CN102544262A - LED (light-emitting diode) chip packaging process - Google Patents
LED (light-emitting diode) chip packaging process Download PDFInfo
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- CN102544262A CN102544262A CN2012100135300A CN201210013530A CN102544262A CN 102544262 A CN102544262 A CN 102544262A CN 2012100135300 A CN2012100135300 A CN 2012100135300A CN 201210013530 A CN201210013530 A CN 201210013530A CN 102544262 A CN102544262 A CN 102544262A
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Abstract
The invention discloses an LED (light-emitting diode) chip packaging process, belonging to the production process of semiconductor luminescent tools. The packaging process is operated according to the following steps: step one, adopting a lead frame as a packaging bracket of an LED chip, and sticking a high temperature resistant member on the back of the lead frame after the surface of the lead frame is plated entirely; step two, spraying elargol on a chip pad on the lead frame, adhering the LED chip on the chip pad on the lead frame and curing for 80-160 minutes; and step three, adopting a metal lead to bond the positive and negative electrodes of the LED chip and extending the positive and negative electrodes of the LED chip out of the lead frame. In the LED chip packaging process, AOTO MOLD is adopted to carry out integral injection molding on the chip pad on the lead frame, thereby ensuring the consistency of the color temperature of light sources of LED products. The LED chip packaging process of the invention is simple in process steps and easy to popularize.
Description
Technical field
The present invention relates to a kind of production technology of semiconductor light emitting instrument, in particular, the present invention relates generally to a kind of led chip packaging technology.
Background technology
Along with China's science and technology development, the LED industry development is rapid, and since semiconductor lighting got into the general illumination field, production cost was first restraining factors.Reduce the semiconductor lighting cost, must at first consider how to reduce the cost of light source.And in present LED packaging technology, mainly adopt the SMD support, led chip is installed in frame bottom; Utilize the mixture of fluorescent material and silica gel to carry out whole embedding again; Seem the low LED light fixture product of power though this kind technology also can be produced, but still not enough below existing, at first traditional LED encapsulation pattern makes that the chip volume after the encapsulation is big; And area is greater than 10 square millimeters, thereby chip thickness is greater than 1.8 millimeters structure spaces that limit light fixture.Moreover the framework that adopts of traditional LED packaging technology, every 180 light sources of multipotency encapsulation increase the overall package cost.And what mostly adopt in traditional LED packaging technology is the gold thread bonding, and electrical conductivity is low and cost high.And what traditional encapsulation pattern adopted is single light source injecting glue, causes that colour temperature differs, production efficiency is low.Need to prove that also what existing LED packaged chip adopted is mechanical Trim Molding, cause the damage of led light source body easily, quality is difficult to be protected.Therefore be necessary to do further improvement to aforesaid led chip packaging technology.
Summary of the invention
One of the object of the invention is to solve above-mentioned deficiency, provides a kind of volume littler, and the relatively low led chip packaging technology of production cost.
For solving above-mentioned technical problem, the present invention adopts following technical scheme:
A kind of led chip packaging technology provided by the present invention, described packaging technology is operated according to following steps:
Step 1, adopt the package support of lead frame, and, stick high temperature resistance diaphragm at the back side of lead frame with behind its surperficial whole coating as led chip;
Step 2, on the positive chip backing plate of lead frame, spray elargol, led chip is bonded on the chip backing plate on the lead frame, and solidified 80 to 160 minutes;
Step 3, adopt plain conductor with the positive and negative electrode bonding on the led chip, and respectively with led chip
Positive and negative electrode extend on the pin at the lead frame back side;
Step 4, adopt mixture injection molding on the chip backing plate of silica gel and fluorescent material, plastic packaging is lived the lead frame front, with and the led chip and the plain conductor of top, and the led chip finished product light source after promptly obtaining after it is solidified encapsulating.
Technical scheme further is: described packaging technology also comprises step 5, the high temperature resistance diaphragm that is attached to the lead frame back side in the step 1 is peeled off, and silica gel after solidifying and phosphor mixture lead frame surface subsides PV film.
Technical scheme further is: described step 1 is provided with a plurality of chip backing plates identical or inequality with lead frame in the step 2; All be bonded with led chip on each chip backing plate, and the back side of lead frame also is provided with the pin that is complementary with chip backing plate quantity.
Technical scheme further is: described packaging technology also comprises step 6, be that the unit cuts with lead frame according to the chip backing plate that is provided with on it, is cut to the independent led chip finished product after the encapsulation.
Technical scheme further is: described lead frame is stamped to form through copper alloy based.
Technical scheme further is: the integral thickness of said lead frame is 0.15 to 0.45 millimeter.
Technical scheme further is: the whole coating of lead frame surface is electrosilvering in the described step 1; Plain conductor in the described step 3 is a copper conductor.
Technical scheme further is: the fluorescent material in the described step 4 in fluorescent material and the silica-gel mixture and the mixed proportion of silica gel are 1.5: 1000.
Technical scheme further is: the mixture injection molding on the chip backing plate on the lead frame that adopts automatic injector fluorescent material and silica gel in the described step 4
Technical scheme further is: make mode that the mixture of fluorescent material and silica gel solidifies for long roasting or solidified at normal temperatures 100 to 240 minutes in the described step 4.
Compared with prior art; One of beneficial effect of the present invention is: adopt QFN not have the pin encapsulation technology led chip is encapsulated; Make that the area and the thickness of single finished product led light source after encapsulating are littler, thereby reduced the volume and the weight of product, adopt disposable encapsulation of lead frame and copper lines bonding simultaneously; When improving LED encapsulation production efficiency, also reduced packaging cost; And having improved the stability that LED finished product light source uses, a kind of led chip packaging technology provided by the present invention adopts the enterprising capable unitary, injection-molded of the chip backing plate of automatic injector on lead frame simultaneously, has guaranteed the consistency of LED finished product light source color temperature; And processing step is simple, is easy to promote.
Description of drawings
Fig. 1 is the structural representation of lead frame in the embodiment of the invention;
Fig. 2 is at chip backing plate zone spraying elargol sketch map in the embodiment of the invention;
Fig. 3 be in the embodiment of the invention in chip backing plate zone bonding led chip sketch map;
Fig. 4 is at the both positive and negative polarity bonding plain conductor sketch map of led chip in the embodiment of the invention;
Fig. 5 is the injection molding sketch map in the embodiment of the invention;
Fig. 6 is stickup PV mould and the independent LED packaged chip cutting sketch map in the embodiment of the invention;
Fig. 7 is the led chip light source finished product sketch map after the encapsulation in the embodiments of the invention.
Among the figure, 1 is that lead frame, 2 is that elargol, 3 is that led chip, 4 is that plain conductor, 5 mixtures for silica gel and fluorescent material, 6 are PV film, 7 high-speed cutting machines.
Embodiment
Below in conjunction with accompanying drawing the present invention is done further elaboration.
Embodiment
A kind of embodiment of the present invention will provide a kind of led chip packaging technology, and described packaging technology is operated according to following steps:
Step 1, adopt the package support of lead frame 1, and, stick high temperature resistance diaphragm at the back side of lead frame 1 with behind its surperficial whole coating as led chip 3; At the aforementioned lead frame of mentioning 1; Its structure is as shown in Figure 1; Wherein A is the front schematic view of lead frame 1, and B is the schematic rear view of lead frame 1, and the technical scheme of comparative optimization is that lead frame 1 is adopted copper alloy based being stamped to form; Can make the led chip 3 after encapsulation is accomplished have good performance of heat dissipation like this; And because the volume of the thickness of the lead frame 1 led chip 3 finished product light sources after accomplishing with encapsulation exists direct relation, so its thickness preferably is set to 0.15 to 0.45 millimeter, specifically can be in aforesaid scope principle arbitrarily; All can realize or approach to realize technical purpose of the present invention and effect, and can make through aforesaid serial number scope that the present invention is variable and be changed to a plurality of roughly the same embodiment.
And in practical operation of the present invention; Need be at the overlay coating of lead frame 1, the main purpose of coating is to help bonding between chip and the lead frame, and when the pin bonding at the plain conductor and the lead frame back side; Copper alloy framework surface must be provided with coating; Otherwise two materials can not be bonding normally, and inventor of the present invention thinks, the preferred material of whole coating on the lead frame 1 is an electrosilvering.
Step 2, on the positive chip backing plate of lead frame 1 spraying elargol 2, led chip 3 is bonded on the chip backing plate on the lead frame 1, and solidified 80 to 160 minutes; Concrete like Fig. 2 and shown in Figure 3; Wherein the A among Fig. 2 is the front schematic view behind the spraying elargol 2 in the chip backing plate zone on lead frame 1, and B is the side schematic view of A, and the A among Fig. 3 is the front schematic view behind the bonding led chip 3 in backing plate zone; Equally, B is the side schematic view of A.Used plain conductor 4 is considered the control of its electric conductivity and led chip packaging cost in this step, and the inventor thinks that plain conductor 4 materials of comparative optimization are copper wires.
And the above-mentioned curing time of mentioning; Need to confirm according to the different environment temperature; Be to be understood that to, the present invention and can be transformed to multiple concrete execution mode and embodiment according to the serial number scope in aforesaid curing time; For example led chip 3 is bonded in the time of solidifying on the chip backing plate and is set to 90 minutes, 120 minutes or 150 minutes; To the normal temperature cure time here, the inventor thinks that through experiment the comparatively preferred normal temperature cure time is 120 minutes, can carry out follow-up encapsulation step after the curing.
Step 3, employing plain conductor 4 are with the positive and negative electrode bonding on the led chip 3; And respectively the positive and negative electrode of led chip 3 is extended on the pin at lead frame 1 back side; Specifically as shown in Figure 4; The positive and negative electrode of led chip 3 is adopted the pin bonding at the plain conductor 4 and lead frame 1 back side, need to prove that plain conductor is sealed in the mixture of fluorescent material and silica gel fully; Described pin then is the pad at lead frame 1 back side, the access of electrode in the time of can making things convenient for the later stage as the light source in LED light fixture or other LED products as the pad of pin.
Mixture injection molding on the chip backing plate of step 4, employing silica gel and fluorescent material; Plastic packaging is lived the lead frame front; With and the led chip and the plain conductor of top, and the led chip finished product light source after promptly obtaining after it is solidified encapsulating, definite says; Step 4 is for filling with the positive integral body of lead frame in the mixture of fluorescent material and silica gel, and this kind mode also can be used as another preferred embodiment comparatively of the present invention.
About the form of injection molding processing, can be with reference to shown in Figure 5, the A among Fig. 5 is the sketch map behind the positive injection molding of lead frame 1, B is a schematic rear view.In the selection of injection molded, consider encapsulation accomplish after the consistency of led chip 3 finished product light source color temperatures, preferably adopt mixture on chip backing plate lead frame 1 on the injection molding of automatic injector with fluorescent material and silica gel.
Inventor of the present invention thinks; Above-mentioned technical scheme can realize the desired technique effect of the present invention, and promptly under prerequisite cheaply, the littler led chip of volume 3 finished product light sources are produced in high efficiency encapsulation; Yet for guaranteeing that the present invention has more good effect and the quality that further promotes the led light source product; The inventor proposes the embodiment that some the present invention are more preferably on the basis of technique scheme, can be used as another kind of embodiment of the present invention:
On the basis of above-mentioned four steps; Described step 1 is provided with a plurality of chip backing plates identical or inequality with lead frame 1 in the step 2; All be bonded with led chip 3 on each chip backing plate; And the back side of lead frame also is provided with the pin that is complementary with chip backing plate quantity, through with a plurality of led chip 3 disposable injection moulding encapsulation, can effectively improve the packaging efficiency of finished product led chip light source; And under normal encapsulation situation; The chip backing plate that is provided with on the lead frame 1 is identical, be not employed in the chip backing plate that different sizes are set on the same lead frame 1 in the special packaging technology of the present invention but also do not get rid of, thereby bonding different led chip 3 encapsulates.On the basis of above-mentioned four steps; The present invention also can proceed step 5, the high temperature resistance diaphragm that is attached to the lead frame back side in the step 1 is peeled off; And silica gel after solidifying and phosphor mixture lead frame surface subsides PV film; Specifically can be referring to shown in Figure 6; The PV film is sticked in lead frame front after the injection molding encapsulation, its objective is for later stage protection LED finished product light source surface and cleaning in a plurality of led chip high-speed cutting processes of lead frame 1 encapsulation, and makes things convenient for high-speed cutting.Form in the arbitrary source process in high-speed cutting, light source is firmly pasted on the PV film always, avoids in the cutting process or the light source of cutting after accomplishing is scattered everywhere.
Said as foregoing; In conjunction with the cutting of above-mentioned LED finished product light source, at the lead frame 1 that a plurality of chip backing plates identical or inequality will be arranged during, also need proceed step 6, be that the unit cuts according to the chip backing plate of setting it on lead frame 1 as package support; Be cut to the independent led chip finished product light source after the encapsulation; On the mode of cutting,, preferentially adopt high-speed cutting machine 7 to cut for avoiding cutting the led chip finished product light source that damage has encapsulated completion; To reach the purpose of rapid completion predefined paths cutting; Specifically can be with reference to shown in Figure 6, A is the side diagrammatic sketch of high-speed cutting machine 7 cutting lead frameworks 1 among Fig. 6, B is a front schematic view.Inventor of the present invention thinks that this execution mode can be used as comparatively one of preferred embodiment of the present invention.
In addition; Inventor of the present invention is with reference to prior art; Be combined in the actual conditions of carrying out injection molding encapsulation on the lead frame 1, think the mixed proportion of the fluorescent material mentioned in the above-mentioned step 4 of the present invention and the fluorescent material in the silica-gel mixture and silica gel for being preferably 1.5: 1000, the fluorescent material behind the while injection molding and the solidification mode of silica-gel mixture are preferably to grow and bake or solidified at normal temperatures 100 to 240 minutes; The time that this dual mode solidifies needs to confirm according to curing environment or long roasting actual temp; Still need to prove that the present invention also can be transformed to multiple different embodiment through aforesaid number range and setting time.
After according to above-mentioned steps four or preferred step 5 of the present invention and step 6 EO; Led chip 3 finished product light sources after the resulting encapsulation are as shown in Figure 7, and the A among Fig. 7 is the front schematic view of light source, and B is the schematic rear view of light source; Several various embodiment through more than the present invention combine accompanying drawing; Suffice to show that the present invention is enforceable,, can realize technical purpose and technique effect that the present invention expects simultaneously through above-mentioned technological means.
What also need describe simultaneously is; " embodiment " who is spoken of in this manual, " another embodiment ", " embodiment ", etc., refer to the concrete characteristic, structure or the characteristics that combine this embodiment to describe and be included among at least one embodiment that the application's generality describes.A plurality of local appearance statement of the same race is not necessarily to refer to same embodiment in specification.Further, when describing a concrete characteristic, structure or characteristics in conjunction with arbitrary embodiment, what institute will advocate is that other embodiment of combination realize that this characteristic, structure or characteristics also fall within the scope of the invention.
Although invention has been described with reference to a plurality of explanatory embodiment of the present invention here; But; Should be appreciated that those skilled in the art can design a lot of other modification and execution modes, these are revised and execution mode will drop within disclosed principle scope of the application and the spirit.More particularly, in the scope of, accompanying drawing open and claim, can carry out multiple modification and improvement to the building block and/or the layout of subject combination layout in the application.Except modification that building block and/or layout are carried out with improve, to those skilled in the art, other purposes also will be tangible.
Claims (10)
1. led chip packaging technology, it is characterized in that: described packaging technology is operated according to following steps:
Step 1, adopt the package support of lead frame, and, stick high temperature resistance diaphragm at the back side of lead frame with behind its surperficial whole coating as led chip;
Step 2, on the positive chip backing plate of lead frame, spray elargol, led chip is bonded on the chip backing plate on the lead frame, and solidified 80 to 160 minutes;
Step 3, adopt plain conductor, and respectively the positive and negative electrode of led chip is extended on the pin at the lead frame back side the positive and negative electrode bonding on the led chip;
Step 4, adopt mixture injection molding on the chip backing plate of silica gel and fluorescent material, plastic packaging is lived the lead frame front, with and the led chip and the plain conductor of top, and the led chip finished product light source after promptly obtaining after it is solidified encapsulating.
2. led chip packaging technology according to claim 1; It is characterized in that: described packaging technology also comprises step 5, the high temperature resistance diaphragm that is attached to the lead frame back side in the step 1 is peeled off, and silica gel after solidifying and phosphor mixture lead frame surface subsides PV film.
3. led chip packaging technology according to claim 2; It is characterized in that: described step 1 is provided with a plurality of chip backing plates identical or inequality with lead frame in the step 2; All be bonded with led chip on each chip backing plate, and the back side of lead frame also is provided with the pin that is complementary with chip backing plate quantity.
4. led chip packaging technology according to claim 3 is characterized in that: described packaging technology also comprises step 6, be that the unit cuts with lead frame according to the chip backing plate that is provided with on it, is cut to the independent led chip finished product after the encapsulation.
5. led chip packaging technology according to claim 1 is characterized in that: described lead frame is stamped to form through copper alloy based.
6. according to claim 1 or 5 described led chip packaging technologies, it is characterized in that: the integral thickness of said lead frame is 0.15 to 0.45 millimeter.
7. led chip packaging technology according to claim 1 is characterized in that: the whole coating of lead frame surface is electrosilvering in the described step 1; Plain conductor in the described step 3 is a copper conductor.
8. led chip packaging technology according to claim 1 is characterized in that: the fluorescent material in the described step 4 in fluorescent material and the silica-gel mixture and the mixed proportion of silica gel are 1.5: 1000.
9. led chip packaging technology according to claim 1 is characterized in that: the mixture injection molding on the chip backing plate on the lead frame that adopts automatic injector fluorescent material and silica gel in the described step 4.
10. according to claim 1 or 9 described led chip packaging technologies, it is characterized in that: make mode that the mixture of fluorescent material and silica gel solidifies in the described step 4 for long roasting or solidified at normal temperatures 100 to 240 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2012100135300A CN102544262A (en) | 2012-01-17 | 2012-01-17 | LED (light-emitting diode) chip packaging process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012100135300A CN102544262A (en) | 2012-01-17 | 2012-01-17 | LED (light-emitting diode) chip packaging process |
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| CN102544262A true CN102544262A (en) | 2012-07-04 |
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| CN2012100135300A Pending CN102544262A (en) | 2012-01-17 | 2012-01-17 | LED (light-emitting diode) chip packaging process |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956359A (en) * | 2014-05-19 | 2014-07-30 | 四川柏狮光电技术有限公司 | Single-ended power supply all-around LED lamp filament and manufacturing method thereof |
| CN106684077A (en) * | 2017-03-03 | 2017-05-17 | 陈官海 | RGBLED (Red Green Blue Light Emitting Diode) structure and preparation process |
| CN108007924A (en) * | 2017-11-09 | 2018-05-08 | 江苏稳润光电科技有限公司 | A kind of method of detection support quality of coating |
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| JP2011176265A (en) * | 2010-01-29 | 2011-09-08 | Toshiba Corp | Method for manufacturing led package |
| CN201994337U (en) * | 2011-02-22 | 2011-09-28 | 广东德豪润达电气股份有限公司 | LED (Light Emitting Diode) packaging support structure and LED device |
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Patent Citations (6)
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| JP2011176265A (en) * | 2010-01-29 | 2011-09-08 | Toshiba Corp | Method for manufacturing led package |
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| CN103956359A (en) * | 2014-05-19 | 2014-07-30 | 四川柏狮光电技术有限公司 | Single-ended power supply all-around LED lamp filament and manufacturing method thereof |
| CN106684077A (en) * | 2017-03-03 | 2017-05-17 | 陈官海 | RGBLED (Red Green Blue Light Emitting Diode) structure and preparation process |
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| CN108007924A (en) * | 2017-11-09 | 2018-05-08 | 江苏稳润光电科技有限公司 | A kind of method of detection support quality of coating |
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Owner name: SICHUAN CHANGYANG TAIDING TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHENGDU TAIDING TECHNOLOGY CO., LTD. Effective date: 20121102 |
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Effective date of registration: 20121102 Address after: 610000 Shiyang Industrial Park, Chengdu hi tech Development Zone, Sichuan Applicant after: Sichuan Changyang Taiding Technology Co., Ltd. Address before: 610000 Shiyang Industrial Zone, hi tech Development Zone, Sichuan, Chengdu Applicant before: Chengdu Taiding Technology Co.,Ltd. |
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Application publication date: 20120704 |