CN203339221U - Fluorescent powder encapsulation structure used for mixed light LED - Google Patents
Fluorescent powder encapsulation structure used for mixed light LED Download PDFInfo
- Publication number
- CN203339221U CN203339221U CN2013202568208U CN201320256820U CN203339221U CN 203339221 U CN203339221 U CN 203339221U CN 2013202568208 U CN2013202568208 U CN 2013202568208U CN 201320256820 U CN201320256820 U CN 201320256820U CN 203339221 U CN203339221 U CN 203339221U
- Authority
- CN
- China
- Prior art keywords
- fluorescent
- metal substrate
- layer
- mixed light
- fluorescent powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The utility model discloses a fluorescent powder encapsulation structure used for a mixed light LED. The structure comprises an LED chip and a metal substrate. The LED chip is disposed on an upper surface of the metal substrate. An insulating layer is disposed on the metal substrate. A circuit layer is disposed on the insulating layer. An encapsulation adhesive limiting layer made of an insulating material is disposed on the circuit layer. A fluorescent adhesive limiting layer made of the insulating material is disposed on the encapsulation adhesive limiting layer. The encapsulation adhesive is filled in the encapsulation adhesive limiting layer, the fluorescent adhesive limiting layer is filled with fluorescent adhesive. Beneficial effect of the structure is that problems of color drifting and brightness decay of the LED device caused by reduction of fluorescent powder conversion efficiency are solved.
Description
Technical field
The utility model relates to field of photoelectric technology, is specifically related to a kind of mixed light LED fluorescent powder packaging structure.
Background technology
But existing mixed light LED preparation method is in applying fluorescent material or chip being wrapped in to fluorescent glue at the excitated fluorescent powder chip surface, utilize the chip excitated fluorescent powder, fluorescent material is sent and coordinate light to mix with the chip body is luminous, prepare mixed light LED device, chip is in the situation that understand because the electric light transformational relation by electric current, PN junction can produce high temperature, because fluorescent material directly applies or wrap up chip, therefore the direct contact chip of fluorescent material meeting, the temperature that causes wafer to produce is directly delivered to fluorescent material, pyrocaloric effect causes the decay of fluorescent material, thereby cause LED device light decay and look drift.
The utility model content
For solving the problems of the technologies described above, the purpose of this utility model is to provide a kind of mixed light LED fluorescent powder packaging structure, solves the brightness decay and the colour temperature drifting problem that cause because of the fluorescent material decay.
For achieving the above object, the technical solution of the utility model is as follows: a kind of mixed light LED fluorescent powder packaging structure, comprise LED chip and metal substrate, described LED chip is located at the upper surface of described metal substrate, lay one deck insulating barrier on described metal substrate, above described insulating barrier, line layer is set, is equipped with the spacing layer of packaging plastic that insulating material is made above described line layer, be provided with again the spacing layer of fluorescent glue that insulating material is made on the spacing layer of described packaging plastic; Pour into packaging plastic in the spacing layer of described packaging plastic, in the spacing layer of described fluorescent glue, pour into fluorescent glue.
Preferably, the positive and negative lead wires of described metal substrate is welded on described line layer.
Preferably, described packaging plastic is silica gel.
Adopt the beneficial effect of above technical scheme to be: owing to being provided with the encapsulation glue-line, avoided fluorescent glue and the direct of wafer to contact, the fluorescent material conversion efficiency that the heat that wafer itself sends while lighting causes the thermal effect of fluorescent material reduces, thereby solved the fluorescent material conversion efficiency, reduces the drift of LED device look and the brightness decay problem of bringing.
The accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment technology, below will the accompanying drawing of required use in the embodiment technical description be briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of a kind of mixed light LED of the utility model by the fluorescent powder packaging structure.
The represented corresponding component title of numeral in figure:
1, metal substrate 2, insulating barrier 3, line layer 4, the spacing layer 5 of packaging plastic, the spacing layer of fluorescent glue.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making under the creative work prerequisite the every other embodiment obtained, and all belong to the scope of the utility model protection.
Embodiment
As shown in Figure 1, a kind of mixed light LED fluorescent powder packaging structure, comprise LED chip and metal substrate 1, LED chip is located at the upper surface of described metal substrate 1, lay one deck insulating barrier 2 on metal substrate 1, line layer 3 is set above insulating barrier 2, be equipped with the spacing layer 4 of packaging plastic that insulating material is made above described line layer, in order to the use amount of weighing packaging adhesive material and use packaging adhesive material protection wafer, be provided with again the spacing layer 5 of fluorescent glue that insulating material is made on the spacing layer 4 of described packaging plastic, in order to weigh the use amount of fluorescent glue glue material; Pour into packaging plastic in the spacing layer 4 of described packaging plastic, in the spacing layer 4 of described fluorescent glue, pour into fluorescent glue, wherein packaging plastic adopts silica gel, and fluorescent glue is that fluorescent material adds glue.
Concrete encapsulation process is as follows:
1, customize or buy the support of existing male model according to the power of producing product and profile;
2, the power ratio according to actual production at the substrate layer of support, used crystal-bonding adhesive fixing metal substrate;
3, after fixing metal substrate, according to wafer arrangement mode on the actual metal substrate, the positive and negative electrode of metal substrate lead-in wire is welded to respectively on line layer, connects in order to wafer and support external power source pin;
4, the semi-finished product after bonding wire pour into packaging adhesive material in the spacing layer of packaging plastic, and the upper limit of packaging adhesive material is limited to and is parallel to the spacing layer of packaging plastic, and it is solidified;
5, the semi-finished product after solidifying pour into fluorescent glue in the spacing layer of fluorescent glue, and fluorescent glue glue material upper limit is limited to and does not overflow the spacing layer of fluorescent glue, and it is solidified.
Owing to being provided with the encapsulation glue-line, avoided fluorescent glue and the direct of wafer to contact, the fluorescent material conversion efficiency that the heat that wafer itself sends while lighting causes the thermal effect of fluorescent material reduces, thereby solved the fluorescent material conversion efficiency, reduces the drift of LED device look and the brightness decay problem of bringing.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the utility model.Multiple modification to these embodiment will be apparent for those skilled in the art, and General Principle as defined herein can be in the situation that do not break away from spirit or scope of the present utility model, realization in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (3)
1. a mixed light LED fluorescent powder packaging structure, comprise LED chip and metal substrate, described LED chip is located at the upper surface of described metal substrate, it is characterized in that, lay one deck insulating barrier on described metal substrate, above described insulating barrier, line layer is set, is equipped with the spacing layer of packaging plastic that insulating material is made above described line layer, be provided with again the spacing layer of fluorescent glue that insulating material is made on the spacing layer of described packaging plastic; Pour into packaging plastic in the spacing layer of described packaging plastic, in the spacing layer of described fluorescent glue, pour into fluorescent glue.
2. mixed light LED fluorescent powder packaging structure according to claim 1, is characterized in that, the positive and negative lead wires of described metal substrate is welded on described line layer.
3. mixed light LED fluorescent powder packaging structure according to claim 1, is characterized in that, described packaging plastic is silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202568208U CN203339221U (en) | 2013-05-13 | 2013-05-13 | Fluorescent powder encapsulation structure used for mixed light LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202568208U CN203339221U (en) | 2013-05-13 | 2013-05-13 | Fluorescent powder encapsulation structure used for mixed light LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203339221U true CN203339221U (en) | 2013-12-11 |
Family
ID=49707881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202568208U Expired - Fee Related CN203339221U (en) | 2013-05-13 | 2013-05-13 | Fluorescent powder encapsulation structure used for mixed light LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203339221U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157774A (en) * | 2013-05-13 | 2014-11-19 | 南通亚浦照明电器制造有限公司 | Fluorescent powder encapsulation structure used for light-mixed LED |
-
2013
- 2013-05-13 CN CN2013202568208U patent/CN203339221U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157774A (en) * | 2013-05-13 | 2014-11-19 | 南通亚浦照明电器制造有限公司 | Fluorescent powder encapsulation structure used for light-mixed LED |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202281057U (en) | High-efficiency LED light emitting tube with LED chip 4pi light outlet | |
| CN204632804U (en) | Wafer-level package LED | |
| CN103840071A (en) | LED lamp bar manufacturing method and LED lamp bar | |
| CN105006511A (en) | LED package method | |
| CN103335236A (en) | Manufacturing technology of high-voltage LED lamp bar, high-voltage LED lamp bank, and assembly method of high-voltage LED lamp bank | |
| CN102447049A (en) | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator | |
| CN204289442U (en) | A kind of New LED filamentray structure | |
| CN203339221U (en) | Fluorescent powder encapsulation structure used for mixed light LED | |
| CN203150541U (en) | LED light source based on COB packaging | |
| CN103151434B (en) | A kind of method improving LED fluorescent material distributing homogeneity | |
| CN203963678U (en) | LED light modulation Down lamp | |
| CN201547559U (en) | High-power LED lamp | |
| CN203746900U (en) | White light LED | |
| CN204927327U (en) | UV packaging structure of SMDLED lamp pearl | |
| CN104157774A (en) | Fluorescent powder encapsulation structure used for light-mixed LED | |
| CN203589071U (en) | An LED support and an LED | |
| CN203836687U (en) | Inverted LED integrated substrate | |
| CN204651345U (en) | Package structure for LED | |
| CN204271135U (en) | The light source module that photoelectric conversion efficiency is high | |
| CN203839378U (en) | Flip-chip adopting LED lamp | |
| CN203746847U (en) | LED filament and illumination device | |
| CN204144309U (en) | A kind of chip-scale white light LEDs | |
| CN101931041A (en) | Silica-based packaging light-emitting diode | |
| CN205177836U (en) | High stable high -voltage ceramic COB LED | |
| CN204391110U (en) | A kind of LED integrated light-emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131211 Termination date: 20200513 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |