CN106369290A - No-substrate LED lamp source - Google Patents

No-substrate LED lamp source Download PDF

Info

Publication number
CN106369290A
CN106369290A CN201610903751.3A CN201610903751A CN106369290A CN 106369290 A CN106369290 A CN 106369290A CN 201610903751 A CN201610903751 A CN 201610903751A CN 106369290 A CN106369290 A CN 106369290A
Authority
CN
China
Prior art keywords
lamp source
transparent insulation
led lamp
basic unit
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610903751.3A
Other languages
Chinese (zh)
Inventor
施嘉铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangmen Rain Lighting Technology Co Ltd
Original Assignee
Jiangmen Rain Lighting Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangmen Rain Lighting Technology Co Ltd filed Critical Jiangmen Rain Lighting Technology Co Ltd
Priority to CN201610903751.3A priority Critical patent/CN106369290A/en
Publication of CN106369290A publication Critical patent/CN106369290A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source

Abstract

The invention discloses a no-substrate LED lamp source. The no-substrate LED lamp source comprises a transparent insulation base layer, and multiple LED wafers fixedly spaced on the transparent insulation base layer; the multiple LED wafers are serially connected through metal wires; and a fluorescent layer for covering the multiple LED wafers is arranged on the upper surface of the transparent insulation base layer. The no-substrate LED lamp source further comprises positive and negative electrode pins; and the positive and negative electrode pins are connected with two ends of the LED wafer serial connecting circuit through metal wires. The no-substrate LED lamp source realizes the structure simplification by adopting a single-surface solid crystal welding wire technology of the transparent insulation base layer. In addition, the transparent insulation base layer can be manufactured as such special shapes as heart shape and five-pointed star shape, so that the no-substrate LED lamp source becomes various, is higher in decorative performance and interesting, and improves the product market competitiveness.

Description

No substrate LED lamp source
Technical field
The present invention relates to a kind of LED lamp source, more particularly to one kind no substrate LED lamp source.
Background technology
LED lamp bubble as disclosed in the Chinese patent of Patent No. 201310149663.5,201180041705.2, mesh The lamp source that front LED lamp bubble uses typically led chip is arranged on the substrate of heat conduction, and substrate is generally circular or bar shaped Shape, can only be distributed led chip, the form of its lamp source is single on the circular or substrate of strip, can be only formed plane or The lamp source of column.
Content of the invention
For overcoming the deficiencies in the prior art, it is an object of the invention to provide one kind no substrate LED lamp source, can be by lamp source system It is made various profiled shape, make the form of lamp source become more to enrich.
The present invention is to solve its technical problem the technical scheme is that
One kind no substrate LED lamp source, including transparent insulation basic unit and be fixed on multiple spaced apart in transparent insulation basic unit Led chip, multiple led chips are connected in series by metal wire, and the upper surface of described transparent insulation basic unit is provided with covering institute State the fluorescence coating of multiple led chips；Also include positive and negative electrode pin, described positive and negative electrode pin connects described by metal wire The two ends of led wafer tandem circuit.
Further, described transparent insulation basic unit is planar structure.
Further, described transparent insulation basic unit is profiled shape.
Further, described transparent insulation basic unit is prepared from by transparent resin material.
The invention has the beneficial effects as follows: the no substrate LED lamp source of the present invention, using transparent insulation basic unit one side die bond bonding wire Technology is it is achieved that the structure in LED lamp source simplifies.Additionally, transparent insulation basic unit can be fabricated to multiple profiled shape, such as heart-shaped, five Angle starriness etc. is so that no substrate LED lamp product-derived becomes variation, and has higher dicoration and interest, improves The competitiveness of product in market.
Brief description
Fig. 1 is the structural representation of the present invention.
Specific embodiment
Below in conjunction with accompanying drawing and example, the present invention will be further described.
As shown in figure 1, one kind of the present invention no substrate LED lamp source, including transparent insulation basic unit 1 and be fixed on transparent absolutely Led chip 2 multiple spaced apart in edge basic unit 1, multiple led chips 2 are connected in series by metal wire, described transparent insulation The upper surface of basic unit 1 is provided with the fluorescence coating covering the plurality of led chip 2；Also include positive and negative electrode pin 3, described just, Negative electrode pin 3 connects the two ends of described led chip 2 series circuit by metal wire.
Described transparent insulation basic unit 1 is planar structure and can be fabricated to multiple profiled shape, such as heart, five-pointed star, sage The shape such as birth tree or animal, then arranges led chip 2 in the transparent insulation basic unit of profiled shape, can improve bulb lamp Ornamental and interesting.
Described transparent insulation basic unit 1 can be prepared from by transparent resin material.
The above, simply presently preferred embodiments of the present invention, the invention is not limited in above-mentioned embodiment, as long as It reaches the technique effect of the present invention with identical means, all should belong to protection scope of the present invention.

Claims (4)

1. no substrate LED lamp source it is characterised in that: include transparent insulation basic unit and be fixed on multiple in transparent insulation basic unit Led chip spaced apart, multiple led chips are connected in series by metal wire, the upper surface setting of described transparent insulation basic unit There is the fluorescence coating covering the plurality of led chip；Also include positive and negative electrode pin, described positive and negative electrode pin passes through metal wire Connect the two ends of described led wafer tandem circuit.
2. no substrate LED lamp source according to claim 1 it is characterised in that: described transparent insulation basic unit be planar structure.
3. no substrate LED lamp source according to claim 1 and 2 it is characterised in that: described transparent insulation basic unit is special-shaped shape Shape.
4. no substrate LED lamp source according to claim 1 and 2 it is characterised in that: described transparent insulation basic unit is by transparent tree Fat material is prepared from.
CN201610903751.3A 2016-10-17 2016-10-17 No-substrate LED lamp source Pending CN106369290A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610903751.3A CN106369290A (en) 2016-10-17 2016-10-17 No-substrate LED lamp source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610903751.3A CN106369290A (en) 2016-10-17 2016-10-17 No-substrate LED lamp source

Publications (1)

Publication Number Publication Date
CN106369290A true CN106369290A (en) 2017-02-01

Family

ID=57895398

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610903751.3A Pending CN106369290A (en) 2016-10-17 2016-10-17 No-substrate LED lamp source

Country Status (1)

Country Link
CN (1) CN106369290A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102224371A (en) * 2008-06-04 2011-10-19 长寿灯泡有限责任公司 Led-based light bulb device
CN202675106U (en) * 2012-07-30 2013-01-16 苏州均亮光电科技有限公司 Light-emitting diode (LED) ceiling metal pinch plate lamp
CN202905778U (en) * 2012-11-06 2013-04-24 河北立德电子有限公司 Omnidirectional LED light source
CN103080634A (en) * 2010-08-31 2013-05-01 株式会社东芝 LED light bulb
CN103956359A (en) * 2014-05-19 2014-07-30 四川柏狮光电技术有限公司 Single-ended power supply all-around LED lamp filament and manufacturing method thereof
CN204153540U (en) * 2014-10-31 2015-02-11 上海博恩世通光电股份有限公司 A kind of wide-angle light extracting LED bulb lamp
CN206176053U (en) * 2016-10-17 2017-05-17 江门市雨点照明科技有限公司 No base plate LED lamp source

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102224371A (en) * 2008-06-04 2011-10-19 长寿灯泡有限责任公司 Led-based light bulb device
CN103080634A (en) * 2010-08-31 2013-05-01 株式会社东芝 LED light bulb
CN202675106U (en) * 2012-07-30 2013-01-16 苏州均亮光电科技有限公司 Light-emitting diode (LED) ceiling metal pinch plate lamp
CN202905778U (en) * 2012-11-06 2013-04-24 河北立德电子有限公司 Omnidirectional LED light source
CN103956359A (en) * 2014-05-19 2014-07-30 四川柏狮光电技术有限公司 Single-ended power supply all-around LED lamp filament and manufacturing method thereof
CN204153540U (en) * 2014-10-31 2015-02-11 上海博恩世通光电股份有限公司 A kind of wide-angle light extracting LED bulb lamp
CN206176053U (en) * 2016-10-17 2017-05-17 江门市雨点照明科技有限公司 No base plate LED lamp source

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20170201