーン樹脂に限らず、例えば、アクリル樹脂、エポキシ樹脂、ガラス、有機材料と無機材料とを複合化した材料などを採用してもよい。また、色変換部４０の材料として用いる透明材料に混合する蛍光材料も黄色蛍光体に限らず、例えば、ＬＥＤチップ１０が青色ＬＥＤチップである場合には、赤色蛍光体と緑色蛍光体とを混合しても白色光を得ることができる。また、色変換部４０における蛍光材料は、ＬＥＤチップ１０が紫〜近紫外ＬＥＤチップである場合には、赤色蛍光体と緑色蛍光体と青色蛍光体とを混合しても白色光を得ることができる。   The transparent material used as the material of the color conversion unit 40 is not limited to a silicone resin, but may be, for example, an acrylic resin, an epoxy resin, glass, a material in which an organic material and an inorganic material are combined, or the like. Further, the fluorescent material mixed with the transparent material used as the material of the color conversion unit 40 is not limited to the yellow phosphor. For example, when the LED chip 10 is a blue LED chip, the red phosphor and the green phosphor are mixed. Even white light can be obtained. Further, when the LED chip 10 is a violet to near-ultraviolet LED chip, the fluorescent material in the color conversion unit 40 can obtain white light even if a red phosphor, a green phosphor, and a blue phosphor are mixed. it can.

ところで、本参考例では、レンズ６０の材料として色変換部４０の透明材料と同じ材料を採用しており、色変換部４０がレンズ６０と同時成形されることでレンズ６０に一体化され、レンズ６０が、回路基板５０との間でＬＥＤチップ１０を囲む形で回路基板５０に封着されている。ここにおいて、レンズ６０は、平凹型のレンズであり、ＬＥＤチップ１０から放射された光が凹曲面状の光入射面６０ａから入射され平面状の光出射面６０ｂから出射されるようになっており、光入射面６０ａの周縁を全周に亘って回路基板５０に対して、例えば接着剤（例えば、シリコーン樹脂、エポキシ樹脂など）を用いて封着してある。ここで、上述の色変換部４０は、レンズ６０における光入射面６０ａ近傍に埋設されている。なお、レンズ６０は、回路基板５０から離れるにつれてレンズ径が徐々に大きくなる形状に形成されている。 By the way, in this reference example, the same material as the transparent material of the color conversion unit 40 is adopted as the material of the lens 60, and the color conversion unit 40 is integrated with the lens 60 by being molded simultaneously with the lens 60, The lens 60 is sealed to the circuit board 50 so as to surround the LED chip 10 with the circuit board 50. Here, the lens 60 is a plano-concave lens, and the light emitted from the LED chip 10 is incident from the concave curved light incident surface 60a and emitted from the planar light emitting surface 60b. The periphery of the light incident surface 60a is sealed to the circuit board 50 over the entire periphery using, for example, an adhesive (for example, a silicone resin, an epoxy resin, or the like). Here, the above-described color conversion unit 40 is embedded in the vicinity of the light incident surface 60 a of the lens 60. The lens 60 is formed in a shape in which the lens diameter gradually increases as the distance from the circuit board 50 increases.

しかして、本参考例のＬＥＤ照明装置では、レンズ６０が回路基板５０との間でＬＥＤチップ１０を囲む形で回路基板５０に封着され、しかも、透明材料とＬＥＤチップ１０から放射された光によって励起されてＬＥＤチップ１０の発光色とは異なる色の光を放射する蛍光材料とで構成される色変換部４０がレンズ６０に一体化されているので、回路基板５０とレンズ６０とでＬＥＤチップ１０のパッケージが構成されるから、図６に示した従来例のようなパッケージングされたＬＥＤチップ１０’を用意する必要がなく低コスト化を図れ、あらかじめ色変換部４０が一体化されたレンズ６０と色変換部４０が一体化されていないレンズとを用意しておくことで、ＬＥＤチップ１０から放射される光と蛍光材料から放射される光との混色光を照明光とするＬＥＤ照明装置と、ＬＥＤチップ１０から放射される光を照明光とするＬＥＤ照明装置とで、パッケージングされていないＬＥＤチップ１０を共用でき、低コスト化を図れる。また、本参考例では、色変換部４０がレンズ６０と同時成形することでレンズ６０に一体化されているので、色変換部４０とレンズ６０とが別部品である場合に比べて、部品点数を削減でき、部品の管理コストを低減できる。 Thus, in the LED lighting device of this reference example , the lens 60 is sealed to the circuit board 50 so as to surround the LED chip 10 with the circuit board 50, and the light emitted from the transparent material and the LED chip 10 is used. Since the color converter 40 that is excited by the fluorescent material that emits light of a color different from the emission color of the LED chip 10 is integrated with the lens 60, the circuit board 50 and the lens 60 can Since the package of the chip 10 is configured, it is not necessary to prepare the packaged LED chip 10 ′ as in the conventional example shown in FIG. 6 and the cost can be reduced, and the color conversion unit 40 is integrated in advance. By preparing a lens 60 and a lens in which the color conversion unit 40 is not integrated, the mixed color light of the light emitted from the LED chip 10 and the light emitted from the fluorescent material is irradiated. The LED lighting device that is not packaged can be shared by the LED lighting device that uses bright light and the LED lighting device that uses the light emitted from the LED chip 10 as lighting light, and the cost can be reduced. Further, in this reference example, the color conversion unit 40 is integrated with the lens 60 by being molded simultaneously with the lens 60, and therefore, compared with the case where the color conversion unit 40 and the lens 60 are separate components. The number of points can be reduced, and the management cost of parts can be reduced.

（実施形態１）
本実施形態のＬＥＤ照明装置の基本構成は参考例１と略同じであって、図２に示すように、ＬＥＤチップ１０から放射された青色の光によって励起されてＬＥＤチップ１０の発光色とは異なる色の光を放射する蛍光材料（例えば、黄色蛍光体など）を透明材料（例えば、シリコーン樹脂など）とともに成形した成形品からなるドーム状の色変換部４０をレンズ６０の光入射面６０ａに接着することで色変換部４０をレンズ６０に一体化してある構成を基本として用いる点が相違する。ここで、色変換部４０は、レンズ６０の光入射面６０ａに沿った形状に形成されている。なお、参考例１と同様の構成要素には同一の符号を付して説明を省略する。 (Embodiment 1 )
The basic configuration of the LED lighting device of the present embodiment is substantially the same as that of Reference Example 1, and as shown in FIG. 2, what is the emission color of the LED chip 10 excited by the blue light emitted from the LED chip 10? A dome-shaped color conversion unit 40 made of a molded product obtained by molding a fluorescent material (for example, yellow phosphor) that emits light of a different color together with a transparent material (for example, silicone resin) is provided on the light incident surface 60a of the lens 60 that it uses an integrated tare Ru constituting the color conversion unit 40 to the lens 60 as a basic by bonding different. Here, the color conversion unit 40 is formed in a shape along the light incident surface 60 a of the lens 60. In addition , the same code | symbol is attached | subjected to the component similar to the reference example 1, and description is abbreviate | omitted.

しかして、本実施形態のＬＥＤ照明装置においても、参考例１と同様に、図６に示した従来例のようなパッケージングされたＬＥＤチップ１０’を用意する必要がなく低コスト化を図れ、あらかじめ色変換部４０が一体化されたレンズ６０と色変換部４０が一体化されていないレンズとを用意しておくことで、ＬＥＤチップ１０から放射される光と蛍光材料から放射される光との混色光を照明光とするＬＥＤ照明装置と、ＬＥＤチップ１０から放射される光を照明光とするＬＥＤ照明装置とで、パッケージングされていないＬＥＤチップ１０を共用でき、低コスト化を図れる。また、本実施形態では、所望の照明色にかかわらずレンズ６０の共通化を図れコストを低減できる。なお、本実施形態では、色変換部４０をレンズ６０の光入射面６０ａに沿ったドーム状の形状に形成してある。色変換部４０は、シート状の形状としてレンズ６０の平面状の光出射面６０ｂに接着することでレンズ６０に一体化することもできる。 Thus, in the LED lighting device of the present embodiment, similarly to the reference example 1 , it is not necessary to prepare the packaged LED chip 10 ′ as in the conventional example shown in FIG. By preparing in advance a lens 60 in which the color conversion unit 40 is integrated and a lens in which the color conversion unit 40 is not integrated, the light emitted from the LED chip 10 and the light emitted from the fluorescent material The LED illumination device that uses the mixed color light as illumination light and the LED illumination device that uses the light emitted from the LED chip 10 as illumination light can share the unpackaged LED chip 10, thereby reducing the cost. In the present embodiment, the lens 60 can be shared regardless of the desired illumination color, and the cost can be reduced. In the present embodiment, Ru tare to form a color conversion unit 40 into a dome-like shape along the light incident surface 60a of the lens 60. The color conversion section 4 0 may also Rukoto be integrated in the lens 60 by adhering to the planar light emitting surface 60b of the lens 60 as a sheet over preparative shape.

なお、本実施形態は、色変換部４０と回路基板５０とで囲まれる空間には、図３に示すように、ＬＥＤチップ１０を封止する封止樹脂（例えば、シリコーン樹脂など）からなる封止部３０を設けており、封止部３０と色変換部４０との間に空気層３５が形成することにより、封止部３０と色変換部４０とを密着させる場合に比べて組立性が向上する。また、参考例１においても、色変換部４０が一体化されたレンズ６０と回路基板５０とで囲まれる空間に、ＬＥＤチップ１０を封止する封止部を設けてもよい。 In this embodiment, the space surrounded by the color conversion unit 40 and the circuit board 50 is sealed with a sealing resin (for example, silicone resin) for sealing the LED chip 10 as shown in FIG. It has established a stop portion 30, by an air layer 35 forms formed between the sealing portion 30 and the color conversion unit 40, assembled as compared to the case of close contact with the sealing portion 30 and the color conversion unit 40 Will improve. Also in Reference Example 1 , a sealing portion that seals the LED chip 10 may be provided in a space surrounded by the lens 60 and the circuit board 50 in which the color conversion portion 40 is integrated.

（参考例２）
本参考例のＬＥＤ照明装置の基本構成は実施形態１と略同じであって、色変換部４０におけるＬＥＤチップ１０側の光入射面に、図４に示すように、ＬＥＤチップ１０から放射された光を透過し且つ色変換部４０から放射された光を反射する波長フィルタ７０を配設してある点が相違するだけである。ここで、波長フィルタ７０は、色変換部４０の光入射面６０ａに沿った形状に形成されている。なお、参考例１と同様の構成要素には同一の符号を付して説明を省略する。 ( Reference Example 2 )
The basic configuration of the LED lighting device of this reference example is substantially the same as that of the first embodiment, and is emitted from the LED chip 10 on the light incident surface on the LED chip 10 side in the color conversion unit 40 as shown in FIG. The only difference is that a wavelength filter 70 that transmits light and reflects light emitted from the color conversion unit 40 is provided. Here, the wavelength filter 70 is formed in a shape along the light incident surface 60 a of the color conversion unit 40. In addition , the same code | symbol is attached | subjected to the component similar to the reference example 1, and description is abbreviate | omitted.

しかして、本参考例のＬＥＤ照明装置では、実施形態１のＬＥＤ照明装置に比べて、色変換部４０の蛍光材料から放射された光の外部への取り出し効率を高めることができ、演色性を高めることが可能となる。 Thus, in the LED lighting device of this reference example, the efficiency of taking out the light emitted from the fluorescent material of the color conversion unit 40 to the outside can be increased compared to the LED lighting device of Embodiment 1 , and the color rendering property can be improved. It becomes possible to raise.

ところで、上記各参考例や実施形態１において、回路基板５０に実装するＬＥＤチップ１０の数は特に限定するものではなく、色変換部４０が一体化されたレンズ６０をＬＥＤチップ１０ごとに囲むように回路基板５０に封着すればよい。 Meanwhile, Oite above Symbol respective reference examples and real施形condition 1, the number of LED chips 10 mounted on the circuit board 50 is not particularly limited, a lens 60 that the color conversion unit 40 is integrated LED chip What is necessary is just to seal to the circuit board 50 so that it may surround every ten.

また、上記各参考例や実施形態１では、ＬＥＤチップ１０として、発光色が青色の青色ＬＥＤチップを採用しており、導電性基板１１としてＳｉＣ基板を採用しているが、ＳｉＣ基板の代わりにＧａＮ基板を用いてもよく、結晶成長用基板として導電性基板１１に代えてサファイア基板を用いてもよい。また、ＬＥＤチップ１０の発光色は青色に限らず、例えば、赤色、緑色などでもよい。すなわち、ＬＥＤチップ１０の発光部１２の材料はＧａＮ系化合物半導体材料に限らず、ＬＥＤチップ１０の発光色に応じて、ＧａＡｓ系化合物半導体材料やＧａＰ系化合物半導体材料などのIII−V族化合物半導体材料を採用してもよいし、II−VI族化合物半導体材料を採用してもよく、結晶成長用基板の材料も発光部１２の材料に応じて適宜変更すればよい。 Further, in the above SL respective reference examples and real施形state 1, as the LED chip 10, light emission color is adopted blue blue LED chip adopts the SiC substrate as the conductive substrate 11, SiC A GaN substrate may be used instead of the substrate, and a sapphire substrate may be used instead of the conductive substrate 11 as a crystal growth substrate. Further, the light emission color of the LED chip 10 is not limited to blue, and may be, for example, red or green. That is, the material of the light emitting portion 12 of the LED chip 10 is not limited to the GaN compound semiconductor material, but depending on the emission color of the LED chip 10, a III-V group compound semiconductor such as a GaAs compound semiconductor material or a GaP compound semiconductor material. A material may be employed, a II-VI group compound semiconductor material may be employed, and the material of the crystal growth substrate may be appropriately changed according to the material of the light emitting portion 12.

参考例１を示す概略断面図である。 6 is a schematic cross-sectional view showing Reference Example 1. FIG. 実施形態１の基礎となる構成を示す概略断面図である。 1 is a schematic cross-sectional view showing a configuration that is a basis of Embodiment 1. FIG . 同上の具体的な構成を示す概略断面図である。It is a schematic sectional drawing which shows the specific structure same as the above. 参考例２を示す概略断面図である。 10 is a schematic cross-sectional view showing Reference Example 2. FIG. 従来の発光装置の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the conventional light-emitting device. 従来例を示す概略断面図である。It is a schematic sectional drawing which shows a prior art example.

１０ ＬＥＤチップ
１４ ボンディングワイヤ
４０ 色変換部
５０ 回路基板
５１ 金属板
５２ 絶縁層
５３ 導体パターン
６０ レンズ
８０ サブマウント部材 DESCRIPTION OF SYMBOLS 10 LED chip 14 Bonding wire 40 Color conversion part 50 Circuit board 51 Metal plate 52 Insulating layer 53 Conductive pattern 60 Lens 80 Submount member

Claims (3)

可視光を放射するＬＥＤチップと、該ＬＥＤチップが実装された回路基板と、前記ＬＥＤチップを封止する封止部と、少なくとも前記ＬＥＤチップから放射された光の配光を制御するレンズであって前記回路基板との間で前記ＬＥＤチップを封止する前記封止部を囲む形で前記回路基板に封着されたレンズとを備え、前記レンズは、透明材料と前記ＬＥＤチップから放射された光によって励起されて前記ＬＥＤチップの発光色とは異なる色の光を放射する蛍光材料とで構成されるドーム状の色変換部が一体化されてなり、前記色変換部と前記封止部との間に空気層を備えてなることを特徴とするＬＥＤ照明装置。 Control and LED chip to emit visible light, and a circuit board to which the L ED chip is mounted, and a sealing portion for sealing the LED chip, the least light distribution of light emitted from the L ED chips a lens and a said circuitry lens of the LED chips are sealed to the circuitry substrate to surround the sealing portion for sealing between the substrate, the lenses may include a transparent material the result is integrated color conversion unit dome that consists in a fluorescent material that emits light of a different color from the L ED is excited by the light emitted from the chip emission color of the L ED chip, the An LED lighting device comprising an air layer between a color conversion portion and the sealing portion . 前記色変換部は、前記レンズに埋設され該レンズに一体化されてなることを特徴とする請求項１記載のＬＥＤ照明装置 The color conversion unit, LED lighting apparatus according to claim 1, characterized by being integrated into buried該Re lens in the lens 前記色変換部は、前記レンズに接着することで前記レンズに一体化されてなることを特徴とする請求項１記載のＬＥＤ照明装置。   The LED lighting device according to claim 1, wherein the color conversion unit is integrated with the lens by bonding to the lens.
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