CN216563177U

CN216563177U - SMD lamp pearl

Info

Publication number: CN216563177U
Application number: CN202123256364.0U
Authority: CN
Inventors: 郑旭峰
Original assignee: Jiangxi Zhaochi Photoelectric Co ltd
Current assignee: Jiangxi Zhaochi Photoelectric Co ltd
Priority date: 2021-12-22
Filing date: 2021-12-22
Publication date: 2022-05-17
Anticipated expiration: 2031-12-22

Abstract

The utility model provides an SMD (surface mounted device) paster lamp bead, which comprises a support and a first conducting layer arranged at the bottom of the support, wherein the support is internally hollowed to form a mounting groove with the first conducting layer as a bottom surface; an illumination assembly is arranged in the mounting groove, the illumination assembly comprises a silver coating layer arranged on the upper surface of the first conductive layer and a second conductive layer arranged on one side of the silver coating layer, which faces away from the first conductive layer, and the second conductive layer is electrically connected with a horizontally arranged light-emitting chip; the upper surface of silvered film covers has the white glue film, the white glue film corresponds the bottom surface parallel and level setting of luminescence chip. The silver coating layer exposed around the chip is covered by the white glue layer, so that the silver coating layer is prevented from absorbing light emitted by the light-emitting chip, and the technical problems of low light-emitting efficiency and low brightness of the SMD (surface mounted device) paster lamp bead in the prior art are solved.

Description

SMD lamp pearl

Technical Field

The utility model relates to the technical field of LED products, in particular to an SMD (surface mounted device) paster lamp bead.

Background

The SMD lamp bead is a novel surface-mounted semiconductor light-emitting device, has the advantages of small volume, large scattering angle, good light-emitting uniformity, high reliability, low power consumption, high response speed and the like, and is widely applied to the fields of image-text display, outdoor landscape illumination, street lamp illumination and the like.

The manufacturing technology of the SMD lamp bead generally comprises the steps of installing materials such as a chip, a metal wire, packaging glue, fluorescent powder, a silver coating and the like in an LED bracket through processes such as die bonding, wire welding, glue dispensing, curing and the like to form a sealing device capable of emitting visible light or invisible light.

In the prior art, when an LED device works, a silver coating layer can absorb light emitted by a chip, so that the device has low light emitting efficiency and low brightness.

SUMMERY OF THE UTILITY MODEL

Based on the technical scheme, the utility model aims to provide the SMD lamp bead, which is used for solving the technical problems of low light emitting efficiency and low brightness of the SMD lamp bead in the prior art.

The utility model provides an SMD (surface mounted device) paster lamp bead, which comprises a support and a first conducting layer arranged at the bottom of the support, wherein the support is hollowed to form a mounting groove with the first conducting layer as a bottom surface;

an illumination assembly is arranged in the mounting groove, the illumination assembly comprises a silver coating layer arranged on the upper surface of the first conductive layer and a second conductive layer arranged on one side of the silver coating layer, which faces away from the first conductive layer, and the second conductive layer is electrically connected with a horizontally arranged light-emitting chip;

the upper surface of silvered film covers has the white glue film, the white glue film corresponds the bottom surface parallel and level setting of luminescence chip.

Above-mentioned SMD paster lamp pearl covers the silvered film that exposes around with the chip through white glue film, avoids the silvered film to absorb the light that light emitting chip sent, has improved luminous efficiency, and in addition, white glue film still can regard as the light reflection stratum, loss when reducing the light reflex, and furtherly, white glue film corresponds light emitting chip's bottom surface parallel and level sets up, avoids sheltering from the light that light emitting chip side sent, has solved SMD paster lamp pearl light-emitting efficiency among the prior art and has hanged down, the low technical problem of luminance.

Further, SMD paster lamp pearl, wherein, SMD paster lamp pearl still including fill in the fluorescence glue film in the mounting groove, fluorescence glue film covers light-emitting chip with the white glue film.

Further, SMD paster lamp pearl, wherein, the inside wall of support is equipped with the guide part of slope setting.

Further, SMD paster lamp pearl, wherein, SMD paster lamp pearl is still including locating fluorescence glue film with the transparent adhesive layer between the white glue film.

Further, SMD paster lamp pearl, wherein, the laminating of transparent adhesive layer the edge of luminous chip and with the top surface of luminous chip flushes the setting.

Further, SMD paster lamp pearl, wherein, the white glue film is formed with an annular sunken around the upper surface at luminous chip edge.

Further, SMD paster lamp pearl, wherein, the recessed angle of annular depression is less than 10.

Further, SMD paster lamp pearl, wherein, first conducting layer is the copper layer.

Drawings

Fig. 1 is a cross-sectional view of an SMD patch lamp bead in a first embodiment of the present invention;

fig. 2 is a cross-sectional view of an SMD patch lamp bead in a second embodiment of the present invention.

Description of the main element symbols:

support frame	10	First conductive layer	20
				Silver coating	31	Second conductive layer	32
Light emitting chip	33	White glue layer	34
				Fluorescent glue layer	35	Transparent adhesive layer	36
Guide part	40

The following detailed description will further illustrate the utility model in conjunction with the above-described figures.

Detailed Description

To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Several embodiments of the utility model are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, an SMD mounted lamp bead according to a first embodiment of the present invention is shown, including a bracket 10 and a first conductive layer 20 disposed at a bottom of the bracket 10, where an installation groove using the first conductive layer 20 as a bottom surface is hollowed out inside the bracket 10;

an illumination assembly is arranged in the mounting groove, the illumination assembly comprises a silver coating 31 arranged on the upper surface of the first conductive layer 20 and a second conductive layer 32 arranged on one side of the silver coating 31, which is opposite to the first conductive layer 20, the second conductive layer 32 is positioned in the middle of the silver coating 31, and the second conductive layer 32 is electrically connected with a horizontally arranged light-emitting chip 33;

the upper surface of the silver coating 31 is covered with a white glue layer 34, and the white glue layer 34 is arranged in parallel and level with the bottom surface of the light emitting chip 33.

It should be noted that, in the present embodiment, the first conductive layer 20 is a copper layer, and a circuit board can be attached for conduction; the second conductive layer 32 is silver paste mainly made of silver powder and epoxy resin, and is used for fixing the light emitting chip 33 and conducting electricity; the white adhesive layer 34 is a water emulsion type adhesive, the main component of which is polyvinyl acetate, and can prevent the silver coating layer 31 from absorbing light emitted by the chip and reduce light effect damage, and the white adhesive layer 34 can also be used as a light reflection layer to reduce loss in light reflection; the white glue layer 34 is disposed parallel and level to the bottom surface of the light emitting chip 33, so as to prevent the white glue layer 34 from blocking the light emitted from the side surface of the light emitting chip 33.

Further, the SMD patch lamp bead further includes a fluorescent glue layer 35 filled in the mounting groove, and the fluorescent glue layer 35 covers the light emitting chip 33 and the white glue layer 34. Specifically, the fluorescent glue layer 35 mainly includes fluorescent powder and silica gel (epoxy resin, acid anhydride, high light diffusibility filler, and heat stability dye), and is used for protecting the chip, changing the light emitting color, brightness, and angle of the chip, and molding the LED lamp bead.

Further, the inner side wall of the bracket 10 is provided with a guide portion 40 which is obliquely arranged. In this embodiment, this guide part 40 is the inclined plane that an slope set up to the accommodating space who makes the mounting groove is the round platform form that a bottom area is less than the top area, so design, make when colloid such as filling fluorescent glue, the colloid can accelerate water conservancy diversion to the bottom through this inclined plane, promotes production and processing's efficiency.

The transparent adhesive layer 36 is attached to the edge of the light emitting chip 33 and is flush with the top surface of the light emitting chip 33. It can be understood that, by such design, the usage amount of the transparent adhesive layer 36 can be saved while the light emitting brightness of the side surface of the light emitting chip 33 is enhanced.

The white glue layer 34 is formed with an annular recess around the upper surface of the edge of the light emitting chip 33. Still further, the annular depression is concave at an angle of less than 10 °. It can be understood that the annular recess is used to make the white glue layer 34 away from the sidewall of the light emitting chip 33, so as to further prevent the white glue layer 34 from covering the sidewall of the light emitting chip 33 and affecting the brightness of the emitted light.

In summary, in the SMD mounted lamp bead according to the above embodiment of the present invention, the white adhesive layer covers the silver coating layer exposed around the chip, so as to prevent the silver coating layer from absorbing the light emitted from the light emitting chip, thereby improving the light emitting efficiency.

Referring to fig. 2, an SMD patch lamp bead in a second embodiment of the present invention is shown, where the difference between the SMD patch lamp bead in the present embodiment and the SMD patch lamp bead in the first embodiment is: the SMD paster lamp bead further comprises a transparent adhesive layer 36 arranged between the fluorescent adhesive layer 35 and the white adhesive layer 34. Specifically, the transparent adhesive layer 36 is silica gel (epoxy resin, acid anhydride, high light diffusibility filler, heat-stable dye), after the white adhesive layer 34 is applied, a small amount of transparent adhesive is applied around the chip, and the adhesive is cured to serve as a reflective layer, so that light emitted from the side surface of the light-emitting chip 33 can be enhanced, and loss caused by that the original light needs to be reflected on the side surface plastic material can be reduced.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. An SMD (surface mounted device) paster lamp bead is characterized by comprising a support and a first conducting layer arranged at the bottom of the support, wherein a mounting groove with the first conducting layer as a bottom surface is hollowed in the support;

2. The SMD patch lamp bead of claim 1, wherein the SMD patch lamp bead further includes a fluorescent glue layer filled in the mounting groove, the fluorescent glue layer covering the light emitting chip and the white glue layer.

3. The SMD patch lamp bead of claim 1, wherein the inner side wall of said holder is provided with obliquely arranged guiding portions.

4. The SMD patch lamp bead of claim 2, wherein the SMD patch lamp bead further includes a transparent adhesive layer disposed between the fluorescent adhesive layer and the white adhesive layer.

5. The SMD patch lamp bead according to claim 4, wherein said transparent glue layer is attached to the edge of said light emitting chip and is disposed flush with the top surface of said light emitting chip.

6. The SMD patch lamp bead of claim 1, wherein an annular recess is formed in the white glue layer around the upper surface at the edge of the light emitting chip.

7. The SMD patch lamp bead of claim 6, wherein said annular recess is recessed at an angle less than 10 °.

8. The SMD patch lamp bead of claim 1, wherein said first conductive layer is a copper layer.