TWI543405B - Light-emitting module - Google Patents

Light-emitting module Download PDF

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TWI543405B
TWI543405B TW104106462A TW104106462A TWI543405B TW I543405 B TWI543405 B TW I543405B TW 104106462 A TW104106462 A TW 104106462A TW 104106462 A TW104106462 A TW 104106462A TW I543405 B TWI543405 B TW I543405B
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light
electrode
substrate
disposed
top surface
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TW104106462A
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Chinese (zh)
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TW201530826A (en
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陳澤澎
任益華
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廣鎵光電股份有限公司
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Description

發光模組Light module

本發明關於一種發光裝置,且特別是指一種具有高發光效率且製程簡易的發光模組,可進一步作為球燈泡的光源使用。 The invention relates to a light-emitting device, and in particular to a light-emitting module with high luminous efficiency and simple process, which can be further used as a light source of a bulb.

相較於其他的照明技術,發光二極體屬於固態的冷發光,具有低耗電量、壽命長、無須暖燈時間、反應快等優點,因此被視為第四世代的照明技術,但是目前發光二極體普及化所面臨的挑戰就是發光效率與製造成本的問題,尤其是使用多顆發光二極體時,更必須考慮到整體結構的散熱效能,才能避免亮度下降及封裝材料劣化的問題,進而維持其功能與使用壽命。 Compared with other lighting technologies, LEDs are solid-state cold light, have low power consumption, long life, no need for warm-light time, fast response, etc., so they are regarded as the fourth generation of lighting technology, but currently The challenge of universalization of light-emitting diodes is the problem of luminous efficiency and manufacturing cost. Especially when using multiple light-emitting diodes, it is necessary to consider the heat dissipation performance of the overall structure to avoid the problem of brightness degradation and deterioration of packaging materials. To maintain its function and service life.

目前的發光二極體燈泡(LED Lamp),多半是將發光二極體分別封裝完成後再設置於電路板上,但這種設計無法將發光二極體進行高密度的排列,在燈泡體積有限的情況下會引起結構設計上的困難,因此,現有的解決方案仍然未臻成熟而有待改進的必要。 At present, LED light bulbs are mostly packaged on a circuit board after the LEDs are packaged separately, but this design cannot arrange the light-emitting diodes at a high density, and the bulb volume is limited. In this case, structural design difficulties are caused. Therefore, the existing solutions are still in need of maturity and need to be improved.

本發明之主要目的在於提供一種發光模組,利用半導體封裝製程直接製成,兼顧高發光效率與低製作成本。 The main object of the present invention is to provide a light-emitting module which is directly fabricated by using a semiconductor packaging process, which has high luminous efficiency and low manufacturing cost.

本發明之另一目的在於提供一種發光模組,具有簡易的結構與較小的體積,能夠直接作為球燈泡的光源使用。 Another object of the present invention is to provide a light-emitting module which has a simple structure and a small volume and can be directly used as a light source of a bulb.

為達成上述目的,本發明所提供一種發光模組包含有:具有頂面的基板;分開設置於頂面上的第一電極及第二電極;設於頂面上的複數個發光元件,且發光元件電性連接第一電極和該第二電極;蓋體,位於基板上且覆蓋複數個發光元件,暴露至少一部份第一電極和第二電極;基座,連接第一電極及/或第二電極。 In order to achieve the above object, a light emitting module includes: a substrate having a top surface; a first electrode and a second electrode separately disposed on the top surface; a plurality of light emitting elements disposed on the top surface, and emitting The device is electrically connected to the first electrode and the second electrode; the cover body is disposed on the substrate and covers the plurality of light emitting elements to expose at least a portion of the first electrode and the second electrode; the base is connected to the first electrode and/or Two electrodes.

為達成上述目的,本發明所提供一種發光模組,其包含有:一基板,至少一電致發光元件設於該基板之頂面,一框柵,設於該基板之頂面,以及一透明蓋板覆蓋於該框柵,其中該基板的頂面設有分開的二電極,該電致發光元件是位於該等電極之間且電性連接該等電極,該框柵對應該電致發光元件設有至少一開槽。 To achieve the above objective, the present invention provides a light emitting module comprising: a substrate, at least one electroluminescent element disposed on a top surface of the substrate, a frame grid disposed on a top surface of the substrate, and a transparent a cover plate is disposed on the frame grid, wherein a top surface of the substrate is provided with two separate electrodes, and the electroluminescent element is disposed between the electrodes and electrically connected to the electrodes, and the frame grid corresponds to the electroluminescent element At least one slot is provided.

藉此,該發光模組的結構簡易而能利用半導體製程直接完成,該電致發光元件所發出的光線主要是經由該框柵與該透明蓋板而穿出。或者,本發明還可以利用二個發光模組疊合而形成一疊合結構,可以設計成共用同一蓋板或是共用同一基板,都可以達成增加光線發射角度的效果。 Therefore, the structure of the light-emitting module can be directly completed by using a semiconductor process, and the light emitted by the electroluminescent element is mainly passed through the frame grid and the transparent cover. Alternatively, the present invention can also use two light emitting modules to form a stacked structure, which can be designed to share the same cover or share the same substrate, and can achieve the effect of increasing the light emission angle.

本發明的較佳設計可以將該框柵直接成型於該基板之頂面,該第二電極設置於該基板頂面而延伸至該框柵頂緣,該透明蓋板是罩設於該二電極上,使製程更加簡化。此外,該基板與該透明蓋板還可以利用具可撓性材料製成,使該發光模組整體具有可撓性。 The preferred design of the present invention can directly form the frame grid on the top surface of the substrate. The second electrode is disposed on the top surface of the substrate and extends to the top edge of the frame. The transparent cover is disposed on the two electrodes. On, to make the process more simplified. In addition, the substrate and the transparent cover plate can also be made of a flexible material to make the light-emitting module as flexible as a whole.

本發明的較佳設計可以將該框柵之開槽填充有透光材料或光致發光材料,以發出特定波長範圍的光線。 A preferred design of the present invention can fill the slot of the frame grid with a light transmissive material or a photoluminescent material to emit light of a particular wavelength range.

為了提高該發光模組的發光角度,該基板可以為透光的材 質,而該框柵則可以利用透光且絕緣的材質。 In order to increase the illumination angle of the light emitting module, the substrate may be a light transmissive material. Quality, and the frame grid can be made of light-transmitting and insulating materials.

本發明的較佳設計是可以將該基板凸伸出該框柵與該透明蓋板而形成一插設端,以插設於一發光裝置而作為其光源使用。 A preferred design of the present invention is that the substrate can be protruded from the frame grid and the transparent cover to form an insertion end for insertion into a light-emitting device for use as a light source.

本發明的較佳設計可以將該透明蓋板表面塗部有螢光粉,或將該透明蓋板摻雜有螢光粉,以發出特定波長之光或不同色溫之白光,亦或該透明蓋板可為濾光材料,以發出特定波長範圍的光。 Preferably, the surface of the transparent cover plate is coated with phosphor powder, or the transparent cover plate is doped with phosphor powder to emit light of a specific wavelength or white light of different color temperatures, or the transparent cover. The plate can be a filter material to emit light of a particular wavelength range.

1、2‧‧‧發光模組 1, 2‧‧‧Lighting Module

3‧‧‧疊合結構 3‧‧‧Multilayer structure

5‧‧‧球燈泡 5‧‧‧Ball bulb

51‧‧‧基座 51‧‧‧Base

52‧‧‧透明罩 52‧‧‧Transparent cover

10‧‧‧基板 10‧‧‧Substrate

11‧‧‧絕緣層 11‧‧‧Insulation

12‧‧‧第一電極 12‧‧‧First electrode

13‧‧‧第二電極 13‧‧‧second electrode

14‧‧‧插設端 14‧‧‧Interface

15‧‧‧凹部 15‧‧‧ recess

16‧‧‧導電結構 16‧‧‧Electrical structure

20‧‧‧發光元件 20‧‧‧Lighting elements

21‧‧‧第一導電墊 21‧‧‧First conductive pad

22‧‧‧第二導電墊 22‧‧‧Second conductive pad

30‧‧‧框柵 30‧‧‧ frame

31‧‧‧開槽 31‧‧‧ slotting

40‧‧‧透明蓋板 40‧‧‧Transparent cover

41‧‧‧反射鍍膜 41‧‧‧Reflective coating

L‧‧‧長度方向 L‧‧‧ Length direction

W‧‧‧寬度方向 W‧‧‧Width direction

第一圖為本發明第一較佳實施例之立體分解圖。 The first figure is an exploded perspective view of a first preferred embodiment of the present invention.

第二圖為本發明第一較佳實施例之組合圖。 The second figure is a combination diagram of the first preferred embodiment of the present invention.

第三圖為本發明第一較佳實施例之剖視圖。 The third figure is a cross-sectional view of a first preferred embodiment of the present invention.

第四圖為本發明第二較佳實施例之剖視圖。 Figure 4 is a cross-sectional view showing a second preferred embodiment of the present invention.

第五圖為本發明第三較佳實施例之剖視圖。 Figure 5 is a cross-sectional view showing a third preferred embodiment of the present invention.

第六圖為本發明第三較佳實施例作為球燈泡光源之立體圖。 Figure 6 is a perspective view of a bulb light source in accordance with a third preferred embodiment of the present invention.

第七圖為本發明第四較佳實施例之立體圖。 Figure 7 is a perspective view of a fourth preferred embodiment of the present invention.

第八圖為本發明第四較佳實施例之剖視圖。 Figure 8 is a cross-sectional view showing a fourth preferred embodiment of the present invention.

第九圖為本發明第四較佳實施例作為球燈泡光源之上視圖。 Figure 9 is a top plan view of a bulb light source in accordance with a fourth preferred embodiment of the present invention.

第十圖為本發明第五較佳實施例之立體分解圖。 Figure 11 is a perspective exploded view of a fifth preferred embodiment of the present invention.

第十一圖為本發明第六較佳實施例之剖視圖。 Figure 11 is a cross-sectional view showing a sixth preferred embodiment of the present invention.

為能更清楚地說明本發明,茲舉較佳實施例並配合圖示詳細說明如后,且以下說明當中所使用的頂面與底面等方向性說明文字是以本領域技術人員的一般認知而言,各實施例當中相同的元件皆使用相同的元 件編號,以方便辨識;同時,以下文中所對照之圖式,係表達與本發明特徵有關之示意,並未依據實際尺寸完整繪製,合先敘明。 In order to explain the present invention more clearly, the preferred embodiments are described in detail with reference to the drawings, and the directional descriptions of the top and bottom surfaces used in the following description are generally recognized by those skilled in the art. In other words, the same components in the embodiments use the same element. The parts are numbered for convenience of identification; at the same time, the drawings in the following texts are diagrams related to the features of the present invention, and are not completely drawn according to actual dimensions, and are described first.

本發明所提供一第一實施例之發光模組1,如第一至三圖所示,而第三圖為第二圖之A-A剖面圖,其包含有一基板10、複數個發光元件20設置於基板10頂面,一框柵30設置於基板10的頂面且圍繞該等發光元件20,以及一透明蓋板40罩設於框柵30上方,個別元件的具體結構說明如下: The light emitting module 1 of the first embodiment is provided as shown in the first to third figures, and the third drawing is a cross-sectional view of the AA of the second figure, which comprises a substrate 10, and a plurality of light emitting elements 20 are disposed on A top surface of the substrate 10, a frame grid 30 is disposed on the top surface of the substrate 10 and surrounds the light emitting elements 20, and a transparent cover 40 is disposed over the frame grid 30. The specific structure of the individual components is as follows:

基板10於本實施例中係採用導電且高導熱材質,例如金屬材料,或者採用絕緣且高導熱材質,例如氮化鋁(Aluminum Nitride)等陶瓷材料所製成,亦可視情況改用透光的材料,例如玻璃、石英、藍寶石(Sapphire,Al2O3)、壓克力或塑膠材料等,其中基板10厚度約介於0.1毫米~3毫米之間,最佳厚度約為0.7毫米,而基板10的頂面部分區域覆蓋有一絕緣層11,其絕緣層11係採用具有良好光反射特性的材料為較佳,可用以提供光線反射的功效,且基板10之頂面設有一第一電極12於絕緣層11未覆蓋的區域,以及一第二電極13設置於基板10頂面相對第一電極12的一側且位於絕緣層11上方,第一電極12、第二電極13可以採用蒸鍍、網版印刷及噴塗等製程完成,厚度約介於0.5~5微米之間,其最佳厚度約為2微米,而採用蒸鍍、網版印刷、噴塗所製成的電極,其具有精密度高、可透光性且厚度相當薄等優勢,可降低整體模組厚度,形成薄型發光模組,而在材料部分則可以使用鋁(Al)或銀(Ag)等高反射材料以減少電極吸光的效果。 In the embodiment, the substrate 10 is made of a conductive and high thermal conductive material, such as a metal material, or an insulating and high thermal conductive material, such as an aluminum nitride (Aluminum Nitride) ceramic material, and may also be translucent if necessary. Materials such as glass, quartz, sapphire (Sapphire, Al2O3), acrylic or plastic materials, etc., wherein the thickness of the substrate 10 is between about 0.1 mm and 3 mm, and the optimum thickness is about 0.7 mm, and the top of the substrate 10 The surface portion of the surface is covered with an insulating layer 11 , and the insulating layer 11 is preferably made of a material having good light reflection properties, and can be used to provide light reflection. The top surface of the substrate 10 is provided with a first electrode 12 on the insulating layer 11 . An uncovered region, and a second electrode 13 are disposed on a side of the top surface of the substrate 10 opposite to the first electrode 12 and above the insulating layer 11, and the first electrode 12 and the second electrode 13 may be vapor deposited, screen printed, and The spraying process is completed, the thickness is about 0.5~5 microns, and the optimum thickness is about 2 microns. The electrodes made by evaporation, screen printing and spraying have high precision and light transmission. Sex and thickness It is quite thin and can reduce the thickness of the whole module to form a thin-type light-emitting module. In the material part, high-reflection materials such as aluminum (Al) or silver (Ag) can be used to reduce the effect of electrode absorption.

該等發光元件20在本實施例中為發光二極體,排列設置於絕緣層11上方並位於第一電極12與第二電極13之間,其中各發光元件20表面設有一第一導電墊21與一第二導電墊22,所以能夠利用打線(Wire Bonding) 製程電性連接該等發光元件20而完成串聯或並聯,最後再將第一導電墊21與第二導電墊22同樣利用打線製程電性連接第一電極12與第二電極13。因此,透過第一電極12與第二電極13就能對該等發光元件20通入電流而使其發光。 In this embodiment, the light-emitting elements 20 are arranged in a light-emitting diode, and are arranged above the insulating layer 11 and between the first electrode 12 and the second electrode 13. The first conductive pad 21 is disposed on the surface of each of the light-emitting elements 20 . With a second conductive pad 22, it is possible to use wire bonding (Wire Bonding) The process is electrically connected to the light-emitting elements 20 to complete the series or parallel connection. Finally, the first conductive pads 21 and the second conductive pads 22 are electrically connected to the first electrode 12 and the second electrode 13 by a wire bonding process. Therefore, a current can be supplied to the light-emitting elements 20 through the first electrode 12 and the second electrode 13 to cause light to be emitted.

框柵30厚度約介於100微米~500微米之間,其最佳厚度約為300微米,並以高於發光元件20及其固晶材料(圖中未顯示)厚度,以及導電金屬線之高度總和為原則,框柵30為透光且絕緣材料如陶瓷、塑料、壓克力、藍寶石、玻璃或石英等所製成,框柵30是設置於第一電極12與第二電極13上方,且對應該等發光元件20設有至少一開槽31,在本實施例中開槽的數量為一個。附帶一提的是,本領域技術人員可以視需要設計開槽31的構型以將點光源轉換為線光源或面光源,或是於開槽31內填充透明材料以允許特定波長範圍的光線通過,或是填充光致發光材料(Photoluminescence)以發出特定波長頻譜的光線,此外由於本發明之框柵30係利用透光材料所製成,故其四面皆可透光,完全不會對光線的側向出光造成遮蔽的情形。 The frame grid 30 has a thickness of between about 100 micrometers and 500 micrometers, and an optimum thickness of about 300 micrometers, and is higher than the thickness of the light-emitting element 20 and its solid crystal material (not shown), and the height of the conductive metal line. According to the principle, the frame grid 30 is made of light and the insulating material is made of ceramic, plastic, acryl, sapphire, glass or quartz, and the frame grid 30 is disposed above the first electrode 12 and the second electrode 13, and The corresponding light-emitting element 20 is provided with at least one slit 31, and the number of slits in the present embodiment is one. Incidentally, those skilled in the art can design the slot 31 as needed to convert the point source into a line source or a surface source, or fill the slot 31 with a transparent material to allow light of a specific wavelength range to pass. Or, the photoluminescence is filled to emit light of a specific wavelength spectrum, and since the frame grid 30 of the present invention is made of a light-transmitting material, it can transmit light on all four sides without any light. Lateral light causes shadowing.

透明蓋板40厚度約介於0.05毫米~1.2毫米之間,最佳厚度約為0.7毫米,而透明蓋板40係罩設於框柵30的上方而封閉該等開槽31,可以使用玻璃、石英、藍寶石(Sapphire)或塑膠材料加以製作,最好具備高熱輻射的特性而能夠幫助散熱,亦即輻射係數(Emissivity)大於0.7為較佳,且透明蓋板40表面能塗佈有螢光粉(Phosphor),例如鋁酸鹽(Alminate)、釔鋁石榴石YAG(Y3Al3O13:Ce)、鋱鋁石榴石TAG(Tb3Al5O12)、矽酸鹽(Silicate)、氮化物(Nitride)或氮氧化物(Oxynitride)等基底螢光材料,或者是透明蓋板40直接摻雜有螢光粉,藉以發出特定波長之光或不同色溫之白 光。除此之外,本領域技術人員亦可改用濾光材料來製作透明蓋板40,以發出特定波長範圍的光。 The transparent cover 40 has a thickness of about 0.05 mm to 1.2 mm, and an optimum thickness of about 0.7 mm. The transparent cover 40 is disposed over the frame grid 30 to close the slots 31. Made of quartz, sapphire or plastic material, it is best to have high heat radiation characteristics to help dissipate heat, that is, an emissivity of more than 0.7 is preferred, and the surface of the transparent cover 40 can be coated with phosphor powder. (Phosphor), such as aluminate (Alminate), yttrium aluminum garnet YAG (Y3Al3O13: Ce), yttrium aluminum garnet TAG (Tb3Al5O12), silicate (Silicate), nitride (Nitride) or oxynitride (Oxynitride The base fluorescent material, or the transparent cover 40 is directly doped with phosphor powder, thereby emitting light of a specific wavelength or white of different color temperatures. Light. In addition, those skilled in the art can also use a filter material to fabricate the transparent cover 40 to emit light of a specific wavelength range.

此外,如第三圖所示,基板10定義有一長度方向L,在本實施例中第一電極12與第二電極13是設置於基板10沿著長度方向L的兩側,基板10靠近第二電極13的一側係沿著長度方向L延伸且凸出於框柵30與透明蓋板40,使基板10形成有裸露於外界的一插設端14,由於第一電極12是電性連接基板10,而且第二電極13藉由插設端14而部分裸露在外,所以當插設端14連接至一外部電源時(圖中未顯示),將可以藉由第二電極13與基板10同時提供正極與負極的電路連接構造。 In addition, as shown in the third figure, the substrate 10 defines a length direction L. In this embodiment, the first electrode 12 and the second electrode 13 are disposed on both sides of the substrate 10 along the length direction L, and the substrate 10 is adjacent to the second. One side of the electrode 13 extends along the length direction L and protrudes from the frame grid 30 and the transparent cover 40, so that the substrate 10 is formed with an insertion end 14 exposed to the outside, since the first electrode 12 is electrically connected to the substrate. 10, and the second electrode 13 is partially exposed by the insertion end 14, so when the insertion end 14 is connected to an external power source (not shown), it can be simultaneously provided by the second electrode 13 and the substrate 10. The circuit connection structure of the positive electrode and the negative electrode.

值得一提的是,該等發光元件20除了利用打線連接之外,也可以在基板10表面設置預定的導電線路,然後利用覆晶技術(Flip-Chip)而將該等發光元件20置放於基板10。 It should be noted that, in addition to the wire bonding, the light-emitting elements 20 may be provided with predetermined conductive lines on the surface of the substrate 10, and then the light-emitting elements 20 may be placed on the surface of the substrate 10 by Flip-Chip. Substrate 10.

藉由上述結構,發光模組1可以利用插設端14而對該等發光元件20通電而發光,所發射的光線是透過框柵30側向發光並透過透明蓋板40而頂向發光,當基板10為透明材料時則可以提供該等發光元件20底部所發出的光線穿過,所以本發明的發光模組1可以達成全面發光,大幅增加光取出率。 With the above configuration, the light-emitting module 1 can be powered by the insertion terminal 14 to emit light, and the emitted light is emitted laterally through the frame grid 30 and transmitted through the transparent cover 40 to emit light. When the substrate 10 is a transparent material, the light emitted from the bottom of the light-emitting elements 20 can be provided, so that the light-emitting module 1 of the present invention can achieve full light emission and greatly increase the light extraction rate.

此外,本實施例之發光模組1係利用具備高熱傳導特性的基板10以及具備高熱輻射係數的透明蓋板40,在可同時藉由傳導及輻射的散熱方式下,快速的將熱散出,使其具有相當良好的散熱效果,以提升發光模組1之使用壽命及效能。 In addition, the light-emitting module 1 of the present embodiment utilizes a substrate 10 having high heat conduction characteristics and a transparent cover 40 having a high heat radiation coefficient, and can quickly dissipate heat by heat dissipation by conduction and radiation. It has a very good heat dissipation effect to improve the service life and performance of the light-emitting module 1.

本發明再提供一第二實施例,如第四圖所示,其係應用與前 述第一實施例結構大致相同的二個發光模組1、2疊合而成一疊合結構3,主要特徵在於該二發光模組1、2是共用同一蓋板40,此時該等發光模組1、2的基板10為可透光,並於蓋板40的頂面與底面設置一反射鍍膜41,其材料可選用但不限於銀(Ag)、鋁(Al)、鉑(Pt)、金(Au)等金屬或布拉格反射器(Distributed Bragg Reflector,DBR),可以達成雙面發光的效果。 The present invention further provides a second embodiment, as shown in the fourth figure, which is applied before The two light-emitting modules 1 and 2 having the same structure in the first embodiment are stacked to form a stacked structure 3, and the main feature is that the two light-emitting modules 1 and 2 share the same cover 40, and the light-emitting modes are in this case. The substrate 10 of the groups 1 and 2 is permeable to light, and a reflective coating 41 is disposed on the top surface and the bottom surface of the cover 40. The material of the substrate 10 can be selected from, but not limited to, silver (Ag), aluminum (Al), platinum (Pt), A metal such as gold (Au) or a Bragg Reflector (DBR) can achieve the effect of double-sided illumination.

請參閱第五圖,本發明提供一第三實施例同樣應用與前述第一實施例結構大致相同的二個發光模組1、2疊合而成一疊合結構3,但該二發光模組1、2改為共用同一基板10,同樣可以達成雙面發光的效果,且基板10同樣如第一實施例設有一插設端14而可以插設於一發光裝置,例如球燈泡。 Referring to the fifth embodiment, the present invention provides a third embodiment. The two light-emitting modules 1 and 2 having substantially the same structure as the first embodiment are stacked to form a stacked structure 3, but the two light-emitting modules 1 are 2, the same as the same substrate 10, the same effect can be achieved, and the substrate 10 is also provided with a plug-in end 14 as in the first embodiment, and can be inserted into a light-emitting device, such as a bulb.

藉此,前述之疊合結構3可做為發光裝置的光源使用,如第六圖所示,球燈泡5具有一基座51與一透明罩52,而疊合結構3的插設端14係插入基座51,此時就能完成電性導通的連接,當球燈泡5連接至一外部電源(圖中未顯示)時,則順利點亮該等發光元件20,本發明之疊合結構3即可做為球燈泡5的光源使用。 Thereby, the foregoing superposed structure 3 can be used as a light source of the light-emitting device. As shown in the sixth figure, the bulb 5 has a base 51 and a transparent cover 52, and the insertion end 14 of the laminated structure 3 is Inserting the base 51, the electrical connection can be completed at this time, and when the ball bulb 5 is connected to an external power source (not shown), the light-emitting elements 20 are smoothly illuminated, and the laminated structure 3 of the present invention It can be used as the light source of the bulb 5 .

此外,本發明之球燈泡5的光源,並不限定於雙層發光模組疊合,亦可採用單層或多種不同組合之發光模組,來作為球燈泡5之光源使用。 In addition, the light source of the ball bulb 5 of the present invention is not limited to the double-layer light-emitting module stacking, and a single-layer or a plurality of different combinations of light-emitting modules may be used as the light source of the bulb 5 .

請再參閱第七與八圖所示,而第八圖為第七圖之B-B剖面圖,本發明提供一第四實施例之發光模組1,其主要結構大致與第一實施例相同,結構差異在於:基板10是利用絕緣材料製成而不需要設置絕緣層,且基板10另定義有與長度方向L相交的一寬度方向W,基板10一側係沿著寬 度方向W延伸且凸出於框柵30與透明蓋板40,進而使基板10形成有裸露於外界的插設端14,由於第一電極12與第二電極13係藉由插設端14而同時裸露在外,所以插設端14將可以同時提供正極與負極的電路連接構造。此外,如第八圖所示,框柵30開槽31之內周面係設呈朝遠離發光元件20方向而向外傾斜,使發光元件20所光線可在傾斜的內周面上產生多次反射,以提升整體之光取出率。 Please refer to the seventh and eighth figures, and the eighth figure is a BB cross-sectional view of the seventh figure. The present invention provides a light-emitting module 1 of a fourth embodiment, the main structure of which is substantially the same as that of the first embodiment. The difference is that the substrate 10 is made of an insulating material without providing an insulating layer, and the substrate 10 is further defined with a width direction W intersecting the longitudinal direction L, and the substrate 10 side is along the width. The first direction 12 and the second electrode 13 are formed by the insertion end 14 because the first electrode 12 and the second electrode 13 are formed by the insertion end 14 , and the frame 10 and the transparent cover 40 are formed. At the same time, it is exposed, so the insertion end 14 can provide the circuit connection structure of the positive electrode and the negative electrode at the same time. Further, as shown in the eighth embodiment, the inner peripheral surface of the slot 31 of the frame grid 30 is inclined outwardly away from the light-emitting element 20, so that the light of the light-emitting element 20 can be generated multiple times on the inclined inner peripheral surface. Reflection to increase the overall light extraction rate.

進一步說明的是,如第九圖所示,本發明第四實施例之發光模組1亦可以利用插設部14而插接在球燈泡5的基座51上,而基座51是可以供四個發光模組1插設其中,以提供全面發光的功效。 It is to be noted that, as shown in FIG. 9 , the light-emitting module 1 of the fourth embodiment of the present invention can also be inserted into the base 51 of the bulb 5 by means of the insertion portion 14 , and the base 51 can be provided. Four illumination modules 1 are inserted therein to provide full illumination.

本發明提供另一第五實施例,如第十圖所示,其主要結構大概與第一實施例相同,其主要差異在於:第一電極12與第二電極13係設置於基板10的同側而形成插設端14,且絕緣層11覆蓋基板10表面的全部面積,並利用一導電結構16連接於相距第一電極12及第二電極13較遠的相鄰二發光元件20;此外,該框柵30的開槽31數量為二個,且其開槽31之內周面皆為朝遠離發光元件20方向而向外傾斜以提升整體之光取出率。 The present invention provides another fifth embodiment. As shown in the tenth figure, the main structure is approximately the same as that of the first embodiment, and the main difference is that the first electrode 12 and the second electrode 13 are disposed on the same side of the substrate 10. The insertion end 14 is formed, and the insulating layer 11 covers the entire area of the surface of the substrate 10, and is connected to the adjacent two light-emitting elements 20 far from the first electrode 12 and the second electrode 13 by a conductive structure 16; The number of the slots 31 of the frame grid 30 is two, and the inner peripheral surfaces of the slots 31 are outwardly inclined away from the light-emitting element 20 to enhance the overall light extraction rate.

附帶一提,前述導電結構16僅為例示之用,亦可將導電結構省略,而將原本連接至導電結構16的二發光元件20直接作串聯或並聯設計,又或者一般半導體常用的電性連接手段均可以取代前述導電結構16而達成相同的效果。 Incidentally, the foregoing conductive structure 16 is for illustrative purposes only, and the conductive structure may be omitted, and the two light-emitting elements 20 originally connected to the conductive structure 16 are directly designed in series or in parallel, or commonly used in general semiconductors. Means can replace the aforementioned conductive structure 16 to achieve the same effect.

請參閱第十一圖所示,本發明提供一第六實施例,發光模組1同樣包含有一基板10、複數個發光元件20設於基板10頂面,一框柵30設置於基板10的頂面且圍繞該等發光元件20,以及一透明蓋板40罩設於框柵30 上方,但本實施例中基板10的頂面對應各發光元件20設有一凹部15以反射各發光元件20所發出的光線,而框柵30直接成型於基板10,第一電極12與第二電極13則是設置於基板10頂面且延伸至框柵30之頂緣,透明蓋板40則是罩設於部分第一電極12與部分第二電極13上,以使基板10沿著長度方向L的兩側可分別形成有裸露於外界的插設端14,由於第一電極12與第二電極13係藉由二插設端14而同時裸露在外,所以二插設端14將可以提供正極與負極的電路連接構造。藉此,本實施例的發光模組1具有更少的元件數量而使製程更加簡化,進而降低整體成本及尺寸。 As shown in FIG. 11 , the present invention provides a sixth embodiment. The light-emitting module 1 also includes a substrate 10 , a plurality of light-emitting elements 20 are disposed on the top surface of the substrate 10 , and a frame grid 30 is disposed on the top of the substrate 10 . And surrounding the light-emitting elements 20, and a transparent cover 40 is disposed on the frame grid 30 Above, in the embodiment, the top surface of the substrate 10 is provided with a recess 15 corresponding to each of the light-emitting elements 20 to reflect the light emitted by each of the light-emitting elements 20, and the frame grid 30 is directly formed on the substrate 10, the first electrode 12 and the second electrode. 13 is disposed on the top surface of the substrate 10 and extends to the top edge of the frame grid 30. The transparent cover 40 is disposed on the portion of the first electrode 12 and the portion of the second electrode 13 so that the substrate 10 is along the length direction. The two sides can be respectively formed with the insertion end 14 exposed to the outside. Since the first electrode 12 and the second electrode 13 are simultaneously exposed by the two insertion ends 14, the second insertion end 14 can provide the positive electrode and the second electrode 13 The circuit connection structure of the negative electrode. Thereby, the light-emitting module 1 of the embodiment has fewer components and the process is more simplified, thereby reducing the overall cost and size.

值得一提的是,前述第六實施例的發光模組1還可以選用具可撓性的材料來製成基板10與透明蓋板40,就可以使發光模組1整體具有可撓性。 It is to be noted that the light-emitting module 1 of the sixth embodiment can also be made of a flexible material to form the substrate 10 and the transparent cover 40, so that the entire light-emitting module 1 can be made flexible.

以上所述僅為本發明較佳可行實施例,本領域技術人員可以視情況設計電路基板而改變該等發光元件與該二電極的電性連接方式,仍應屬本發明之簡單改變,舉凡應用本發明說明書及申請專利範圍所為之等效結構變化,理應包含在本發明之專利範圍內。 The above description is only a preferred embodiment of the present invention. Those skilled in the art can design a circuit substrate to change the electrical connection manner between the light-emitting elements and the two electrodes, which should still be a simple change of the present invention. The equivalent structural changes of the present specification and claims are intended to be included in the scope of the present invention.

1‧‧‧發光模組 1‧‧‧Lighting module

10‧‧‧基板 10‧‧‧Substrate

11‧‧‧絕緣層 11‧‧‧Insulation

12‧‧‧第一電極 12‧‧‧First electrode

13‧‧‧第二電極 13‧‧‧second electrode

14‧‧‧插設部 14‧‧‧Internal Department

20‧‧‧發光元件 20‧‧‧Lighting elements

21‧‧‧第一導電墊 21‧‧‧First conductive pad

22‧‧‧第二導電墊 22‧‧‧Second conductive pad

30‧‧‧框柵 30‧‧‧ frame

31‧‧‧開槽 31‧‧‧ slotting

40‧‧‧透明蓋板 40‧‧‧Transparent cover

Claims (10)

一種發光模組,其包含有:一基板,具有一頂面;一框柵,直接成型於該頂面且設有一開槽;一第一電極及一第二電極,分開設置於該頂面上且延伸至該框柵的一頂緣;複數個發光元件,設於該頂面上,該複數個發光元件電性連接該第一電極和該第二電極且位於該開槽內;以及一蓋體,位於該基板上且覆蓋該複數個發光元件,暴露至少一部份該第一電極和該第二電極。 A light-emitting module includes: a substrate having a top surface; a frame grid directly formed on the top surface and having a slot; a first electrode and a second electrode are separately disposed on the top surface And extending to a top edge of the frame grid; a plurality of light-emitting elements are disposed on the top surface, the plurality of light-emitting elements are electrically connected to the first electrode and the second electrode and located in the slot; and a cover The body is disposed on the substrate and covers the plurality of light emitting elements to expose at least a portion of the first electrode and the second electrode. 如專利請求項第1項所述之發光模組,更包含一基座,連接該第一電極及/或該第二電極。 The illuminating module of claim 1, further comprising a pedestal connecting the first electrode and/or the second electrode. 如專利請求項第1項所述之發光模組,其中該蓋體罩設於該第一電極和該第二電極上。 The illuminating module of claim 1, wherein the cover is disposed on the first electrode and the second electrode. 如專利請求項第1項所述之發光模組,其中該基板與該蓋體利用具可撓性材料製成。 The lighting module of claim 1, wherein the substrate and the cover are made of a flexible material. 如專利請求項第1項所述之發光模組,其中該基板為透光的材質,且/或該框柵為透光且絕緣的材質。 The light-emitting module of claim 1, wherein the substrate is a light transmissive material, and/or the frame grid is a light transmissive and insulating material. 如專利請求項第1項所述之發光模組,其中該基板為高導熱材質, 該頂面的部分區域覆蓋有一絕緣層,該第一電極設於該絕緣層未覆蓋的區域,該第二電極設於該絕緣層上。 The illuminating module of claim 1, wherein the substrate is made of a high thermal conductivity material. A portion of the top surface is covered with an insulating layer, the first electrode is disposed on an uncovered region of the insulating layer, and the second electrode is disposed on the insulating layer. 如專利請求項第1項所述之發光模組,其中該基板是以絕緣材料製成。 The lighting module of claim 1, wherein the substrate is made of an insulating material. 如專利請求項第1項所述之發光模組,其中該蓋體表面塗佈有螢光粉,或該蓋體摻雜有螢光粉,或該蓋體為濾光材料。 The illuminating module of claim 1, wherein the surface of the cover is coated with phosphor powder, or the cover is doped with phosphor powder, or the cover is a filter material. 如專利請求項第1項所述之發光模組,其中該基板之該頂面對應各該發光元件設有一凹部。 The illuminating module of claim 1, wherein the top surface of the substrate is provided with a recess corresponding to each of the illuminating elements. 如專利請求項第1項所述之發光模組,其中該開槽之內周面係朝遠離該等發光元件方向而向外傾斜。 The lighting module of claim 1, wherein the inner peripheral surface of the slot is inclined outwardly away from the direction of the light emitting elements.
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