CN210107088U - LED filament and LED bulb - Google Patents

Abstract

An LED filament, comprising: a plurality of LED chip units; the LED lamp comprises a conductor, at least one LED chip unit is electrically connected with the conductor through a lead, and the included angle between the lead and the length direction of the filament is 30-120 degrees; and the electrode is configured corresponding to the LED unit and is electrically connected with the LED chip unit. The LED bulb lamp with the LED filament is further disclosed. The utility model discloses because of there is the contained angle in conductor or the wire of connecting LED chip unit and conductor and the length extending direction of LED filament, can effectively reduce the filament and exert oneself in the conductor sectional area when buckling, reduced the cracked probability of LED filament buckling simultaneously, promoted the whole quality of LED filament.

Description

LED filament and LED bulb

Technical Field

The utility model relates to the field of lighting, concretely relates to LED filament and LED ball bubble lamp of using thereof.

Background

Incandescent light bulbs have been widely used for decades for illumination in homes and businesses, however, incandescent light bulbs are generally less efficient in their energy usage, with approximately 90% of the energy input going to be dissipated as heat. And because incandescent bulbs have a very limited life (about 1,000 hours), they need to be replaced often. These conventional lamps are gradually replaced by other more efficient lamps, such as fluorescent lamps, high intensity discharge lamps, Light Emitting Diodes (LEDs), etc. Among these lamps, LED lamps are the most attractive lighting technology. The LED lamp has the advantages of long service life, small volume, environmental protection and the like, so the application of the LED lamp is continuously increased.

In recent years, an LED bulb lamp with an LED filament is available on the market. The LED bulb lamp using the LED filament as a luminous source in the market at present still has the following problems to be improved:

first, an LED hard filament is used having a substrate (e.g., a glass substrate) and a plurality of LED chips on the substrate. However, the lighting effect of the LED bulb lamp can be better only by combining a plurality of hard filaments, and the lighting effect of a single hard filament cannot meet the general demand in the market. Traditional ball bubble lamps and lanterns have the tungsten filament, can produce even light-emitting because the nature of the nature bendable of tungsten filament, however the effect of this kind of even light is difficult to reach to the hard filament of LED. There are many reasons why it is difficult to achieve this effect for the LED filament, except for the foregoing inflexibility, one of them is that the substrate can block the light emitted by the LED, and the light generated by the LED is a point light source, which can lead to light concentration. In contrast, a uniform light distribution results in a uniform illumination effect, while a concentrated light distribution results in an uneven and concentrated illumination effect.

In addition, there is also a soft filament of LED, which is similar to the above filament structure, and the glass substrate is partially replaced by a flexible substrate (hereinafter referred to as FPC), so that the filament can have a certain degree of bending. However, the soft filament made of the FPC has a thermal expansion coefficient different from that of the silica gel coating the filament, and the displacement and even the degumming of the LED chip are caused by long-term use; or the FPC is not favorable for flexible change of the process conditions and the like. In addition, the filament structure has the challenge to the stability of the metal routing between the chips when buckling, and when the arrangement of the chips in the filament is meticulous, if the adjacent LED chips are connected in a metal routing mode, the stress is easily over concentrated at the specific part of the filament due to the bending of the filament, so that the metal routing for connecting the LED chips is damaged or even broken.

In addition, the LED filament is generally disposed in the LED bulb, and in order to present an aesthetic feeling in appearance and to make an illumination effect of the LED filament more uniform and wide, the LED filament may be bent to present various curves. However, the LED filament has LED chips arranged therein, and the LED chips are relatively hard objects, so that the LED filament is difficult to bend into a desired shape. Further, the LED filament is also prone to cracking due to stress concentration during bending.

The existing LED bulb lamp is provided with a plurality of LED lamp filaments in order to increase aesthetic feeling in appearance and enable illumination effect to be more uniform, and the LED lamp filaments are set to be different placing angles. However, since a plurality of LED filaments need to be installed in a single LED bulb, and the LED filaments need to be individually fixed, the manufacturing process is more complicated, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

It is specifically noted that the present disclosure may actually include one or more of the presently claimed or as yet unclaimed versions, and that the various versions possible herein may be collectively referred to herein as "the present invention" in the course of writing the specification in order to avoid confusion due to unnecessary distinction between such possible versions.

This summary describes many embodiments relating to the "present invention". However, the term "present invention" is used merely to describe some embodiments disclosed in this specification (whether or not in the claims), and not a complete description of all possible embodiments. Certain embodiments of various features or aspects described below as "the present invention" may be combined in different ways to form an LED bulb or a portion thereof.

According to an embodiment of the utility model, a LED filament is disclosed, including LED section, conductor section, at least two electrodes and photoconversion layer, the conductor section is located between two adjacent LED sections, the electrode corresponds to the configuration of LED section, and the electric connection LED section, two adjacent LED sections are through conductor section mutual electric connection; the LED section comprises at least two LED chips which are electrically connected with each other through a wire; the light conversion layer covers the LED segment, the conductor segment and the electrodes and respectively exposes a part of the two electrodes.

Optionally, the conductor segment comprises a conductor connected to the LED segment, and the length of the wire is less than the length of the conductor.

Optionally, the light conversion layer may have at least a top layer and a base layer.

According to another embodiment of the present invention, an LED filament is disclosed, comprising a plurality of LED chip units, a conductor, at least two electrodes; two adjacent LED chip units are connected through the conductor, at least one LED chip unit is electrically connected with the conductor through a lead, the included angle between the lead and the filament in the length direction is 30-120 degrees, and the electrode is configured corresponding to the LED chip unit and is electrically connected with the LED chip unit.

The lead is perpendicular to the length direction of the filament.

The LED chip unit includes at least one LED chip.

The LED chip unit further comprises a light conversion layer, wherein the light conversion layer covers the LED chip unit, the conductor and the electrodes, and respectively exposes one part of each of the two electrodes.

The conductor is Z-shaped.

The conductor is a metal wire or a metal coating.

The utility model also discloses a LED ball bubble lamp, including the aforesaid LED filament.

The LED bulb lamp comprises a lamp shell, wherein a conductive support is arranged in the lamp shell, and an electrode of the LED filament is electrically connected with the conductive support.

The utility model discloses owing to adopted above technical scheme, can reach at least following one of beneficial effect or its arbitrary combination: the structure of the LED filament is divided into an LED section and a conductor section, so that stress is easily concentrated on the conductor section when the LED filament is bent, and the probability of breakage of a gold wire connected with an adjacent chip in the LED section is reduced when the gold wire is bent, so that the overall quality of the LED filament is improved;

drawings

FIG. 1 is a schematic perspective partial cross-sectional view of a light-emitting portion according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an embodiment of the segmented LED filament according to the present invention;

fig. 3A to 3I are schematic top views of different embodiments of the present invention;

fig. 4A is a schematic diagram of an LED bulb lamp using the LED filament of the present invention;

FIG. 4B is an enlarged cross-sectional view taken at the dashed circle of FIG. 4A;

fig. 4C shows a projection of the LED filament of the LED bulb lamp of fig. 4A in a top view;

fig. 5A to 5D are a schematic diagram, a side view, another side view and a top view, respectively, of an LED bulb according to an embodiment of the present invention;

Detailed Description

The present disclosure provides a new LED filament and an LED bulb using the same, which will be described in the following embodiments with reference to the accompanying drawings. The following description of various embodiments of the invention presented herein is for the purpose of illustration and example only and is not intended to be exhaustive or limited to the precise forms disclosed. These example embodiments are merely examples, and many implementations and variations are possible that do not require the details provided herein. It should also be emphasized that this disclosure provides details of alternative examples, but that these alternative displays are not exclusive. Moreover, any agreement in detail between the various examples should be understood as requiring such detail as, after all, to be impractical for every possible variation of the feature set forth herein.

In the drawings, the size and relative sizes of components may be exaggerated for clarity. Like reference numerals refer to like elements throughout the drawings.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a" and "an" are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed terms and may be abbreviated as "/".

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various components, members, regions, layers or steps, these components, members, regions, layers and/or steps should not be limited by these terms. Unless the context indicates otherwise, these terms are only used to distinguish one component, region, layer or step from another component, region, layer or step, e.g., as a naming convention. Thus, a first component, member, region, layer or step discussed below in one section of the specification can be termed a second component, member, region, layer or step in another section of the specification or in the claims without departing from the teachings of the present invention. Furthermore, in some cases, even if the terms "first", "second", and the like are not used in the specification to describe terms, the terms may be referred to as "first" or "second" in the claims to distinguish different components described from each other.

It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, regions, integers, steps, operations, components, and/or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, components, and/or components.

The embodiments described herein will be described with reference to plan and/or cross-sectional views through idealized schematic diagrams. Accordingly, the exemplary views may be modified depending on manufacturing techniques and/or tolerances. Accordingly, the disclosed embodiments are not limited to those shown in the drawings, but include variations of configurations formed on the basis of manufacturing processes. Thus, the regions illustrated in the figures may be of a schematic nature and the shapes of the regions illustrated in the figures may exemplify the shapes of the regions of the components, although the aspects of the present invention are not limited thereto.

Spatially relative terms, such as "under", "below", "lower", "over", "upper", and the like, may be used herein to facilitate describing one component or feature's relationship to another component or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the term "below" may encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Terms such as "same," "equal," "planar," or "coplanar," as used herein with reference to orientation, layout, position, shape, size, quantity, or other measure, do not necessarily mean exactly the same orientation, layout, position, shape, size, quantity, or other measure, but are intended to encompass nearly the same orientation, layout, position, shape, size, quantity, or other measure, within an acceptable range of variation, for example, due to manufacturing processes. The term "substantially" may be used herein to reflect this meaning.

Terms such as "about" or "approximately" may reflect dimensions, orientations, or arrangements that vary only in a relatively minor manner and/or in a manner that does not significantly alter the operation, function, or structure of certain components. For example, a range from "about 0.1 to about 1" may encompass, for example, a range of 0% -5% deviation about 0.1 and 0% to 5% deviation about 1, particularly if such deviations maintain the same effect as the listed range.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and/or the present application and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Fig. 1 is a schematic perspective partial cross-sectional view of a light-emitting portion according to an embodiment of the present invention. The utility model discloses explain as illuminating part embodiment with the LED filament in the following promptly, however the form that the illuminating part probably implemented in the LED ball bubble lamp of the utility model is not with this limit, hold the mode that any luminous body can see through the buckling and make LED ball bubble lamp can send whole period of light, should be visualized as the equivalent replacement subassembly of the illuminating part that indicates of the utility model. The LED filament 100 includes a plurality of LED chip units 102, 104, at least two conductive electrodes 110, 112, and a light conversion coating 120 (in a specific embodiment, the light conversion coating may be referred to as a silicone layer), wherein the phosphor in the light conversion coating 120 absorbs some radiation (e.g., light) and emits light. The LED filament emits light when its conductive electrodes 110, 112 are energized (voltage or current source). Taking this embodiment as an example, the emitted light may be substantially 360 degrees of light close to the point light source; will the embodiment of the utility model provides a LED filament is applied to the ball bubble lamp, then can send the all round light (omni-directivity).

As can be seen from fig. 1, the cross-sectional shape of the LED filament 100 of the present invention is rectangular, but the cross-sectional shape of the LED filament 100 is not limited thereto, and may also be triangular, circular, elliptical, polygonal or rhombic, or even may be square, but the corners may adopt chamfers or fillets.

The LED chip units 102 and 104, or referred to as LED segments 102 and 104, may be a single LED chip, or two LED chips, or may include a plurality of LED chips, i.e., equal to or greater than three LED chips.

Referring to fig. 2 to a schematic diagram of an embodiment of a segmented LED filament, fig. 2 is a cross-sectional view of the LED filament along an axial direction thereof as shown in fig. 2, the LED filament can be divided into different segments in the axial direction of the LED filament, for example, the LED filament can be divided into LED segments (i.e., LED chip units) 102 and 104 and a conductor segment 130, but is not limited thereto. The number of the LED segments 102, 104 and the conductor segments 130 in a single LED filament may be one or more, respectively, and the LED segments 102, 104 and the conductor segments 130 are arranged along the axial direction of the LED filament. The LED segments 102 and 104 and the conductor segment 130 can have different structural features to achieve different effects, as described in detail later.

As shown in fig. 2, the LED filament 100 includes LED segments 102 and 104, a conductor segment 130, at least two electrodes 110 and 112, and a light conversion layer 120, wherein the conductor segment 130 is located between two adjacent LED segments 102 and 104, the electrodes 110 and 112 are disposed corresponding to the LED segments 102 and 104 and electrically connected to the LED segments 102 and 104, the two adjacent LED segments 102 and 104 are electrically connected to each other through the conductor segment 130, in this embodiment, the conductor segment 130 includes a conductor 130a connecting the LED segments 102 and 104, a length of the conducting wire 140 is smaller than a length of the conductor 130a, or a shortest distance between two LED chips respectively located in the two adjacent LED segments 102 and 104 is larger than a distance between two adjacent LED chips in the single LED segment 102/104. In addition, in other preferred embodiments of the present invention, each LED segment 102, 104 includes at least two LED chips 142, the LED chips 142 are electrically connected to each other, and the electrical connection is performed through a wire 140; the present invention is not limited to this.

The light-converting layer 120 covers the LED segments 102 and 104, the conductor segment 130, and the electrodes 110 and 112, and exposes a portion of each of the two electrodes 110 and 112. In this embodiment, each of the six faces of the LED chips 142 in the LED segments 102, 104 is covered by the light conversion layer 120, that is, the six faces are covered by the light conversion layer 120 and can be referred to as the light conversion layer 120 enveloping the LED chips 142, and this covering or enveloping can be, but is not limited to, direct contact, and preferably, in this embodiment, each of the six faces of the LED chips 142 is in direct contact with the light conversion layer 120. However, in practice, the light conversion layer 120 may cover only two surfaces of the six surfaces of each LED chip 142, i.e., the light conversion layer 120 directly contacts the two surfaces, and the two directly contacting surfaces may be, but are not limited to, the top surface or the bottom surface in fig. 2. Likewise, the light conversion layer 120 may directly contact both surfaces of the two electrodes 110, 112. In various embodiments, the light conversion layer 120 may be an encapsulant without light conversion function, for example, the light conversion layer 120 of the conductor segment 130 may be a transparent encapsulant with good flexibility.

In some embodiments, the LED filaments 100 are disposed in the LED bulbs, and each LED bulb has only a single LED filament to provide sufficient illumination. Moreover, in order to present aesthetic feeling in appearance, the illumination effect of a single LED filament can be more uniform and wide, and even the effect of full-circle light is achieved, so that the LED filament in the LED bulb lamp can present diversified curves through bending and flexing, the light emitting direction of the LED filament faces all directions through the diversified curves, or the overall light emitting shape of the LED bulb lamp is adjusted by the diversified curves. In order to make it easier for the LED filament to be bent into such a curved structure, and the LED filament can also bear the bending stress, the conductor section 130 of the LED filament does not have any LED chip therein, but only has the conductor 130 a. The conductor 130a (e.g. a metal wire or a metal coating) is easier to bend with respect to the LED chip, i.e. the conductor segment 130 without any LED chip will be correspondingly easier to bend with respect to the LED segments 102, 104 with LED chips.

According to the utility model discloses aforementioned each embodiment because LED filament structural differentiation is LED section and conductor segment, consequently the LED filament is easy with stress concentration in the conductor segment when buckling, makes the gold thread of connecting adjacent chip in the LED section reduce cracked probability when buckling, promotes the whole quality of LED filament by this. Simultaneously in order to promote the nature of can buckling of LED filament conductor section, further avoid the conductor to produce when the LED filament is buckled and destroy the utility model discloses in other embodiments, the conductor in the LED filament conductor section can be "M" style of calligraphy or be wavy to the extension effect that provides the LED filament preferred.

The chip wire bonding related design of the LED filament is described next. Fig. 3A is a top view of an embodiment of the LED filament 300 according to the present invention in an unbent state, wherein the LED filament 300 includes a plurality of LED chip units 302, 304, a conductor 330a, and at least two electrodes 310, 312. The LED chip units 302 and 304 may be a single LED chip, or may include a plurality of LED chips, i.e., two or more LED chips.

The conductor 330a is located between two adjacent LED chip units 302, 304, the LED chip units 302, 304 are located at different positions in the Y direction, the electrodes 310, 312 are configured corresponding to the LED chip units 302, 304 and are electrically connected to the LED chip units 302, 304 through the wire 340, the two adjacent LED chip units 302, 304 are electrically connected to each other through the conductor 330a, and an included angle between the conductor 330a and the filament in the length direction (X direction) is 30 ° to 120 °, preferably 60 ° to 120 °. In the prior art, the direction of the conductor 330a is parallel to the X direction, the internal stress acting on the sectional area of the conductor is larger when the filament is bent at the conductor, and the conductor 330a is configured to form a certain included angle with the X direction, so that the internal stress acting on the sectional area of the conductor when the filament is bent can be effectively reduced. The wires 340 form a certain included angle with the X direction, are parallel to each other, are perpendicular to each other, or are combined at any angle, in this embodiment, the LED filament 300 includes two wires 340, one wire 340 is parallel to the X direction, and the included angle between the other wire 340 and the X direction is 30 ° to 120 °. The LED filament 300 emits light when its electrodes 310, 312 are energized (voltage or current source).

Fig. 3B to 3D show the case where the conductor in fig. 3A is 90 ° to the X direction, that is, the conductor 330a is perpendicular to the X direction, which can reduce the internal stress on the cross-sectional area of the conductor when the filament is bent, in the embodiment shown in fig. 3B, the lead 340 is parallel to and perpendicular to the X direction, the LED filament 300 includes two leads 340, one lead 340 is parallel to the X direction, and the other lead 340 is perpendicular to the X direction.

As shown in fig. 3C, the difference from the embodiment shown in fig. 3B is that the lead 340 is perpendicular to the X direction, the bending performance between the electrodes 310 and 312 and the LED chip units 302 and 304 is improved, and the conductor 330a and the lead 340 are simultaneously arranged perpendicular to the X direction, so that the filament can be bent well at any position.

Fig. 3E is a top view of the LED filament 300 according to the next embodiment in the unbent state, which is different from the embodiment shown in fig. 3C in that, in the X direction, the LED chip unit 304 is located between two adjacent LED chip units 302, and the projection in the Y direction does not have an overlapping region with the LED chip unit 302, so that when the filament is bent at the conductor 330a, the chip is not damaged, thereby improving the stability of the product quality.

As shown in fig. 3F, the LED filament 300 includes a plurality of LED chip units 302, 304, a conductor 330a, and at least two electrodes 310, 312, the conductor 330a is located between two adjacent LED chip units 302, 304, and the LED chip units 302, 304 are located at substantially the same position in the Y direction, so that the overall width of the LED filament 300 is smaller, and further the heat dissipation path of the LED chip is shortened, and the heat dissipation effect is improved. The electrodes 310 and 312 are disposed corresponding to the LED chip units 302 and 304 and electrically connected to the LED chip units 302 and 304 through the wires 340, the LED chip unit 302/304 is electrically connected to the conductor 330a through the wires 350, the conductor 330a is substantially Z-shaped, which can increase the mechanical strength of the conductor and the area where the LED chip is located and can prevent the wires connecting the LED chip and the conductor from being damaged when the LED filament 300 is bent, and the wires 340 are disposed parallel to the X direction.

As shown in fig. 3G, the LED filament 300 includes a plurality of LED chip units 302, 304, a conductor 330a, and at least two electrodes 310, 312, the LED chip units 302, 304 are at the same position in the Y direction, the conductor 330a is parallel to the X direction, the conductor 330a includes a first conductor 3301a and a second conductor 3302a, which are respectively located at two sides of the LED chip unit 302/304, the first conductor 3301a is located between two adjacent LED chip units, and is electrically connected to the LED chip unit 302/304 through a wire 350. The lead 350 is perpendicular to the X direction, so that the internal stress on the cross section area of the lead when the LED filament 300 is bent is reduced, and the bending resistance of the lead is improved. The second conductor 3302a and the LED chip 142 are not electrically connected, and the second conductor 3302a extends to the wire 340 along the X direction, so that when the LED filament 300 is subjected to an external force, the stress buffering effect can be achieved, the LED chip is protected, the product stability is improved, and then the stress on the two sides of the LED chip is balanced. The electrodes 310, 312 are disposed corresponding to the LED chip units 302, 304 and electrically connected to the LED chip units 302, 304 through wires 340.

As shown in fig. 3H, the difference from the embodiment shown in fig. 3G is that the first conductor 3301a and the second conductor 3302a extend to the wire 340 in the X direction, and the first conductor 3301a and the second conductor 3302a are connected to the LED chip unit 302 and the LED chip unit 304 by the wire 350. In other embodiments, for example, the first conductor 3301a connects the LED chip unit 302 and the LED chip unit 304 through the wire 350, and the second conductor 3302a may not be electrically connected to the LED chip unit 302/304. Through setting up the conductor in LED chip both sides for when LED filament 300 buckles, can play the effect that increases LED filament 300 intensity and can disperse the produced heat of some LED chips when luminous again.

Fig. 3I is the utility model discloses the plan view of the next embodiment of the unbent state of LED filament 300, in this embodiment, LED chip unit 302, 304 are single LED chip, and the width direction of LED chip unit 302, 304 is parallel with the X direction, and preferred LED chip unit 302, 304 are in substantially the same position in the Y direction, so can make the whole width of LED filament 300 less, and then shorten the heat dissipation route of LED chip, improve the radiating effect. Two adjacent LED chip units 302 and 304 are connected through a conductor 330a, the included angle between the conductor 330a and the X direction is 30-120 degrees, the internal stress on the sectional area of the lead when the LED filament 300 is bent is reduced, and the bending resistance of the lead is improved. In other embodiments, the long side of the LED chip unit may have a certain angle with the X direction, so that the overall width of the LED filament 300 can be further reduced.

The LED filament structure in each embodiment can be mainly applied to LED bulb lamp products, so that the LED bulb lamp can achieve the light emitting effect of full-period light through the flexible bending characteristic of the single LED filament. The following further describes a specific embodiment of applying the aforementioned LED filament to an LED bulb lamp.

Referring to fig. 4A, fig. 4A is a schematic structural diagram of a first embodiment of an LED bulb 20 c. According to the first embodiment, the LED bulb 20c includes a lamp housing 12, a base 16 connected to the lamp housing 12, at least two conductive brackets 51a and 51b disposed in the lamp housing 12, a driving circuit 518, a supporting portion (including the cantilever 15 and the stem 19), and a single light emitting portion (i.e., an LED filament) 100. The driving circuit 518 is electrically connected to the conductive brackets 51a and 51b and the lamp head 16. The stem 19 further has a vertical rod 19a extending vertically to the center of the lamp housing 12, the vertical rod 19a is located on the central axis of the lamp head 16, or the vertical rod 19a is located on the central axis of the LED bulb 20 c. A plurality of cantilevers 15 are located between the rod 19a and the LED filament 100, and the cantilevers 15 are used to support the LED filament 100 and can maintain the LED filament 100 in a predetermined curve and shape. Each cantilever 15 includes opposite first and second ends, the first end of each cantilever 15 is connected to the vertical rod 19a, and the second end of each cantilever 15 is connected to the LED filament 100.

The lamp envelope 12 may be made of a material with better light transmission or better thermal conductivity, such as, but not limited to, glass or plastic. In practice, the lamp housing 12 may be doped with a golden yellow material or the surface of the lamp housing may be plated with a yellow film to absorb a portion of the blue light emitted from the LED chip, so as to reduce the color temperature of the light emitted from the LED bulb 20 c. In other embodiments of the present invention, the lamp housing 12 includes a luminescent material layer (not shown), which can be formed on the inner surface and the outer surface of the lamp housing 12 or even be integrated into the material of the lamp housing 12 according to design requirements or process feasibility. The layer of light emitting material includes low reabsorbing (abbreviated herein as LR) semiconductor nanocrystals, referred to herein as LR quantum dots. LR quantum dots are specially designed quantum dots that include a core, a protective shell, and a light absorbing shell disposed between the core and the protective shell. The core emits light, while the light-absorbing shell absorbs excitation light at a longer wavelength than the excitation light, and the protective shell provides light stability. Low re-absorption is to use the absorbance ratio to achieve this goal. Ideally, the nanocrystal emitter absorbs the desired number of high energy photons from the excitation light source and does not absorb any photons at all in the lower energy window. In one option, the "absorbance ratio" is defined as the ratio of the absorbance at the peak of the excitation light source to the absorbance at 550 nm. This option works if the emission peak of the nanocrystal is at a higher wavelength than 550 nm. The reason for choosing 550nm is that 550nm is the wavelength to which the human eye is most sensitive under ambient conditions. In the present disclosure, this absorption luminance ratio is referred to as "Iexcitation/I550". For example, if the excitation peak of the blue LED is at 450mm (common peak position for high power and high efficiency blue LEDs), then the relative absorption luminance ratio is "I450/I550". In certain embodiments, useful LR quantum dots have an absorption luminance ratio of greater than about 8, suitably equal to or greater than about 10, or equal to or even greater than about 15. Alternatively, one can define the absorbance ratio as "absorbance ratio at emission peak" calculated by dividing the absorbance at the peak of the excitation light source by the absorbance at the emission peak of the nanocrystal, which parameter is labeled "Iexcitation/iemit" in this disclosure. For example, if the peak value of the excitation light source is 450nm, the "ratio of the absorption luminance at the emission peak" is "I450/Iemision". Preferably, the absorbance ratio at the emission peak is greater than 8, suitably greater than 10, or even greater than 15.

The electrodes 506 of the LED filament 100 are electrically connected to the conductive legs 51a, 51b to receive power from the driving circuit 518. The connection between the electrode 506 and the conductive supports 51a and 51b may be a mechanical press connection or a welding connection, and the mechanical connection may be achieved by passing the conductive supports 51a and 51b through a specific through hole (not shown) formed in the electrode 506 and then bending the free ends of the conductive supports 51a and 51b such that the conductive supports 51a and 51b clamp the electrode 50₆Parallel shape_{Electric property of formation}And (4) connecting. The solder connection may be by way of silver-based solder, silver solder, or the like, connecting conductive brackets 51a, 51b to electrode 506.

The LED filament 100 shown in fig. 4A is bent to form a circular-like profile in the top view of fig. 4A. In the embodiment of fig. 4A, the LED filament 100 may be bent to form a wave shape in a side view since it has a structure including the LED filament as described in any one of the embodiments of fig. 1 to 3. The shape of the LED filament 100 is novel and makes the illumination more uniform. Compared to an LED bulb with multiple LED filaments, a single LED filament 100 has fewer contacts. In practice, a single filament 100 has only two connection points, thus reducing the possibility of defects due to welding or mechanical crimping.

The stem 19 has a stem 19a, the stem 19a extending toward the center of the envelope 12. The legs 19a support the cantilevers 15, a first end of each cantilever 15 is connected to the leg 19a, and a second end of each cantilever 15 is connected to the LED filament 100.

Referring to fig. 4B, fig. 4B is an enlarged cross-sectional view of the dotted circle of fig. 4A. The second end of each cantilever 15 has a clamp 15a, and the clamp 15a clamps the body of the LED filament 10. The clamp portion 15a may be used to clamp the wavy peaks or valleys of the LED filament 100, but not limited thereto, and the clamp portion 15a may also be used to clamp the portions between the wavy peaks and valleys of the LED filament 100. The shape of the pincer 15a may closely fit the outer shape of the cross section of the LED filament 100, and the size of the inner shape (inner hole) of the pincer 15a may be slightly smaller than the outer shape of the cross section of the LED filament 100. Thus, during manufacture, the LED filament 100 may be inserted through the inner bore of the clamp 15a to form a tight fit. The other fixing method is to form the pincer portion through a bending procedure, and further, the LED filament 100 is first placed at the second end of the cantilever 15, and then the second end is bent into the pincer portion 15a by a jig to clamp the LED filament 100.

The cantilever 15 may be made of, but not limited to, carbon spring steel to provide suitable rigidity and elasticity, so as to absorb external vibration and reduce impact on the LED filament, thereby making the LED filament less prone to deformation. Because the upright rod 19a extends to the center of the lamp housing 12, and the cantilever 15 is connected to the vicinity of the top end of the upright rod 19a, the vertical height of the LED filament 100 is close to the center of the lamp housing 12, so the light-emitting characteristic of the LED bulb 20c is close to the light-emitting characteristic of the conventional bulb, the light emission is more uniform, and meanwhile, the light-emitting brightness can also reach the brightness level of the conventional bulb. In the present embodiment, at least half of the LED filament 100 surrounds the central axis of the LED bulb 20 c. This central axis is coaxial with the axis of the upright 19 a.

In this embodiment, the first end of the cantilever 15 of the LED filament 100 is connected to the vertical rod 19a of the stem 19, and the second end of the cantilever 15 is connected to the outer insulating surface of the LED filament 100 through the clamp 15a, so the cantilever 15 is not used for transmitting power. In one embodiment, the stem 19 is made of glass, so that the stem 19 is not damaged or burst due to thermal expansion and contraction of the suspension wall 15. In various embodiments, the LED bulb may not have a stem, and the cantilever 15 may be connected to the stem or may be directly connected to the housing to reduce the negative impact on the light emission caused by the stem.

Because the cantilever 15 is non-conductive, the risk that the glass core column 19 is damaged and burst due to expansion and contraction of the metal wire in the cantilever 15 caused by heat generation of the passing current when the cantilever 15 is conductive in the past is avoided.

In various embodiments, the second end of the cantilever 15 may be directly inserted into the LED filament 100 and become an auxiliary (auxiliary bar) in the LED filament 100, which may strengthen the mechanical strength of the LED filament 100.

The inner shape (hole shape) of the pincer 15a matches the outer shape of the cross section of the LED filament 100, and therefore, the cross section of the LED filament 100 can be oriented toward a specific orientation. The LED filament 100 includes a primary light emitting surface Lm and a secondary light emitting surface Ls corresponding to the LED chip. When the LED chips of the LED filament 100 are wire-bonded and aligned in a linear manner, the surface of the top layer 420a away from the base layer 420b is a primary light emitting surface Lm, and the surface of the base layer 420b away from the top layer 420a is a secondary light emitting surface Ls. The primary light emitting surface Lm and the secondary light emitting surface Ls oppose each other. When the LED filament 100 emits light, the primary light emitting surface Lm is a surface through which the maximum amount of light passes, and the secondary light emitting surface Ls is a surface through which the second maximum amount of light passes. In the present embodiment, a conductive foil 530 is further disposed between the top layer 420a and the base layer 420b for electrically connecting the LED chips. In the present embodiment, the LED filament 100 is wound with a coil so that the main light emitting surface Lm always faces outward. That is, any part of the primary light emitting surface Lm is directed towards the envelope 12 or burner 16 and at any angle away from the stem 19. The secondary light emitting surface Ls is always directed toward the stem 19 or toward the tip of the stem 19 (the secondary light emitting surface Ls is always directed inward).

The LED filament 100 shown in fig. 4A is bent to form a circle in a top view and a wave in a side view. The wave-shaped structure not only has novel appearance, but also can ensure uniform illumination of the LED filament 100. Meanwhile, compared to multiple LED filaments, the single LED filament 100 requires fewer contacts (e.g., press contacts, welding contacts, or soldering contacts) to connect the conductive supports 51a and 51 b. In practice, a single LED filament 100 requires only two contacts, which are formed on two electrodes, respectively. Therefore, the risk of welding errors can be effectively reduced, and compared with mechanical connection in a pressing mode, the connection process can be simplified.

Referring to fig. 4C, fig. 4C shows a projection of the LED filament 100 of the LED bulb 20C of fig. 4A in a top view. In one embodiment, as shown in fig. 4C, the LED filament may be bent to form a wave shape, and when viewed from a top view, the wave shape may resemble a circle, and the circle may surround the center of the bulb or stem. In various embodiments, the LED filament viewed from a top view may form a circular-like or "U" -like shape.

As shown in fig. 4C, the LED filament 100 surrounds in a circular-like wave shape and has a symmetrical-like structure in a top view, and the light emitting surface of the LED filament 100 is also symmetrical. For example, in a top view, the main light emitting surface Lm may face outwardly. Due to the symmetrical characteristic, the LED filament 100 can produce a full-cycle effect. The symmetry property is about the quasi-symmetric structure of the LED filament 100 and the configuration of the light emitting surface of the LED filament 100 in a top view. Therefore, the whole LED bulb 20c can generate a full-cycle light effect similar to 360-degree light emission. In addition, the two contacts can be close to each other, so that the conductive legs 51a, 51b are substantially lower than the LED filament 100. Visually, the conductive legs 51a, 51b would appear less distinct and integrated with the LED filament 100 to exhibit a graceful curve.

The definition of the full-cycle light depends on the area where the LED bulb lamp is used, and can change along with the time. According to different organizations and countries, the LED bulb lamp capable of providing full-cycle light is declared to be capable of meeting different standards. The american energy star project lamp qualification criteria, first edition (bulb) 24, defines eligibility criterion version1.0, which requires that the emitted light between 135 and 180 degrees should be at least 5% of the total luminous flux (lm) at a full perimeter lamp base up setting, while 90% of the luminance measurements are variable, but not more than 25% different from the average of the total luminance measurements over all planes. Luminance (cd) is measured in each vertical plane at a vertical angle of 5 degrees increase (maximum) between 0 and 135 degrees. In JEL801 specifications of japan, the LED lamp is required to have a luminous flux within 120 degrees of the optical axis, which is not less than 70% of the total luminous flux of the bulb lamp. Based on the arrangement of the LED filaments with the symmetrical characteristic in the embodiment, the LED bulb lamp with the LED filaments can meet different standards of a full-cycle light lamp.

Referring to fig. 5A and fig. 5B to 5D, fig. 5A is a schematic diagram of an LED bulb 40a according to an embodiment of the present invention, and fig. 5B to 5D are a side view, another side view and a top view of the LED bulb 40a of fig. 5A, respectively. In the present embodiment, the LED bulb 40a includes a lamp housing 12, a base 16 connected to the lamp housing 12, a stem 19, and a single LED filament 100. Moreover, the LED bulb 40a and the single LED filament 100 disposed in the LED bulb 40a can refer to the LED bulbs, the LED filaments and their related descriptions of the previous embodiments, wherein the same or similar components and the connection relationship between the components are not described in detail.

In the embodiment, the stem 19 is connected to the base 16 and located inside the lamp housing 12, the stem 19 has a vertical rod 19a extending vertically to the center of the lamp housing 12, the vertical rod 19a is located on the central axis of the base 16, or the vertical rod 19a is located on the central axis of the LED bulb 40 a. The LED filament 100 is disposed around the vertical rod 19a and located in the lamp housing 12, and the LED filament 100 can be connected to the vertical rod 19a through a cantilever (the detailed description of the cantilever can refer to the previous embodiment and the attached drawings) to maintain the predetermined curve and shape. The LED filament 100 includes two electrodes 110, 112 at both ends, a plurality of LED segments 102, 104, and a plurality of conductor segments 130. As shown in fig. 5A to 5D, in order to separate the conductor segment 130 from the LED segments 102 and 104, the LED filament 100 is distributed in a plurality of points on the conductor segment 130, which is only for the reader to understand more easily and is not intended to be limiting, and the following embodiments and related drawings are also separated from the LED segments 102 and 104 by the conductor segment 130 exhibiting a point distribution. As described in the previous embodiments, each LED segment 102, 104 may include a plurality of LED chips connected to each other, and each conductor segment 130 may include a conductor. Each conductor segment 130 is located between two adjacent LED segments 102, 104, the conductor in each conductor segment 130 connects the LED chips in the two adjacent LED segments 102, 104, and the LED chips in the two LED segments adjacent to the two electrodes 110, 112 connect the two electrodes 110, 112, respectively. The stem 19 may be connected to the two electrodes 110, 112 by conductive brackets (the detailed description of which refers to the previous embodiments and figures).

As shown in fig. 5A to 5D, in the present embodiment, there are three conductor segments of the LED filament 100, wherein there are two first conductor segments 130, one second conductor segment 130', and four LED segments 102 and 104, and each two adjacent LED segments 102 and 104 are bent through the first conductor segment 130 and the second conductor segment 130'. Moreover, since the first and second conductor segments 130, 130 'have higher flexibility than the LED segments 102, 104, the first and second conductor segments 130, 130' between two adjacent LED segments 102, 104 can be bent to a greater extent, so that the included angle between two adjacent LED segments 102, 104 can be relatively small, for example, the included angle can reach 45 degrees or less. In the present embodiment, each of the LED segments 102, 104 has little or no bending compared to the first and second conductor segments 130, 130', so that the single LED filament 100 in the LED bulb 40a can be bent greatly by the first and second conductor segments 130, 130' and has a significant bending variation, and the LED filament 100 can be defined as a segment that is continuous after each of the bent first and second conductor segments 130, 130', so that each of the LED segments 102, 104 forms a corresponding segment.

As shown in fig. 5B and 5C, in the present embodiment, each of the first conductor segment 130, the second conductor segment 130 'and the two adjacent LED segments 102 and 104 form a U-shaped or V-shaped bent structure together, and the U-shaped or V-shaped bent structure formed by each of the first conductor segment 130, the second conductor segment 130' and the two adjacent LED segments 102 and 104 is bent and divided into two segments, where the two LED segments 102 and 104 are the two segments, respectively. In the present embodiment, the LED filament 100 is bent into four segments by the first conductor segment 130 and the second conductor segment 130', and the four LED segments 102 and 104 are the four segments respectively. Also, in the present embodiment, the number of LED segments 102, 104 is 1 more than the number of conductor segments.

As shown in fig. 5B, in the present embodiment, the electrodes 110, 112 are located between the highest point and the lowest point of the LED filament 100 in the Z direction. The highest point is located at the first conductor segment 130 'that is highest in the Z direction, and the lowest point is located at the second conductor segment 130' that is lowest in the Z direction. The lower second conductor segments 130' represent closer to the burner 16 than the electrodes 110, 112, while the higher first conductor segments 130 represent farther from the burner 16 than the electrodes 110, 112. Viewed in the YZ plane (see fig. 5B), the electrodes 110, 112 may be connected to one another in a line LA, two of the first, higher conductor segments 130 above the line LA and one of the second, lower conductor segments 130' below the line LA. In other words, the number of first conductor segments 130 located above the line LA connecting the electrodes 110, 112 is 1 more than the number of second conductor segments 130' located below the line LA in the Z direction. It can also be said that the number of first conductor segments 130 remote from the burner 16 with respect to the electrodes 110, 112 is 1 more than the number of second conductor segments 130' close to the burner 16 with respect to the electrodes 110, 112, as a whole. When the LED filament 100 is projected on the YZ plane (see fig. 5B), at least one intersection point exists between the projection of the LED segments 102 and 104 and the line LA connecting the electrodes 110 and 112. In the present embodiment, on the YZ plane, the straight line LA formed by the electrodes 110 and 112 respectively intersects the projections of the two LED segments 104, so that two intersection points exist between the straight line LA and the projections of the two adjacent LED segments 104.

As shown in fig. 5C, in the present embodiment, if the LED filament 100 is projected on the XZ plane (see fig. 5C), the projections of the two opposing LED segments 102 and 104 are overlapped with each other. In some embodiments, the projections of the opposing two LED segments 102, 104 onto a particular plane may be parallel to each other.

As shown in fig. 5D, in the present embodiment, if the LED filament 100 is projected on the XY plane (see fig. 5D), the projections of the electrodes 110 and 112 on the XY plane may be connected to form a straight line LB, and the projections of the first conductor segment 130 and the second conductor segment 130 'on the XY plane do not intersect or overlap with the straight line LB, and the projections of the first conductor segment 130 and the second conductor segment 130' on the XY plane are located on one side of the straight line LB. For example, as shown in fig. 5D, the projections of the first conductor segments 130 and the second conductor segments 130' on the XY plane are located above the straight line LB.

As shown in fig. 5B to 5D, in the present embodiment, the projection lengths of the LED filament 100 on three projection surfaces perpendicular to each other have a designed ratio to make the illumination more uniform. For example, the projection of the LED filament 100 on a first projection plane (e.g., XY plane) has a length of L1, the projection of the LED filament 100 on a second projection plane (e.g., YZ plane) has a length of L2, and the projection of the LED filament 100 on a third projection plane (e.g., XZ plane) has a length of L3. The first projection plane, the second projection plane and the third projection plane are perpendicular to each other, and the normal line of the first projection plane is parallel to the axis of the LED bulb 40a from the center of the lamp housing 12 to the center of the lamp head 16. Further, the projection of the LED filament 100 on the XY plane can be seen in fig. 5D, the projection appears like an inverted U, and the total length of the projection of the LED filament 100 on the XY plane is the length L1; the projection of the LED filament 100 on the YZ plane can be shown in fig. 5B, the projection will appear like an inverted W shape, and the total length of the projection of the LED filament 100 on the YZ plane is length L2; the projection of the LED filament 100 on the XZ plane can be seen in fig. 5C, which will appear like an inverted V, and the total length of the projection of the LED filament 100 on the XZ plane is length L3. In the present embodiment, the length L1: length L2: length L3 is approximately equal to 1: 1: 0.9. in some embodiments, length L1: length L2: length L3 is approximately equal to 1: 0.5 to 1: 0.6 to 0.9. For example, if the ratio of the length L1, the length L2, and the length L3 is closer to 1: 1: 1, the more uniform the illumination effect of the single LED filament 100 in the LED bulb 40a is, the better the full-cycle light effect is.

In some embodiments, the projected length of the LED filament 100 in the XZ plane or in the YZ plane is, for example, but not limited to, the minimum of the height difference of the first conductor segment 130, the second conductor segment 130' in the Z direction multiplied by the quantity value of the LED segments 102, 104 or the minimum of the height difference of the highest point and the lowest point of the LED filament in the Z direction multiplied by the quantity value of the LED segments 102, 104. In the present embodiment, the total length of the LED filament 100 is about 7 to 9 times the total length of the first conductor segment 130 or the second conductor segment 130'.

In the present embodiment, the LED filament 100 can be bent to form various curves through the first conductor segment 130 and the second conductor segment 130', which not only increases the aesthetic feeling of the whole LED bulb 40a in appearance, but also makes the light emitted from the LED bulb 40a more uniform, thereby achieving better illumination effect.

The features of the various embodiments of the present invention described above can be combined and changed arbitrarily without mutual exclusion, and are not limited to a specific embodiment. Such as described in the embodiment of fig. 3A, although features not described in the embodiment of fig. 5C may also be included in the embodiment of fig. 3A, it should be apparent to those of ordinary skill in the art that such features may be applied to fig. 5C without inventive step based on the description of fig. 3A; for another example, although the present invention has been described with reference to LED bulb lamps, the obvious designs can be applied to other lamps with different shapes or types without any inventive step, such as LED candle lamps, etc., which are not listed here.

The utility model discloses the realization of each embodiment of LED ball bubble lamp of LED filament and applied thereof has been as before, what need remind is to same root LED filament or adopt the LED ball bubble lamp of LED filament, above the characteristics that relate to in each embodiment can include one, two, a plurality of or all technical characterstic under the condition of not conflicting each other. The corresponding content may be selected from one or a combination of the technical features included in the corresponding embodiments.

While the present invention has been disclosed in terms of the preferred embodiment, it will be understood by those skilled in the art that this embodiment is provided for illustration only, and should not be construed as limiting the scope of the invention. It should be noted that equivalent changes and substitutions to those of the embodiment are also intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the appended claims.

Claims (9)

1. An LED filament, comprising:

a plurality of LED chip units;

the LED lamp comprises conductors, wherein two adjacent LED chip units are connected through the conductors, at least one LED chip unit is electrically connected with the conductors through a lead, and the included angle between the lead and the filament in the length direction is 30-120 degrees;

and the two electrodes are configured corresponding to the LED chip units and are electrically connected with the LED chip units.

2. The LED filament of claim 1, wherein the wire is perpendicular to the filament length direction.

3. The LED filament of claim 2, wherein the LED chip unit comprises at least one LED chip.

4. The LED filament of claim 3, further comprising a light conversion layer covering the LED chip unit, the conductor and the electrodes and respectively exposing a portion of both electrodes.

5. The LED filament of claim 4, wherein the conductor is Z-shaped.

6. The LED filament of claim 1, wherein the LED chip unit comprises a single LED chip, and a width direction of the LED chip unit is parallel to a length direction of the filament.

7. The LED filament of claim 6, wherein the conductor is a metal wire or a metal coating.

8. An LED bulb lamp, characterized in that the LED bulb lamp comprises the LED filament of any one of claims 1-7.

9. The LED bulb lamp according to claim 8, comprising a lamp housing, wherein a conductive support is arranged in the lamp housing, and an electrode of the LED filament is electrically connected with the conductive support.

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