CN208157453U - LED filament substrate, LED encapsulation structure and LED lamp - Google Patents
LED filament substrate, LED encapsulation structure and LED lamp Download PDFInfo
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- CN208157453U CN208157453U CN201721786702.2U CN201721786702U CN208157453U CN 208157453 U CN208157453 U CN 208157453U CN 201721786702 U CN201721786702 U CN 201721786702U CN 208157453 U CN208157453 U CN 208157453U
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Abstract
The utility model is suitable for light emitting diode applied technical field, provide a kind of LED filament substrate, LED encapsulation structure and LED lamp, including insulating substrate, conductive layer and pin for connecting external power supply circuit, the surface of the insulating substrate is arranged in conductive layer, the external LED chip of conductive layer, the shape of conductive layer is determined according to the type and connection type of external LED chip, type, number of the number of conductive layer according to external LED chip, and the spacing between external LED chip determines, pin is arranged on the insulating substrate.LED filament substrate, LED encapsulation structure and LED lamp provided by the utility model, conductive layer is provided on LED filament substrate, it can choose a plurality of types of LED chips, and the spacing and series-parallel system of LED chip are unrestricted, and the arrangement mode of LED chip is more diversified on LED filament substrate.
Description
Technical field
The utility model belongs to light emitting diode applied technical field more particularly to a kind of LED filament substrate, LED encapsulation
Structure and LED lamp.
Background technique
Currently, the typical structure of insulation filament substrate is the gold that insulating substrate and substrate both ends are used for external electrical connection
Belong to pin, multiple light emitting diodes (Light Emitting Diode, the LED) chip being arranged on filament substrate is available
Chip type, chip chamber away from and series-parallel system it is all very limited.In traditional encapsulating structure, usually by multiple formal dress
For the equidistant series arrangement of the LED chip of structure on substrate, the arrangement mode of chip is single.
Utility model content
In view of this, the utility model embodiment provides a kind of LED filament substrate, LED encapsulation structure and LED lamp,
With solve in the prior art the available chip type of LED chip on LED filament substrate, chip chamber away from and series-parallel system by
Limit, the single problem of LED chip arrangement mode.
The utility model embodiment first aspect provides a kind of LED filament substrate, including insulating substrate, conductive layer and use
In the pin of connection external power supply circuit, the surface of the insulating substrate is arranged in conductive layer, and the external LED chip of conductive layer is led
The shape of electric layer determines according to the type and connection type of external LED chip, and the number of conductive layer is according to the class of external LED chip
Spacing between type, number and external LED chip determines that pin is arranged on the insulating substrate.
Further, pin is separately positioned on the both ends of the insulating substrate or the same of the insulating substrate is arranged in
End.
Further, conductive layer passes through chip electrode or the external LED chip of bonding line.
Further, the material of the insulating substrate is sapphire, glass, ceramics, polyimides or polyester film.
Further, the material of conductive layer is silver-colored conductive material, copper conductive material, golden conductive material or transparent metal chemical combination
Object conductive material.
The utility model embodiment second aspect provides a kind of LED encapsulation structure, including the utility model embodiment
On the one hand the LED filament substrate provided, further includes multiple LED chips, a plurality of bonding line and packaging plastic；
Each LED chip is arranged on the LED filament substrate, by bonding line and/or described between different LED chips
The conductive layer of LED filament substrate connects, and the packaging plastic is wrapped in the LED filament substrate, each LED chip and the bonding of each item
The outside of line.
Further, the LED filament substrate includes intermediate region and fringe region, is at least set in the intermediate region
Set there are two LED chip, in the intermediate region, the LED filament substrate geometric center to the LED filament substrate
In direction of both ends, the spacing of LED chip and next stage adjacent LED chip is less than or equal to LED chip and upper level adjacent LED core
The spacing of piece, in the fringe region, the LED filament substrate geometric center to LED filament substrate both ends side
Upwards, the spacing of LED chip and next stage adjacent LED chip is less than or equal between LED chip and upper level adjacent LED chip
Away from the maximum spacing of adjacent LED chip is less than in the intermediate region between the minimum of adjacent LED chip in the fringe region
Away from.
Further, the type of each LED chip is positive assembling structure, inverted structure or vertical structure.
Further, the packaging plastic is epoxy resin packaging plastic, organic silicon packaging glue, polyurethane packaging plastic or photocuring
Packaging plastic.
The utility model embodiment third aspect provides a kind of LED lamp, including the utility model embodiment second party
The LED encapsulation structure that face provides.
Existing beneficial effect is the utility model embodiment compared with prior art：It is provided by the embodiment of the utility model
LED filament substrate, LED encapsulation structure and LED lamp are provided with conductive layer on LED filament substrate, can be according to external LED core
The type and connection type of piece determine the shape of conductive layer, according to the type, number and external LED chip of external LED chip
Between spacing determine the number of conductive layer, can choose a plurality of types of LED chips, and the spacing of LED chip and string are simultaneously
Connection mode is unrestricted, and the arrangement mode of LED chip is more diversified on LED filament substrate.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new
Some embodiments of type for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of LED filament substrate provided by the embodiment of the utility model；
Fig. 2 is a kind of structure for realizing LED filament substrate that LED chip is connected in parallel provided by the embodiment of the utility model
Schematic diagram；
Fig. 3 is a kind of structure for realizing LED encapsulation structure that LED chip is connected in parallel provided by the embodiment of the utility model
Schematic diagram；
Fig. 4 is a kind of side view for LED encapsulation structure that another embodiment of the utility model provides；
Fig. 5 is a kind of top view of the LED encapsulation structure provided in Fig. 5；
Fig. 6 is a kind of structural schematic diagram of LED encapsulation structure provided by the embodiment of the utility model.
In figure：1, insulating substrate, 2, conductive layer, 3, pin, 4, LED chip, 5, bonding line, 6, packaging plastic, 41, formal dress knot
The LED chip of structure, 42, the LED chip of inverted structure, 43, the LED chip of vertical structure.
Specific embodiment
In being described below, for illustration and not for limitation, the tool of such as particular system structure, technology etc is proposed
Body details, to understand thoroughly the utility model embodiment.However, it will be clear to one skilled in the art that there is no these
The utility model also may be implemented in the other embodiments of detail.In other situations, omit to well-known system,
The detailed description of apparatus, circuit and method, in case unnecessary details interferes the description of the utility model.
In order to illustrate technical solution described in the utility model, the following is a description of specific embodiments.
Fig. 1 is a kind of structural schematic diagram for LED filament substrate that the utility model embodiment first aspect provides.
In the utility model embodiment, LED filament substrate includes insulating substrate 1, conductive layer 2 and for connecting external confession
The pin 3 of circuit, conductive layer 2 are arranged in the surface of the insulating substrate 1, the external LED chip 4 of conductive layer 2, conductive layer 2
Shape determines according to the type and connection type of external LED chip 4, the number of conductive layer 2 according to the type of external LED chip 4,
Spacing between number and external LED chip 4 determines that pin 3 is arranged on the insulating substrate 1.
Specifically, 1 surface of insulating substrate is provided with multiple conductive layers 2 being independently distributed, and can connect the LED of various structures
Chip 4 can use two conductive layers 2 and connect respectively with two electrodes of inverted structure LED chip 42, also can use one
Conductive layer 2 is connect with the lower lateral electrode of light emitting diode (LED) chip with vertical structure 43.In addition, when the spacing of adjacent LED chip 4 is larger, two
LED chip 4 is all connected by bonding line 5 and the conductive layer 2 being arranged between two LED chips 4, is thereby realized adjacent
The connection of LED chip 4 keeps the arrangement spacing of LED chip 4 unrestricted, while solving the problems, such as that bonding line 5 is too long, excessively high,
Convenient for encapsulation.And a variety of connection types between LED chip 4, including series, parallel and string may be implemented using conductive layer 2
Parallel connection combination etc..Pin 3 is arranged on insulating substrate 1, such as a pin 3 is respectively arranged at the both ends of insulating substrate 1, and insulate base
Circuit on material 1 is connect by bonding line 5 with pin 3, further external power supply circuit is connected by pin 3, in external power supply
Encapsulating structure is set to shine under the action of circuit.In addition, two pins 3 can also be arranged according to actual needs in insulating substrate 1
The same end, similarly, can also make under the action of external power supply circuit encapsulating structure shine.
As shown in Figures 2 and 3, the utility model embodiment provides a kind of LED filament substrate and LED encapsulation structure, LED
Filament substrate includes insulating substrate 1, conductive layer 2 and pin 3, and LED encapsulation structure includes above-mentioned LED filament substrate and multiple
LED chip 4, a plurality of bonding line 5 and packaging plastic 6 realize LED chip 4 two-by-two by adjusting the number and shape of conductive layer 2
Connection type in parallel.
LED filament substrate, LED encapsulation structure and LED lamp provided by the embodiment of the utility model, on LED filament substrate
It is provided with conductive layer, the shape of conductive layer can be determined according to the type and connection type of external LED chip, according to external LED
Spacing between the type of chip, number and external LED chip determines the number of conductive layer, can choose a plurality of types of
LED chip, and the spacing of LED chip and series-parallel system are unrestricted, the arrangement mode of LED chip on LED filament substrate
It is more diversified.
Further, pin 3 is separately positioned on the both ends of the insulating substrate 1 or the same of the insulating substrate 1 is arranged in
One end.
Specifically, one pin 3 is respectively set at the both ends of insulating substrate 1, the circuit on insulating substrate 1 passes through bonding line 5
It is connect with pin 3, external power supply circuit is further connected by pin 3, makes encapsulating structure under the action of external power supply circuit
It shines.In addition, two pins 3 can also be arranged in the same end of insulating substrate 1 according to actual needs, similarly, supplied in outside
Encapsulating structure can also be made to shine under the action of circuit.
Further, conductive layer 2 passes through chip electrode or the external LED chip 4 of bonding line 5.
Specifically, conductive layer 2 is directly connect with the chip electrode of vertical structure or the LED chip 4 of inverted structure, conductive layer
2 are connect by bonding line 5 with packed LED chip 41.
Further, the material of the insulating substrate 1 is sapphire, glass, ceramics, polyimides or polyester film.
Specifically, insulating substrate 1 is the dielectric substrate materials such as sapphire, glass, ceramics, polyimides or polyester film.
Further, the material of conductive layer 2 is silver-colored conductive material, copper conductive material, golden conductive material or transparent metallized
Close object conductive material.
Specifically, conductive layer 2 is arranged on 1 surface of insulating substrate, is independently distributed, and can be using vapor deposition, plating, sintering etc.
The conductive materials such as silver, copper, gold or transparent metal chemical combination object prepared by mode.
Refering to Fig. 4, the utility model embodiment second aspect provides a kind of LED encapsulation structure, including the utility model
The LED filament substrate that embodiment first aspect provides, further includes multiple LED chips, a plurality of bonding line and packaging plastic；
Each LED chip 4 is arranged on the LED filament substrate, between different LED chips 4 by bonding line 5 and/or
The conductive layer 2 of the LED filament substrate connects, and the packaging plastic is wrapped in the LED filament substrate, each LED chip and each
The outside of bonding line.
Specifically, as shown in Figures 4 and 5, LED encapsulation structure includes insulating substrate 1, conductive layer 2, pin 3, positive assembling structure
LED chip 41, the LED chip 42 of inverted structure, the LED chip 43 of positive assembling structure, bonding line 5 and packaging plastic 6.Positive assembling structure
LED chip 41 connect by bonding line 5 and conductive layer 2 with the LED chip 43 of vertical structure, the LED chip 43 of vertical structure
It is connect by bonding line 5 and conductive layer 2 with the LED chip 42 of inverted structure, a plurality of types of LED chips 4 can be selected, encapsulated
Structure diversification.
Further, the LED filament substrate includes intermediate region and fringe region, is at least set in the intermediate region
Set there are two LED chip 4, in the intermediate region, the LED filament substrate geometric center to the LED filament base
On board ends direction, LED chip 4 is adjacent with upper level less than or equal to LED chip 4 with the spacing of next stage adjacent LED chip 4
The spacing of LED chip 4, in the fringe region, the LED filament substrate geometric center to the LED filament substrate
In direction of both ends, LED chip 4 is adjacent with upper level less than or equal to LED chip 4 with the spacing of next stage adjacent LED chip 4
The spacing of LED chip 4, the maximum spacing of adjacent LED chip 4 is less than adjacent LED in the intermediate region in the fringe region
The minimum spacing of chip 4.
Specifically, multiple LED chips 4 are fixed on LED filament substrate, LED chip 4 can according to arranged in a straight line,
It is attached, can also be combined by bonding line 5 and conductive layer 2 by bonding line 5 between two adjacent LED chips 4
Connection.For example, spacing of the intermediate region setting of LED filament substrate there are four LED chip 4, between adjacent LED chip 4 in Fig. 6
Including L0, L1, L1', wherein L0 is maximum distance values, and L1 or L1' are the minimum spacing of intermediate region, and L2 or L2' are marginal zone
The maximum spacing in domain, but still have L1>L2,L1>L2',L1'>L2' or L1'>L2, between edge region adjacent LED chip 4
The size relation of spacing can be L2>L3=L4 ... and L2'=L3'>L4' ..., in this way in the middle position of LED filament substrate
The arrangement of LED chip 4 is more loose, more close in the arrangement of marginal position LED chip 4 of filament substrate, and filament substrate is made to radiate
Uniformly, avoid local temperature excessively high, it is more reliable and more stable.
Further, the type of each LED chip 4 is positive assembling structure, inverted structure or vertical structure.
Specifically, as shown in Figures 4 and 5, two electrodes of the LED chip 41 of positive assembling structure are all made of the connection of bonding line 5,
Two electrodes of the LED chip 42 of inverted structure are all made of the connection of conductive layer 2, the side electrode of the LED chip 43 of vertical structure
It is connected using bonding line 5, the lower lateral electrode of the LED chip 43 of vertical structure is connected using conductive layer 2.The LED core of positive assembling structure
Two electrodes of piece 41 are respectively positioned on the upside of LED chip, need to connect conductive layer 2 or the electricity of other LED chips using bonding line 5
Pole.Two electrodes of the LED chip 42 of inverted structure are respectively positioned on the downside of LED chip 4, need to distinguish using two conductive layers 2
It is connect with two electrode, connects bonding line 5 or the electrode of other inverted structure LED chips 42 using conductive layer 2.Vertical structure
Two electrodes of LED chip 43 be located at the upper side and lower side of LED chip 4, lower lateral electrode can be connected with conductive layer 2
It connects, then bonding line 5 or the electrode of other LED chips 4 is connected by conductive layer 2, side electrode can be connected by bonding line 5 and be led
The electrode of electric layer 2 or other LED chips 4.
Further, the packaging plastic 6 is that epoxy resin packaging plastic, organic silicon packaging glue, polyurethane packaging plastic or light are solid
Change packaging plastic.
Specifically, the packaging plastic 6 or fluorescent glue, fluorescent glue be mixed fluorescent powder epoxy resin packaging plastic,
The photocuring packaging plastic of the organic silicon packaging glue of mixed fluorescent powder, the polyurethane packaging plastic of mixed fluorescent powder or mixed fluorescent powder.
Suitable packaging plastic 6 can be chosen according to the material property of packaging plastic 6, by a certain percentage mix fluorescent powder with packaging plastic 6
It to fluorescent glue, is packaged using fluorescent glue and luminous efficiency can be improved, and illumination effect can be improved.
Epoxy resin packaging plastic can solidify after room temperature or heating, hardness height, surfacing, transparency after solidification
Height, but also there are the characteristics such as insulation, Water-proof and oil-proof, dust-proof corrosion-resistant, ageing-resistant and cold-resistant thermal shock, using epoxy resin
Packaging plastic encapsulating light emitting module, it is simple to operate, and also package surface glossiness is high.
Organic silicon packaging glue ozone-resistant ability is strong, and Yellowing will not occur, and can be good at the translucency for keeping colloid,
And ageing-resistant, high temperature resistant and low temperature tolerance ability are strong, are also equipped with outstanding waterproof ability, can guarantee the mould that shines under wet condition
The normal use of block can change illumination effect by mixed fluorescent powder.
Polyurethane packaging plastic has good tensile strength, and mechanical strength is big, and elasticity is good, has excellent recovery
Property, it can be used for dynamic juncture.
Photocuring packaging plastic adhesion strength is high, chemical stability is good, electric property is excellent, heat-resist, is suitble to electronics device
Part encapsulation, and photocuring packaging plastic can be with low-temperature setting, and suitable for the encapsulation of heat-sensitive material, curing rate is high-efficient fastly,
It can be applied to high-speed production lines, be conducive to improve production efficiency.
The utility model embodiment third aspect provides a kind of LED lamp, including the utility model embodiment second party
The LED encapsulation structure that face provides, in LED encapsulation structure the specific structure of each unit and function referring to above-described embodiment, due to
The LED lamp uses all technical solutions of above-described embodiment, therefore at least with the technical solution institute of above-described embodiment
All beneficial effects of bring.
Embodiment described above is only to illustrate the technical solution of the utility model, rather than its limitations；Although referring to before
Embodiment is stated the utility model is described in detail, those skilled in the art should understand that：It still can be with
It modifies the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；And
These are modified or replaceed, the spirit for various embodiments of the utility model technical solution that it does not separate the essence of the corresponding technical solution
And range, it should be included within the scope of protection of this utility model.
Claims (9)
1. a kind of LED lamp silk substrate, which is characterized in that including insulating substrate, conductive layer and for connecting outside
The surface of the insulating substrate, the external LED chip of conductive layer, the shape of conductive layer is arranged in the pin of power supply circuit, conductive layer
It is determined according to the type of external LED chip and connection type, type, number of the number of conductive layer according to external LED chip, with
And the spacing between external LED chip determines, pin is arranged on the insulating substrate.
2. LED filament substrate according to claim 1, which is characterized in that pin is separately positioned on the insulating substrate
Both ends or the same end that the insulating substrate is set.
3. LED filament substrate according to claim 1, which is characterized in that conductive layer passes through outside chip electrode or bonding line
Connect LED chip.
4. LED filament substrate according to claim 1, which is characterized in that the material of the insulating substrate is sapphire, glass
Glass, ceramics, polyimides or polyester film.
5. LED filament substrate according to claim 1, which is characterized in that the material of conductive layer is led for silver-colored conductive material, copper
Electric material, golden conductive material or transparent metal chemical combination object conductive material.
6. a kind of LED encapsulation structure, which is characterized in that including LED filament substrate described in claim 1 to 5 any one, also
Including multiple LED chips, a plurality of bonding line and packaging plastic；
Each LED chip is arranged on the LED filament substrate, passes through bonding line and/or the LED between different LED chips
The conductive layer of filament substrate connects, and the packaging plastic is wrapped in the LED filament substrate, each LED chip and each bonding line
Outside；
The LED filament substrate includes intermediate region and fringe region, at least provided with two LED cores in the intermediate region
Piece, in the intermediate region, in the geometric center to the LED filament substrate direction of both ends of the LED filament substrate,
The spacing of LED chip and next stage adjacent LED chip is less than or equal to the spacing of LED chip and upper level adjacent LED chip,
In the fringe region, in the geometric center to the LED filament substrate direction of both ends of the LED filament substrate, LED chip
It is less than or equal to the spacing of LED chip and upper level adjacent LED chip, the edge with the spacing of next stage adjacent LED chip
The maximum spacing of adjacent LED chip is less than the minimum spacing of adjacent LED chip in the intermediate region in region.
7. LED encapsulation structure according to claim 6, which is characterized in that the type of each LED chip be positive assembling structure,
Inverted structure or vertical structure.
8. LED encapsulation structure according to claim 6, which is characterized in that the packaging plastic is epoxy resin packaging plastic, has
Machine silicon packaging plastic, polyurethane packaging plastic or photocuring packaging plastic.
9. a kind of LED lamp, which is characterized in that including LED encapsulation structure described in claim 6 to 8 any one.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721786702.2U CN208157453U (en) | 2017-12-19 | 2017-12-19 | LED filament substrate, LED encapsulation structure and LED lamp |
| PCT/CN2018/077112 WO2019119639A1 (en) | 2017-12-19 | 2018-02-24 | Led filament substrate, led package structure, and led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721786702.2U CN208157453U (en) | 2017-12-19 | 2017-12-19 | LED filament substrate, LED encapsulation structure and LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208157453U true CN208157453U (en) | 2018-11-27 |
Family
ID=64414337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721786702.2U Expired - Fee Related CN208157453U (en) | 2017-12-19 | 2017-12-19 | LED filament substrate, LED encapsulation structure and LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208157453U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473944A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | Multipurpose LED support and LED |
-
2017
- 2017-12-19 CN CN201721786702.2U patent/CN208157453U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473944A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | Multipurpose LED support and LED |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181127 Termination date: 20201219 |
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| CF01 | Termination of patent right due to non-payment of annual fee |