CN203631591U - Vertical LED light bar - Google Patents
Vertical LED light bar Download PDFInfo
- Publication number
- CN203631591U CN203631591U CN201320664435.7U CN201320664435U CN203631591U CN 203631591 U CN203631591 U CN 203631591U CN 201320664435 U CN201320664435 U CN 201320664435U CN 203631591 U CN203631591 U CN 203631591U
- Authority
- CN
- China
- Prior art keywords
- glass
- electrode
- wiring board
- led
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Abstract
The utility model discloses a vertical LED light bar. The light bar comprises a glass circuit board, a glass protection plate and a plurality of LED chips, wherein the glass circuit board and the glass protection plate are arranged oppositely; the plurality of LED chips are arranged between the glass circuit board and the glass protection plate. A top end of each LED chip is provided with a first electrode and a bottom end is provided with a second electrode. The first electrode is connected with one surface of the glass protection plate. The second electrode is connected with one surface of the glass circuit board. A protection layer wraps the LED chips. According to the light bar of the utility model, light sources of the LED chips are fully used so that omnibearing luminescence is achieved; besides, the glass circuit board possesses high heat resistance performance, high temperature resistance performance and good heat dissipation performance so that a service life of the LED light bar is prolonged to some extent.
Description
Technical field
The utility model relates to LED field, relates in particular to a kind of vertical LED lamp bar.
Background technology
Existing LED lamp bar, because the power density of LED chip is very high, this just needs the designer of LED chip device and producer to be optimized meter to cooling system at aspects such as structure and materials.
Along with the exploitation gradually of high-power LED chip, also be developed for effectively discharging the hot technology that LED chip produces thereupon, in order more to improve the radiating efficiency of LED chip, normally LED chip is encapsulated on a substrate, and this substrate is made by metal material conventionally, and realize the electrical connection of LED chip and substrate by wire-bonded.
But therefore the poor thermal conductivity of the insulating barrier forming on metal substrate, even if used metal substrate also cannot avoid the problem that thermal conductivity is low.And, also great majority employing PCB wiring board of the wiring board of LED lamp bar at present, it does not have light transmission yet.Cannot accomplish that LED packaging body is omnibearing luminous.
Therefore, if the heat radiation of LED chip cannot normally realize, as a kind of LED chip of semiconductor device, because heat radiation wavelength changes, thereby the emission efficiency that produces yellowing phenomenon or light can reduce, and while at high temperature operation, the life-span of LED encapsulation may shorten, thereby to be improved be the core of encapsulating structure and technique to the structure that the heat that LED chip is produced dispels the heat.
Utility model content
The purpose of this utility model is to provide a kind of vertical LED lamp bar.It can realize the luminous in all directions of LED.
For achieving the above object, the utility model is by the following technical solutions:
A kind of vertical LED lamp bar; it comprises: the glass wiring board and the protector plate for glass that are oppositely arranged; and be arranged on the multiple LED chips between glass wiring board and protector plate for glass; wherein the top of each LED chip is provided with the first electrode; bottom is provided with the second electrode; described the first electrode is connected with the one side of protector plate for glass, and described the second electrode is connected with the one side of glass wiring board, is also enclosed with protective layer on described LED chip.
Preferably, described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located at respectively glass wiring board and protector plate for glass on the face of LED chip.
Preferably, described the first electrode is connected with the one side of glass wiring board by gold thread, described the second electrode by scolder connect, eutectic connect or die bond connect be connected with the one side of glass wiring board.
Preferably, described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located between each LED chip and protective layer.
The utility model adopts above design, by LED chip is directly encapsulated on glass wiring board, relatively original LED chip need first be encapsulated on metal substrate, be encapsulated into again on PCB wiring board, save processing step, provide cost savings, and can accomplish the omnibearing luminous of LED chip, improved the brightness of LED chip; Another glass wiring board has higher heat-resisting and heat-resisting quantity, has extended to a certain extent the useful life of LED lamp bar, and glass wiring board also has better heat dispersion simultaneously.In another the utility model, also can, by directly LED chip being encapsulated on glass wiring board, save original substrate, save material; The first electrode of the present utility model is connected from different glass plates respectively with the second electrode simultaneously, and the heat of LED chip just can distribute to two places by these two electrodes like this, has improved its radiating efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED lamp bar embodiment mono-that the utility model is vertical;
Fig. 2 is the structural representation of the LED lamp bar embodiment bis-that the utility model is vertical.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1, vertical LED lamp bar described in the utility model comprises: the glass wiring board 1 being oppositely arranged and protector plate for glass 8, be located at multiple vertical LED chip 2 and protective layer 4 between glass wiring board 1 and protector plate for glass 8, the top of each LED chip 2 is provided with the first electrode 21, bottom is provided with the second electrode 22, described the first electrode 21 is connected with protector plate for glass 8 by scolder 3, described the second electrode 22 is connected by scolder 7 and glass wiring board 1, it also comprises phosphor powder layer 6, described phosphor powder layer 6 is located between LED chip 2 and protective layer 4, described protective layer 4 is wrapped on LED chip 2, and be filled between glass wiring board 1 and protector plate for glass 8.
Embodiment bis-:
As shown in Figure 2, different from embodiment mono-, the phosphor powder layer in the present embodiment is arranged on protector plate for glass 8 and glass wiring board 1 on the face of LED chip 2.
The first electrode 21 in the utility model is connected with glass wiring board 1 with protector plate for glass 8 respectively with the second electrode 22, and the heat of LED chip 2 just can distribute to two places by these two electrodes like this, has improved its radiating efficiency.The utility model, by adopting glass wiring board 1 and protector plate for glass 8, has been realized the omnibearing luminous of LED chip, has improved the brightness of LED chip; Glass wiring board has higher heat-resisting and heat-resisting quantity in addition, has extended to a certain extent the useful life of LED lamp bar.
In the utility model; the first electrode 21 also can adopt die bond to be connected with the second electrode 22; the modes such as eutectic connection are connected with corresponding glass substrate 1 or protector plate for glass 8, can adopt the first electrode 21 for N-type electrode in the present embodiment, and the second electrode 22 is P type electrode.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (4)
1. a vertical LED lamp bar; it is characterized in that; comprise: the glass wiring board and the protector plate for glass that are oppositely arranged; and be arranged on the multiple LED chips between glass wiring board and protector plate for glass; wherein the top of each LED chip is provided with the first electrode, and bottom is provided with the second electrode, and described the first electrode is connected with the one side of protector plate for glass; described the second electrode is connected with the one side of glass wiring board, is also enclosed with protective layer on described LED chip.
2. LED lamp bar according to claim 1, is characterized in that: described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located at respectively glass wiring board and protector plate for glass on the face of LED chip.
3. LED lamp bar according to claim 1, is characterized in that: described the first electrode is connected with the one side of glass wiring board by gold thread, described the second electrode by scolder connect, eutectic connect or die bond connect be connected with the one side of glass wiring board.
4. LED lamp bar according to claim 1, is characterized in that: described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located between each LED chip and protective layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320664435.7U CN203631591U (en) | 2013-10-25 | 2013-10-25 | Vertical LED light bar |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320664435.7U CN203631591U (en) | 2013-10-25 | 2013-10-25 | Vertical LED light bar |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203631591U true CN203631591U (en) | 2014-06-04 |
Family
ID=50818040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201320664435.7U Expired - Fee Related CN203631591U (en) | 2013-10-25 | 2013-10-25 | Vertical LED light bar |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203631591U (en) |
-
2013
- 2013-10-25 CN CN201320664435.7U patent/CN203631591U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140604 Termination date: 20181025 |
|
CF01 | Termination of patent right due to non-payment of annual fee |