CN103956359A - Single-ended power supply all-around LED lamp filament and manufacturing method thereof - Google Patents
Single-ended power supply all-around LED lamp filament and manufacturing method thereof Download PDFInfo
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- CN103956359A CN103956359A CN201410210277.7A CN201410210277A CN103956359A CN 103956359 A CN103956359 A CN 103956359A CN 201410210277 A CN201410210277 A CN 201410210277A CN 103956359 A CN103956359 A CN 103956359A
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Abstract
Provided is a single-ended power supply all-around LED lamp filament. Two rows of LED wafers are arranged on a strip-shaped substrate, each row of LED wafers are identical in front-back sequence, different rows of LED wafers are opposite in front-back sequence, and heads and tails of the LED wafers are connected through lead wires to form a U-shaped LED cluster. A pair of electrodes is arranged at one end of the strip-shaped substrate close to the U-shaped LED cluster, and each end LED is respectively connected with one electrode through an elargol conductive region formed by an elargol layer. All exposed surfaces of LED wafer regions arranged on the strip-shaped substrate are coated with fluorescent glue. The invention further discloses a method for manufacturing the single-ended power supply all-around LED lamp filament. Compared with the prior art, good light-emitting effect and good mechanical connecting firmness are obtained.
Description
Technical field
The present invention relates to a kind of LED preparation method, particularly relate to a kind of single-ended power supply LED of omnidirectional filament and preparation method thereof.
Background technology
Along with popularizing of LED lighting source, market requires more and more higher to the efficiency of LED lighting source.The present invention is according to the one-tenth light characteristic of LED, changes the mode of utilizing of blue light that traditional handicraft sends LED wafer, improves to greatest extent the utilance of blue light, to reach higher light efficiency output.
Light-emitting diode is the same with general-purpose diode to be made up of a PN junction, has unilateral conduction.When adding after forward voltage to light-emitting diode, be injected into the hole in N district from P district and be injected into the electronics in P district by N district, near PN junction in several microns respectively with the electronics in N district and the hole-recombination in P district, produce the fluorescence of spontaneous radiation.In different semi-conducting materials, electronics is different with the residing energy state in hole.How much different the energy discharging in the time of electronics and hole-recombination is, and the energy discharging is more, and the light wavelength of sending is shorter, wavelength difference, and the color of light shows different.
The existing luminous LED light fixture of LED wafer that utilizes adopts a bowl type rack bearing wafer more, insufficient to the luminous reflection of LED, in recent years, along with emerging in large numbers and the progress of semiconductor fabrication process of new material, there is the LED filament that Liao Neng omnidirectional is luminous, can be luminous within the scope of 360 degree, but the unidirectional array that adopt more, electrode position is unfavorable for being connected with current electrode, and between LED wafer or being connected of LED wafer and electrode adopt gold thread mode to connect, mechanical performance fragility.
Summary of the invention
Insufficient for overcoming the existing LED of utilization wafer alight tool reflection, electrode connects inconvenience, and LED wafer connects fragile technological deficiency, the invention discloses a kind of single-ended power supply LED of omnidirectional filament and preparation method thereof.
The single-ended power supply LED of omnidirectional filament preparation method of the present invention, comprises the steps:
S1. LED wafer is arranged in to two row in the mode of sequence consensus end to end, be bonded on the bar shaped substrate of transparent insulation, the both positive and negative polarity trend of two row LED wafers is contrary, and one end of described bar shaped substrate is fixed with two electrodes, and described electrode at least one end is close to described bar shaped substrate surface;
S2. use wire that two row LED wafers are connected end to end in turn, form U-shaped LED string, between two termination LED wafers of going here and there at U-shaped LED and two electrodes, spray elargol and form elargol conduction region, make each termination LED wafer form and be electrically connected with an electrode respectively;
S3. configure fluorescent glue, fluorescent glue is applied to the whole exposed surfaces in region that are furnished with LED wafer on bar shaped substrate, coated bar shaped substrate is sent into baking box baking-curing.
Preferably, in described step S2, use ultrasonic wave gold thread pellet bonding machine to connect each LED.
Preferably, in described step S3, utilize matrix dispensing needle head to apply fluorescent glue on bar shaped substrate.
The invention also discloses a kind of single-ended power supply LED of omnidirectional filament, comprise the bar shaped substrate of transparent insulation and be arranged in the plurality of LEDs wafer on bar shaped substrate,
Described LED wafer is two row on bar shaped substrate to be arranged, every row LED wafer sequence consensus end to end, and different lines LED wafer reversed in order end to end, LED wafer is connected to form U-shaped LED by wire between end to end and goes here and there;
Described bar shaped substrate is provided with pair of electrodes near one end of U-shaped LED string termination, and the elargol conduction region that each termination LED forms by elargol layer is connected with an electrode respectively; The whole exposed surfaces in region that are furnished with LED wafer on described bar shaped substrate are coated with fluorescent glue.
Preferably, described bar shaped substrate is high-boron-silicon glass.
Concrete, the wire connecting between LED wafer is at least one in gold thread, fine silver line, pure copper wire, alloy wire and plating palladium line.
Concrete, described electrode is copper or copper alloy, and electroplate.
Concrete, described fluorescent glue is aluminium yttrogarnet look fluorescent material or Nitride phosphor.
Concrete, described LED wafer is GaN base blue light wafer.
Adopt the single-ended power supply LED of omnidirectional filament of the present invention, have the following advantages compared with prior art:
1, cancel traditional bowl cup type support, adopt the carrier of transparent bar shaped substrate as wafer, LED wafer is lighted rear luminously just can be radiated among surrounding space with 360 ° of full azimuths.Avoid traditional bowl of cup type support insufficient to blue reflection of light, caused luminous utilization ratio low.
2, adopt the mode of single-ended power supply finished product lamp bar directly can be inserted in the electrode hole of two electrodes of power end, without doing again loaded down with trivial details welding action.Simultaneously on bar shaped substrate near the LED wafer of electrode tip adopt mode that elargol covers directly with electrode conduction formation loop, avoided adopting traditional bonding wire mode to connect last wafer and support and caused the fragile problem of wire and support junction.
3, the coating processes of fluorescent glue improvement.Cancel and adopt formed in mould mode to apply fluorescent glue, change into utilize matrix dispensing needle head by the fluorescent glue preparing the positive and negative of glass substrate and two, form parcel entirely, illumination effect is better.
Brief description of the drawings
Fig. 1 is a kind of embodiment structural representation of the single-ended power supply LED of omnidirectional filament of the present invention;
Fig. 2 illustrates that the single-ended power supply LED of omnidirectional filament of the present invention applies a kind of embodiment structural representation of fluorescent glue;
In figure, Reference numeral name is called: 1-bar shaped substrate, 2-electrode, 3-elargol conduction region, 4-LED wafer.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
As shown in Figure 1, the present invention selects the filament main body of bar shaped substrate as carrying LED wafer, bar shaped substrate is generally rectangle, also can make chamfered in rectangle corner, the length and width of rectangle and common filament size are approximate, for example wide 10 millimeters, long 150 millimeters, bar shaped substrate must be selected transparent insulation material, ensure that 360 degree omnidirectionals are luminous, for ensureing translucent effect, bar shaped substrate should be selected the material that light transmittance is high, for example high-boron-silicon glass, high-boron-silicon glass (having another name called hard glass), coefficient of linear thermal expansion is (3.3 scholar 0.1) × 10-6/K, light transmittance is even higher than ultra-clear glasses, can reach more than 90%, it is a kind of low thermal expansion, high temperature resistant, high strength, high rigidity, the specific glass material of high transmission rate and high chemical stability, high-boron-silicon glass has good insulation property simultaneously, in the time that LED electrified light emitting causes glass temperature to raise, remain good insulator.
LED wafer 4 is arranged in to two row in the mode of sequence consensus end to end, be bonded on the bar shaped substrate of transparent insulation, as shown in Figure 1, the both positive and negative polarity trend of two row GaN base blue-ray LED wafers is contrary, direction almost parallel, and one end of bar shaped substrate is fixed with two electrodes, electrode can be selected to conduct electricity very well, make with copper or Cu alloy material that glass easily adheres to, can be silver-plated at electrode surface, improve electrode corrosion resistance and surface conductance performance.The secure attachment of electrode and bar shaped substrate can adopt prior art, for example gluing, electrode at least one end is close to described bar shaped substrate surface, and the other end can stretch out bar shaped substrate, also can be positioned at bar shaped substrate surface scope, depend on the light fixture lamp socket form being used in conjunction with LED filament.
As Fig. 1, two row LED wafer head and the tail are connected, form U-shaped LED string, connect wire and select semiconductor bonding gold thread, comprise proof gold line, fine silver line, pure copper wire and alloy wire and plating palladium line, when connection, can use ultrasonic wave gold thread pellet bonding machine.
Aforesaid way is cancelled traditional bowl cup type support, adopts the carrier of transparent bar shaped substrate as wafer, and LED wafer is lighted rear luminously just can be radiated among surrounding space with 360 ° of full azimuths.Avoid traditional bowl of cup type support insufficient to blue reflection of light, caused luminous utilization ratio low
In two terminations of U-shaped LED string, termination LED need to be electrically connected with two electrodes 2, in the present invention, termination LED does not re-use conventional gold thread with the connected mode of electrode and is connected, but utilize elargol coverage mode, elargol claims again conductive silver glue, a kind of solidify or dry after there is the adhesive of certain electric conductivity, conventionally be that conducting particles is as chief component composition taking matrix resin and conductive filler, bonding effect by matrix resin combines conducting particles, form conductive path, realizing by the conduction of sticky material and connecting. the curing temperature scope of conductive silver glue is very wide, can be from more than room temperature to 200 degree Celsius.
Between two termination LED wafers of going here and there at U-shaped LED and two electrodes, spray elargol and form elargol conduction region 3, make each termination LED wafer form and be electrically connected with an electrode 2 respectively; 3 coated electrode ends, elargol conduction region and termination LED, elargol conduction region width should be much larger than electrode width, guarantees good conductive capability, can select the high temperature resistant elargol product of A7/HA7 series of TeamChem Company company.On U-shaped substrate near last wafer of electrode tip adopt mode that elargol covers directly with electrode conduction formation loop, overcome and adopted traditional bonding wire mode to connect last wafer and electrode suppor and cause the fragile problem of junction.
After LED wafer is connected with electrode, configuration fluorescent glue, fluorescent glue is taking fluorescent material as main batching, adds a certain proportion of adhesive to form the fluorescer with certain viscosity.Fluorescent glue is coated in dotted line frame region as shown in Figure 2, dotted line frame region should cover whole LED wafers suitably expansion, guarantee in omnidirectional's 360 light emitting regions of every LEDs, all covered by fluorescent glue, obtain uniform illumination effect, fluorescent glue can be selected aluminium yttrogarnet look fluorescent material or Nitride phosphor, preferably adopt spill dispensing needle head to apply, dispensing needle head applies and allows fluorescent glue be circular-arc parcel wafer, fluorescent glue surface is easily consistent to the distance of LED wafer, makes hue preserving homogeneous after wafer fluorescence excitation glue.After coating, bar shaped substrate entirety is sent into baking box baking, after fluorescent glue solidifies, take out.
More than comprehensive, the single-ended power supply LED of omnidirectional filament preparation method of the present invention, specifically comprises the steps:
S1. LED wafer is arranged in to two row in the mode of sequence consensus end to end, be bonded on the bar shaped substrate of transparent insulation, the both positive and negative polarity trend of two row LED wafers is contrary, and one end of described bar shaped substrate is fixed with two electrodes, and described electrode at least one end is close to described bar shaped substrate surface;
S2. use wire that two row LED wafers are connected end to end in turn, form U-shaped LED string, between two termination LED wafers of going here and there at U-shaped LED and two electrodes, spray elargol and form elargol conduction region, make each termination LED wafer form and be electrically connected with an electrode respectively;
S3. configure fluorescent glue, fluorescent glue is applied to the whole exposed surfaces in region that are furnished with LED wafer on bar shaped substrate, coated bar shaped substrate is sent into baking box baking-curing.
The invention also discloses a kind of single-ended power supply LED of omnidirectional filament that utilizes said method to make, comprise the bar shaped substrate of transparent insulation and be arranged in the plurality of LEDs wafer on bar shaped substrate, described LED wafer is two row and arranges on bar shaped substrate, every row LED wafer sequence consensus end to end, different lines LED wafer reversed in order end to end, LED wafer is connected to form U-shaped LED by wire between end to end and goes here and there;
Described bar shaped substrate is provided with pair of electrodes near one end of U-shaped LED string termination, and the elargol conduction region that each termination LED forms by elargol layer is connected with an electrode respectively; The whole exposed surfaces in region that are furnished with LED wafer on described bar shaped substrate are coated with fluorescent glue.
Adopt the single-ended power supply LED of omnidirectional filament of the present invention and preparation method thereof, have the following advantages compared with prior art:
1, cancel traditional bowl cup type support, adopt the carrier of transparent bar shaped substrate as wafer, LED wafer is lighted rear luminously just can be radiated among surrounding space with 360 ° of full azimuths.Avoid traditional bowl of cup type support insufficient to blue reflection of light, caused luminous utilization ratio low.
2, adopt the mode of single-ended power supply finished product lamp bar directly can be inserted in the electrode hole of two electrodes of power end, without doing again loaded down with trivial details welding action.Simultaneously on bar shaped substrate near the LED wafer of electrode tip adopt mode that elargol covers directly with electrode conduction formation loop, avoided adopting traditional bonding wire mode to connect last wafer and support and caused the fragile problem of wire and support junction.
3, the coating processes of fluorescent glue improvement.Cancel and adopt formed in mould mode to apply fluorescent glue, change into utilize matrix dispensing needle head by the fluorescent glue preparing the positive and negative of glass substrate and two, form parcel entirely, illumination effect is better.
Previously described is each preferred embodiment of the present invention, preferred implementation in each preferred embodiment is if not obviously contradictory or taking a certain preferred implementation as prerequisite, each preferred implementation arbitrarily stack combinations is used, design parameter in described embodiment and embodiment is only the invention proof procedure for clear statement inventor, not in order to limit scope of patent protection of the present invention, scope of patent protection of the present invention is still as the criterion with its claims, the equivalent structure that every utilization specification of the present invention and accompanying drawing content are done changes, in like manner all should be included in protection scope of the present invention.
Claims (9)
1. the single-ended power supply LED of omnidirectional filament preparation method, is characterized in that, comprises the steps:
S1. LED wafer is arranged in to two row in the mode of sequence consensus end to end, be bonded on the bar shaped substrate of transparent insulation, the both positive and negative polarity trend of two row LED wafers is contrary, and one end of described bar shaped substrate is fixed with two electrodes, and described electrode at least one end is close to described bar shaped substrate surface;
S2. use wire that two row LED wafers are connected end to end in turn, form U-shaped LED string, between two termination LED wafers of going here and there at U-shaped LED and two electrodes, spray elargol and form elargol conduction region, make each termination LED wafer form and be electrically connected with an electrode respectively;
S3. configure fluorescent glue, fluorescent glue is applied to the whole exposed surfaces in region that are furnished with LED wafer on bar shaped substrate, coated bar shaped substrate is sent into baking box baking-curing.
2. the single-ended power supply LED of omnidirectional filament preparation method as claimed in claim 1, is characterized in that, uses ultrasonic wave gold thread pellet bonding machine to connect each LED in described step S2.
3. the single-ended power supply LED of omnidirectional filament preparation method as claimed in claim 1, is characterized in that, utilizes matrix dispensing needle head to apply fluorescent glue in described step S3 on bar shaped substrate.
4. the single-ended power supply LED of omnidirectional filament, comprises the bar shaped substrate of transparent insulation and is arranged in the plurality of LEDs wafer on bar shaped substrate,
It is characterized in that, described LED wafer is two row on bar shaped substrate to be arranged, every row LED wafer sequence consensus end to end, and different lines LED wafer reversed in order end to end, LED wafer is connected to form U-shaped LED by wire between end to end and goes here and there;
Described bar shaped substrate is provided with pair of electrodes near one end of U-shaped LED string termination, and the elargol conduction region that each termination LED forms by elargol layer is connected with an electrode respectively; The whole exposed surfaces in region that are furnished with LED wafer on described bar shaped substrate are coated with fluorescent glue.
5. the single-ended power supply LED of omnidirectional filament as claimed in claim 4, is characterized in that, described bar shaped substrate is high-boron-silicon glass.
6. the single-ended power supply LED of omnidirectional filament as claimed in claim 4, is characterized in that, the wire connecting between LED wafer is at least one in gold thread, fine silver line, pure copper wire, alloy wire and plating palladium line.
7. the single-ended power supply LED of omnidirectional filament as claimed in claim 4, is characterized in that, described electrode is copper or copper alloy, and electroplate.
8. the single-ended power supply LED of omnidirectional filament as claimed in claim 4, is characterized in that, described fluorescent glue is aluminium yttrogarnet look fluorescent material or Nitride phosphor.
9. the single-ended power supply LED of omnidirectional filament as claimed in claim 4, is characterized in that, described LED wafer is GaN base blue light wafer.
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| CN201410210277.7A CN103956359A (en) | 2014-05-19 | 2014-05-19 | Single-ended power supply all-around LED lamp filament and manufacturing method thereof |
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Cited By (6)
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| CN105304797A (en) * | 2015-09-06 | 2016-02-03 | 深圳市源磊科技有限公司 | LED filament glue dispensing method |
| CN106322147A (en) * | 2016-10-17 | 2017-01-11 | 江门市雨点照明科技有限公司 | Substrate-free assembled LED lamp post |
| CN106369290A (en) * | 2016-10-17 | 2017-02-01 | 江门市雨点照明科技有限公司 | No-substrate LED lamp source |
| DE102015120085A1 (en) * | 2015-11-19 | 2017-05-24 | Osram Opto Semiconductors Gmbh | LED filaments, process for producing LED filaments and retrofit lamp with LED filament |
| CN110139469A (en) * | 2019-05-08 | 2019-08-16 | 格瑞电子（厦门）有限公司 | A kind of small array LED lamp group circuit board |
| CN110139468A (en) * | 2019-05-08 | 2019-08-16 | 格瑞电子（厦门）有限公司 | A kind of stage LED light circuit board |
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Application publication date: 20140730 |