CN201425186Y - LED light emitting structure - Google Patents

LED light emitting structure Download PDF

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Publication number
CN201425186Y
CN201425186Y CN2009201318158U CN200920131815U CN201425186Y CN 201425186 Y CN201425186 Y CN 201425186Y CN 2009201318158 U CN2009201318158 U CN 2009201318158U CN 200920131815 U CN200920131815 U CN 200920131815U CN 201425186 Y CN201425186 Y CN 201425186Y
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China
Prior art keywords
groove
luminescence chip
chip
ray structure
light emitting
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Expired - Fee Related
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CN2009201318158U
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Chinese (zh)
Inventor
黄建中
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Brightek Optoelectronic Co Ltd
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Brightek Optoelectronic Co Ltd
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Abstract

The utility model relates to an LED light emitting structure which includes a bracket and a light emitting chip, the bracket is provided with a support surface, the light emitting chip is arranged onthe support surface, a groove is formed on a part of the support surface, which encloses the light emitting chip, and the groove encloses the periphery of the light emitting chip. In the LED light emitting structure, the groove is formed on a part of the support surface, which encloses the light emitting chip, and the groove encloses the periphery of the light emitting chip, so that the reflectiontime of light emitting from the side surface of the light emitting chip can be increased, the light emitted from the side surface of the light emitting chip can be dispersed fully, the yellow ring phenomenon can be further improved, and the emergent light spots are uniform.

Description

The LED ray structure
Technical field
The utility model relates to LED luminescence technology field, relates in particular to a kind of LED ray structure.
Background technology
LED (Light Emitting Diode), promptly light emitting diode is a kind of semiconductor solid luminescence device.It is to utilize the solid semiconductor chip as luminescent material.When two ends add forward voltage, son and majority that dams that dams of the minority in the semiconductor takes place compoundly, emits superfluous energy and causes photo emissions, directly sends red, orange, yellow, green, blue, blue, purple, white light.Led light source since have high energy-conservation, the life-span long, be beneficial to advantage such as environmental protection, in fact, since LED comes out, the application surface of LED more and more widely, the advantage of its environmental protection and energy saving makes LED be regarded as one of main lighting source of 21 century.
LED is applied to the illumination aspect, and it is playing the part of very important role always aspect decoration, and also more and more higher to the requirement of LED color along with the raising of people's living standard, this makes the colour rendering of LED, and color has had higher requirement.
In order to gain a place in illumination market, the white light LEDs of different encapsulated types constantly occurs on market.Along with the extensive application of LED, the requirement of LED increases gradually, and wherein high-capacity LED also receives increasing concern along with the needs of illumination.The heat dissipation problem that how to improve the power of LED and how to solve high-capacity LED always is an important topic of LED exploitation.With regard to lighting module, luminous power, heat dispersion, light extraction efficiency and white purity all are the focuses that the designer was concerned about.In white light illumination module in the past, all be to send white light by hanging down wavelength chip such as blue light or purple light chip excitation fluorescent material, tradition is wrapped up chip in a glue mode with fluorescent material, the variable thickness of fluorescent material parcel chip causes, thereby make its luminous spot inhomogeneous, and influenced light extraction efficiency greatly.In traditional support when chip light emitting, there is the front to emit beam and the light that sends of side, penetrate outside the packaging body behind the light excitation fluorescent material layer that send in the front, the light that send the side can excite the fluorescent material of bottom, thereby penetrates the outer and positive light that sends of the packaging body yellow circle of superposition formation mutually after reflection.How to improve yellow this shortcoming of circle and become a problem demanding prompt solution.
The utility model content
In view of this, the utility model embodiment provides a kind of LED ray structure that can effectively improve yellow circle.
A kind of LED ray structure, it comprises support and luminescence chip, and described support has a supporting surface, and described luminescence chip is located on the described supporting surface, described supporting surface is provided with groove in the part of surrounding described luminescence chip, and described groove is surrounded on around the described luminescence chip.
Preferably, the degree of depth of described groove and width dimensions are constructed to and make the light reflection of being sent by described luminescence chip side enter in the groove again through repeatedly sending after the reflection.
Preferably, the ratio of the degree of depth of described groove and width is greater than the ratio of distance between described luminescence chip height and described groove and luminescence chip side.
More preferably, at least one cell wall of described groove has concaveconvex structure.
Further, described support comprises support body and chip carrier, and described support body is provided with hollow bore, and described chip carrier is located in the described hollow bore, and described chip carrier is to be made by thermally conductive materials, and described luminescence chip is located on the chip carrier surface.
Further, be coated with fluorescent material on the described luminescence chip, be coated with transparent colloid on the described support, described transparent colloid covers fluorescent material and groove.
Further, described fluorescent material is formed with the fluorescent material beds of precipitation at chip surface.
Further, described groove cell wall in the outer part is not less than its cell wall in the inner part.Described groove is square or circular rings be around in described luminescence chip around.
Compared with prior art, in described LED ray structure, described supporting surface is provided with groove in the part of surrounding described luminescence chip, by groove being set around chip, can increase the order of reflection of luminescence chip lateral emitting, the light that the luminescence chip side is sent is fully disperseed, thereby can improve yellow circle phenomenon, and makes the bright dipping hot spot even.In addition, when being coated with transparent colloid on the support, transparent colloid covers fluorescent material and groove, thereby thereby the adhesion that can increase colloidal materials and support promotes its reliability.
Description of drawings
Below in conjunction with accompanying drawing embodiment of the present utility model is described, wherein:
Fig. 1 is the schematic cross-section of the LED ray structure that provides of the utility model first embodiment.
Fig. 2 is the structure for amplifying schematic diagram that the groove among Fig. 1 reflects ambient light.
Fig. 3 is the local structure for amplifying schematic diagram of the groove among Fig. 1.
Fig. 4 is the structure for amplifying schematic diagram that present a kind of LED ray structure reflects ambient light.
Fig. 5 is the schematic cross-section of the LED ray structure that provides of the utility model second embodiment.
Fig. 6 is the schematic cross-section of the LED ray structure that provides of the utility model the 3rd embodiment.
The specific embodiment
Below based on accompanying drawing specific embodiment of the utility model is further elaborated.Should be appreciated that specific embodiment described herein as just example, and be not used in qualification protection domain of the present utility model.
See also Fig. 1 and 2, be the LED ray structure 10 that the utility model first embodiment provides, this LED ray structure 10 comprises support 12 and is located at luminescence chip 14 on the support 12.Support 12 has a supporting surface 120, and luminescence chip 14 is located on the described supporting surface 120.This supporting surface 120 is provided with groove 16 in the part of surrounding luminescence chip 14, and described groove 16 is surrounded on around the luminescence chip 14.
Support 12 comprises the chip carrier 124 that is positioned at peripheral support body 122 and is positioned at central authorities, and support body 122 is provided with hollow bore 125, and chip carrier 124 is located in the described hollow bore 125.Chip carrier 124 is to be made by thermally conductive materials, for example aluminium, copper, aluminium copper or the good material of other thermal conductivity.Luminescence chip 14 is located on the surface of chip carrier 124, the end face of chip carrier 124 just, and this end face just is provided with the supporting surface 120 of described luminescence chip 14.Chip carrier 124 extends outward annular lip 126 by bottom side, annular lip 126 has large surface area, chip carrier 124 can be used as the heat sink structure of luminescence chip 14, the heat that luminescence chip 14 is sent conducts to annular lip 126 rapidly vertically by chip carrier 124, conduct to the secondary heat abstractor rapidly by annular lip 126 again, thereby cool off luminescence chip 14 fast, make it keep higher luminous efficiency and illumination effect.
As shown in Figure 1, luminescence chip 14 both sides have both positive and negative polarity respectively, support body 122 corresponding luminescence chip 14 both positive and negative polarities around chip carrier 124 are respectively equipped with depression 123, the both positive and negative polarity of luminescence chip 14 is drawn by corresponding pin 19, pin 19 electrically connects by the both positive and negative polarity of gold thread 17 with luminescence chip 14, one end of each pin 19 is contained in the corresponding depression 123, and the outside that the other end extends support 12 is connected with external power source or circuit.
Groove 16 is opened in the end face of chip carrier 124, promptly on the supporting surface 120.Groove 16 square or circular around being shaped as, the groove 16 of present embodiment square around being shaped as.Preferably, groove 16 degree of depth and width dimensions are constructed to and make the light reflection of being sent by luminescence chip 14 sides enter in the groove 16 again through repeatedly sending after the reflection.As shown in Figure 2, the light beam L that is sent by luminescence chip 14 sides incides the cell wall in the outer part 162 of groove 16 earlier, reflexes to the diapire of groove 16 again, then reflects between relative two cell walls of groove 16, up to launching.Preferably, the light beam that sends of luminescence chip 14 sides between relative two cell walls through repeatedly launching after the reflection.So, on the one hand, reflect in the outer part cell wall 162 by light beam that luminescence chip 14 sides are sent, through after the reflection of cell wall 162, light beam obtains fully to disperse, and the light that can greatly reduce side-emitted and the positive light that sends is superposition mutually, thereby avoids forming yellow the circle.On the other hand, owing to dug groove 16, the light that luminescence chip 14 sides are sent reflects at cell wall earlier, and can not directly excite the fluorescent material of bottom, thereby can improve the bright dipping hot spot, makes whole bright dipping hot spot even.Because in traditional support, supporting surface 120 is a plane, when chip light emitting, there is the front to emit beam and the light that sends of side, penetrate outside the packaging body behind the optical excitation fluorescent material layer that send in the front, the light that send the side can excite the fluorescent material of bottom, thereby penetrates the outer and positive light that sends of the packaging body yellow circle of superposition formation mutually after reflection.By groove 16 is set, can improve the appearance of yellow circle.
Preferably, the ratio of the degree of depth of groove 16 and width is greater than the ratio of distance between luminescence chip 14 height and described groove 16 and luminescence chip 14 sides.As shown in Figure 3, suppose that the distance between groove 16 and luminescence chip 14 sides is D, luminescence chip 14 highly is H, the degree of depth of groove 16 is P, width groove 16 be W, suppose that the illumination that send on the summit, side of luminescence chip 14 penetrates on the cell wall in groove 16 outsides angled θ in bottom surface of this light beam and groove 16, tan θ=H/D.And
Figure G2009201318158D00041
Clearly,
Figure G2009201318158D00042
Therefore, P/W＞H/D, like this, the light that send luminescence chip 14 sides can repeatedly reflect in groove 16.As shown in Figure 3, the light that send on summit, the side of luminescence chip 14 need shine on the cell wall in groove 16 outsides, and can not image pattern 4 such (traditional support), shine when smooth supporting surface, to directly reflect away, thus with the positive light that sends superposition mutually, form yellow circle.
In addition, please consult Fig. 1 again, be coated with fluorescent material 15 on the luminescence chip 14, be coated with transparent colloid 13 on the support 12, transparent colloid 13 covers fluorescent material 15 and groove 16, also can further cover depression 123.By groove 16 and 123 the concaveconvex structure of caving in, can strengthen the contact area between transparent colloid 13 and the support 12, make transparent colloid 13 and support that better adhesion be arranged.Transparent colloid 13 is a lens shape, to reach predetermined light shooting angle.
In addition, surface precipitation at luminescence chip 14 forms one deck fluorescent material beds of precipitation 142, its forming process is: when making white light, adopt the fluorescent material sedimentation, make fluorescent material 15 under certain condition, for example kept 2 hours under 60 ° of temperature, skim is formed on the top at chip and chip carrier 124 owing to precipitate to make fluorescent material 15, and promptly the fluorescent material beds of precipitation 142.The fluorescent material of the beds of precipitation 142 can effectively be excited, thereby improves light extraction efficiency.In addition, the fluorescent material beds of precipitation 142 further bottom land of covering groove 16 also.
See also Fig. 5, be the structural representation of the LED ray structure 20 among the utility model second embodiment.Wherein, LED ray structure 20 has and LED ray structure 10 similar structures, and components identical adopts identical label among Fig. 5 and Fig. 1, represents identical structure and composition, does not repeat them here.Be that with the LED ray structure 10 main difference parts of first embodiment groove 26 outer cell walls 262 of present embodiment are higher than inner cell wall, also promptly are higher than supporting surface 120, also can be further a little more than the end face of luminescence chip 14.
Embodiment is identical with the front, and at surface precipitation formation one deck fluorescent material beds of precipitation 142 of luminescence chip 14, to improve light extraction efficiency, the fluorescent material beds of precipitation 142 are the bottom land of covering groove 26 equally further.
See also Fig. 6, be the structural representation of the LED ray structure 30 among the utility model the 3rd embodiment.Wherein, LED ray structure 30 has and LED ray structure 20 similar structures, and components identical adopts identical label among Fig. 6 and Fig. 5, represents identical structure and composition, does not repeat them here.Be the structure of support 32 with the LED ray structure 20 main difference parts of second embodiment.
Support 32 comprises cup-shaped support body 322 and chip carrier 324.The support body 322 of present embodiment has the hollow space 323 of back taper, it is a cup, luminescence chip 14, fluorescent material 15, transparent colloid 13 all are contained in the hollow space 323 of cup, the hollow space 323 of this back taper has the cell wall 328 of inclination, can the edge light beam that luminescence chip 14 sends be reflected, thereby improve rising angle and bright dipping hot spot.
Support body 322 also has the hollow bore 325 of accommodating chip carrier 324 equally, hollow bore 325 communicates with hollow space 323, this structural leadthroughs is the frame-type lead-in wire, the two poles of the earth of luminescence chip 14 are electrically connected with a pin 327 respectively, each pin 327 extends to lateral surface via corresponding fluting 321, and extends to the bottom surface of support body 322 around the lateral surface of support body 322.
The hollow bore 325 of present embodiment comprises first through hole 325a that is close to hollow space 323 and the second through hole 325b that joins and communicate with the first through hole 325a, the aperture of the first through hole 325a is less than the aperture of the second through hole 325b, and the second through hole 325b runs through support body 322 bottoms.Correspondingly, the first through hole 325a accommodates the main body of chip carrier 324, and the flange 326 of chip carrier 324 is contained among the second through hole 325b, and stretches out outside the second through hole 325b, so that, heat is in time promptly distributed with the fully contact mutually of secondary heat abstractor.
In above embodiment, the cell wall of groove all is straight wall, in other embodiment, groove cell wall in the outer part can be formed with step, in addition, groove can be an arcuate furrow also, is not limited to the square groove shown in the foregoing description, can also be V-shaped groove, the groove of dovetail groove or other arbitrary shapes.Further, groove in the outer part cell wall and/or inboard cell wall can have concaveconvex structure, as zigzag structure etc., disperse more so that incide the light of this cell wall, can weaken the influence of the light that ambient light sends the front greatly.Certainly, groove can also have other distortion, does not enumerate one by one at this, and these variations or change all should belong within the design of the present utility model.
In the LED of above embodiment ray structure, supporting surface 120 is provided with groove 16,26 in the part of surrounding luminescence chip 14, by groove 16,26 is set around chip 14, can increase the number of times of the light reflection of sending luminescence chip 14 sides, the light that luminescence chip 14 sides are sent is fully disperseed, thereby can eliminate the appearance of yellow circle, and make the bright dipping hot spot even.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.

Claims (9)

1, a kind of LED ray structure, it comprises support and luminescence chip, described support has a supporting surface, described luminescence chip is located on the described supporting surface, it is characterized in that described supporting surface is provided with groove in the part of surrounding described luminescence chip, described groove is surrounded on around the described luminescence chip.
2, LED ray structure as claimed in claim 1 is characterized in that, the degree of depth of described groove and width dimensions are constructed to and make the light reflection of being sent by described luminescence chip side enter in the groove again through repeatedly sending after the reflection.
3, LED ray structure as claimed in claim 1 is characterized in that, the ratio of the degree of depth of described groove and width is greater than the ratio of distance between described luminescence chip height and described groove and luminescence chip side.
4, LED ray structure as claimed in claim 1 is characterized in that, is coated with fluorescent material on the described luminescence chip, is coated with transparent colloid on the described support, and described transparent colloid covers fluorescent material and groove.
5, LED ray structure as claimed in claim 4 is characterized in that, described fluorescent material is formed with the fluorescent material beds of precipitation at chip surface.
6, LED ray structure as claimed in claim 1 is characterized in that, at least one cell wall of described groove has concaveconvex structure.
7, LED ray structure as claimed in claim 1, it is characterized in that, described support comprises support body and chip carrier, described support body has hollow bore, described chip carrier is located in the described hollow bore, described chip carrier is to be made by thermally conductive materials, and described luminescence chip is located on the chip carrier surface.
8, LED ray structure as claimed in claim 1 is characterized in that, described groove cell wall in the outer part is not less than its cell wall in the inner part.
9, LED ray structure as claimed in claim 1 is characterized in that, described groove is square or circular rings be around in described luminescence chip around.
CN2009201318158U 2009-05-13 2009-05-13 LED light emitting structure Expired - Fee Related CN201425186Y (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102086996A (en) * 2010-12-31 2011-06-08 昆山琉明光电有限公司 LED (Light emitting Diode) on-edge backlight
CN108470813A (en) * 2018-05-24 2018-08-31 郑州森源新能源科技有限公司 A kind of LED light source
CN108716638A (en) * 2018-06-04 2018-10-30 郑州森源新能源科技有限公司 A kind of LED light source in beads
CN108930917A (en) * 2018-06-01 2018-12-04 郑州森源新能源科技有限公司 A kind of LED light source of jungle lighting device
CN112467008A (en) * 2020-11-13 2021-03-09 中山市聚明星电子有限公司 Light-emitting device manufacturing method and light-emitting device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102086996A (en) * 2010-12-31 2011-06-08 昆山琉明光电有限公司 LED (Light emitting Diode) on-edge backlight
CN108470813A (en) * 2018-05-24 2018-08-31 郑州森源新能源科技有限公司 A kind of LED light source
CN108930917A (en) * 2018-06-01 2018-12-04 郑州森源新能源科技有限公司 A kind of LED light source of jungle lighting device
CN108716638A (en) * 2018-06-04 2018-10-30 郑州森源新能源科技有限公司 A kind of LED light source in beads
CN112467008A (en) * 2020-11-13 2021-03-09 中山市聚明星电子有限公司 Light-emitting device manufacturing method and light-emitting device

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Granted publication date: 20100317

Termination date: 20130513