TW201608746A - LED device with heat dissipation substrate - Google Patents

Abstract

An LED device includes a heat dissipation substrate, at least one power supply substrate and at least one LED die. The power supply substrate is disposed on the heat dissipation substrate, and includes a transparent plate and a conductive circuit. The conductive circuit is disposed on the transparent plate. The conductive circuit and the heat dissipation substrate are respectively located at the opposite sides of the transparent plate. The LED die is disposed on the power supply substrate and electrically connected to the conductive circuit.

Description

Light-emitting diode device with heat-dissipating substrate

The invention relates to a light-emitting diode device, in particular to a light-emitting diode device provided with a heat-dissipating substrate.

The light-emitting diode is currently the most important semiconductor lighting component, and has the advantages of good luminous efficiency, long life, and fast reaction speed. However, in high-power, high-brightness applications, the light-emitting diodes cause heat build-up problems that affect luminous efficiency and lifetime.

Accordingly, it is an object of the present invention to provide a light emitting diode device that solves the above problems.

Therefore, the light emitting diode device of the present invention comprises a heat dissipating substrate, at least one power supply substrate and at least one light emitting diode die. The power supply substrate is disposed on the heat dissipation substrate and includes a light transmission plate and a conductive line. The conductive circuit is disposed on the light-transmitting plate, and is disposed on opposite sides of the light-transmitting plate from the heat-dissipating substrate. The light emitting diode die is disposed on the power supply substrate and electrically connected to the conductive circuit.

In an embodiment, the power supply substrate further includes a reflective layer The light reflecting layer is disposed on the light transmissive plate and located between the light transmissive plate and the heat dissipating substrate.

Preferably, the light emitting diode die is electrically connected to the conductive line in a flip chip manner.

In one embodiment, the LED device further includes a phosphor structure disposed on the power supply substrate and encapsulating the LED body. The fluorescent structure includes a first phosphor and a second phosphor. The first phosphor is disposed between the power supply substrate and the LED die, and the second phosphor is covered. The light emitting diode crystal grains.

In one embodiment, the light emitting diode device further includes a lens structure disposed on the power supply substrate and covering the light emitting diode die.

In one embodiment, the number of the power supply substrates is plural, and are respectively disposed on opposite sides of the heat dissipation substrate; the number of the light emitting diodes is plural, and are respectively disposed on the power supply substrate.

Preferably, the material of the light transmissive plate is selected from the group consisting of borosilicate glass, quartz glass, sapphire glass, tantalum carbide and a combination thereof. The light transmissive plate has flexibility. The main material of the heat dissipation substrate is metal.

Another object of the present invention is to provide a lighting fixture using the above-described light emitting diode device.

Accordingly, the lighting fixture of the present invention comprises an outer casing structure and at least one light emitting diode device as described above.

Preferably, the outer casing structure is a lamp cup of a light cup or a bulb capable of collecting light.

The effect of the invention is that the heat dissipation effect of the light-emitting diode device can be improved by the arrangement of the heat-dissipating substrate, and the brightness and the service life of the light-emitting diode device are improved. In addition, the optical characteristics of the light-emitting diode device can be adjusted by different power supply substrates and arrangement patterns of the light-emitting diodes, and are applied to different application modes.

100‧‧‧Lighting diode device

101‧‧‧Lighting fixtures

1‧‧‧heating substrate

2‧‧‧Power supply substrate

21‧‧‧Translucent plate

22‧‧‧Electrical circuit

23‧‧‧Reflective layer

24‧‧‧ Solder

3‧‧‧Light-emitting diode grains

31‧‧‧ epitaxial substrate

32‧‧‧First semiconductor layer

33‧‧‧Second semiconductor layer

34‧‧‧First electrode

35‧‧‧second electrode

4‧‧‧Fluorescent structure

41‧‧‧First phosphor

42‧‧‧Secondary phosphor

5‧‧‧ lens structure

6‧‧‧Shell structure

7‧‧‧ circuit module

The other features and advantages of the present invention will be apparent from the detailed description of the embodiments of the invention, wherein: Figure 1 is a side view showing a first embodiment of the light emitting diode device of the present invention; FIG. 3 is a side elevational view showing a third embodiment of the light emitting diode device of the present invention; FIG. 4 is a side view showing the second embodiment of the light emitting diode device of the present invention; A fourth embodiment of the light-emitting diode device of the present invention is illustrated; FIG. 5 is a side view showing a modified embodiment of the fourth embodiment; and FIGS. 6 and 7 are side views showing the light-emitting device of the present invention. The polar body device is applied as an embodiment of the lighting fixture.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

First embodiment:

Referring to FIG. 1, a first embodiment of a light emitting diode device 100 of the present invention is shown. Here, the LED device 100 includes a heat dissipation substrate 1 , a power supply substrate 2 , and a light emitting diode die 3 .

The heat-dissipating substrate 1 is made of a material having a high heat transfer coefficient, and heat generated by the light-emitting diode crystal grains 3 can be conducted to avoid heat accumulation. In this embodiment, the heat dissipation substrate 1 can be made of a metal or the like, but the specific material is not limited to metal.

The power supply substrate 2 is disposed on the heat dissipation substrate 1 and includes a light transmission plate 21, a conductive line 22, and a light reflecting layer 23.

The light-transmitting plate 21 is made of a transparent, insulating material, and the light-emitting diode die 3 is placed thereon. In this embodiment, the material of the light-transmitting plate 21 is selected from the group consisting of borosilicate glass, quartz glass, sapphire glass, tantalum carbide, and the like, and the materials have light transmission characteristics, thermal expansion coefficient and light-emitting diode crystal grains. 3 is similar, which can avoid the problem of structural stress, and is beneficial to the arrangement of the light-emitting diode die 3. However, in different implementations, the material of the light-transmitting plate 21 is adjusted as needed, and is not limited to the contents disclosed herein.

The conductive circuit 22 is disposed on the light-transmitting plate 21, and is disposed on opposite sides of the light-transmitting plate 21 from the heat-dissipating substrate 1, and includes a pad, an extended circuit (not shown), and the like. The bulk crystal 3 and an external circuit (not shown) form an electrical connection.

The reflective layer 23 is disposed on the light-transmitting plate 21 and located between the light-transmitting plate 21 and the heat-dissipating substrate 1 , and may be made of a material having high reflectivity such as silver or aluminum, or a photonic crystal having high reflectivity. Multi-layer reflective film, To provide the effect of reflecting light and enhancing brightness.

The light-emitting diode die 3 is disposed on the power supply substrate 2, and is electrically connected to the conductive circuit 22 in a flip-chip manner, and may be selected from various types such as blue light, red light, green light, and ultraviolet light. Diode grain.

Specifically, the LED die 3 of the present embodiment includes an epitaxial substrate 31, a first semiconductor layer 32, a second semiconductor layer 33, a first electrode 34, and a second electrode 35. The substrate 31, the first semiconductor layer 32 and the second semiconductor layer 33 are sequentially stacked one on another, and the first electrode 34 and the second electrode 35 are respectively disposed on the surfaces of the first semiconductor layer 32 and the second semiconductor layer 33, and Solder 24 is electrically connected to conductive line 22.

According to the above, in the structure design in which the light-emitting diode die 3 is not provided with a mirror, the light emitted by the light-emitting diode 3 is irradiated in all directions, and the light irradiated to the light-transmitting plate 21 is reflected by the light-reflecting layer 23. After the reflection, the light is irradiated in the opposite direction, so that the overall brightness of the light-emitting diode device 100 can be improved, and the light source characteristics of the half-circumference light (that is, the space above the heat-dissipating substrate 1) can be provided. In addition, by the arrangement of the heat dissipation substrate 1, the heat dissipation effect of the LED device 100 in the high power use state can be improved, and the brightness performance and the service life are improved.

However, it should be noted that the number of the power supply substrate 2 and the light-emitting diode die 3 in the present embodiment is described by taking one example as an example, but in different implementations, the power supply substrate 2 and the light-emitting diode are described. The number of dies 3 can be configured in multiples without being limited to what is disclosed herein. In addition, the LED device 100 can provide different applications depending on the configuration of the heat dissipating substrate 1 of different types. For example, when the shape of the heat dissipation substrate 1 is a strip When a plurality of power supply substrates 2 and light-emitting diode crystal grains 3 are provided thereon, the light-emitting diode device 100 is implemented in the form of a light-emitting light bar. Of course, the application manner of the LED device 100 of the present embodiment may also have different implementation manners, and is not limited to the description herein.

Second embodiment:

Referring to FIG. 2, a second embodiment of a light emitting diode device 100 of the present invention is shown. Compared with the first embodiment, the LED device 100 of the present embodiment further includes a fluorescent structure 4 and a lens structure 5, and the power supply substrate 2 is not provided with a reflective layer.

The fluorescent structure 4 can adjust the color of the light emitted from the LED device 100, and is disposed on the power supply substrate 2 and includes a first phosphor 41 and a second phosphor 42. The first phosphor 41 is disposed between the power supply substrate 2 and the light-emitting diode die 3, and is fabricated by a technique such as printing or dispensing before the light-emitting diode die 3 is mounted on the power supply substrate 2. The second phosphor 42 covers the light-emitting diode crystal 3, and is formed after the light-emitting diode die 3 is mounted on the power supply substrate 2. In this embodiment, since the first phosphor 41 and the second phosphor 42 cooperate together, the LED die 3 is completely covered, thereby ensuring uniform and stable operation of the LED device 100. Light output characteristics. However, in various embodiments, the phosphor structure 4 can be implemented in different ways, and is not limited to what is disclosed herein.

The lens structure 5 is disposed on the power supply substrate 2 and covers the light-emitting diode die 3 therein. The structure of the lens structure 5 affects the optical characteristics such as the viewing angle and the light-emitting efficiency of the LED device 100. The structural design of the first-order optical lens.

According to the embodiment of the fluorescent structure 4 and the lens structure 5, the light emitting diode device 100 of the present embodiment exhibits optical characteristics different from those of the first embodiment, but can also be improved by the heat dissipation substrate 1 to enhance the heat dissipation effect. Brightness and longevity performance. Further, when the heat dissipation substrate 1 of the present embodiment is disposed in a porous mesh structure (not shown), the light emitted from the light-emitting diode crystal 3 penetrates the light-transmitting plate 21 and can be further passed through. The substrate 1 is thermally dissipated to exhibit a full-perimeter optical characteristic different from that of the first embodiment.

Third embodiment:

Referring to FIG. 3, a third embodiment of the light emitting diode device 100 of the present invention is shown. Compared with the first embodiment, the LED device 100 of the present embodiment includes a plurality of power supply substrates 2 and a plurality of LED dies 3 , and the power supply substrate 2 is respectively mounted on the heat dissipation substrate 1 . On the opposite side, the light-emitting diode crystal grains 3 are respectively disposed on the power supply substrate 2. Accordingly, in the first embodiment, the half-circumferential light-emitting characteristics of the light-emitting diode device 100 are converted into the light-emitting diode crystal grains 3 provided on the upper and lower sides of the heat-dissipating substrate 1 in the present embodiment. The light-emitting characteristics of the full moonlight.

Fourth embodiment:

Referring to FIG. 4 and FIG. 5, a fourth embodiment of the light-emitting diode device 100 of the present invention is shown. Compared with the third embodiment, the heat dissipation substrate 1 of the present embodiment can be further made of a material having flexibility, or can be made into a curved structure (as shown in FIG. 4) and a tubular structure (as shown in FIG. 5), and The power supply substrate 2, together with the light-emitting diode die 3, is mounted thereon, thereby providing different illumination and illumination applications.

Referring to FIG. 6 and FIG. 7, the LED device 100 is in addition to the foregoing. In addition to the four embodiments, it can be further implemented in the manner of the lighting fixture 101. Specifically, the main structure of the lighting fixture 101 includes a housing structure 6, a light emitting diode device 100, and a circuit module 7.

In FIG. 6, the outer casing structure 6 of the lighting fixture 101 is a light cup capable of collecting light, and the light emitting diode device 100 is disposed at a focus of the reflecting surface of the outer casing structure 6, and thus the light emitting diode device 100 emits The light can be condensed into parallel light through the outer casing structure 6, and the lighting fixture 101 is suitable for lighting applications such as a lamp, a searchlight, a flashlight, and the like.

In Fig. 7, the lighting fixture 101 is applied to the bulb illumination, and the outer casing structure 6 is the outer casing of the bulb, and the illumination device is provided with the full-circumference type of the light-emitting diode device 100 as a light source.

In summary, the arrangement of the heat-dissipating substrate 1 of the light-emitting diode device 100 of the present invention can effectively improve the heat dissipation effect of the light-emitting diode device 100, thereby improving brightness and service life. In addition, the selection of the heat dissipation substrate 1 of different types and the arrangement of the corresponding power supply substrate 2 and the light emitting diode die 3 can control the light emitting diode device 100 to be semi-circumferential or full-circumferential. Optical properties and have different application types. Therefore, the light-emitting diode device 100 of the present invention can achieve the object of the present invention.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

100‧‧‧Lighting diode device

1‧‧‧heating substrate

2‧‧‧Power supply substrate

21‧‧‧Translucent plate

22‧‧‧Electrical circuit

23‧‧‧Reflective layer

3‧‧‧Light-emitting diode grains

Claims (12)

A light emitting diode device comprising: a heat dissipating substrate; at least one power supply substrate disposed on the heat dissipating substrate, and comprising a light transmissive plate, and a conductive circuit disposed on the light transmissive plate and the heat dissipating base The materials are respectively located on opposite sides of the light-transmitting plate; and at least one light-emitting diode die is disposed on the power supply substrate and electrically connected to the conductive circuit. The light-emitting diode device of claim 1, wherein the power supply substrate further comprises a light-reflecting layer disposed on the light-transmitting plate and located between the light-transmitting plate and the heat-dissipating substrate. The illuminating diode device of claim 1, wherein the illuminating diode die is electrically connected to the conductive line in a flip chip manner. The illuminating diode device of claim 1, further comprising a fluorescent structure disposed on the power supply substrate and encapsulating the luminescent diode die. The light emitting diode device of claim 4, wherein the fluorescent structure comprises a first phosphor and a second phosphor, the first phosphor being disposed on the power supply substrate and the light emitting diode Between the bulk crystal grains, the second phosphor covers the light emitting diode crystal grains. The illuminating diode device of claim 1, further comprising a lens structure disposed on the power supply substrate and covering the illuminating diode die. The light-emitting diode device of claim 1, wherein the number of the power supply substrates is plural, and is respectively disposed on opposite sides of the heat dissipation substrate; the number of the light-emitting diode crystal grains is plural. And respectively disposed on the power supply substrate. The light-emitting diode device of claim 1, wherein the material of the light-transmitting plate is selected from the group consisting of borosilicate glass, quartz glass, sapphire glass, tantalum carbide, and a combination thereof. The light-emitting diode device of claim 1, wherein the light-transmitting plate has flexibility. The illuminating diode device of claim 1, wherein the main material of the heat dissipating substrate is metal. A lighting fixture comprising: a housing structure; and at least one of the light emitting diode devices of any one of claims 1 to 10 disposed in the housing structure. The lighting fixture of claim 11, wherein the outer casing is a lamp cup or a bulb of a light bulb that can converge light.