CN205372147U - Wide -angle LED filament lamp that gives out light; give off light - Google Patents
Wide -angle LED filament lamp that gives out light; give off light Download PDFInfo
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- CN205372147U CN205372147U CN201620045938.XU CN201620045938U CN205372147U CN 205372147 U CN205372147 U CN 205372147U CN 201620045938 U CN201620045938 U CN 201620045938U CN 205372147 U CN205372147 U CN 205372147U
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Abstract
The utility model provides a wide -angle LED filament lamp that gives out light, give off light, includes body, heat transfer plate and a plurality of light source board, and every light source board includes all that base plate and interval set up a plurality of LED light sources on this base plate, and this heat transfer plate sets up at the top of this body, is equipped with a plurality of connecting portion on this heat transfer plate, the other interval of coupling part set up on this heat transfer plate and with this heat transfer plate hot link, the bottom of light source board is fixed respectively on the connecting portion and with the connecting portion hot link, the base plate of every light source board is made by the heat sink material, the LED light source sets up on the side of this base plate and distributes secretlyer in the position of the bottom near this base plate. This wide -angle LED filament lamp that gives out light, give off light has simple, the good advantage of dispelling the heat of packaging technology.
Description
Technical field
This utility model relates to technical field of LED illumination, particularly to a kind of Large-angle emission LED lamp silk lamp.
Background technology
In recent years, due to quickly growing of LED industry, LED lamp progressively replaces traditional lighting.Owing to LED luminescence has the characteristic such as point source and directivity, therefore LED lamp is difficult to replace conventional incandescent, accomplishes that full luminous intensity distribution illuminates.Existing a kind of LED filament, is that one group of LED chip encapsulation is formed LED filament on the transparent substrate, it is possible to achieve wide-angle is luminous, and then multiple filaments connect the illumination effect forming similar tengsten lamp.At present, LED filament is substantially free of radiator, and LED filament cannot be carried out heat conducting and radiating, conduct so being difficult to the heat by LED chip produces, heat can only carry out heat conduction and heat radiation by the convection current of radiation and internal gas, it is easy to causes the accumulation of heat so that the lost of life of LED filament.
Existing LED filament lamp generally adopts and fills heat-conducting gas and glass envelope bubble technique manufacture, and the technology of envelope bubble is required height, apparatus expensive by this technique, it is easy to cause that envelope bubble is not tamping, gas leakage, blast, the problem such as glass envelope is frangible.Life-time service is difficult to avoid that and there will be leakage problem, and gas leakage can cause that heat-sinking capability reduces even LED filament and is burned out.And the heat dispersion of gas is limited, the exploitation of low-power LED filament lamp can only be met, and once do high-power, the heat of the generation of LED filament cannot shed in time, it is easy to causing cause thermal damage and the light decay of LED chip so that the lux maintenance of whole lamp is low, the life-span is short.
Utility model content
In view of this, it is necessary to a kind of simple for assembly process, Large-angle emission LED lamp silk lamp of dispelling the heat good is provided.
A kind of Large-angle emission LED lamp silk lamp, including body, heat transfer plate and multiple light source board, each light source board all includes substrate and the multiple LED light sources being disposed on this substrate, this heat transfer plate is arranged on the top of this body, this heat transfer plate is provided with multiple connecting portion, described connecting portion be disposed on this heat transfer plate respectively and with this heat transfer plate thermally coupled, the bottom of described light source board be separately fixed on described connecting portion and with described connecting portion thermally coupled, the substrate of each light source board is made by heat sink material, described LED light source is arranged on the side of this substrate and closeer in the position distribution of bottom near this substrate.
nullCompared with prior art，When LED light source is arranged on this substrate by this utility model，Make its position distribution in the bottom near this substrate closeer，And the bottom of these light source boards be separately fixed at on the hot linked connecting portion of heat transfer plate，So，The heat that these LED light sources produce can form Gradient distribution on the substrate，The heat produced closer to the position of the bottom of this substrate is more，And this partial heat is shorter to the heat conduction path of this heat transfer plate，Can be transmitted to rapidly on this connecting portion，And conducted by this heat transfer plate，Put forward highly thermally conductive speed，Avoid heat build-up，This large-angle LED filament light fixture is made to have good radiating effect，And without additionally filling heat-conducting gas and glass envelope bubble technique，Avoid the complicated technology designed exclusively for filling heat-conducting gas and glass envelope bubble，Have simple for assembly process、Dispel the heat good advantage.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of this utility model Large-angle emission LED lamp silk lamp first embodiment.
Fig. 2 is the lamp three-dimensional exploded view of Large-angle emission LED lamp silk shown in Fig. 1.
Fig. 3 is the profile of the lamp of Large-angle emission LED lamp silk shown in Fig. 1.
Fig. 4 is the axonometric chart of electrode terminal in the lamp of Large-angle emission LED lamp silk shown in Fig. 2.
Fig. 5 is the part assembling stereogram of the lamp of Large-angle emission LED lamp silk shown in Fig. 2.
Description of reference numerals:
10 body 11 radiating parts
20 heat transfer plate 21 connecting portions
211 heat-transfer area 30 light source boards
31 substrate 40 bulb housings
50 circuit board 51 resigning holes
52 electrode terminal 521 elastic contact blades
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, this utility model is described in further detail.
Refer to Fig. 1 to Fig. 5, this Large-angle emission LED lamp silk lamp, including body 10, heat transfer plate 20 and multiple light source board 30, each light source board 30 all includes substrate 31 and the multiple LED light source (not shown) being disposed on this substrate 31, this heat transfer plate 20 is arranged on the top of this body 10, this body 10 is provided with radiating part 11, this heat transfer plate 20 and this radiating part 11 thermally coupled.
Wherein, these light source boards 30 this heat transfer plate 20 relative respectively is obliquely installed, and these light source boards 30 circularize arrangement around the axis of this heat transfer plate 20.This heat transfer plate 20 is provided with four connecting portions 21, these connecting portions 21 be respectively separated be arranged on this heat transfer plate 20 and with this heat transfer plate 20 thermally coupled.Each connecting portion 21 is the block structure being integrally disposed upon on this light source board 30.The bottom of these light source boards 30 be separately fixed on these connecting portions 21 and with these connecting portion 21 thermally coupleds so that the heat of these light source boards 30 can be transmitted on this heat transfer plate 20.In the present embodiment, the top of these light source boards 30 relatively bottom it axis closer to this heat transfer plate 20 arrange, these connecting portions 21 these light source boards 30 corresponding are respectively equipped with the heat-transfer area 211 of inclination, in order to increase the thermally coupled area of these light source boards 30 and these connecting portions 21.In the present embodiment, these connecting portions 21 can be multiple, it is possible to these connecting portions 21 are set to one.
In the present embodiment, these substrates 31 are made up of transparent or semitransparent material, and a part of light that these LED light sources send outwards penetrates through this substrate 31.These LED light sources are arranged on the front of this substrate 31, and the back side of this substrate 31 is additionally provided with heat-conducting layer (not shown), a part for this heat-conducting layer and this connecting portion 21 thermally coupled, and the position of these LED light sources is deviateed in the position of this heat-conducting layer.Concrete, these substrates 31 are made up of heat conduction glass ceramic, high or sapphire material, and this heat-conducting layer is the metallic silver layer or the metal copper layer that are attached to this substrate 31 back side.LED light source on each light source board 30 is packaged together formation face illuminating source by a phosphor powder layer.The substrate 31 of each light source board 30 is made by heat sink material, these LED light sources are arranged on the side of this substrate 31 and closeer in the position distribution of bottom near this substrate 31, so, the heat that these LED light sources produce can form Gradient distribution on this substrate 31, the heat produced closer to the position of the bottom of this substrate 31 is more, and this partial heat is shorter to the heat conduction path of this heat transfer plate 20, can be transmitted on this connecting portion 21 rapidly, put forward highly thermally conductive speed, and it is transmitted on this radiating part 11 hot linked with this heat transfer plate 20 by this heat transfer plate 20, distribute through this radiating part 11, avoid heat build-up, cause that these LED light sources lost efficacy.
Additionally, refer to Fig. 2, Fig. 4 and Fig. 5, also including circuit board 50, this circuit board 50 is arranged on the top of this heat transfer plate 20, and this circuit board 50 these connecting portions 21 corresponding are provided with resigning hole 51 so that this circuit board 50 can be set on these connecting portions 21.On this circuit board 50, corresponding each light source board 30 is additionally provided with electrode terminal 52, one end of these electrode terminals 52 electrically connects with this circuit board 50, the other end of these electrode terminals 52 is provided with elastic contact blade 521, the bottom of the substrate 31 in each light source board 30 is respectively equipped with electrode (not shown), the elastic contact blade 521 of these electrode terminals 52 electrically connects with realization with the abutting of the electrode elastic on these light source boards 30 respectively, so without other bonding wire, it is simple to automated production.
In addition, also include bulb housing 40, in the bottom cover of this bulb housing 40 is located at this heat transfer plate 20 and is contained in by these light source boards 30, this bulb housing 40 was hemisphere bubble shell structure, on these light source boards 30, LED light source bottom this substrate 31 is to should the bottom of bulb housing 40 arrange, and the bottom of this bulb housing 40 is for reflecting most of light that LED light source bottom this substrate 31 on these light source boards 30 sends towards near the direction of this heat transfer plate 20.This bulb housing 40 is transparent or semitransparent structure, and it is made up of plastics or glass, and this bulb housing 40 can arrange light diffusion material.
nullIn sum，When LED light source is arranged on this substrate 31 by this utility model，Make its position distribution in the bottom near this substrate 31 closeer、More，Position distribution in the bottom away from this substrate is relatively sparse、Less，And the bottom of these light source boards 30 be separately fixed at on the hot linked connecting portion 21 of heat transfer plate 20，So，The heat that these LED light sources produce can form Gradient distribution on this substrate 31，The heat produced closer to the position of the bottom of this substrate 31 is more，And this partial heat is shorter to the heat conduction path of this heat transfer plate 20，Can be transmitted to rapidly on this connecting portion 21，And conducted by this heat transfer plate 20，Put forward highly thermally conductive speed，Avoid heat build-up，This large-angle LED filament light fixture is made to have good radiating effect，And without additionally filling heat-conducting gas and glass envelope bubble technique，Avoid the complicated technology designed exclusively for filling heat-conducting gas and glass envelope bubble，Have simple for assembly process、Dispel the heat good advantage.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, any those skilled in the art are without departing from, in this programme technical scope, utilizing the technology contents of above-mentioned exposure to make the Equivalent embodiments for equal change of few modifications.In every case depart from technical solutions of the utility model content, according to this utility model technical spirit to any amendment made for any of the above embodiments, equivalent replacement, improvement etc., should be included within the scope of this utility model protection.
Claims (12)
1. a Large-angle emission LED lamp silk lamp, including body, heat transfer plate and multiple light source board, each light source board all includes substrate and the multiple LED light sources being disposed on this substrate, this heat transfer plate is arranged on the top of this body, it is characterized in that: this heat transfer plate is provided with multiple connecting portion, described connecting portion be disposed on this heat transfer plate respectively and with this heat transfer plate thermally coupled, the bottom of described light source board be separately fixed on described connecting portion and with described connecting portion thermally coupled, the substrate of each light source board is made by heat sink material, described LED light source is arranged on the side of this substrate and closeer in the position distribution of bottom near this substrate.
2. Large-angle emission LED lamp silk lamp according to claim 1, it is characterised in that: described light source board this heat transfer plate relative respectively is obliquely installed, and described light source board circularizes arrangement around the axis of this heat transfer plate.
3. Large-angle emission LED lamp silk lamp according to claim 2, it is characterised in that: the top of described light source board relatively bottom it axis closer to this heat transfer plate arranges, the described connecting portion described light source board of correspondence is respectively equipped with the heat-transfer area of inclination.
4. Large-angle emission LED lamp silk lamp according to claim 1, it is characterized in that: also include bulb housing, in the bottom cover of this bulb housing is located on this heat transfer plate and is contained in by described light source board, this bulb housing was hemisphere bubble shell structure, near the LED light source of this base plate bottom to should the bottom of bulb housing arrange on described light source board, the bottom of this bulb housing is for reflecting most of light that the LED light source of this base plate bottom close on described light source board sends towards near the direction of this heat transfer plate.
5. Large-angle emission LED lamp silk lamp according to claim 4, it is characterised in that: this bulb housing is transparent or semitransparent structure, and it is made up of plastics or glass, and this bulb housing can arrange light diffusion material.
6. Large-angle emission LED lamp silk lamp according to claim 1, it is characterised in that: the LED light source on each light source board is packaged together formation face illuminating source by a phosphor powder layer.
7. Large-angle emission LED lamp silk lamp according to claim 1, it is characterised in that: described substrate is made up of transparent or semitransparent material, and a part of light that described LED light source sends outwards penetrates through this substrate.
8. Large-angle emission LED lamp silk lamp according to claim 1, it is characterised in that: this body is provided with radiating part, this heat transfer plate and this radiating part thermally coupled.
9. Large-angle emission LED lamp silk lamp according to claim 1, it is characterised in that: described LED light source is arranged on the front of this substrate, and the back side of this substrate is additionally provided with heat-conducting layer, a part for this heat-conducting layer and this connecting portion thermally coupled.
10. Large-angle emission LED lamp silk lamp according to claim 9, it is characterized in that: described substrate is made up of transparent or semitransparent material, a part of light that described LED light source sends outwards penetrates through this substrate, and the position of described LED light source is deviateed in the position of this heat-conducting layer.
11. Large-angle emission LED lamp silk lamp according to claim 10, it is characterised in that: described substrate is made up of heat conduction glass ceramic, high or sapphire material, and this heat-conducting layer is the metallic silver layer or the metal copper layer that are attached to this substrate back.
12. Large-angle emission LED lamp silk lamp according to claim 1, it is characterized in that: also include circuit board, this circuit board is arranged on the top of this heat transfer plate, and the corresponding described connecting portion of this circuit board is provided with resigning hole, on this circuit board, corresponding each light source board is additionally provided with electrode terminal, one end of described electrode terminal electrically connects with this circuit board, the other end of described electrode terminal is provided with elastic contact blade, the bottom of the substrate in each light source board is respectively equipped with electrode, the elastic contact blade of described electrode terminal electrically connects with realization with the abutting of the electrode elastic on described light source board respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620045938.XU CN205372147U (en) | 2016-01-18 | 2016-01-18 | Wide -angle LED filament lamp that gives out light; give off light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620045938.XU CN205372147U (en) | 2016-01-18 | 2016-01-18 | Wide -angle LED filament lamp that gives out light; give off light |
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|---|---|
| CN205372147U true CN205372147U (en) | 2016-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620045938.XU Active CN205372147U (en) | 2016-01-18 | 2016-01-18 | Wide -angle LED filament lamp that gives out light; give off light |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105805579A (en) * | 2016-01-18 | 2016-07-27 | 漳州立达信光电子科技有限公司 | Large-angle light-emitting LED filament lamp |
| CN107461617A (en) * | 2017-08-03 | 2017-12-12 | 漳州立达信光电子科技有限公司 | Led filament |
-
2016
- 2016-01-18 CN CN201620045938.XU patent/CN205372147U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105805579A (en) * | 2016-01-18 | 2016-07-27 | 漳州立达信光电子科技有限公司 | Large-angle light-emitting LED filament lamp |
| WO2017124784A1 (en) * | 2016-01-18 | 2017-07-27 | 漳洲立达信光电子科技有限公司 | Wide-angle light emitting led filament lamp |
| CN107461617A (en) * | 2017-08-03 | 2017-12-12 | 漳州立达信光电子科技有限公司 | Led filament |
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