WO2019119639A1 - Led filament substrate, led package structure, and led lamp - Google Patents

Led filament substrate, led package structure, and led lamp Download PDF

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Publication number
WO2019119639A1
WO2019119639A1 PCT/CN2018/077112 CN2018077112W WO2019119639A1 WO 2019119639 A1 WO2019119639 A1 WO 2019119639A1 CN 2018077112 W CN2018077112 W CN 2018077112W WO 2019119639 A1 WO2019119639 A1 WO 2019119639A1
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WO
WIPO (PCT)
Prior art keywords
led
filament substrate
chip
substrate
conductive layer
Prior art date
Application number
PCT/CN2018/077112
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French (fr)
Chinese (zh)
Inventor
张丽君
Original Assignee
深圳市瑞丰光电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201711378083.8A external-priority patent/CN108039402B/en
Priority claimed from CN201721786702.2U external-priority patent/CN208157453U/en
Application filed by 深圳市瑞丰光电子股份有限公司 filed Critical 深圳市瑞丰光电子股份有限公司
Publication of WO2019119639A1 publication Critical patent/WO2019119639A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the invention belongs to the technical field of light emitting diodes, and particularly relates to an LED filament substrate, an LED package structure and an LED lamp.
  • the typical structure of the insulated filament substrate is an insulating substrate and metal pins for external electrical connection at both ends of the substrate, and a plurality of light emitting diodes arranged on the filament substrate (Light
  • the chip types, chip spacing, and series-parallel options available for the Emitting Diode (LED) chip are very limited.
  • a plurality of LED chips of a front-mounted structure are usually arranged in series on a substrate, and the arrangement of the chips is single.
  • the embodiments of the present invention provide an LED filament substrate, an LED package structure, and an LED lamp, to solve the problem that the chip type, chip spacing, and series-parallel mode of the LED chip on the LED filament substrate in the prior art are limited.
  • a first aspect of the embodiments of the present invention provides an LED filament substrate, including an insulating substrate, a conductive layer, and a lead for connecting an external power supply circuit.
  • the conductive layer is disposed on a surface of the insulating substrate, and the conductive layer is externally connected with the LED chip.
  • the shape of the conductive layer is determined according to the type and connection mode of the external LED chip, and the number of the conductive layers is determined according to the type and number of the external LED chips, and the spacing between the external LED chips, and the pins are disposed on the insulating substrate. on.
  • the pins are respectively disposed at both ends of the insulating substrate or at the same end of the insulating substrate.
  • the conductive layer is externally connected to the LED chip through the chip electrode or the bonding wire.
  • the material of the insulating substrate is sapphire, glass, ceramic, polyimide or polyester film.
  • the material of the conductive layer is a silver conductive material, a copper conductive material, a gold conductive material or a transparent metal compound conductive material.
  • a second aspect of the present invention provides an LED package structure, including the LED filament substrate provided by the first aspect of the present invention, further comprising a plurality of LED chips, a plurality of bonding wires and an encapsulant;
  • Each LED chip is disposed on the LED filament substrate, and different LED chips are connected by a bonding wire and/or a conductive layer of the LED filament substrate, and the encapsulant is wrapped on the LED filament substrate, each LED chip and The outer side of each bond wire.
  • the LED filament substrate comprises an intermediate region and an edge region, wherein at least two LED chips are disposed in the intermediate region, in the intermediate region, at a geometric center of the LED filament substrate to the LED filament In the direction of the two ends of the substrate, the distance between the LED chip and the next adjacent LED chip is less than or equal to the distance between the LED chip and the adjacent LED chip, and in the edge region, at the geometric center of the LED filament substrate In the direction of the two ends of the LED filament substrate, the distance between the LED chip and the next adjacent LED chip is less than or equal to the distance between the LED chip and the adjacent LED chip, and the maximum of the adjacent LED chips in the edge region The spacing is less than the minimum spacing of adjacent LED chips in the intermediate region.
  • the types of the respective LED chips are a formal structure, a flip-chip structure, or a vertical structure.
  • the encapsulant is an epoxy resin encapsulant, a silicone encapsulant, a polyurethane encapsulant or a photocurable encapsulant.
  • a third aspect of the embodiments of the present invention provides an LED luminaire comprising the LED package structure provided by the second aspect of the embodiments of the present invention.
  • the embodiment of the present invention has the beneficial effects that the LED filament substrate, the LED package structure and the LED lamp provided by the embodiment of the invention are provided with a conductive layer on the LED filament substrate, which can be according to the type of the external LED chip and
  • the connection method determines the shape of the conductive layer, and the number of the conductive layers is determined according to the type and number of external LED chips, and the spacing between the external LED chips.
  • Various types of LED chips can be selected, and the spacing of the LED chips and the series and parallel connection The method is not limited, and the arrangement of the LED chips on the LED filament substrate is more diverse.
  • FIG. 1 is a schematic structural view of an LED filament substrate according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of an LED filament substrate for realizing parallel connection of LED chips according to an embodiment of the present invention
  • FIG. 3 is a schematic structural diagram of an LED package structure for realizing parallel connection of LED chips according to an embodiment of the present invention
  • FIG. 4 is a side view of an LED package structure according to another embodiment of the present invention.
  • FIG. 5 is a top plan view of an LED package structure according to another embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of an LED package structure according to an embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of an LED filament substrate according to a first aspect of the present invention.
  • the LED filament substrate comprises an insulating substrate 1, a conductive layer 2 and a lead 3 for connecting an external power supply circuit.
  • the conductive layer 2 is disposed on the surface of the insulating substrate 1, and the conductive layer 2 is externally connected to the LED.
  • the shape of the conductive layer 2 is determined according to the type and connection mode of the external LED chip 4.
  • the number of the conductive layers 2 is determined according to the type and number of the external LED chips 4, and the spacing between the external LED chips 4, and the pins are determined.
  • 3 is disposed on the insulating substrate 1.
  • the surface of the insulating substrate 1 is provided with a plurality of independently distributed conductive layers 2, and the LED chips 4 of various structures can be connected, and the two conductive layers 2 can be respectively connected to the two electrodes of the flip-chip LED chip 42. It is also possible to use a conductive layer 2 to be connected to the lower electrode of the vertical structure LED chip 43.
  • the two LED chips 4 are connected to the conductive layer 2 disposed between the two LED chips 4 through the bonding wires 5, thus realizing the adjacent LED chips 4
  • the connection makes the arrangement interval of the LED chip 4 unrestricted, and solves the problem that the bonding wire 5 is too long and too high, and is convenient for packaging.
  • connection modes between the LED chips 4 can be realized by using the conductive layer 2, including series, parallel, series-parallel combination and the like.
  • the pin 3 is disposed on the insulating substrate 1, for example, a pin 3 is disposed at each end of the insulating substrate 1, and the circuit on the insulating substrate 1 is connected to the pin 3 through the bonding wire 5, and further through the pin 3.
  • An external power supply circuit is connected to cause the package structure to emit light under the action of an external power supply circuit.
  • the two pins 3 can be disposed at the same end of the insulating substrate 1 according to actual needs.
  • the package structure can be illuminated by the external power supply circuit.
  • an embodiment of the present invention provides an LED filament substrate and an LED package structure.
  • the LED filament substrate includes an insulating substrate 1, a conductive layer 2, and a lead 3.
  • the LED package structure includes the LED filament substrate. And a plurality of LED chips 4, a plurality of bonding wires 5 and an encapsulant 6, and by adjusting the number and shape of the conductive layers 2, the connection manner of the LED chips 4 in parallel is realized.
  • the LED filament substrate, the LED package structure and the LED lamp provided by the embodiment of the invention have a conductive layer disposed on the LED filament substrate, and the shape of the conductive layer can be determined according to the type and connection mode of the external LED chip, according to the type of the external LED chip.
  • the number and the spacing between the external LED chips determine the number of conductive layers, and various types of LED chips can be selected, and the spacing and series-parallel arrangement of the LED chips are not limited, and the LED chips on the LED filament substrate are arranged more. diversification.
  • the leads 3 are respectively disposed at both ends of the insulating substrate 1 or at the same end of the insulating substrate 1.
  • a pin 3 is disposed at each end of the insulating substrate 1, and the circuit on the insulating substrate 1 is connected to the pin 3 through the bonding wire 5, and further connected to the external power supply circuit through the pin 3, and the external power supply circuit
  • the package structure is illuminated by the action.
  • the two pins 3 can be disposed at the same end of the insulating substrate 1 according to actual needs.
  • the package structure can be illuminated by the external power supply circuit.
  • the conductive layer 2 is externally connected to the LED chip 4 through the chip electrode or the bonding wire 5.
  • the conductive layer 2 is directly connected to the chip electrode of the LED chip 4 of the vertical structure or the flip-chip structure, and the conductive layer 2 is connected to the LED chip 41 by the bonding wire 5.
  • the material of the insulating substrate 1 is a sapphire, glass, ceramic, polyimide or polyester film.
  • the insulating base material 1 is an insulating base material such as sapphire, glass, ceramic, polyimide or polyester film.
  • the material of the conductive layer 2 is a silver conductive material, a copper conductive material, a gold conductive material or a transparent metal compound conductive material.
  • the conductive layer 2 is disposed on the surface of the insulating substrate 1 and is independently distributed, and may be a conductive material such as silver, copper, gold or a transparent metal compound prepared by vapor deposition, electroplating, sintering or the like.
  • a second aspect of an embodiment of the present invention provides an LED package structure, including the LED filament substrate provided by the first aspect of the present invention, further comprising a plurality of LED chips, a plurality of bonding wires, and an encapsulant;
  • Each LED chip 4 is disposed on the LED filament substrate, and the different LED chips 4 are connected by a bonding wire 5 and/or a conductive layer 2 of the LED filament substrate, and the encapsulant is wrapped on the LED filament substrate, The outer side of each LED chip and each bonding wire.
  • the LED package structure includes an insulating substrate 1, a conductive layer 2, a lead 3, an LED chip 41 of a self-contained structure, an LED chip 42 of a flip-chip structure, and an LED chip 43 of a self-contained structure. , bonding wire 5 and encapsulant 6.
  • the LED chip 41 of the positive structure is connected to the LED chip 43 of the vertical structure through the bonding wire 5 and the conductive layer 2
  • the LED chip 43 of the vertical structure is connected to the LED chip 42 of the flip-chip structure through the bonding wire 5 and the conductive layer 2
  • Various types of LED chips 4 are selected, and the package structure is diverse.
  • the LED filament substrate comprises an intermediate region and an edge region, in which at least two LED chips 4 are disposed, in the intermediate region, at the geometric center of the LED filament substrate to the LED
  • the distance between the LED chip 4 and the next adjacent LED chip 4 is less than or equal to the distance between the LED chip 4 and the adjacent LED chip 4 in the edge region, in the edge region, in the LED
  • the geometric center of the filament substrate is in the direction of the two ends of the LED filament substrate, and the distance between the LED chip 4 and the next adjacent LED chip 4 is less than or equal to the distance between the LED chip 4 and the adjacent LED chip 4 of the upper stage.
  • the maximum spacing of adjacent LED chips 4 in the edge region is less than the minimum spacing of adjacent LED chips 4 in the intermediate region.
  • the plurality of LED chips 4 are fixedly disposed on the LED filament substrate, the LED chips 4 may be arranged in a straight line, and the adjacent two LED chips 4 are connected by a bonding wire 5, or may be connected by a bonding wire 5 and The conductive layer 2 is connected in combination.
  • the middle area of the LED filament substrate in FIG. 6 is provided with four LED chips 4, and the spacing between adjacent LED chips 4 includes L0, L1, L1', where L0 is the maximum spacing value, and L1 or L1' is the intermediate area.
  • the LED chips 4 are arranged loosely.
  • the LED chips 4 are arranged closely at the edge of the filament substrate, so that the filament substrate is evenly dissipated, and the local temperature is too high, which is more stable and reliable.
  • the types of the respective LED chips 4 are a formal structure, a flip-chip structure, or a vertical structure.
  • the two electrodes of the LED chip 41 of the front-mounted structure are connected by a bonding wire 5, and the two electrodes of the LED chip 42 of the flip-chip structure are connected by a conductive layer 2, and the vertical structure
  • the upper electrode of the LED chip 43 is connected by a bonding wire 5, and the lower electrode of the vertical LED chip 43 is connected by a conductive layer 2.
  • the two electrodes of the LED chip 41 of the positive structure are located on the upper side of the LED chip, and the bonding wires 5 are required to connect the electrodes of the conductive layer 2 or other LED chips.
  • the two electrodes of the flip-chip LED chip 42 are located on the lower side of the LED chip 4, and two conductive layers 2 are required to be respectively connected to the two electrodes thereof, and the conductive layer 2 is used to connect the bonding wires 5 or other flip-chip LED chips. 42 electrodes.
  • the two electrodes of the LED chip 43 of the vertical structure are respectively located on the upper side and the lower side of the LED chip 4, and the lower electrode can be connected to the conductive layer 2, and then the electrode of the bonding wire 5 or other LED chip 4 is connected through the conductive layer 2.
  • the upper electrode may be connected to the electrode of the conductive layer 2 or other LED chip 4 through the bonding wire 5.
  • the encapsulant 6 is an epoxy resin encapsulant, a silicone encapsulant, a polyurethane encapsulant or a photocurable encapsulant.
  • the encapsulant 6 can also be a fluorescent glue, which is an epoxy resin encapsulant of a mixed phosphor, a silicone encapsulant mixed with a phosphor, a polyurethane encapsulant mixed with a phosphor, or a photocuring of a mixed phosphor.
  • a fluorescent glue which is an epoxy resin encapsulant of a mixed phosphor, a silicone encapsulant mixed with a phosphor, a polyurethane encapsulant mixed with a phosphor, or a photocuring of a mixed phosphor.
  • a suitable encapsulant 6 can be selected, and the phosphor is mixed with the encapsulant 6 to obtain a fluorescent glue according to a certain ratio, and the encapsulation by the fluorescent glue can improve the luminous efficiency and improve the luminous effect.
  • Epoxy resin encapsulant can be cured at room temperature or after heating. It has high hardness, smooth surface and high transparency after curing. It also has the characteristics of insulation, waterproof, oil proof, dust and corrosion resistance, aging resistance and thermal shock resistance. Epoxy encapsulant encapsulates the light-emitting module, which is easy to operate and has high gloss on the surface of the package.
  • Silicone encapsulant has strong anti-ozone ability, does not cause yellowing phenomenon, can maintain the transparency of colloid, and has strong resistance to aging, high temperature and low temperature. It also has excellent waterproof ability and can be wet. In the environment, the normal use of the light-emitting module is ensured, and the light-emitting effect can be changed by mixing the phosphor.
  • Polyurethane encapsulant has good tensile strength, high mechanical strength, good elasticity, excellent recovery and can be used for dynamic seams.
  • the light-curing encapsulant has high bonding strength, good chemical stability, excellent electrical properties and good heat resistance, and is suitable for electronic device packaging, and the photocurable encapsulant can be cured at a low temperature, and is suitable for packaging of heat sensitive materials, and has high curing speed and high efficiency. It can be applied to high-speed production lines, which is conducive to improving production efficiency.
  • a third aspect of the embodiments of the present invention provides an LED luminaire, which includes the LED package structure provided by the second aspect of the embodiment of the present invention.
  • the specific structure and function of each unit in the LED package structure refer to the above embodiment, because the LED luminaire adopts All the technical solutions of the above embodiments are at least have all the beneficial effects brought by the technical solutions of the above embodiments.
  • each functional module described above is exemplified.
  • the above function assignment can be completed by different functional units and modules as needed. That is, the internal structure of the device is divided into different functional units or modules to perform all or part of the functions described above.
  • Each functional unit and module in the embodiment may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit, and the integrated unit may be hardware.
  • Formal implementation can also be implemented in the form of software functional units.
  • the specific names of the respective functional units and modules are only for the purpose of facilitating mutual differentiation, and are not intended to limit the scope of protection of the present application.
  • For the specific working process of the unit and the module in the foregoing system reference may be made to the corresponding process in the foregoing method embodiment, and details are not described herein again.
  • the disclosed apparatus and method may be implemented in other manners.
  • the system embodiment described above is merely illustrative.
  • the division of the module or unit is only a logical function division.
  • there may be another division manner for example, multiple units or components may be used. Combinations can be integrated into another system, or some features can be ignored or not executed.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in electrical, mechanical or other form.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
  • each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
  • the above integrated unit can be implemented in the form of hardware or in the form of a software functional unit.

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

The present invention is applicable to the technical field of light emitting diode (LED) applications, and provides an LED filament substrate, an LED package structure, and an LED lamp. The LED filament substrate comprises an insulating base, conductive layers, and pins connected to an external power supply circuit. The conductive layers are provided on the surface of the insulating base. The conductive layers are connected to external LED chips. The shape of the conductive layers is determined according to the types and connection mode of the external LED chips. The number of the conductive layers is determined according to the types and number of the external LED chips and the spacing between the external LED chips. The pins are provided on the insulating base. According to the LED filament substrate, the LED package structure, and the LED lamp provided in this solution, the conductive layers are provided on the LED filament substrate, multiple types of LED chips can be selected, and the spacing and series-parallel connection mode of the LED chips are not limited, and therefore, the arrangement of the LED chips on the LED filament substrate is diversified.

Description

LED灯丝基板、LED封装结构及LED灯具LED filament substrate, LED package structure and LED lamp 技术领域Technical field
本发明属于发光二极管应用技术领域,尤其涉及一种LED灯丝基板、LED封装结构及LED灯具。The invention belongs to the technical field of light emitting diodes, and particularly relates to an LED filament substrate, an LED package structure and an LED lamp.
背景技术Background technique
目前,绝缘灯丝基板的典型结构为绝缘基材以及基材两端用于外部电气连接的金属引脚,排布在灯丝基板上的多个发光二极管(Light Emitting Diode,LED)芯片可选用的芯片类型、芯片间距以及串并联方式都十分受限。在传统的封装结构中,通常是将多个正装结构的LED芯片等间距串联排布在基板上,芯片的排布方式单一。At present, the typical structure of the insulated filament substrate is an insulating substrate and metal pins for external electrical connection at both ends of the substrate, and a plurality of light emitting diodes arranged on the filament substrate (Light The chip types, chip spacing, and series-parallel options available for the Emitting Diode (LED) chip are very limited. In a conventional package structure, a plurality of LED chips of a front-mounted structure are usually arranged in series on a substrate, and the arrangement of the chips is single.
技术问题technical problem
有鉴于此,本发明实施例提供了一种LED灯丝基板、LED封装结构及LED灯具,以解决现有技术中LED灯丝基板上LED芯片可选用的芯片类型、芯片间距以及串并联方式受限,LED芯片排布方式单一的问题。In view of this, the embodiments of the present invention provide an LED filament substrate, an LED package structure, and an LED lamp, to solve the problem that the chip type, chip spacing, and series-parallel mode of the LED chip on the LED filament substrate in the prior art are limited. The problem of single arrangement of LED chips.
技术解决方案Technical solution
本发明实施例第一方面提供了一种LED灯丝基板,包括绝缘基材、导电层和用于连接外部供电电路的引脚,导电层设置在所述绝缘基材的表面,导电层外接LED芯片,导电层的形状根据外接LED芯片的类型和连接方式确定,导电层的个数根据外接LED芯片的类型、个数,以及外接LED芯片之间的间距确定,引脚设置在所述绝缘基材上。A first aspect of the embodiments of the present invention provides an LED filament substrate, including an insulating substrate, a conductive layer, and a lead for connecting an external power supply circuit. The conductive layer is disposed on a surface of the insulating substrate, and the conductive layer is externally connected with the LED chip. The shape of the conductive layer is determined according to the type and connection mode of the external LED chip, and the number of the conductive layers is determined according to the type and number of the external LED chips, and the spacing between the external LED chips, and the pins are disposed on the insulating substrate. on.
进一步地,引脚分别设置在所述绝缘基材的两端或设置在所述绝缘基材的同一端。Further, the pins are respectively disposed at both ends of the insulating substrate or at the same end of the insulating substrate.
进一步地,导电层通过芯片电极或键合线外接LED芯片。Further, the conductive layer is externally connected to the LED chip through the chip electrode or the bonding wire.
进一步地,所述绝缘基材的材料为蓝宝石、玻璃、陶瓷、聚酰亚胺或聚酯薄膜。Further, the material of the insulating substrate is sapphire, glass, ceramic, polyimide or polyester film.
进一步地,导电层的材料为银导电材料、铜导电材料、金导电材料或透明金属化合物导电材料。Further, the material of the conductive layer is a silver conductive material, a copper conductive material, a gold conductive material or a transparent metal compound conductive material.
本发明实施例第二方面提供了一种LED封装结构,包括本发明实施例第一方面提供的LED灯丝基板,还包括多个LED芯片、多条键合线和封装胶;A second aspect of the present invention provides an LED package structure, including the LED filament substrate provided by the first aspect of the present invention, further comprising a plurality of LED chips, a plurality of bonding wires and an encapsulant;
各个LED芯片设置在所述LED灯丝基板上,不同LED芯片之间通过键合线和/或所述LED灯丝基板的导电层连接,所述封装胶包裹在所述LED灯丝基板、各个LED芯片和各条键合线的外侧。Each LED chip is disposed on the LED filament substrate, and different LED chips are connected by a bonding wire and/or a conductive layer of the LED filament substrate, and the encapsulant is wrapped on the LED filament substrate, each LED chip and The outer side of each bond wire.
进一步地,所述LED灯丝基板包括中间区域和边缘区域,在所述中间区域内至少设置有两个LED芯片,在所述中间区域内,在所述LED灯丝基板的几何中心到所述LED灯丝基板两端方向上,LED芯片与下一级相邻LED芯片的间距小于或等于LED芯片与上一级相邻LED芯片的间距,在所述边缘区域内,在所述LED灯丝基板的几何中心到所述LED灯丝基板两端方向上,LED芯片与下一级相邻LED芯片的间距小于或等于LED芯片与上一级相邻LED芯片的间距,所述边缘区域内相邻LED芯片的最大间距小于所述中间区域内相邻LED芯片的最小间距。Further, the LED filament substrate comprises an intermediate region and an edge region, wherein at least two LED chips are disposed in the intermediate region, in the intermediate region, at a geometric center of the LED filament substrate to the LED filament In the direction of the two ends of the substrate, the distance between the LED chip and the next adjacent LED chip is less than or equal to the distance between the LED chip and the adjacent LED chip, and in the edge region, at the geometric center of the LED filament substrate In the direction of the two ends of the LED filament substrate, the distance between the LED chip and the next adjacent LED chip is less than or equal to the distance between the LED chip and the adjacent LED chip, and the maximum of the adjacent LED chips in the edge region The spacing is less than the minimum spacing of adjacent LED chips in the intermediate region.
进一步地,各个LED芯片的类型为正装结构、倒装结构或垂直结构。Further, the types of the respective LED chips are a formal structure, a flip-chip structure, or a vertical structure.
进一步地,所述封装胶为环氧树脂封装胶、有机硅封装胶、聚氨酯封装胶或光固化封装胶。Further, the encapsulant is an epoxy resin encapsulant, a silicone encapsulant, a polyurethane encapsulant or a photocurable encapsulant.
本发明实施例第三方面提供了一种LED灯具,包括本发明实施例第二方面提供的LED封装结构。A third aspect of the embodiments of the present invention provides an LED luminaire comprising the LED package structure provided by the second aspect of the embodiments of the present invention.
有益效果Beneficial effect
本发明实施例与现有技术相比存在的有益效果是:本发明实施例提供的LED灯丝基板、LED封装结构及LED灯具,LED灯丝基板上设置有导电层,可以根据外接LED芯片的类型和连接方式确定导电层的形状,根据外接LED芯片的类型、个数,以及外接LED芯片之间的间距确定导电层的个数,可以选择多种类型的LED芯片,而且LED芯片的间距及串并联方式不受限制,LED灯丝基板上LED芯片的排布方式更加多样化。Compared with the prior art, the embodiment of the present invention has the beneficial effects that the LED filament substrate, the LED package structure and the LED lamp provided by the embodiment of the invention are provided with a conductive layer on the LED filament substrate, which can be according to the type of the external LED chip and The connection method determines the shape of the conductive layer, and the number of the conductive layers is determined according to the type and number of external LED chips, and the spacing between the external LED chips. Various types of LED chips can be selected, and the spacing of the LED chips and the series and parallel connection The method is not limited, and the arrangement of the LED chips on the LED filament substrate is more diverse.
附图说明DRAWINGS
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the embodiments or the description of the prior art will be briefly described below. It is obvious that the drawings in the following description are only the present invention. For some embodiments, other drawings may be obtained from those of ordinary skill in the art in light of the inventive workability.
图1是本发明实施例提供的一种LED灯丝基板的结构示意图;1 is a schematic structural view of an LED filament substrate according to an embodiment of the present invention;
图2是本发明实施例提供的一种实现LED芯片并联连接的LED灯丝基板的结构示意图;2 is a schematic structural diagram of an LED filament substrate for realizing parallel connection of LED chips according to an embodiment of the present invention;
图3是本发明实施例提供的一种实现LED芯片并联连接的LED封装结构的结构示意图;3 is a schematic structural diagram of an LED package structure for realizing parallel connection of LED chips according to an embodiment of the present invention;
图4是本发明另一实施例提供的一种LED封装结构的侧视图;4 is a side view of an LED package structure according to another embodiment of the present invention;
图5是图4中本发明另一实施例提供的一种LED封装结构的俯视图;FIG. 5 is a top plan view of an LED package structure according to another embodiment of the present invention; FIG.
图6是本发明实施例提供的一种LED封装结构的结构示意图。FIG. 6 is a schematic structural diagram of an LED package structure according to an embodiment of the present invention.
图中:1、绝缘基材,2、导电层,3、引脚,4、LED芯片,5、键合线,6、封装胶,41、正装结构的LED芯片,42、倒装结构的LED芯片,43、垂直结构的LED芯片。In the figure: 1, insulating substrate, 2, conductive layer, 3, pin, 4, LED chip, 5, bonding wire, 6, package adhesive, 41, LED chip in the formal structure, 42, flip-chip LED Chip, 43, LED chip with vertical structure.
本发明的实施方式Embodiments of the invention
以下描述中,为了说明而不是为了限定,提出了诸如特定系统结构、技术之类的具体细节,以便透彻理解本发明实施例。然而,本领域的技术人员应当清楚,在没有这些具体细节的其它实施例中也可以实现本发明。在其它情况中,省略对众所周知的系统、装置、电路以及方法的详细说明,以免不必要的细节妨碍本发明的描述。In the following description, for purposes of illustration and description However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the invention.
为了说明本发明所述的技术方案,下面通过具体实施例来进行说明。In order to explain the technical solution described in the present invention, the following description will be made by way of specific embodiments.
图1为本发明实施例第一方面提供的一种LED灯丝基板的结构示意图。FIG. 1 is a schematic structural diagram of an LED filament substrate according to a first aspect of the present invention.
在本发明实施例中,LED灯丝基板包括绝缘基材1、导电层2和用于连接外部供电电路的引脚3,导电层2设置在所述绝缘基材1的表面,导电层2外接LED芯片4,导电层2的形状根据外接LED芯片4的类型和连接方式确定,导电层2的个数根据外接LED芯片4的类型、个数,以及外接LED芯片4之间的间距确定,引脚3设置在所述绝缘基材1上。In an embodiment of the invention, the LED filament substrate comprises an insulating substrate 1, a conductive layer 2 and a lead 3 for connecting an external power supply circuit. The conductive layer 2 is disposed on the surface of the insulating substrate 1, and the conductive layer 2 is externally connected to the LED. The shape of the conductive layer 2 is determined according to the type and connection mode of the external LED chip 4. The number of the conductive layers 2 is determined according to the type and number of the external LED chips 4, and the spacing between the external LED chips 4, and the pins are determined. 3 is disposed on the insulating substrate 1.
具体地,绝缘基材1表面设置有多个独立分布的导电层2,能够连接多种结构的LED芯片4,可以利用两个导电层2分别与倒装结构LED芯片42的两个电极连接,也可以利用一个导电层2与垂直结构LED芯片43的下侧电极连接。此外,在相邻LED芯片4的间距较大时,两个LED芯片4都通过键合线5与设置在两个LED芯片4之间的导电层2连接,这样就实现了相邻LED芯片4的连接,使LED芯片4的排布间距不受限制,同时解决了键合线5过长、过高的问题,便于封装。而且利用导电层2可以实现LED芯片4之间的多种连接方式,包括串联、并联和串并联结合等。引脚3设置在绝缘基材1上,例如在绝缘基材1的两端各设置一个引脚3,绝缘基材1上的电路通过键合线5与引脚3连接,进一步通过引脚3连接外部供电电路,在外部供电电路的作用下使封装结构发光。此外,根据实际需求也可以将两个引脚3设置在绝缘基材1的同一端,同理,在外部供电电路的作用下也可以使封装结构发光。Specifically, the surface of the insulating substrate 1 is provided with a plurality of independently distributed conductive layers 2, and the LED chips 4 of various structures can be connected, and the two conductive layers 2 can be respectively connected to the two electrodes of the flip-chip LED chip 42. It is also possible to use a conductive layer 2 to be connected to the lower electrode of the vertical structure LED chip 43. In addition, when the pitch of the adjacent LED chips 4 is large, the two LED chips 4 are connected to the conductive layer 2 disposed between the two LED chips 4 through the bonding wires 5, thus realizing the adjacent LED chips 4 The connection makes the arrangement interval of the LED chip 4 unrestricted, and solves the problem that the bonding wire 5 is too long and too high, and is convenient for packaging. Moreover, various connection modes between the LED chips 4 can be realized by using the conductive layer 2, including series, parallel, series-parallel combination and the like. The pin 3 is disposed on the insulating substrate 1, for example, a pin 3 is disposed at each end of the insulating substrate 1, and the circuit on the insulating substrate 1 is connected to the pin 3 through the bonding wire 5, and further through the pin 3. An external power supply circuit is connected to cause the package structure to emit light under the action of an external power supply circuit. In addition, the two pins 3 can be disposed at the same end of the insulating substrate 1 according to actual needs. Similarly, the package structure can be illuminated by the external power supply circuit.
如图2及图3所示,本发明实施例提供了一种LED灯丝基板及LED封装结构,LED灯丝基板包括绝缘基材1、导电层2和引脚3,LED封装结构包括上述LED灯丝基板,以及多个LED芯片4、多条键合线5和封装胶6,通过调整导电层2的个数和形状,实现了LED芯片4两两并联的连接方式。As shown in FIG. 2 and FIG. 3, an embodiment of the present invention provides an LED filament substrate and an LED package structure. The LED filament substrate includes an insulating substrate 1, a conductive layer 2, and a lead 3. The LED package structure includes the LED filament substrate. And a plurality of LED chips 4, a plurality of bonding wires 5 and an encapsulant 6, and by adjusting the number and shape of the conductive layers 2, the connection manner of the LED chips 4 in parallel is realized.
本发明实施例提供的LED灯丝基板、LED封装结构及LED灯具,LED灯丝基板上设置有导电层,可以根据外接LED芯片的类型和连接方式确定导电层的形状,根据外接LED芯片的类型、个数,以及外接LED芯片之间的间距确定导电层的个数,可以选择多种类型的LED芯片,而且LED芯片的间距及串并联方式不受限制,LED灯丝基板上LED芯片的排布方式更加多样化。The LED filament substrate, the LED package structure and the LED lamp provided by the embodiment of the invention have a conductive layer disposed on the LED filament substrate, and the shape of the conductive layer can be determined according to the type and connection mode of the external LED chip, according to the type of the external LED chip. The number and the spacing between the external LED chips determine the number of conductive layers, and various types of LED chips can be selected, and the spacing and series-parallel arrangement of the LED chips are not limited, and the LED chips on the LED filament substrate are arranged more. diversification.
进一步地,引脚3分别设置在所述绝缘基材1的两端或设置在所述绝缘基材1的同一端。Further, the leads 3 are respectively disposed at both ends of the insulating substrate 1 or at the same end of the insulating substrate 1.
具体地,在绝缘基材1的两端各设置一个引脚3,绝缘基材1上的电路通过键合线5与引脚3连接,进一步通过引脚3连接外部供电电路,在外部供电电路的作用下使封装结构发光。此外,根据实际需求也可以将两个引脚3设置在绝缘基材1的同一端,同理,在外部供电电路的作用下也可以使封装结构发光。Specifically, a pin 3 is disposed at each end of the insulating substrate 1, and the circuit on the insulating substrate 1 is connected to the pin 3 through the bonding wire 5, and further connected to the external power supply circuit through the pin 3, and the external power supply circuit The package structure is illuminated by the action. In addition, the two pins 3 can be disposed at the same end of the insulating substrate 1 according to actual needs. Similarly, the package structure can be illuminated by the external power supply circuit.
进一步地,导电层2通过芯片电极或键合线5外接LED芯片4。Further, the conductive layer 2 is externally connected to the LED chip 4 through the chip electrode or the bonding wire 5.
具体地,导电层2直接与垂直结构或倒装结构的LED芯片4的芯片电极连接,导电层2通过键合线5与正装LED芯片41连接。Specifically, the conductive layer 2 is directly connected to the chip electrode of the LED chip 4 of the vertical structure or the flip-chip structure, and the conductive layer 2 is connected to the LED chip 41 by the bonding wire 5.
进一步地,所述绝缘基材1的材料为蓝宝石、玻璃、陶瓷、聚酰亚胺或聚酯薄膜。Further, the material of the insulating substrate 1 is a sapphire, glass, ceramic, polyimide or polyester film.
具体地,绝缘基材1为蓝宝石、玻璃、陶瓷、聚酰亚胺或聚酯薄膜等绝缘基底材料。Specifically, the insulating base material 1 is an insulating base material such as sapphire, glass, ceramic, polyimide or polyester film.
进一步地,导电层2的材料为银导电材料、铜导电材料、金导电材料或透明金属化合物导电材料。Further, the material of the conductive layer 2 is a silver conductive material, a copper conductive material, a gold conductive material or a transparent metal compound conductive material.
具体地,导电层2设置在绝缘基材1表面,独立分布,可以是采用蒸镀、电镀、烧结等方式制备的银、铜、金或透明金属化合物等导电材料。Specifically, the conductive layer 2 is disposed on the surface of the insulating substrate 1 and is independently distributed, and may be a conductive material such as silver, copper, gold or a transparent metal compound prepared by vapor deposition, electroplating, sintering or the like.
参阅图4,本发明实施例第二方面提供了一种LED封装结构,包括本发明实施例第一方面提供的LED灯丝基板,还包括多个LED芯片、多条键合线和封装胶;Referring to FIG. 4, a second aspect of an embodiment of the present invention provides an LED package structure, including the LED filament substrate provided by the first aspect of the present invention, further comprising a plurality of LED chips, a plurality of bonding wires, and an encapsulant;
各个LED芯片4设置在所述LED灯丝基板上,不同LED芯片4之间通过键合线5和/或所述LED灯丝基板的导电层2连接,所述封装胶包裹在所述LED灯丝基板、各个LED芯片和各条键合线的外侧。Each LED chip 4 is disposed on the LED filament substrate, and the different LED chips 4 are connected by a bonding wire 5 and/or a conductive layer 2 of the LED filament substrate, and the encapsulant is wrapped on the LED filament substrate, The outer side of each LED chip and each bonding wire.
具体地,如图4及图5所示,LED封装结构包括绝缘基材1、导电层2、引脚3、正装结构的LED芯片41、倒装结构的LED芯片42、正装结构的LED芯片43、键合线5和封装胶6。正装结构的LED芯片41通过键合线5和导电层2与垂直结构的LED芯片43连接,垂直结构的LED芯片43通过键合线5和导电层2与倒装结构的LED芯片42连接,可以选用多种类型的LED芯片4,封装结构多样化。Specifically, as shown in FIG. 4 and FIG. 5, the LED package structure includes an insulating substrate 1, a conductive layer 2, a lead 3, an LED chip 41 of a self-contained structure, an LED chip 42 of a flip-chip structure, and an LED chip 43 of a self-contained structure. , bonding wire 5 and encapsulant 6. The LED chip 41 of the positive structure is connected to the LED chip 43 of the vertical structure through the bonding wire 5 and the conductive layer 2, and the LED chip 43 of the vertical structure is connected to the LED chip 42 of the flip-chip structure through the bonding wire 5 and the conductive layer 2, Various types of LED chips 4 are selected, and the package structure is diverse.
进一步地,所述LED灯丝基板包括中间区域和边缘区域,在所述中间区域内至少设置有两个LED芯片4,在所述中间区域内,在所述LED灯丝基板的几何中心到所述LED灯丝基板两端方向上,LED芯片4与下一级相邻LED芯片4的间距小于或等于LED芯片4与上一级相邻LED芯片4的间距,在所述边缘区域内,在所述LED灯丝基板的几何中心到所述LED灯丝基板两端方向上,LED芯片4与下一级相邻LED芯片4的间距小于或等于LED芯片4与上一级相邻LED芯片4的间距,所述边缘区域内相邻LED芯片4的最大间距小于所述中间区域内相邻LED芯片4的最小间距。Further, the LED filament substrate comprises an intermediate region and an edge region, in which at least two LED chips 4 are disposed, in the intermediate region, at the geometric center of the LED filament substrate to the LED In the direction of the two ends of the filament substrate, the distance between the LED chip 4 and the next adjacent LED chip 4 is less than or equal to the distance between the LED chip 4 and the adjacent LED chip 4 in the edge region, in the edge region, in the LED The geometric center of the filament substrate is in the direction of the two ends of the LED filament substrate, and the distance between the LED chip 4 and the next adjacent LED chip 4 is less than or equal to the distance between the LED chip 4 and the adjacent LED chip 4 of the upper stage. The maximum spacing of adjacent LED chips 4 in the edge region is less than the minimum spacing of adjacent LED chips 4 in the intermediate region.
具体地,多个LED芯片4固定设置在LED灯丝基板上,LED芯片4可以按照直线排列,相邻的两个LED芯片4之间通过键合线5进行连接,也可以通过键合线5和导电层2进行组合连接。例如,图6中LED灯丝基板的中间区域设置有四个LED芯片4,相邻LED芯片4之间的间距包括L0、L1、L1',其中L0为最大间距值,L1或L1'为中间区域的最小间距,L2或L2'为边缘区域的最大间距,但仍然有L1>L2、L1> L2'、L1'> L2'或L1'> L2,在边缘区域相邻LED芯片4之间的间距的大小关系可以为L2>L3=L4…和L2'=L3'>L4'…,这样在LED灯丝基板的中间位置LED芯片4排列较为疏松,在灯丝基板的边缘位置LED芯片4排列较为紧密,使灯丝基板散热均匀,避免局部温度过高,更加稳定可靠。Specifically, the plurality of LED chips 4 are fixedly disposed on the LED filament substrate, the LED chips 4 may be arranged in a straight line, and the adjacent two LED chips 4 are connected by a bonding wire 5, or may be connected by a bonding wire 5 and The conductive layer 2 is connected in combination. For example, the middle area of the LED filament substrate in FIG. 6 is provided with four LED chips 4, and the spacing between adjacent LED chips 4 includes L0, L1, L1', where L0 is the maximum spacing value, and L1 or L1' is the intermediate area. The minimum spacing, L2 or L2' is the maximum spacing of the edge regions, but still has L1>L2, L1> L2', L1'> L2' or L1'> L2, the size relationship between the adjacent LED chips 4 in the edge region may be L2>L3=L4... and L2'=L3'>L4'..., so that the position is in the middle of the LED filament substrate The LED chips 4 are arranged loosely. The LED chips 4 are arranged closely at the edge of the filament substrate, so that the filament substrate is evenly dissipated, and the local temperature is too high, which is more stable and reliable.
进一步地,各个LED芯片4的类型为正装结构、倒装结构或垂直结构。Further, the types of the respective LED chips 4 are a formal structure, a flip-chip structure, or a vertical structure.
具体地,如图4及图5所示,正装结构的LED芯片41的两个电极均采用键合线5连接,倒装结构的LED芯片42的两个电极均采用导电层2连接,垂直结构的LED芯片43的上侧电极采用键合线5连接,垂直结构的LED芯片43的下侧电极采用导电层2连接。正装结构的LED芯片41的两个电极均位于LED芯片的上侧,需要采用键合线5连接导电层2或其他LED芯片的电极。倒装结构的LED芯片42的两个电极均位于LED芯片4的下侧,需要采用两个导电层2分别与其两个电极连接,利用导电层2连接键合线5或其他倒装结构LED芯片42的电极。垂直结构的LED芯片43的两个电极分别位于LED芯片4的上侧和下侧,下侧电极可以与导电层2进行连接,再通过导电层2连接键合线5或其他LED芯片4的电极,上侧电极可以通过键合线5连接导电层2或其他LED芯片4的电极。Specifically, as shown in FIG. 4 and FIG. 5, the two electrodes of the LED chip 41 of the front-mounted structure are connected by a bonding wire 5, and the two electrodes of the LED chip 42 of the flip-chip structure are connected by a conductive layer 2, and the vertical structure The upper electrode of the LED chip 43 is connected by a bonding wire 5, and the lower electrode of the vertical LED chip 43 is connected by a conductive layer 2. The two electrodes of the LED chip 41 of the positive structure are located on the upper side of the LED chip, and the bonding wires 5 are required to connect the electrodes of the conductive layer 2 or other LED chips. The two electrodes of the flip-chip LED chip 42 are located on the lower side of the LED chip 4, and two conductive layers 2 are required to be respectively connected to the two electrodes thereof, and the conductive layer 2 is used to connect the bonding wires 5 or other flip-chip LED chips. 42 electrodes. The two electrodes of the LED chip 43 of the vertical structure are respectively located on the upper side and the lower side of the LED chip 4, and the lower electrode can be connected to the conductive layer 2, and then the electrode of the bonding wire 5 or other LED chip 4 is connected through the conductive layer 2. The upper electrode may be connected to the electrode of the conductive layer 2 or other LED chip 4 through the bonding wire 5.
进一步地,所述封装胶6为环氧树脂封装胶、有机硅封装胶、聚氨酯封装胶或光固化封装胶。Further, the encapsulant 6 is an epoxy resin encapsulant, a silicone encapsulant, a polyurethane encapsulant or a photocurable encapsulant.
具体地,所述封装胶6也可以为荧光胶,荧光胶为混合荧光粉的环氧树脂封装胶、混合荧光粉的有机硅封装胶、混合荧光粉的聚氨酯封装胶或混合荧光粉的光固化封装胶。可以根据封装胶6的材料特性选取合适的封装胶6,按一定比例将荧光粉与封装胶6混合得到荧光胶,采用荧光胶进行封装可以提高发光效率,并且能够改善发光效果。Specifically, the encapsulant 6 can also be a fluorescent glue, which is an epoxy resin encapsulant of a mixed phosphor, a silicone encapsulant mixed with a phosphor, a polyurethane encapsulant mixed with a phosphor, or a photocuring of a mixed phosphor. Encapsulant. According to the material characteristics of the encapsulant 6, a suitable encapsulant 6 can be selected, and the phosphor is mixed with the encapsulant 6 to obtain a fluorescent glue according to a certain ratio, and the encapsulation by the fluorescent glue can improve the luminous efficiency and improve the luminous effect.
环氧树脂封装胶可以在室温或加热后固化,固化之后硬度高、表面平整、透明度高,而且还具有绝缘、防水、防油、防尘耐腐蚀、耐老化和耐冷热冲击等特性,采用环氧树脂封装胶封装发光模块,操作简单方便,而且封装表面光泽度高。Epoxy resin encapsulant can be cured at room temperature or after heating. It has high hardness, smooth surface and high transparency after curing. It also has the characteristics of insulation, waterproof, oil proof, dust and corrosion resistance, aging resistance and thermal shock resistance. Epoxy encapsulant encapsulates the light-emitting module, which is easy to operate and has high gloss on the surface of the package.
有机硅封装胶抗臭氧能力强,不会发生黄变现象,能够很好的保持胶体的透光性,而且耐老化、耐高温和耐低温能力强,还具备优秀的防水能力,能在湿态环境下保证发光模块的正常使用,能够通过混合荧光粉改变发光效果。Silicone encapsulant has strong anti-ozone ability, does not cause yellowing phenomenon, can maintain the transparency of colloid, and has strong resistance to aging, high temperature and low temperature. It also has excellent waterproof ability and can be wet. In the environment, the normal use of the light-emitting module is ensured, and the light-emitting effect can be changed by mixing the phosphor.
聚氨酯封装胶具有良好的拉伸强度,而且机械强度大,弹性良好,具有优良的复原性,可以用于动态接缝。Polyurethane encapsulant has good tensile strength, high mechanical strength, good elasticity, excellent recovery and can be used for dynamic seams.
光固化封装胶粘结强度高、化学稳定性好、电学性能优良、耐热性好,适合电子器件封装,而且光固化封装胶可以低温固化,适用于热敏感材料的封装,固化速度快效率高,能够应用于高速生产线,有利于提高生产效率。The light-curing encapsulant has high bonding strength, good chemical stability, excellent electrical properties and good heat resistance, and is suitable for electronic device packaging, and the photocurable encapsulant can be cured at a low temperature, and is suitable for packaging of heat sensitive materials, and has high curing speed and high efficiency. It can be applied to high-speed production lines, which is conducive to improving production efficiency.
本发明实施例第三方面提供了一种LED灯具,包括本发明实施例第二方面提供的LED封装结构,LED封装结构中各个单元的具体结构和功能参照上述实施例,由于所述LED灯具采用了上述实施例的所有技术方案,因此至少具有上述实施例的技术方案所带来的所有有益效果。A third aspect of the embodiments of the present invention provides an LED luminaire, which includes the LED package structure provided by the second aspect of the embodiment of the present invention. The specific structure and function of each unit in the LED package structure refer to the above embodiment, because the LED luminaire adopts All the technical solutions of the above embodiments are at least have all the beneficial effects brought by the technical solutions of the above embodiments.
所属领域的技术人员可以清楚地了解到,为了描述的方便和简洁,仅以上述各功能模块的划分进行举例说明,实际应用中,可以根据需要而将上述功能分配由不同的功能单元、模块完成,即将所述装置的内部结构划分成不同的功能单元或模块,以完成以上描述的全部或者部分功能。实施例中的各功能单元、模块可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中,上述集成的单元既可以采用硬件的形式实现,也可以采用软件功能单元的形式实现。另外,各功能单元、模块的具体名称也只是为了便于相互区分,并不用于限制本申请的保护范围。上述系统中单元、模块的具体工作过程,可以参考前述方法实施例中的对应过程,在此不再赘述。It will be clearly understood by those skilled in the art that, for convenience and brevity of description, only the division of each functional module described above is exemplified. In practical applications, the above function assignment can be completed by different functional units and modules as needed. That is, the internal structure of the device is divided into different functional units or modules to perform all or part of the functions described above. Each functional unit and module in the embodiment may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit, and the integrated unit may be hardware. Formal implementation can also be implemented in the form of software functional units. In addition, the specific names of the respective functional units and modules are only for the purpose of facilitating mutual differentiation, and are not intended to limit the scope of protection of the present application. For the specific working process of the unit and the module in the foregoing system, reference may be made to the corresponding process in the foregoing method embodiment, and details are not described herein again.
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述或记载的部分,可以参见其它实施例的相关描述。In the above embodiments, the descriptions of the various embodiments are different, and the parts that are not detailed or described in a certain embodiment can be referred to the related descriptions of other embodiments.
本领域普通技术人员可以意识到,结合本文中所公开的实施例描述的各示例的单元及算法步骤,能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行,取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能,但是这种实现不应认为超出本发明的范围。Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the various examples described in connection with the embodiments disclosed herein can be implemented in electronic hardware or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the solution. A person skilled in the art can use different methods for implementing the described functions for each particular application, but such implementation should not be considered to be beyond the scope of the present invention.
在本发明所提供的实施例中,应该理解到,所揭露的装置和方法,可以通过其它的方式实现。例如,以上所描述的系统实施例仅仅是示意性的,例如,所述模块或单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通讯连接可以是通过一些接口,装置或单元的间接耦合或通讯连接,可以是电性,机械或其它的形式。In the embodiments provided by the present invention, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the system embodiment described above is merely illustrative. For example, the division of the module or unit is only a logical function division. In actual implementation, there may be another division manner, for example, multiple units or components may be used. Combinations can be integrated into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in electrical, mechanical or other form.
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
另外,在本发明各个实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现,也可以采用软件功能单元的形式实现。In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above integrated unit can be implemented in the form of hardware or in the form of a software functional unit.
以上所述实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围,均应包含在本发明的保护范围之内。The embodiments described above are only for explaining the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that The technical solutions described in the examples are modified, or some of the technical features are equivalently replaced; and the modifications or substitutions do not deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in Within the scope of protection of the present invention.

Claims (10)

  1. 一种发光二极管LED灯丝基板,其特征在于,包括绝缘基材、导电层和用于连接外部供电电路的引脚,导电层设置在所述绝缘基材的表面,导电层外接LED芯片,导电层的形状根据外接LED芯片的类型和连接方式确定,导电层的个数根据外接LED芯片的类型、个数,以及外接LED芯片之间的间距确定,引脚设置在所述绝缘基材上。A light-emitting diode LED filament substrate, comprising: an insulating substrate, a conductive layer and a lead for connecting an external power supply circuit, the conductive layer is disposed on the surface of the insulating substrate, the conductive layer is externally connected with the LED chip, and the conductive layer The shape is determined according to the type and connection mode of the external LED chip, and the number of the conductive layers is determined according to the type and number of the external LED chips, and the spacing between the external LED chips, and the pins are disposed on the insulating substrate.
  2. 根据权利要求1所述的LED灯丝基板,其特征在于,引脚分别设置在所述绝缘基材的两端或设置在所述绝缘基材的同一端。The LED filament substrate according to claim 1, wherein the pins are respectively disposed at both ends of the insulating substrate or at the same end of the insulating substrate.
  3. 根据权利要求1所述的LED灯丝基板,其特征在于,导电层通过芯片电极或键合线外接LED芯片。The LED filament substrate according to claim 1, wherein the conductive layer is externally connected to the LED chip through a chip electrode or a bonding wire.
  4. 根据权利要求1所述的LED灯丝基板,其特征在于,所述绝缘基材的材料为蓝宝石、玻璃、陶瓷、聚酰亚胺或聚酯薄膜。The LED filament substrate according to claim 1, wherein the insulating substrate is made of sapphire, glass, ceramic, polyimide or polyester film.
  5. 根据权利要求1所述的LED灯丝基板,其特征在于,导电层的材料为银导电材料、铜导电材料、金导电材料或透明金属化合物导电材料。The LED filament substrate according to claim 1, wherein the conductive layer is made of a silver conductive material, a copper conductive material, a gold conductive material or a transparent metal compound conductive material.
  6. 一种LED封装结构,其特征在于,包括权利要求1至5任意一项所述的LED灯丝基板,还包括多个LED芯片、多条键合线和封装胶;An LED package structure, comprising the LED filament substrate of any one of claims 1 to 5, further comprising a plurality of LED chips, a plurality of bonding wires and an encapsulant;
    各个LED芯片设置在所述LED灯丝基板上,不同LED芯片之间通过键合线和/或所述LED灯丝基板的导电层连接,所述封装胶包裹在所述LED灯丝基板、各个LED芯片和各条键合线的外侧。Each LED chip is disposed on the LED filament substrate, and different LED chips are connected by a bonding wire and/or a conductive layer of the LED filament substrate, and the encapsulant is wrapped on the LED filament substrate, each LED chip and The outer side of each bond wire.
  7. 根据权利要求6所述的LED封装结构,其特征在于,所述LED灯丝基板包括中间区域和边缘区域,在所述中间区域内至少设置有两个LED芯片,在所述中间区域内,在所述LED灯丝基板的几何中心到所述LED灯丝基板两端方向上,LED芯片与下一级相邻LED芯片的间距小于或等于LED芯片与上一级相邻LED芯片的间距,在所述边缘区域内,在所述LED灯丝基板的几何中心到所述LED灯丝基板两端方向上,LED芯片与下一级相邻LED芯片的间距小于或等于LED芯片与上一级相邻LED芯片的间距,所述边缘区域内相邻LED芯片的最大间距小于所述中间区域内相邻LED芯片的最小间距。The LED package structure according to claim 6, wherein the LED filament substrate comprises an intermediate region and an edge region, wherein at least two LED chips are disposed in the intermediate region, and in the intermediate region The geometric center of the LED filament substrate is in the direction of the two ends of the LED filament substrate, and the distance between the LED chip and the next adjacent LED chip is less than or equal to the spacing between the LED chip and the adjacent LED chip at the edge, at the edge In the region, in the direction from the geometric center of the LED filament substrate to the ends of the LED filament substrate, the distance between the LED chip and the next adjacent LED chip is less than or equal to the spacing between the LED chip and the adjacent LED chip of the previous stage. The maximum spacing of adjacent LED chips in the edge region is less than the minimum spacing of adjacent LED chips in the intermediate region.
  8. 根据权利要求6所述的LED封装结构,其特征在于,各个LED芯片的类型为正装结构、倒装结构或垂直结构。The LED package structure according to claim 6, wherein each of the LED chips is of a positive-fit structure, a flip-chip structure or a vertical structure.
  9. 根据权利要求6所述的LED封装结构,其特征在于,所述封装胶为环氧树脂封装胶、有机硅封装胶、聚氨酯封装胶或光固化封装胶。The LED package structure according to claim 6, wherein the encapsulant is an epoxy encapsulant, a silicone encapsulant, a polyurethane encapsulant or a photocurable encapsulant.
  10. 一种LED灯具,其特征在于,包括权利要求6至9任意一项所述的LED封装结构。An LED lamp comprising the LED package structure according to any one of claims 6 to 9.
PCT/CN2018/077112 2017-12-19 2018-02-24 Led filament substrate, led package structure, and led lamp WO2019119639A1 (en)

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CN201721786702.2 2017-12-19
CN201711378083.8A CN108039402B (en) 2017-12-19 2017-12-19 LED filament substrate, LED packaging structure and LED lamp
CN201711378083.8 2017-12-19
CN201721786702.2U CN208157453U (en) 2017-12-19 2017-12-19 LED filament substrate, LED encapsulation structure and LED lamp

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1036416A1 (en) * 1997-05-15 2000-09-20 CIS Institut für Mikrosensorik Electronic hybrid component and method for the production thereof
US20090168403A1 (en) * 2007-12-27 2009-07-02 Chia-Hsien Chang Lateral light-emitting diode backlight module
CN204227119U (en) * 2014-11-14 2015-03-25 浙江英特来光电科技有限公司 A kind of LED silk

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1036416A1 (en) * 1997-05-15 2000-09-20 CIS Institut für Mikrosensorik Electronic hybrid component and method for the production thereof
US20090168403A1 (en) * 2007-12-27 2009-07-02 Chia-Hsien Chang Lateral light-emitting diode backlight module
CN204227119U (en) * 2014-11-14 2015-03-25 浙江英特来光电科技有限公司 A kind of LED silk

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