CN100559558C - The manufacturing method for heat radiating base of surface adhesion type diode support and structure thereof - Google Patents
The manufacturing method for heat radiating base of surface adhesion type diode support and structure thereof Download PDFInfo
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- CN100559558C CN100559558C CN 200710079485 CN200710079485A CN100559558C CN 100559558 C CN100559558 C CN 100559558C CN 200710079485 CN200710079485 CN 200710079485 CN 200710079485 A CN200710079485 A CN 200710079485A CN 100559558 C CN100559558 C CN 100559558C
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- cooling base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
A kind of manufacturing method for heat radiating base of surface adhesion type diode support and structure thereof provide the cooling base that can produce various different size thickness.The cooling base structure of diode support comprises colloid, one with the affixed cooling base of colloid, and most metal pins affixed with colloid, cooling base then has first and second metal sheet of storehouse combination in regular turn mutually; By this, via the mutual storehouse of first and second metal sheets in conjunction with the cooling base of being formed, and then can produce various gauge according to actual demand, so that the diode support that can manufacture out to the property adjusted various sizes to be provided, thereby promote in the convenience of aspects such as processing procedure.
Description
Technical field
The present invention is relevant for a kind of design of LED support, especially refer to a kind of manufacturing method for heat radiating base and structure thereof relevant for SMD LED surface-mount device LED (SMD) diode support, form cooling base with use storehouse combination, and then have the cooling base of the property adjusted ground production various sizes thickness.
Background technology
Light-emitting diode (Light Emitting Diode, LED) be by the made luminescence component of semi-conducting material, life-span was more than 100,000 hours, and have that volume is little, low power consumption, need not warm up lamp (idling time), reaction speed fast, shatter-proof, be fit to good mechanical properties such as volume production.Especially in recent years, the luminous efficiency of light-emitting diode is constantly progressive to be promoted, and made light-emitting diode heal to become extensively in application, was widely used in the light source as information products etc. gradually.
Generally speaking, light-emitting diode chip for backlight unit is fixed in a SMD LED surface-mount device LED, and (Surface MountDevice SMD) in the diode support, uses and can constitute a light-emitting diode, after diode support imports electric current, can the driven for emitting lights diode chip for backlight unit luminous, but during its running, will produce heat, when heat too high, cause the damage of light-emitting diode chip for backlight unit easily, therefore, the radiating effect of light-emitting diode just belongs to a very important ring.
As shown in Figures 1 and 2, for the surface adhesion type diode support (maybe can cite approvingly coil holder) that peddle present market is constructed, it has a bowl-shape colloid 11, and colloid 11 is preset with a perforation 111, in the colloid 11 and be connected with metal pin 12, its be from inside to outside extend to colloid 11 outsides, with as follow-up contact, 111 supplies of this perforation, one radiating block 13 that is convex character shape is embedded, so that radiating block 13 can be incorporated in the colloid 11.Afterwards, according to actual required quantity one or more light-emitting diode chip for backlight unit 14 is fixed in radiating block 13 surfaces and goes up (promptly solid brilliant operation), and on light-emitting diode chip for backlight unit 14, be connected with lead 15 to metal pin 12 (being the routing operation), and in colloid 11, cover one deck epoxy resin 16 (they being packaging operation), with encapsulation LED chip 14 and lead 15.Make when metal pin 12 applies electric current, can make light-emitting diode chip for backlight unit 14 discharge light, when it operated, the heat that is produced can conduct to radiating block 13 and then reach the effect of outside heat radiation.
But, between radiating block 13 and colloid 11 and the metal pin 12, be to belong to separately independent to make, colloid 11 is the mode and metal pin 12 first combinations with ejection formation, and after the radiating block 13 turning machine-shaping of use as lathe earlier, is embedded in the colloid 11 again, therefore quite time-consuming on the processing procedure, the relative cost that also improves on making, and organize after the moulding respectively between radiating block 13 and the colloid 11 again and establish becomes dealer perplexing greatly in manufacturing undoubtedly.
Therefore, in order to improve above-mentioned disappearance, manufacture method and structure thereof as the LED lead frame of Taiwan patent TWI246209, see also Fig. 3 and Fig. 4, it exposes the substrate 21 that utilizes a different-thickness, produce polarity pin 211, fixing feet 212 and radiating seat 213 in the mode of utilizing punching press, and the technical approach that utilization is penetrated on substrate 21 again, to be formed with plastic insulation material 22, and plastic insulation material 22 coats the outside of polarity pin 211, fixing feet 212 and radiating seat 213, and separated, use the lead frame that constitutes a light-emitting diode.
After lead frame constitutes, radiating seat 213 upper ends can set firmly semiconductor chip (being light-emitting diode chip for backlight unit) 23, utilize lead 24 to connect semiconductor chip 23 and polarity pin 211 simultaneously, utilize epoxy resin 25 to be packaged on the plastic insulation material 22 again, make semiconductor chip 23 and lead 24 be coated on epoxy resin 25 inside, can constitute a light-emitting diode.
Above-mentioned radiating seat 213 is made by punching press, but be subject to the thickness of the former substrate that provides 21 on its thickness, only can make single size thickness, the diode support that can only be supplied in single size uses, when the diode support variation becomes large-scale size, radiating seat 213 promptly must become thicker size with collocation use mutually, or the thickness that will increase this radiating seat 213 is when reaching better radiating effect, but the structural design of this radiating seat 213, but can't be according to requiring to change to thicker size, maybe can provide increases suitable thickness extraly, certainly will be prior to changing on the former substrate that provides 21 sizes, just can produce the thicker radiating seat of size 213, just can reach this requirement, a beyond doubt puzzlement greatly for the diode support manufacturer, can't be neatly in response to the demand of aspects such as actual processing procedure and product size, thereby increase inconvenience place on the processing procedure.
Therefore, the improving of the above-mentioned disappearance of inventor's thoughts is that the spy concentrates on studies and cooperates the utilization of scientific principle, proposes a kind of reasonable in design and effectively improve the present invention of above-mentioned disappearance finally.
Summary of the invention
Purpose of the present invention, be to provide a kind of manufacturing method for heat radiating base and structure thereof of surface adhesion type diode support, it can produce the cooling base of various different size thickness, and then can manufacture out the diode support of various sizes, or can thicken the gauge of cooling base and reach the purpose that improves heat radiation function etc.
In order to achieve the above object, the invention provides a kind of manufacturing method for heat radiating base of surface adhesion type diode support, this cooling base includes one first metal sheet, and is a natural X second metal sheet, and this manufacture method comprises the following steps:
(a) provide first metal substrate, and this first metal substrate of punching press, make this first metal substrate form perforation;
(b) provide second metal substrate, and this second metal substrate of punching press, make this second metal substrate form relative protuberance and recess;
(c) with this first metal substrate in alignment with a predetermined mould, and this first metal substrate of punching press is to form this first metal sheet in this mould;
(d) this second metal substrate is aimed at this mould, and this second metal substrate of punching press,, make in the corresponding perforation that is incorporated into this first metal sheet of the protuberance of this first second metal sheet to form first second metal sheet in this mould;
(e) repeat this step (d) X-1 time, and then second metal sheet that forms other is in this mould, wherein in the process that repeats this step (d) for the Y time, the recess of this Y second metal sheet and the tab of (Y+1) individual second metal sheet together, Y is 1 a integer to (X-1) scope; And
(f) take out this first metal sheet and this X second metal sheet that has combined in this mould certainly, and then obtain this cooling base.
Wherein, after finishing, step (f) can comprise following step further:
(g) provide the 3rd metal substrate, and punching press the 3rd metal substrate, make it form most metal pins;
(h) the 3rd metal substrate and cooling base are interosculated, make those metal pins and this cooling base adjacent at interval; And
(i) provide the colloid that penetrates insulating properties, make those metal pins and this cooling base and this colloid affixed, and then constitute a surface adhesion type diode support.
In order to achieve the above object, the invention provides a kind of cooling base structure of surface adhesion type diode support, comprising:
Colloid, one end have the functional areas of an indent;
One cooling base, it is fixed in this colloid, and this cooling base two opposite surfaces is revealed in respectively and reaches outside this colloid in these functional areas, this cooling base comprises first and second metal sheet of mutual storehouse combination, this first metal sheet is near the end that forms these functional areas, this first metal sheet has perforation, reach this second metal sheet and have relative protuberance and recess, and the tab of this second metal sheet is in the perforation of this first metal sheet; And
Most metal pins, be fixed in respectively in this colloid adjacent at interval with this cooling base, and by extending out to this colloid outside in these functional areas.
Wherein, the second above-mentioned metal sheet can further be made as most, those second metal sheets all are provided with relative protuberance and recess, and mutual in regular turn storehouse combination is to have the first second metal sheet and position, an end second metal sheet, the tab of this first place second metal sheet is in the perforation of this first metallic plate, and the tab of two adjacent second metal sheets is in the recess of another metal sheet, the surface of this first metal sheet is revealed in these functional areas, and the bottom surface of this position, end second metal sheet is revealed in outside this colloid.
The benefit that the present invention has: the present invention can produce the cooling base of various different size thickness, form cooling base with the storehouse combination, produced the cooling base of various sizes thickness, and then can manufacture out to the property adjusted the diode support of various sizes, or can thicken the gauge of cooling base and improve the effect of heat radiation, but make the present invention's flexibility ground in response to the actual demand on various sizes, to promote in the convenience of aspects such as processing procedure.
For enabling further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Fig. 1 is the three-dimensional exploded view of known diode support.
Fig. 2 is the assembled sectional view of Fig. 1.
Fig. 3 is the stereogram of known LED lead frame structure.
Fig. 4 is the cutaway view of Fig. 3.
Fig. 5 is the flow chart of first embodiment of the invention.
Fig. 6 A be first embodiment of the invention cooling base in conjunction with the action schematic diagram.
Fig. 6 B be first embodiment of the invention cooling base another in conjunction with the action schematic diagram.
Fig. 7 is the vertical view that the cooling base of first embodiment of the invention combines with metal pin and colloid.
Fig. 8 is first cutaway view that the cooling base of first embodiment of the invention combines with metal pin and colloid.
Fig. 9 is second cutaway view that the cooling base of first embodiment of the invention combines with metal pin and colloid.
Figure 10 is the 3rd cutaway view that the cooling base of first embodiment of the invention combines with metal pin and colloid.
Figure 11 is the cutaway view of the affixed light-emitting diode chip for backlight unit of first embodiment of the invention.
Figure 12 is another cutaway view of the affixed light-emitting diode chip for backlight unit of first embodiment of the invention.
Figure 13 is the flow chart of second embodiment of the invention.
Figure 14 A is that the cooling base of second embodiment of the invention is in conjunction with schematic diagram.
Figure 14 B be second embodiment of the invention cooling base another in conjunction with schematic diagram.
Figure 15 is first cutaway view that the cooling base of second embodiment of the invention combines with metal pin and colloid.
Figure 16 is second cutaway view that the cooling base of second embodiment of the invention combines with metal pin and colloid.
Figure 17 is the cutaway view of the affixed light-emitting diode chip for backlight unit of second embodiment of the invention.
The primary clustering symbol description
One, known
Colloid 11 perforation 111
Light-emitting diode chip for backlight unit 14 leads 15
Epoxy resin 16
Fixing feet 212 radiating seats 213
Lead 24 epoxy resin 25
Two, the present invention
31 perforation 311 of first metal sheet
First open-work 312
Protuberance 321,321a recess 322,322a
Second open-work 323,323a
Routing end 41 pin ends 42
Light-emitting diode chip for backlight unit 60
Cooling base 30 '
First metal sheet, 31 ' recess 311 '
First open-work 312 '
Second metal sheet, 32 ' bottom 321 '
Extension 322 ' protuberance 323 '
Projection 324 ' second open-work 325 '
Metal pin 40 '
Routing end 41 ' pin end 42 '
Colloid 50 '
Functional areas 51 '
Light-emitting diode chip for backlight unit 60 '
Lead 70 '
Adhesive layer 80 '
Embodiment
Please consult earlier shown in Fig. 5, Fig. 6 A and Fig. 6 B, be the manufacture method of the cooling base of surface adhesion type diode support of the present invention and first embodiment of structure thereof, its cooling base of desiring to produce 30 includes one first metal sheet 31 and X second metal sheet, X is a natural number, and this manufacture method comprises following step:
(a) provide first metal substrate (not shown), it can be the metal foil material of a continous way, and punching press first metal substrate, makes the punch forming in advance of first metal substrate that perforation 311 be arranged; Wherein, the quantity of perforation 311 can be one or more according to the practical design demand.
(b) provide second metal substrate (not shown), it can be the metal foil material of a continous way, and punching press second metal substrate, makes the relative both sides of second metal substrate form protuberance 321 and recess 322 in advance; Wherein, the quantity of protuberance 321 and recess 322 forms according to above-mentioned perforation 311 quantity.
(c) with first metal substrate in alignment with a predetermined mould (not shown), and punching press first metal substrate is to form the first above-mentioned metal sheet 31 in mould.
(d) then, second metal substrate is aimed at mould, make the protuberance 321 of second metal substrate can aim at the perforation 311 of first metal substrate.After aligning is finished, i.e. punching press second metal substrate, and can be incorporated in the mode of riveted in the perforation 311 with seasonal protuberance 321 to mould with second metal sheet 32 that forms first.
(e) then, repeat above-mentioned step (d) X-1 time, and then the second metal sheet 32a that forms other is in mould, wherein, in the process of the Y time repeating step (d), the numerical value of Y is 1 a integer to (X-1) scope, and the recess 322 of Y second metal sheet 32 and the protuberance 321a of (Y+1) individual second metal sheet 32a combine in the mode of riveted.
Describe in detail further again, see also shown in Fig. 6 B, after the protuberance 321 of first second metal sheet 32 is riveting in the perforation 311 of first metal sheet 31, with the protuberance 321a of second second metal sheet 32a being riveting in the recess 322 of first second metal sheet 32, afterwards, can be in order with the 3rd, the fourth class other second metal sheet mutually in regular turn storehouse rivet together, with the tab of two adjacent second metal sheets in the recess of another second metal sheet.Yet, what is particularly worth mentioning is that the quantity of second metal sheet is established according to the demand number of reality, promptly can be one, two or three, even the quantity that can reach dozens of etc. produces.
(f) when first metal sheet 31 and X second metal sheet punch forming all in mould, and rivet together, and then after constituting a complete cooling base 30, the technical approach that can in mould, use as eject etc., take out first metal sheet 31 and this X second metal sheet of riveted, to obtain this cooling base 30.
Via above-mentioned step explanation, make the present invention can comply with actual demand number, and can produce the cooling base 30 of multiple different size thickness.
(please cooperate and consult Fig. 7 and shown in Figure 8) after above-mentioned step (f) is finished, then, the present invention further specifies the fabrication steps that constitutes the surface-mounting LED support again, and it can comprise following step further:
(g) provide one the 3rd metal substrate (not shown), it can be the metal foil material of a continous way, and punching press the 3rd metal substrate, makes it form most metal pins 40.
(h) the 3rd metal substrate and cooling base 30 are interosculated, make each metal pin 40 adjacent at interval with cooling base 30 respectively.
(i) then, can use the technical approach of ejection formation, the colloid 50 that penetrates insulating properties is provided, make each metal pin 40 and cooling base 30 affixed with colloid 50, and then formation/acquisition one surface adhesion type diode support.Afterwards, can on cooling base 30, carry out solid brilliant operation, routing operation and sealing operation, to constitute a surface-mounting LED.
Please cooperate and consult Fig. 9, wherein, in order to increase the conjugation between cooling base 30 and the colloid 50, can in step (a), first open-work 312 be arranged further punch forming, its quantity is not limit, and further punch forming has second open-work 323 in the step (b), 323a, its quantity is according to the quantity of first open-work 312, behind first metal sheet 31 and second metal sheet, 32 mutual riveteds, first open-work 312 and second open-work 323,323a is together corresponding, and in step (i), when colloid 50 penetrates, colloid 50 can be filled simultaneously and be passed first open-work 312 and second open-work 323,323a and being incorporated into wherein is to increase the conjugation between cooling base 30 and the colloid 50.
As shown in Figures 7 and 8, after penetrating this colloid 50, these colloid 50 1 end faces inwardly obliquely are arranged with and form functional areas 51, its profile can present the design as circular, square or ellipse etc. according to design, and the material of this colloid 50, its can be as polyphthalamide (Polyphthalamide, PPA), or other any known thermoplastic resin.
This cooling base 30 is fixed in this colloid 50, and cooling base 30 relative upper and lower two surfaces respectively are revealed in these functional areas 51 and colloid 50 outside.Wherein, first metal sheet 31 is close to the endface position place that forms these functional areas 51, and the surface of first metal sheet 31 is exposed in these functional areas 51, first (promptly the first) second metal sheet 32 promptly combines with first metal sheet 31, and the bottom surface that is positioned at the second metal sheet 32a of last position is revealed in outside this colloid 50.
The quantity of those metal pins 40 is not limit, and it can be two, three or six s' etc. design, of the present invention graphic in, be to be example with four.Colloid 50 is affixed each metal pin 40 simultaneously, make each metal pin 40 respectively by extending out to this colloid 50 outsides in these functional areas 51, make each metal pin 40 have a dozen line ends 41 respectively and be arranged in this functional areas 51, reach a pin end 42 and be positioned at this colloid 50 outsides, use as follow-up contact.Via above-mentioned composition, can constitute the cooling base structure of surface adhesion type diode support of the present invention.
Wherein, as shown in figure 10, in order to increase the conjugation between cooling base 30 and the colloid 50, the size of first second metal sheet 32 can be greater than first metal sheet 31, promptly the both side edges of second metal sheet 32 can be formed with projection 324, it extends beyond the both side edges of this first metal sheet 31, being fastened in the inside of this colloid 50, and increases the conjugation of 50 in cooling base 30 and colloid.
Via above-mentioned, as shown in figure 11, can in the functional areas 51 of colloid 50, carry out the operation of solid crystalline substance, that is operation is adhered in the installation of carrying out light-emitting diode chip for backlight unit 60 on first metal sheet 31 of cooling base 30, can required light-emitting diode chip for backlight unit 60 quantity be installed according to metal pin 40 quantity, the light-emitting diode chip for backlight unit 60 of one to three grade can be installed as four metal pins 40; Then, carry out the operation of routing, the routing end 41 with the metal pin 40 in light-emitting diode chip for backlight unit 60 and the functional areas 51 respectively utilizes two ends of two leads 70 to connect light-emitting diode chip for backlight unit 60 and a dozen line ends 41 respectively; At last, carry out the sealing operation, in the functional areas 51 of colloid 50, cover the adhesive layer 80 of one deck light transmission, for example epoxy resin (epoxy resin) or other known thermoplastic resin etc., with encapsulation LED chip 60 and lead 70, promptly constitute a surface-mounting LED.
Wherein, light-emitting diode chip for backlight unit 60 can be fixed on other the position, as shown in figure 12, this first metal sheet 31 is provided with a perforation 311, and second metal sheet 32,32a also are provided with a protuberance 321,321a and a recess 322,322a, and the protuberance 321 of second metal sheet 32 that combines with this first metal sheet 31 can directly be revealed in the functional areas 51, light-emitting diode chip for backlight unit 60 can be fixed on the protuberance 321 of this second metal sheet 32.
In addition, what deserves to be mentioned is, please consult Fig. 5 and Figure 11 again, after step of manufacturing of the present invention (h), is can make different fabrication steps to change, and its main difference place is shown in following step:
(j) provide at least one light-emitting diode chip for backlight unit 60 earlier, light-emitting diode chip for backlight unit 60 is fixed in cooling base 30 (promptly solid brilliant operation) earlier.
(k) then, provide lead 70, lead 70 is connected to metal pin 40 and light-emitting diode chip for backlight unit 60 (being the routing operation).
(l) then, utilize the technical approach of ejection formation, to penetrate colloid 50 that each metal pin 40 and cooling base 30 is affixed with colloid 50, make light-emitting diode chip for backlight unit 60 and lead 70 be arranged in colloid 50 (promptly penetrating operation).
(m) last, an adhesive layer 80 is provided, and is packaged in the colloid 50, light-emitting diode chip for backlight unit 60 and lead 70 are coated in the adhesive layer 80 (being the sealing operation), can constitute a surface-mounting LED, and finish whole process operations.
Comprehensive above-mentioned explanation, the present invention can produce the cooling base 30 of various different size thickness, form this cooling base 30 with storehouse combination in regular turn, produced the cooling base 30 of various sizes thickness, and then manufacture out the diode support of various sizes with having the property adjusted, or can thicken the gauge of cooling base 30 and improve the effect of heat radiation, but make the present invention's flexibility ground in response to the actual demand on various sizes, to promote in the convenience of aspects such as processing procedure.
In addition, please consult earlier shown in Figure 13, Figure 14 A and Figure 14 B, be the manufacture method of the cooling base of surface adhesion type diode support of the present invention and second embodiment of structure thereof, it is desired to produce cooling base 30 ' and includes one first metal sheet 31 ' and one second metal sheet 32 ', and this manufacture method comprises following step:
(a) provide one first metal substrate (not shown), it can be the metal foil material of continous way, and punching press first metal substrate, makes its basal surface form recess 311 '; Wherein, the quantity of recess 311 ' can be one or more according to the practical design demand.
(b) provide second metal substrate (not shown) of a thickness greater than first metal substrate, it can be the thick material of metal of a continous way, and punching press second metal substrate, makes its upper surface form protuberance 323 '; Wherein, the quantity of protuberance 323 ' designs according to above-mentioned recess 311 ' quantity.
(c) then, first metal substrate is aimed at a predetermined mould, and punching press first metal substrate, to form first metal sheet 31 ' in mould.
(d) then, second metal substrate is aimed at mould, and punching press second metal substrate forming second metal sheet 32 ' in mould, and can be incorporated in the recess 311 ' of first metal sheet 31 ' in the mode that is embedded with the protuberance 323 ' of seasonal second metal sheet 32 '.
(e) last, when first metal sheet 31 ' and second metal sheet 32 ' punch forming all in mould, and be entrenched togather, and after constituting a complete cooling base 30 ', can from mould, take out first metal sheet 31 ' and second metal sheet 32 ' that have been entrenched togather, to obtain cooling base 30 '.
Via above-mentioned explanation, make the present invention can produce the thicker cooling base 30 ' of dimensional thickness, met the demand on the industry.
Yet after above-mentioned step (e) was finished, the present invention further specified the fabrication steps (please cooperate and consult Figure 15) that constitutes the surface-mounting LED support again, and it can comprise following step further:
(f) provide one the 3rd metal substrate (not shown), it can be the metal foil material of a continous way, and punching press the 3rd metal substrate, makes it form most metal pins 40 '.
(g) the 3rd metal substrate and cooling base 30 ' are interosculated, make each metal pin 40 ' adjacent at interval with cooling base 30 ' respectively.
(h) last, the colloid 50 ' that penetrates insulating properties is provided, make each metal pin 40 ' and cooling base 30 ' affixed, and then constitute a surface adhesion type diode support with colloid 50 '.Afterwards, can on cooling base 30 ', carry out solid brilliant operation, routing operation and sealing operation, to constitute a surface-mounting LED.
See also Figure 15, after colloid 50 ' penetrated, one end also was formed with the functional areas 51 ' of an indent, and the explanations such as material of colloid 50 ', it has been addressed by aforesaid first embodiment, is no longer given unnecessary details at this.
These cooling base 30 ' relative upper and lower two surfaces also are to be revealed in the functional areas 51 ' of colloid 50 ' respectively and outside the colloid 50 ', and first metal sheet 31 ' of cooling base 30 ' also is close to the endface position place that is formed at functional areas 51 ', and the surface of this first metal sheet 31 ' can partly or entirely be exposed in the functional areas 51 '.Second metal sheet, 32 ' thickness is greater than first metal sheet 31 ', and second metal sheet 32 ' can have a bottom 321 ', one by the extension 322 ' of this bottom 321 ' towards this first metal sheet, 31 ' extension, reach most the projections 324 ' that respectively stretch out and be fastened in colloid 50 ' inside by this bottom 321 ' both side edges, it is in order to increase the conjugation between cooling base 30 ' and colloid 50 ', and described protuberance 323 ' is based in the endface position place of extension 322 ', and the bottom surface of bottom 321 ' then is revealed in outside this colloid 50 '.
Each metal pin 40 ' respectively has a dozen line ends 41 ' and a pin end 42 ', and each metal pin 40 ' no longer is illustrated at this as the described explanation of first embodiment.Via above-mentioned composition, can constitute the cooling base structure of the surface adhesion type diode support of second embodiment of the invention.
In addition, please consult Figure 13 and shown in Figure 16 again, in the step of second embodiment, it is as being same as the described explanation of first embodiment, can be in step (a) further punch forming first open-work 312 ' is arranged, and in step (b) further punch forming second open-work 325 ' is arranged, and in step (h), when colloid 50 ' penetrated, colloid 50 ' can be filled and is incorporated in first open-work 312 ' and second open-work 325 ', to increase the conjugation between cooling base 30 ' and the colloid 50 '.
By above-mentioned explanation, as shown in figure 17, the surface of first metal sheet 31 ' can provide affixed light-emitting diode chip for backlight unit 60 '; Then, two leads 70 ' are connected to respectively on light-emitting diode chip for backlight unit 60 ' and the routing end 41 '; At last, in the functional areas 51 ' of colloid 50 ', cover an adhesive layer 80 ', and encapsulation LED chip 60 ' and lead 70 ' can constitute a surface-mounting LED.
In addition, please consulting Figure 13 and Figure 17 again, in the second embodiment of the present invention, after its described step of manufacturing (g), also is can make different fabrication steps to change, and its main difference place is shown in following step:
(i) provide at least one light-emitting diode chip for backlight unit 60 ' earlier, light-emitting diode chip for backlight unit 60 ' is fixed in cooling base 30 ' earlier.
(j) then, provide lead 70 ', lead 70 ' is connected to metal pin 40 ' and light-emitting diode chip for backlight unit 60 '.
(k) then, utilize the technical approach of ejection formation, to penetrate colloid 50 ' that each metal pin 40 ' and cooling base 30 ' is affixed with colloid 50 ', make light-emitting diode chip for backlight unit 60 ' and lead 70 ' be arranged in colloid 50 '.
(l) last, adhesive layer 80 ' is provided, and is packaged in the colloid 50 ', light-emitting diode chip for backlight unit 60 ' and lead 70 ' are coated in the adhesive layer 80 ', can constitute a surface-mounting LED, and finish whole process operations.
By above-mentioned explanation, the second embodiment of the present invention is interosculated via first metal sheet 31 ' and thicker second metal sheet 32 ', and then thicken the thickness of cooling base 30 ', and can improve the effect of heat radiation, and can be according to actual demand, and change first and/or second metal sheet 31 ', 32 ' thickness, add so that the thickness of cooling base 30 ' produces different variations, but flexibility ground is in response to the actual demand on various sizes, to promote in the convenience of aspects such as processing procedure.
But the above only is a preferable possible embodiments of the present invention, and non-so promptly inflexible limit claim of the present invention so the equivalent structure that uses specification of the present invention and graphic content to do such as changes, all in like manner all is contained in the scope of the present invention, closes and gives Chen Ming.
Claims (22)
1, a kind of manufacturing method for heat radiating base of surface adhesion type diode support, this cooling base include one first metal sheet, and are a natural X second metal sheet, it is characterized in that this manufacture method comprises the following steps:
(a) provide first metal substrate, and this first metal substrate of punching press, make this first metal substrate form perforation;
(b) provide second metal substrate, and this second metal substrate of punching press, make this second metal substrate form relative protuberance and recess;
(c) with this first metal substrate in alignment with a predetermined mould, and this first metal substrate of punching press is to form this first metal sheet in this mould;
(d) this second metal substrate is aimed at this mould, and this second metal substrate of punching press,, make in the corresponding perforation that is incorporated into this first metal sheet of the protuberance of this first second metal sheet to form first second metal sheet in this mould;
(e) repeat this step (d) X-1 time, and then second metal sheet that forms other is in this mould, wherein in the process that repeats this step (d) for the Y time, the recess of this Y second metal sheet and the tab of (Y+1) individual second metal sheet together, Y is 1 a integer to (X-1) scope; And
(f) take out this first metal sheet and this X second metal sheet that has combined in this mould certainly, and then obtain this cooling base.
2, the manufacturing method for heat radiating base of surface adhesion type diode support as claimed in claim 1, it is characterized in that: further comprising after this step (f) provides the 3rd metal substrate, and punching press the 3rd metal substrate forms the step (g) of most metal pins, and this cooling base combined with the 3rd metal substrate, make the adjacent at interval step (h) of those metal pins and this cooling base.
3, the manufacturing method for heat radiating base of surface adhesion type diode support as claimed in claim 2, it is characterized in that: more comprising after this step (h) provides the colloid that penetrates insulating properties, with those metal pins and the affixed step (i) of this cooling base, and then constitute a surface adhesion type diode support.
4, the manufacturing method for heat radiating base of surface adhesion type diode support as claimed in claim 3, it is characterized in that: this step (a) further forms first open-work, reach this step (b) and further form second open-work, the colloid of this step (i) is filled in this first and second open-work.
5, the manufacturing method for heat radiating base of surface adhesion type diode support as claimed in claim 2, it is characterized in that: more comprising after this step (g) provides at least one light-emitting diode chip for backlight unit, this light-emitting diode chip for backlight unit is fixed in the step (j) of this cooling base, and lead is provided, this lead is connected to the step (k) of this light-emitting diode chip for backlight unit and this metal pin.
6, the manufacturing method for heat radiating base of surface adhesion type diode support as claimed in claim 5, it is characterized in that: more comprising after this step (k) provides the colloid that penetrates insulating properties, those metal pins and this cooling base are affixed, make this light-emitting diode chip for backlight unit and this lead be arranged in the step (1) of this colloid, and the adhesive layer that light transmission is provided, be packaged in this colloid this light-emitting diode chip for backlight unit and this lead are coated on the interior step (m) of this adhesive layer, to constitute a surface-mounting LED.
7, a kind of manufacturing method for heat radiating base of surface adhesion type diode support, this cooling base include one first metal sheet and one second metal sheet, it is characterized in that this manufacture method comprises the following steps:
(a) provide one first metal substrate, and this first metal substrate of punching press, make this first metal substrate form recess;
(b) provide second metal substrate of a thickness greater than this first metal substrate, and this second metal substrate of punching press, make this second metal substrate form protuberance;
(c) with this first metal substrate in alignment with a predetermined mould, and this first metal substrate of punching press is to form this first metal sheet in this mould;
(d) this second metal substrate is aimed at this mould, and this second metal substrate of punching press, to form this second metal sheet in this mould, make the tab of recess and this second metal sheet of this first metal sheet; And
(e) take out this first metal sheet and this second metal sheet that has combined in this mould certainly, and then obtain this cooling base.
8, the manufacturing method for heat radiating base of surface adhesion type diode support as claimed in claim 7, it is characterized in that: further comprising after this step (e) provides one the 3rd metal substrate, and punching press the 3rd metal substrate forms the step (f) of most metal pins, and this cooling base combined with the 3rd metal substrate, make those metal pins and this cooling base adjacent step that combines (g) at interval.
9, the manufacturing method for heat radiating base of surface adhesion type diode support as claimed in claim 8, it is characterized in that: more comprising after this step (g) provides the colloid that penetrates insulating properties, with those metal pins and the affixed step (h) of this cooling base, and then constitute a surface adhesion type diode support.
10, the manufacturing method for heat radiating base of surface adhesion type diode support as claimed in claim 9, it is characterized in that: this step (a) further forms first open-work, reach this step (b) and further form second open-work, the colloid of this step (h) is filled in this first and second open-work.
11, the manufacturing method for heat radiating base of surface adhesion type diode support as claimed in claim 8, it is characterized in that: more comprising after this step (g) provides at least one light-emitting diode chip for backlight unit, this light-emitting diode chip for backlight unit is fixed in the step (i) of this cooling base, and lead is provided, this lead is connected to the step (j) of this light-emitting diode chip for backlight unit and this metal pin.
12, the manufacturing method for heat radiating base of surface adhesion type diode support as claimed in claim 11, it is characterized in that: more comprise after this step (j) to provide and penetrate the insulating properties colloid, those metal pins and this cooling base are affixed, make this light-emitting diode chip for backlight unit and this lead be arranged in the step (k) of this colloid, and the adhesive layer that light transmission is provided, be packaged in this colloid this light-emitting diode chip for backlight unit and this lead are coated on the interior step (l) of this adhesive layer, to constitute a surface-mounting LED.
13, a kind of cooling base structure of surface adhesion type diode support is characterized in that, comprising:
Colloid, one end have the functional areas of an indent;
One cooling base, it is fixed in this colloid, and this cooling base two opposite surfaces is revealed in respectively and reaches outside this colloid in these functional areas, this cooling base comprises first and second metal sheet of mutual storehouse combination, this first metal sheet is near the end that forms these functional areas, this first metal sheet has perforation, reach this second metal sheet and have relative protuberance and recess, and the tab of this second metal sheet is in the perforation of this first metal sheet; And
Most metal pins, be fixed in respectively in this colloid adjacent at interval with this cooling base, and by extending out to this colloid outside in these functional areas.
14, the cooling base structure of surface adhesion type diode support as claimed in claim 13, it is characterized in that: this second metal sheet further is made as most, those second metal sheets all have relative protuberance and recess, and mutual in regular turn storehouse combination is to have the first second metal sheet and position, an end second metal sheet, the tab of this first place second metal sheet is in the perforation of this first metallic plate, and the tab of two adjacent second metal sheets is in the recess of another second metal sheet, the surface of this first metal sheet is revealed in these functional areas, and the bottom surface of this position, end second metal sheet is revealed in outside this colloid.
15, the cooling base structure of surface adhesion type diode support as claimed in claim 14 is characterized in that: this first metal sheet is provided with first open-work, and those second metal sheets all are provided with second open-work, this colloid pass this first and those second open-works.
16, the cooling base structure of surface adhesion type diode support as claimed in claim 13, it is characterized in that: the lateral margin of this second metal sheet is formed with the lateral margin that projection extends beyond this first metal sheet, to be fastened in the inside of this colloid.
17, the cooling base structure of surface adhesion type diode support as claimed in claim 13, it is characterized in that: the surface of this protuberance further is revealed in these functional areas.
18, a kind of cooling base structure of surface adhesion type diode support is characterized in that, comprising:
Colloid, one end have the functional areas of an indent;
One cooling base, it is fixed in this colloid, and this cooling base two opposite surfaces is revealed in respectively and reaches outside this colloid in these functional areas, this cooling base includes first and second metal sheet of mutual storehouse combination, this first metal sheet is near the end that forms these functional areas, this first metal sheet has recess, reach this second metal sheet and have protuberance, and the tab of this second metal sheet is in the recess of this first metal sheet; And
Most metal pins, be fixed in respectively in this colloid adjacent at interval with this cooling base, and by extending out to this colloid outside in these functional areas.
19, the cooling base structure of surface adhesion type diode support as claimed in claim 18 is characterized in that: this first metal sheet is provided with first open-work, and this second metal sheet is provided with second open-work, and this colloid passes this first and second open-work.
20, the cooling base structure of surface adhesion type diode support as claimed in claim 18, it is characterized in that: the thickness of this second metal sheet is greater than the thickness of this first metal sheet.
21, the cooling base structure of surface adhesion type diode support as claimed in claim 18, it is characterized in that: this second metal sheet has a bottom, reach one by the extension of this bottom towards this first metal sheet extension, this protuberance is based in the end face of this extension.
22, the cooling base structure of surface adhesion type diode support as claimed in claim 21 is characterized in that: this two bottom sides edge respectively stretches out and is formed with projection, and those projections are fastened in the inside of this colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710079485 CN100559558C (en) | 2007-04-11 | 2007-04-11 | The manufacturing method for heat radiating base of surface adhesion type diode support and structure thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710079485 CN100559558C (en) | 2007-04-11 | 2007-04-11 | The manufacturing method for heat radiating base of surface adhesion type diode support and structure thereof |
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| CN100559558C true CN100559558C (en) | 2009-11-11 |
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| CN103560198A (en) * | 2013-11-08 | 2014-02-05 | 桂林机床电器有限公司 | LED packaging structure |
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Application publication date: 20081015 Assignee: I-Chiun Precision Electric Industry (China) Co., Ltd., Assignor: I-Chiun Precision Industry Co., Ltd. Contract record no.: 2010990000213 Denomination of invention: Manufacturing method for heat radiating base of surface adhesive diode support and construction thereof Granted publication date: 20091111 License type: Exclusive License Record date: 20100423 |
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