JP5898881B2 - Lighting device - Google Patents
Lighting device Download PDFInfo
- Publication number
- JP5898881B2 JP5898881B2 JP2011174361A JP2011174361A JP5898881B2 JP 5898881 B2 JP5898881 B2 JP 5898881B2 JP 2011174361 A JP2011174361 A JP 2011174361A JP 2011174361 A JP2011174361 A JP 2011174361A JP 5898881 B2 JP5898881 B2 JP 5898881B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- metal substrate
- light emitting
- lighting device
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
本発明は、発光ダイオード等の半導体発光素子を複数配列して光源とした平面発光モジュールおよび配光性を制御した照明装置に関する。 The present invention relates to a planar light-emitting module using a plurality of semiconductor light-emitting elements such as light-emitting diodes as a light source, and a lighting device that controls light distribution.
特開２００３−１２４５２８号公報（特許文献１）に、「「以上の理由から、多数のＬＥＤベアチップ２２を高密度で実装したＬＥＤ照明装置を実用化するには、従来以上に高い放熱性を実現し、ベアチップ温度を低く抑えなければならない。また、ＬＥＤベアチップ２２から発する光をできる限り無駄なく照明光として使用できるように、光の利用効率を高くする必要もある。（段落番号００１３）」問題点を解決するために、「「好ましい実施形態では、前記基板のうち前記ＬＥＤが実装されている基板面の一端側に給電電極が形成されており、前記基板において前記ＬＥＤが実装されている光出射領域の中心位置が前記基板の中心位置からずれている。（段落番号００２５）」「好ましい実施形態では、前記基板のうち前記ＬＥＤが実装されていない基板裏面と熱的に接触し、前記基板裏面から熱を受け取る熱伝導部材（段落番号００２６）」を備えている「カード型ＬＥＤ照明光源と電気的に接続される点灯回路とを備えている。（段落番号００２２）」ＬＥＤ照明光源およびＬＥＤ照明装置を提供する。」また「好ましい実施形態において、前記複数のＬＥＤベアチップの少なくとも一部は、フリップチップボンディングにより、前記金属ベース基板の配線パターンに接続されている。（段落番号００４５）」「カード型ＬＥＤ照明光源は、各々が素子基板上に発光部を有する複数のＬＥＤベアチップが放熱基板上に設けられているカード型ＬＥＤ照明光源であって、前記ＬＥＤベアチップは、前記発光部と前記放熱基板との距離が前記素子基板と前記放熱基板との距離よりも小さくなるようにして前記放熱基板上に設けられ、前記ＬＥＤベアチップの前記素子基板の光出射表面は、辺縁部が中央部に比べて低背になるような傾斜面状を形成している。（段落番号００４８）」という記載がある。 Japanese Patent Laid-Open No. 2003-124528 (Patent Document 1) states, “For the above reasons, in order to put into practical use an LED illuminating device in which a large number of LED bare chips 22 are mounted at a high density, higher heat dissipation is realized than before. In addition, it is necessary to increase the light use efficiency so that the light emitted from the LED bare chip 22 can be used as illumination light as efficiently as possible (paragraph 0013). In order to solve the problem, ““ In a preferred embodiment, a power supply electrode is formed on one end side of a substrate surface on which the LED is mounted in the substrate, and the LED is mounted on the substrate. The center position of the emission region is deviated from the center position of the substrate. (Paragraph number 0025) ”“ In a preferred embodiment, the LED of the substrate is A lighting circuit electrically connected to the card-type LED illumination light source, which is provided with a heat conducting member (paragraph number 0026) that is in thermal contact with the back surface of the substrate that is not yet received and receives heat from the back surface of the substrate (Paragraph 0022) "An LED illumination light source and an LED illumination device are provided. Further, in a preferred embodiment, at least a part of the plurality of LED bare chips is connected to the wiring pattern of the metal base substrate by flip chip bonding (paragraph number 0045). , A card-type LED illumination light source in which a plurality of LED bare chips each having a light emitting portion on an element substrate are provided on a heat dissipation substrate, wherein the LED bare chip has a distance between the light emitting portion and the heat dissipation substrate. Provided on the heat dissipation substrate so as to be smaller than the distance between the element substrate and the heat dissipation substrate, the light emitting surface of the element substrate of the LED bare chip has a lower edge than the center portion. Such a sloped surface shape is formed (paragraph number 0048) ".
特開２０００−３０６４１８号公報（特許文献２）に、「マザーユニットと、このユニットに着脱自在のＬＥＤユニットからなるＬＥＤ光源装置において、前記マザーユニットは、窓を挟んで対向配置したコネクタの対を備え、前記ＬＥＤユニットは、回路基板の一方の面にＬＥＤランプ及び前記一対のコネクタと対応する一対のコネクタを備え、前記マザーユニット側のコネクタにＬＥＤユニット側のコネクタを装着することにより、前記ＬＥＤユニットが前記マザーユニットに電気的に接続されると同時に、ＬＥＤユニットが前記マザーユニットに保持される構成としたことを特徴とするＬＥＤ光源装置。（請求項１）」という記載がある。 Japanese Patent Laid-Open No. 2000-306418 (Patent Document 2) states that “in an LED light source device comprising a mother unit and an LED unit that is detachable from this unit, the mother unit includes a pair of connectors that are arranged opposite to each other with a window interposed therebetween. The LED unit includes a pair of connectors corresponding to the LED lamp and the pair of connectors on one surface of the circuit board, and the LED unit side connector is attached to the connector on the mother unit side, whereby the LED An LED light source device characterized in that the LED unit is held by the mother unit at the same time that the unit is electrically connected to the mother unit.
特開２００１−５２５０４号公報（特許文献３）に、「従来の白熱電球と同様の口金２に設けられた基板２ａに光源となる複数の発光ダイオードＬＥＤを配列したうえ、口金２と各発光ダイオードＬＥＤ間を電気的に接続した発光部１と、口金２が螺入された場合に口金２と電気的に導通される電球用ソケット３と、１００ボルトの交流電源４から電圧の供給を受けて複数の発光ダイオードＬＥＤに直流電圧を出力する電源部５とを示した電気回路図である。（段落番号００１１）」、また「直管１１の各ピン１２が二つの蛍光灯用ソケット１３に装着された状態で、電源部５に交流電源４からの１００ボルト電圧が供給されると、電源部５は直流電圧を出力するため、その直流電圧は二つの蛍光灯用ソケット１３及び各ピン１２を介して前記各発光ダイオードＬＥＤに印加される。これにより、各発光ダイオードＬＥＤが発光し、周囲を照明する。このように、既設の蛍光灯用ソケット１３に直管１１の各ピン１２を装着することで、各発光ダイオードＬＥＤを発光させることができる。（段落番号００１８）」という記載がある。 Japanese Patent Laid-Open No. 2001-52504 (Patent Document 3) states that “a plurality of light emitting diodes LED serving as a light source are arranged on a substrate 2 a provided on a base 2 similar to a conventional incandescent bulb, and then the base 2 and each light emitting diode. A voltage is supplied from a light emitting unit 1 that is electrically connected between LEDs, a light bulb socket 3 that is electrically connected to the base 2 when the base 2 is screwed, and a 100-volt AC power source 4. It is the electric circuit diagram which showed the power supply part 5 which outputs a DC voltage to several light emitting diode LED. (Paragraph number 0011) "and" each pin 12 of the straight tube | pipe 11 is attached to the socket 13 for two fluorescent lamps. In this state, when a 100 volt voltage from the AC power supply 4 is supplied to the power supply unit 5, the power supply unit 5 outputs a DC voltage, so that the DC voltage is applied to the two fluorescent lamp sockets 13 and the pins 12. Through Each light emitting diode LED emits light to illuminate the surrounding area, and thus, by attaching each pin 12 of the straight tube 11 to the existing fluorescent lamp socket 13, Each light-emitting diode LED can emit light (paragraph number 0018) ".
特開２００９−１３９４８３号公報（特許文献４）に、「本発明では、自動焦点調節の補助のための照明光（以下補助光）は被写体距離が大きくなった場合、被写体に対し大きく拡がることがないように設計可能である。また、被写体上に投射された補助光の配光パターンは、被写体距離が一定以上のフラウンホーファ領域では、距離が大きく変動しても常にボケない。（段落番号００１９）」との効果を唱っているが、「半導体レーザの代わりに高輝度のＬＥＤを用いることも、空間コヒーレンスが低下するため投射する回折光の配光分布の鮮鋭さは低下するが可能である。（段落番号００３４）」という記載がある。 Japanese Patent Laid-Open No. 2009-139483 (Patent Document 4) states that “In the present invention, illumination light for assisting automatic focus adjustment (hereinafter referred to as auxiliary light) can be greatly expanded with respect to the subject when the subject distance increases. In addition, the light distribution pattern of the auxiliary light projected onto the subject does not always blur even if the distance fluctuates greatly in the Fraunhofer region where the subject distance is a certain distance or more (paragraph number 0019). However, it is possible to reduce the sharpness of the light distribution of the diffracted light that is projected because the spatial coherence is reduced. (Paragraph number 0034) ".
特開２０１１−５４３２０号公報（特許文献５）に、「「これら図２，図３で示すように照明装置１は、例えば映画やテレビドラマ等の屋外撮影用のロケーション用スポットライト等として好適な照明装置であり、例えばほぼ円筒状の装置本体２を有する。（段落番号００１９）」である「ダブルエンド形のメタルハライドランプ６、光学手段としての反射鏡７、このメタルハライドランプ６に所要のランプ電力を給電する一対のソケット８，９、この一対のソケット８，９を支持するソケット支持装置１０を具備している。（段落番号００２１）」、「一対の電極を封入したガラスバルブ、このバルブの軸方向両端に配設されて一対の電極に電気的に接続された一対の口金を有する発光管と；
前記一対の口金に対してそれぞれ電気的に持続されて口金を固定する給電部を有する一対のソケットと；
これら一対のソケットをそれぞれ支持する一対のソケット支持部およびこれら一対のソケット支持部の一方を固定し、その他方を前記バルブ軸方向に平行な方向に可動可能に取り付ける支持台を有するソケット支持装置と；
前記一対のソケットの電気接触部に電気的に接続されて発光管を点灯させる点灯装置と；
これら点灯装置、一対のソケット、ソケット支持装置および発光管を収容する装置本体と；
を具備していることを特徴とする照明装置。（請求項１）」」という記載がある。Japanese Unexamined Patent Publication No. 2011-54320 (Patent Document 5) states that ““ The illumination device 1 is suitable as a spotlight for location for outdoor shooting such as movies and TV dramas, as shown in FIGS. This is an illuminating device, for example, having a substantially cylindrical device body 2. (paragraph number 0019) “double-end metal halide lamp 6, reflector 7 as optical means, and lamp power required for this metal halide lamp 6 A pair of sockets 8 and 9, and a socket support device 10 for supporting the pair of sockets 8 and 9. (paragraph number 0021) ”,“ a glass bulb enclosing a pair of electrodes, An arc tube having a pair of caps disposed at opposite axial ends and electrically connected to a pair of electrodes;
A pair of sockets each having a power feeding portion that is electrically sustained with respect to the pair of bases and fixes the base;
A socket support device having a pair of socket support portions that respectively support the pair of sockets, and a support base for fixing one of the pair of socket support portions movably in a direction parallel to the valve shaft direction; ;
A lighting device that is electrically connected to the electrical contact portions of the pair of sockets to light the arc tube;
An apparatus main body for housing the lighting device, a pair of sockets, a socket support device, and an arc tube;
An illumination device comprising: (Claim 1) "".
特開２００３−８６００６号公報（特許文献６）に、「「複数個のＬＥＤと；前記ＬＥＤを点灯制御する点灯装置と；を具備し、前記ＬＥＤは前記点灯装置と略同一面内であって前記点灯装置の周囲に配置されているＬＥＤ照明装置（請求項１）」であって、「前記ＬＥＤはリング状に間欠的に配列され、前記配光制御部材には前記ＬＥＤの配列方向に沿って狭角配光部と広角配光部とが交互に形成され、前記配光制御部材は前記狭角配光部が前記ＬＥＤに対向する位置と前記広角配光部が前記ＬＥＤに対向する位置とへ回動切替自在に設けられているＬＥＤ照明装置。（請求項５）」」という記載がある。 Japanese Patent Laid-Open No. 2003-86006 (Patent Document 6) includes ““ a plurality of LEDs; and a lighting device that controls lighting of the LEDs ”, and the LEDs are substantially in the same plane as the lighting device. An LED lighting device (Claim 1) arranged around the lighting device, wherein “the LEDs are intermittently arranged in a ring shape, and the light distribution control member is arranged along the arrangement direction of the LEDs. The narrow-angle light distribution part and the wide-angle light distribution part are alternately formed, and the light distribution control member has a position where the narrow-angle light distribution part faces the LED and a position where the wide-angle light distribution part faces the LED. LED lighting device provided so as to be freely switchable to and from (Claim 5) ".
特開２０１１−６６３０７号公報（特許文献７）に、「「光学素子を用いて配光制御性を確保しつつ、被照射面での光の照度むらを低減することが可能な発光装置を提供することにある。（段落番号００１２）」とし、「複数個の発光素子を備えた光源部と、該光源部の少なくとも一部を内部に配置し、内面が前記光源部からの光を外部に反射する反射面を回転面とする光学素子と、を有する発光装置であって、前記光学素子の前記内部における光源部は、前記回転面の回転軸に沿って長手方向が配される多角形状の柱状体と、該柱状体を囲み、該柱状体の側面に配置された前記発光素子が発光する光の少なくとも一部を吸収して波長変換した光を発する光変換部材とを有することを特徴とする。（段落番号００１３）」という発光装置の記載がある。 Japanese Laid-Open Patent Publication No. 2011-66307 (Patent Document 7) provides “a light-emitting device capable of reducing unevenness of light illuminance on an irradiated surface while ensuring light distribution controllability using an optical element. (Paragraph number 0012) ”,“ a light source portion having a plurality of light emitting elements and at least a part of the light source portion are disposed inside, and an inner surface transmits light from the light source portion to the outside. An optical element having a reflecting surface as a rotating surface, wherein the light source section inside the optical element has a polygonal shape whose longitudinal direction is arranged along the rotation axis of the rotating surface. A columnar body; and a light conversion member that surrounds the columnar body and emits light that has undergone wavelength conversion by absorbing at least part of the light emitted by the light emitting element disposed on a side surface of the columnar body. (Paragraph number 0013) " There is.
しかし、特許文献１、特許文献２、特許文献６は高輝度、大出力とするために、複数のＬＥＤを用いているが、個々のＬＥＤから発光する光分布が不均一であって明暗を生じ、配光性も制御できないという欠点がある。 However, Patent Document 1, Patent Document 2, and Patent Document 6 use a plurality of LEDs in order to achieve high luminance and high output, but the light distribution emitted from each LED is uneven and light and dark. However, there is a drawback that the light distribution cannot be controlled.
また、特許文献４は、配光性を制御しているが、カメラ等の小出力で近距離の配光性しか制御できないなどの問題がある。
特許文献７では、大出力、配光制御性を確保しつつ、被照射面での光の照度むらを低減することが可能な発光装置を提供しているが、「配線基板６の中央部に立設した多角形状の柱状体３と、柱状体３の各側面３ａそれぞれ配置され各別に複数個のＬＥＤチップ１が実装された複数枚の実装基板５と、柱状体３の長手方向に沿って柱状体３の外周を覆うように配置される円筒形状の光変換部材４とを備えている。（段落番号００４２）」という複雑な構造を有し、放熱性、メンテナス、コストなどの問題がある。Moreover, although patent document 4 is controlling light distribution, there exists a problem that only short distance light distribution can be controlled with small outputs, such as a camera.
Patent Document 7 provides a light-emitting device that can reduce unevenness in the illuminance of light on an irradiated surface while ensuring high output and light distribution controllability. Along a standing polygonal columnar body 3, a plurality of mounting substrates 5 each having a plurality of LED chips 1 mounted on each side surface 3 a of the columnar body 3, and along the longitudinal direction of the columnar body 3. And a cylindrical light conversion member 4 disposed so as to cover the outer periphery of the columnar body 3. (Paragraph No. 0042) ”has a complicated structure and has problems such as heat dissipation, maintenance, and cost. .
スタディアム用の投光装置等、ロケーション用スポットライト等、体育館等の大空間用の照明に用いることができる大出力、高輝度照明装置として、特許文献５などのメタルハライドランプや水銀灯がもちいられているが、複雑な構造であり、破損し易く、大電力を消費するという課題がある。As a high-power, high-intensity lighting device that can be used for lighting in large spaces such as gymnasiums, such as spotlights for stadiums, spotlights for locations, etc., metal halide lamps and mercury lamps such as Patent Document 5 are used However, it has a complicated structure, is easily damaged, and consumes a large amount of power.
本発明は、高輝度、大出力の平面発光単一型の光源であり、それを用いて近距離、遠距離に到達する配光性を制御できるＬＥＤ照明装置を提供しようとするものである。 The present invention is intended to provide an LED lighting device that is a single light source of high luminance and high output, and that can control light distribution reaching a short distance and a long distance.
本願発明者は、鋭意研究の結果、ベアチップ状態の複数の発光素子を熱伝導性の高い金属等の基板に直接に接合、接着することにより、発光素子からの放熱を金属等の基板に及び封止枠に伝熱し、ヒートシンクや放熱フィンを介して排熱されることで、これを点光源とするレンズ系による配光性を制御することにより発明を完成し、上記課題を解決した。すなわち、 As a result of diligent research, the inventor of the present application has directly sealed and bonded a plurality of light emitting elements in a bare chip state to a metal substrate having high thermal conductivity, and thus has released heat from the light emitting element to the metal substrate. The invention was completed by controlling the light distribution by a lens system using this as a point light source by transferring heat to the stop frame and exhausting heat through a heat sink or heat radiating fin, and solved the above problems. That is,
本発明は、複数の大出力発光素子を金属基板・封止枠、等に接合する光源とレンズ系とで構成とし、ヒートシンクや放熱フィンを介して排熱されることで、発光素子を高密度に集積しても、蓄熱が抑制され、効率よく、持続的に発光することができ、また、封止材に蛍光体を分散することで蛍光体の粒子が光源となり、あたかも封止枠内が単一光源のように作用することで、平面発光単一型光源とみなし、これを点光源とするレンズ系による配光性を制御することにより、高い伝熱性と熱輸送及び平面発光の光源を配光制御するという作用機構によって、照度むらのない、近距離、遠距離の配光性を制御した、高輝度、大出力の新規なＬＥＤ照明装置を実現したものである。 The present invention comprises a light source and a lens system for joining a plurality of high-power light-emitting elements to a metal substrate, a sealing frame, etc., and the heat is exhausted through a heat sink or a heat radiating fin, thereby increasing the density of the light-emitting elements. Even if accumulated, heat storage is suppressed, and light can be emitted efficiently and continuously, and by dispersing the phosphor in the sealing material, the phosphor particles serve as a light source, as if the inside of the sealing frame is single. By acting like a single light source, it is regarded as a flat light source single light source, and by controlling the light distribution by a lens system using this as a point light source, a light source with high heat transfer and heat transport and flat light emission is arranged. A novel LED lighting device with high brightness and high output is realized by controlling the light distribution of short distance and long distance without unevenness of illuminance by the action mechanism of light control.
本発明の照明装置は、
金属基板と、
回路基板と、
前記金属基板の表面に直接接合されるベアチップ状態の複数の発光素子と、
前記金属基板の表面上に密着する封止枠であると共に前記回路基板の全部又は一部と配線接続された複数の発光素子との周囲を囲む封止枠と、
前記封止枠内部において、前記発光素子と接触しつつ前記発光素子を封止する封止材と、を備え、
前記封止材は、蛍光体を含むことができる透明材もしくは半透明材であると共にその上面は、平面形状を有し、
前記発光素子の発する光を平面発光に変換して行い、
前記金属基板が、熱伝導率「Ｗ／（ｍ＊Ｋ）」が１００〜１０，００の範囲である金属、合金、半導体化合物、炭素のそれぞれを板状にしたものから選ばれた少なくとも一つであり、
プラスチックフィルムに熱伝導性のある網目状のものと複合した熱伝導性フィルムが、前記封止材の上層に積層され、
前記熱伝導性フィルムの上部に設置されるレンズ板を更に備え、
前記発光素子の発する光を平行光、拡散および集光の少なくとも一つを行なう。
The lighting device of the present invention is
A metal substrate;
A circuit board;
A plurality of light emitting elements in a bare chip state directly bonded to the surface of the metal substrate;
A sealing frame that is in close contact with the surface of the metal substrate and encloses the periphery of a plurality of light-emitting elements connected to all or a part of the circuit board;
A sealing material that seals the light emitting element in contact with the light emitting element inside the sealing frame; and
The sealing material is a transparent material or a translucent material that can contain a phosphor, and its upper surface has a planar shape,
There line is converted to a plane emission light emitted from the light emitting element,
The metal substrate is at least one selected from a metal, an alloy, a semiconductor compound, and carbon each having a thermal conductivity “W / (m * K)” in the range of 100 to 10,000 in a plate shape. And
A heat conductive film combined with a heat conductive network-like material is laminated on the upper layer of the sealing material,
Further comprising a lens plate installed on top of the thermally conductive film,
The light emitted from the light emitting element is subjected to at least one of parallel light, diffusion and light collection.
また、前記金属基板が、熱伝導率（Ｗ／ｍ＊Ｋ）が１００〜１０，００の範囲である金属、合金、半導体化合物、炭素のそれぞれを板状にしたものから選ばれた少なくとも一つのものを含む。とくに、前記金属基板が、真鍮、窒化アルミニウム、ガリウムナイトライド、アルミニウム、金、銀、銅、石炭、グラアァイト、ダイヤモンド、グラフィンから選ばれた少なくとも一つのものが好ましい。Further, the metal substrate has at least one selected from a metal, an alloy, a semiconductor compound, and a carbon plate each having a thermal conductivity (W / m * K) in the range of 100 to 10,000. Including things. In particular, the metal substrate is preferably at least one selected from brass, aluminum nitride, gallium nitride, aluminum, gold, silver, copper, coal, graphite, diamond, and graphene.
本発明の照明装置は、
前記封止材の上層に積層される熱伝導性フィルムを更に備え、
前記発光素子の発する光を平面単一発光として行なうものである。
更に前記熱伝導性フィルムが、熱伝導性のある網目状のものとの複合したもの及び／又は金属蒸着したものも含まれる。The lighting device of the present invention is
Further comprising a thermally conductive film laminated on the upper layer of the sealing material,
The light emitted from the light emitting element is emitted as a single plane light emission.
Further, the heat conductive film includes a composite with a heat conductive network and / or a metal deposited film.
本発明の照明装置は、
前記封止材の上部に設置されるレンズ板を更に備え、
前記発光素子の発する光を平行光、拡散および集光の少なくとも一つを行なうものである。The lighting device of the present invention is
Further comprising a lens plate installed on top of the sealing material,
The light emitted from the light emitting element is subjected to at least one of parallel light, diffusion and light collection.
本発明の照明装置は、
前記金属基板の裏面に密着、密接又は接着させるヒートシンク及び／又は放熱フィンを更に備えるものである。The lighting device of the present invention is
It further includes a heat sink and / or a heat radiating fin that is brought into close contact with, in close contact with, or adhered to the back surface of the metal substrate.
本発明の照明装置は、
前記金属基板の上面方向３０〜２００ｍｍを移動させることができるレンズ系機構を更に備えていることを特徴とするものである。The lighting device of the present invention is
It further comprises a lens system mechanism capable of moving the upper surface direction of the metal substrate of 30 to 200 mm.
本発明の照明装置は、
照明装置を包み囲むフードを更に備えていることを特徴とするものである。The lighting device of the present invention is
A hood surrounding the lighting device is further provided.
本発明の照明装置は、 ベアチップ状態の複数の発光素子を熱伝導性の高い金属等の基板に直接に接合、接着することにより、発光素子からの放熱を金属等の基板に及び封止枠に伝熱し、ヒートシンクや放熱フィンを介して排熱されることで、発光素子を高密度に集積することができるので、小型照明機器はもとより、スタディアム用の投光装置等、ロケーション用スポットライト等、体育館等の大空間用の大型で、大出力で、高輝度の照明装置とすることができる。
また、蓄熱が抑制され、発光素子集積部の温度上昇が抑制されるので、長時間の照明によっても照度の低下を起こさない。The illuminating device of the present invention directly couples and bonds a plurality of light emitting elements in a bare chip state to a metal substrate having high thermal conductivity, thereby dissipating heat from the light emitting element to the metal substrate and the sealing frame. By transferring heat and exhausting heat through heat sinks and heat dissipation fins, the light emitting elements can be integrated with high density, so not only small lighting equipment but also light projectors for stadiums, spotlights for locations, etc. A large-sized, large-output, high-luminance lighting device for a large space such as a gymnasium can be provided.
Moreover, since heat storage is suppressed and the temperature rise of the light emitting element integrated portion is suppressed, the illuminance does not decrease even with long-time illumination.
発光素子を高密度に集積することができること、封止材に蛍光体を分散することで蛍光体の粒子が光源となり、あたかも封止枠内が単一光源のように作用することにより、あたかも封止枠内が単一に平面発光した光源となり、照度ムラが殆ど生じなく、被照射体を優しく見ることができる。
また、平面発光単一型光源とみなし、これを点光源とするレンズ系による配光性を制御することにより、近距離、遠距離の照度分布を制御できるので、自動車道路や街灯などに使用することができる。It is possible to integrate the light emitting elements with high density, and by dispersing the phosphor in the sealing material, the phosphor particles serve as the light source, and the sealing frame acts as if it is a single light source. The inside of the stop frame is a light source that emits light in a single plane, and unevenness in illuminance hardly occurs, so that the irradiated object can be seen gently.
Also, it is considered as a flat light source single light source, and by controlling the light distribution by a lens system using this as a point light source, the illuminance distribution at short distance and long distance can be controlled. be able to.
本発明の照明装置に関する実施するための形態について記載する。
以下、ベアチップ状態の発光素子をＬＥＤベアチップといい、一般に市販されている封止材で封止されている発光素子をＬＥＤ素子という。The form for implementing regarding the illuminating device of this invention is described.
Hereinafter, a light emitting element in a bare chip state is referred to as an LED bare chip, and a light emitting element that is generally sealed with a commercially available sealing material is referred to as an LED element.
本発明の照明装置の光源部分を構成する概念図を図１に示す。
ＬＥＤベアチップ１２と金属基板１０と、回路基板１６と、封止枠２２と、封止材の層２０から構成されている。金属基板１０上に、ＬＥＤベアチップ１２を複数個直接接合する。金属基板１０は熱伝導率の高い材料が好ましく、例えば銅基板やアルミニューム基板を用いる。より詳しくは、熱伝導率（Ｗ／ｍ＊Ｋ）が１００〜１０，００の範囲である金属、合金、半導体化合物、炭素のそれぞれを板状にしたものから選ばれた少なくとも一つのものを含む。とくに、前記金属基板が、真鍮、窒化アルミニウム、ガリウムナイトライド、アルミニウム、金、銀、銅、石炭、グラアァイト、ダイヤモンド、グラフィンから選ばれた少なくとも一つのものが好ましい。The conceptual diagram which comprises the light source part of the illuminating device of this invention is shown in FIG.
The LED bare chip 12, the metal substrate 10, the circuit board 16, a sealing frame 22, and a sealing material layer 20 are included. A plurality of LED bare chips 12 are directly bonded on the metal substrate 10. The metal substrate 10 is preferably made of a material having a high thermal conductivity. For example, a copper substrate or an aluminum substrate is used. More specifically, it includes at least one selected from a metal, an alloy, a semiconductor compound, and a carbon plate each having a thermal conductivity (W / m * K) in the range of 100 to 10,000. . In particular, the metal substrate is preferably at least one selected from brass, aluminum nitride, gallium nitride, aluminum, gold, silver, copper, coal, graphite, diamond, and graphene.
ＬＥＤベアチップの実装は、従来は例えばシリコーン系の樹脂を用いるが、通常シリコーン系樹脂の熱伝導率は１ｗ／ｍ・Ｋ程度であり、排熱上の問題を有していた。
本実施例では熱伝導率の高いＡｕ薄膜１４をチップの実装面および対応する金属基板表面上に形成し、チップボンダーにより金属接合し、固定する。
金属基板１０上のチップ実装領域外には、ＬＥＤベアチップ１２に電圧を供給するための回路線を有する回路基板１６を固定し、回路基板上の電極パッドおよびチップ上の電極パッド間をＡｕワイヤ線１８によりワイヤボンディングを行う。Conventionally, for example, a silicone-based resin is used for mounting the LED bare chip. However, the thermal conductivity of the silicone-based resin is usually about 1 w / m · K, which has a problem of exhaust heat.
In this embodiment, an Au thin film 14 having high thermal conductivity is formed on the chip mounting surface and the corresponding metal substrate surface, and is metal-bonded and fixed by a chip bonder.
A circuit board 16 having a circuit line for supplying a voltage to the LED bare chip 12 is fixed outside the chip mounting area on the metal substrate 10, and an Au wire line is provided between the electrode pad on the circuit board and the electrode pad on the chip. Wire bonding is performed by 18.
ワイヤボンディング後チップ実装領域にシリコーン系封止樹脂に蛍光体を添加した封止材を用いて、ＬＥＤベアチップ１２と接触しつつ、覆うように充填し、この後、例えば１５０℃程度でキュアさせて蛍光体を分散させた封止材の層２０を形成する。封止材の層２０はＬＥＤベアチップ１２の表面と略平行になるように形成することにより、優れた平面発光する光源を実現することができた。更に、熱伝導性フィルムを封止材の層２０の上層に積層する。熱伝導性フィルムは、プラスチックフィルムに金属を蒸着したもの、あるいは熱伝導性のある網目状のものとの複合したものを用いるとことも好ましい。
さらに、封止材の層２０の上部及び／又は熱伝導性フィルムの上部にレンズ板を設置すると、レンズの性質により平行光、拡散および集光させることができる。After wire bonding, the chip mounting area is filled with a sealing material obtained by adding a phosphor to a silicone-based sealing resin while being in contact with the LED bare chip 12, and then cured at, for example, about 150 ° C. The sealing material layer 20 in which the phosphor is dispersed is formed. By forming the encapsulant layer 20 so as to be substantially parallel to the surface of the LED bare chip 12, it was possible to realize an excellent light source emitting flat light. Furthermore, a heat conductive film is laminated | stacked on the upper layer of the layer 20 of a sealing material. It is also preferable to use a thermally conductive film obtained by vapor-depositing a metal on a plastic film or a composite of a thermally conductive network.
Furthermore, if a lens plate is installed on the upper part of the sealing material layer 20 and / or the upper part of the heat conductive film, parallel light, diffusion and condensing can be performed depending on the property of the lens.
封止枠２２は封止材の層２０を形成する領域を規定するために配置する。また、封止枠２２はＬＥＤベアチップ１２からの発光および蛍光体で波長変換された発光を反射させ、光の出射方向に有効に光を取り出すための機能を兼備することができる。
封止枠２２と金属基板１０および回路基板１６との位置関係を図２に従って説明する。図２の形態では、封止枠２２の一部は回路基板１６と接するが、その一部は金属基板１０と密着する構造とした。勿論、封止枠２２の全体が金属基板１０と密着するように、回路基板１６を包含するように配置することも可能である。実施の形態１によれば、チップ実装面に形成したＡｕ等の金属薄膜と、対応した金属基板１０上に形成したＡｕ等の金属薄膜との金属接合層１４により、ＬＥＤベアチップからの発熱が、例えば銅製の金属基板１０に有効に熱拡散され、金属基板１０により放熱される。更に金属製封止枠２２の少なくともその一部が金属基板１０に密着していることにより、封止枠２２は放熱器としても有効に機能する。The sealing frame 22 is disposed to define a region where the sealing material layer 20 is formed. In addition, the sealing frame 22 can reflect the light emitted from the LED bare chip 12 and the light converted in wavelength by the phosphor, and can also have a function for effectively extracting light in the light emission direction.
The positional relationship between the sealing frame 22, the metal substrate 10, and the circuit board 16 will be described with reference to FIG. In the form of FIG. 2, a part of the sealing frame 22 is in contact with the circuit board 16, but a part thereof is in close contact with the metal substrate 10. Of course, it is also possible to arrange the sealing frame 22 so as to include the circuit board 16 so that the entire sealing frame 22 is in close contact with the metal board 10. According to the first embodiment, the heat generated from the LED bare chip is caused by the metal bonding layer 14 of the metal thin film such as Au formed on the chip mounting surface and the metal thin film such as Au formed on the corresponding metal substrate 10. For example, the heat is effectively diffused to the copper metal substrate 10 and is radiated by the metal substrate 10. Furthermore, since at least a part of the metal sealing frame 22 is in close contact with the metal substrate 10, the sealing frame 22 effectively functions as a radiator.
実施の形態２は、実施の形態１の構成に排熱部２４を追加したものである。
排熱部２４は金属基板１０のＬＥＤベアチップ１２実装と反対の面に連結され、例えばＡｌに黒色アルマイト処理したものを使用した。金属基板１０と排熱部２４との連結は例えば真鍮の金属ネジ２６を使用し、金属ネジ穴部にＡｇ等の金属紛体を充填する事により熱伝導性を向上させた。また連結部に熱伝導性を有する熱拡散樹脂シートあるいはシリコーンオイルコンパウンド（図示せず）を使用した。更に金属基板１０に取り付け金具２８を連結することにより、取付け金具２８も放熱性向上に寄与するため、有効であった。例えば、消費電力１Ｗタイプのチップを１２０個実装し、発光部全体に１２０Ｗ投入した際の金属基板１０の裏面温度、排熱部２４の表面温度共に７０℃以下であり、実用上問題ない温度であることを確認した。In the second embodiment, an exhaust heat unit 24 is added to the configuration of the first embodiment.
The exhaust heat unit 24 is connected to the surface of the metal substrate 10 opposite to the mounting of the LED bare chip 12, and for example, Al that has been black-anodized is used. The metal substrate 10 and the exhaust heat part 24 are connected by using, for example, brass metal screws 26, and the metal screw holes are filled with a metal powder such as Ag to improve the thermal conductivity. Further, a thermal diffusion resin sheet or a silicone oil compound (not shown) having thermal conductivity was used for the connecting portion. Furthermore, by connecting the mounting bracket 28 to the metal substrate 10, the mounting bracket 28 also contributes to the improvement of heat dissipation, which is effective. For example, when 120 chips with a power consumption of 1 W are mounted and 120 W is charged to the entire light emitting part, the back surface temperature of the metal substrate 10 and the surface temperature of the exhaust heat part 24 are 70 ° C. or less, and there is no practical problem. I confirmed that there was.
実施の形態３は、実施の形態２にレンズ３０とレンズ３０を固定するための支柱３２を追加したものである。光度（カンデラｃｄ）の測定は、横河電機社製の照度計を用い、光源から１ｍ地点で照度（ｌｘ）を測定した。したがって、この光度は光源から１ｍ地点で測定した照度（ｌｘ）と一致する。
レンズ３０を具備しない場合、図５に示すように完全拡散面光源と同等の配光特性を示した。均一で広角の照度分布が得られる。これは平面発光していることを示している。近距離照射が必要な場合に適している。
本実施例では遠距離照射を実現するための一形態を示す。レンズ３０として例えば焦点距離１３０ｍｍ、レンズ直径１８５ｍｍのフレネルレンズを使用した場合の配光特性を図６に示す。また封止枠に囲まれた発光部領域は略５０ｍｍ×５０ｍｍである。図６の横軸は光源の光軸上に対する水平角度を示す。
縦軸には水平角度に対する光度を示している。
レンズ３０がない場合には図５で説明した通り、完全拡散面光源と同等な広角の照度分布となるが、レンズ３０を構成することにより、図６のレンズ付きの如き照度分布を実現することができる。In the third embodiment, a lens 30 and a support 32 for fixing the lens 30 are added to the second embodiment. The light intensity (candela cd) was measured by using an illuminometer manufactured by Yokogawa Electric Corporation and measuring the illuminance (lx) at a point of 1 m from the light source. Therefore, this luminous intensity matches the illuminance (lx) measured at 1 m from the light source.
In the case where the lens 30 was not provided, the light distribution characteristic equivalent to that of the completely diffusing surface light source was shown as shown in FIG. Uniform and wide-angle illumination distribution can be obtained. This indicates that planar light emission occurs. Suitable for short distance irradiation.
In this embodiment, an embodiment for realizing long-distance irradiation is shown. FIG. 6 shows the light distribution characteristics when, for example, a Fresnel lens having a focal length of 130 mm and a lens diameter of 185 mm is used as the lens 30. The light emitting area surrounded by the sealing frame is approximately 50 mm × 50 mm. The horizontal axis in FIG. 6 indicates the horizontal angle with respect to the optical axis of the light source.
The vertical axis indicates the light intensity with respect to the horizontal angle.
When the lens 30 is not provided, as described with reference to FIG. 5, the illuminance distribution has a wide angle equivalent to that of a completely diffusing surface light source. However, the illuminance distribution as shown in FIG. Can do.
実際にこの構成で作成した照明器具を高さ８ｍの天井から吊り下げ、床面を照射したところ直下では１００ｌｘ以上の照度を得ることができた。
図６に示した照度分布は一例であり、レンズ３０の取付け高さ（光源からの高さともいう。）やレンズ直径によって、用途に応じた所望の照度分布を実現することができる。When the lighting fixture created with this configuration was actually suspended from a ceiling with a height of 8 m and irradiated on the floor surface, an illuminance of 100 lx or more was obtained immediately below.
The illuminance distribution shown in FIG. 6 is an example, and a desired illuminance distribution according to the application can be realized by the mounting height of the lens 30 (also referred to as the height from the light source) and the lens diameter.
実施の形態４は、実施の形態３の照明装置にフード３４を取り付けたものである。この照明装置を例えば吊り下げ用取付け金具３８により天井に吊り下げる。フード３４は光源からの出射光の配光を制御すると共に、金属基板１０に密着させる取付け金具２８と一体化させることにより、高い放熱効果を得ることができた。この結果、フード３４で覆う、かかる構造においても実施例２の場合と同等以下の温度分布を実現することが可能となり、コンパクトで、製品デザイン的にも好適な形態を実現することができた。
更にフード３４の他の効果としてレンズ３０との組合せにおいて、様々な配光特性を提供することができる。図８には、フード３４とレンズ３０とを組合せた場合の配光特性を示す。レンズ３０としては、焦点距離１３０ｍｍ、レンズ直径１８５ｍｍのフレネルレンズを使用した。図８において、レンズ３０の取付け高さを高くするほど、出射光のビームは狭角となる。少なくともレンズ３０の焦点距離高さまでは単調にビーム角が狭角となることを確認した。In the fourth embodiment, a hood 34 is attached to the illumination device of the third embodiment. This illuminating device is suspended from the ceiling by, for example, a suspension mounting bracket 38. The hood 34 was able to obtain a high heat dissipation effect by controlling the light distribution of the emitted light from the light source and integrating it with the mounting bracket 28 that is in close contact with the metal substrate 10. As a result, even in such a structure covered with the hood 34, a temperature distribution equal to or lower than that in the case of Example 2 can be realized, and a compact and suitable product design can be realized.
Further, as another effect of the hood 34, various light distribution characteristics can be provided in combination with the lens 30. FIG. 8 shows light distribution characteristics when the hood 34 and the lens 30 are combined. As the lens 30, a Fresnel lens having a focal length of 130 mm and a lens diameter of 185 mm was used. In FIG. 8, the higher the mounting height of the lens 30, the narrower the beam of emitted light. It was confirmed that the beam angle is monotonously narrow at least when the focal length of the lens 30 is high.
また出射光の横方向の広がりに関しては、フード３４の傾斜角とレンズ３０の取付け高さにより制御することができる。またレンズ３０の焦点距離を変えることにより、所望のビーム角を得るための取付け高さを変えることができるため、照明設計の自由度は格別に高くなった。本願により得られる一つの効果としては、レンズ３０の光源からの距離を規定する支柱３２の高さを変えることにより、一枚のレンズにより容易に様々な配光特性、照度分布を実現できることにある。 Further, the lateral spread of the emitted light can be controlled by the inclination angle of the hood 34 and the mounting height of the lens 30. Further, since the mounting height for obtaining a desired beam angle can be changed by changing the focal length of the lens 30, the degree of freedom in lighting design has been remarkably increased. One effect obtained by the present application is that various light distribution characteristics and illuminance distributions can be easily realized by a single lens by changing the height of the support column 32 that defines the distance of the lens 30 from the light source. .
１０ 金属基板
１２ ＬＥＤベアチップ
１４ Ａｕ薄膜
１６ 回路基板
１８ Ａｕワイヤ線
２０ 封止材の層
２２ 封止枠
２４ 排熱部
２６ 金属ネジ
２８ 取付け金具
３０ レンズ
３２ 支柱
３４ フード
３８ 吊り下げ用取付け金具DESCRIPTION OF SYMBOLS 10 Metal substrate 12 LED bare chip 14 Au thin film 16 Circuit board 18 Au wire wire 20 Sealing material layer 22 Sealing frame 24 Heat exhaust part 26 Metal screw 28 Mounting bracket 30 Lens 32 Support column 34 Hood 38 Hanging mounting bracket
Claims (5)
回路基板と、
前記金属基板の表面に直接接合されるベアチップ状態の複数の発光素子と、
前記金属基板の表面上に密着する封止枠であると共に前記回路基板の全部又は一部と配線接続された複数の発光素子との周囲を囲む封止枠と、
前記封止枠内部において、前記発光素子と接触しつつ前記発光素子を封止する封止材と、を備え、
前記封止材は、蛍光体を含むことができる透明材もしくは半透明材であると共にその上面は、平面形状を有し、
前記発光素子の発する光を平面発光に変換して行い、
前記金属基板が、熱伝導率「Ｗ／（ｍ＊Ｋ）」が１００〜１０，００の範囲である金属、合金、半導体化合物、炭素のそれぞれを板状にしたものから選ばれた少なくとも一つであり、
プラスチックフィルムに熱伝導性のある網目状のものと複合した熱伝導性フィルムが、前記封止材の上層に積層され、
前記熱伝導性フィルムの上部に設置されるレンズ板を更に備え、
前記発光素子の発する光を平行光、拡散および集光の少なくとも一つを行なう、照明装置。 A metal substrate;
A circuit board;
A plurality of light emitting elements in a bare chip state directly bonded to the surface of the metal substrate;
A sealing frame that is in close contact with the surface of the metal substrate and encloses the periphery of a plurality of light-emitting elements connected to all or a part of the circuit board;
A sealing material that seals the light emitting element in contact with the light emitting element inside the sealing frame; and
The sealing material is a transparent material or a translucent material that can contain a phosphor, and its upper surface has a planar shape,
There line is converted to a plane emission light emitted from the light emitting element,
The metal substrate is at least one selected from a metal, an alloy, a semiconductor compound, and carbon each having a thermal conductivity “W / (m * K)” in the range of 100 to 10,000 in a plate shape. And
A heat conductive film combined with a heat conductive network-like material is laminated on the upper layer of the sealing material,
Further comprising a lens plate installed on top of the thermally conductive film,
An illumination device that performs at least one of parallel light, diffusion, and condensing on the light emitted from the light emitting element .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011174361A JP5898881B2 (en) | 2011-07-24 | 2011-07-24 | Lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011174361A JP5898881B2 (en) | 2011-07-24 | 2011-07-24 | Lighting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013026207A JP2013026207A (en) | 2013-02-04 |
| JP5898881B2 true JP5898881B2 (en) | 2016-04-06 |
Family
ID=47784277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011174361A Expired - Fee Related JP5898881B2 (en) | 2011-07-24 | 2011-07-24 | Lighting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5898881B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101734441B1 (en) | 2014-12-19 | 2017-05-11 | 엘지디스플레이 주식회사 | Transparent Organic EL Display Devices |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2986888B1 (en) * | 2013-03-27 | 2023-02-22 | OLEDWorks GmbH | Retrofit organic light emitting diode (oled) light source |
| HK1192818A2 (en) * | 2013-07-04 | 2014-08-29 | 澳洲新思動力有限公司 | Par lamp with improved heat dissipation par |
| KR101570969B1 (en) * | 2014-07-10 | 2015-11-23 | 알미늄프라자 주식회사 | Lighting apparatus |
| CN104763901B (en) * | 2015-03-31 | 2017-06-06 | 东莞市闻誉实业有限公司 | Led daylight lamp |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004128444A (en) * | 2002-07-31 | 2004-04-22 | Shin Etsu Handotai Co Ltd | Light emitting device and lighting device using it |
| US20050225222A1 (en) * | 2004-04-09 | 2005-10-13 | Joseph Mazzochette | Light emitting diode arrays with improved light extraction |
| JP2008016341A (en) * | 2006-07-06 | 2008-01-24 | Ri Bunsu | Led lighting device having high uniformity |
| JP5029893B2 (en) * | 2007-07-06 | 2012-09-19 | 東芝ライテック株式会社 | Light bulb shaped LED lamp and lighting device |
| JP2011134652A (en) * | 2009-12-25 | 2011-07-07 | Seiwa Electric Mfg Co Ltd | Lighting fixture |
-
2011
- 2011-07-24 JP JP2011174361A patent/JP5898881B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101734441B1 (en) | 2014-12-19 | 2017-05-11 | 엘지디스플레이 주식회사 | Transparent Organic EL Display Devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013026207A (en) | 2013-02-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8696169B2 (en) | Light emitting diode lamp source | |
| US8506135B1 (en) | LED light engine apparatus for luminaire retrofit | |
| US9068701B2 (en) | Lamp structure with remote LED light source | |
| KR101227527B1 (en) | Lighting apparatus | |
| WO2011055659A1 (en) | Large led lighting apparatus | |
| JP2013531367A (en) | LED light source and manufacturing method thereof | |
| JP2006244725A (en) | Led lighting system | |
| JP5898881B2 (en) | Lighting device | |
| JP4096927B2 (en) | LED lighting source | |
| KR20130092211A (en) | Lighting fixture using lighting emitting diode | |
| US8789974B2 (en) | Lighting device | |
| KR101244854B1 (en) | Dissipative assembly to emit the heat caused from LED blub lights | |
| KR200451022Y1 (en) | Led lamp structure for improving radiation heat and illumination efficiency | |
| WO2016029808A1 (en) | Light emission and heat dissipation structure of led light source and light emission and heat dissipation method therefor | |
| KR101474994B1 (en) | LED Light Apparatus | |
| JP2015111497A (en) | Lamp | |
| JP2011181252A (en) | Lighting fixture | |
| RU81599U1 (en) | LED LIGHT LAMP | |
| JP5742629B2 (en) | LIGHT EMITTING DEVICE AND LIGHTING APPARATUS HAVING THE SAME | |
| JP3177084U (en) | Combination heat dissipation structure for LED bulbs | |
| US20130099668A1 (en) | Led lamp with an air-permeable shell for heat dissipation | |
| JP5649462B2 (en) | Lighting device | |
| JP2003288806A (en) | Lighting device | |
| WO2017138538A1 (en) | Illumination fixture | |
| TWI432674B (en) | Lighting apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20140630 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140701 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20140703 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150326 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150421 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150516 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150721 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150828 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160301 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160307 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5898881 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313532 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |