CN203760508U - All-metal structure LED packaging support - Google Patents
All-metal structure LED packaging support Download PDFInfo
- Publication number
- CN203760508U CN203760508U CN201320794398.1U CN201320794398U CN203760508U CN 203760508 U CN203760508 U CN 203760508U CN 201320794398 U CN201320794398 U CN 201320794398U CN 203760508 U CN203760508 U CN 203760508U
- Authority
- CN
- China
- Prior art keywords
- package support
- led package
- metal construction
- led
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 title claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 48
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000012790 adhesive layer Substances 0.000 claims abstract description 7
- 238000010276 construction Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000001556 precipitation Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 5
- 230000001681 protective effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
An all-metal structure LED packaging support is characterized in that: a metal plate is used to make a support body with a concave reflection cup; a heat-resistant insulating adhesive layer is used to fix two relatively separate metal sheets on an upper surface of the support body so as to form an integrated all-metal LED packaging support which is provided with input and output electrodes in an insulating protective condition; an LED chip is fixed on an upper surface of a concave reflection cup; one end of each of the two metal plates, which is near the LED chip, is electrically connected with the LED chip; or a coating which can be electrically connected with the LED chip is directly deposited on the upper surface of the concave reflection cup by physical or chemical methods.
Description
Technical field
This is novel, and what relate to is a kind of LED package support, and concrete is a kind of LED package support of all-metal construction.
Background technology
Current traditional LED package support is mainly that LED is granule sealed in cross section is the support of the reflective cup-shaped of inverted trapezoidal, plastics or pottery+metal electrode composition, and LED particle left and right has 2 electrode pins to extend outside support.This traditional scheme complex process and owing to using plastics on the one hand to cause reflector efficiency low for reflectorized material; Because sheathing material is plastics, its thermal conductivity is poor on the other hand, and heat radiation only depends on 2 electrode pins in left and right, so cause integral heat sink poor effect.So it is high to design a kind of reflector efficiency, the packaged type that heat conductivility is good is just very important.
Summary of the invention
In view of this, in order to address the above problem, to the invention provides one and improved for above-mentioned shortcoming, technique is simple, the Novel LED encapsulating bracket of the low reflective good heat dissipation effect of cost.
For achieving the above object, the present invention adopts following technical scheme:
A LED package support for all-metal construction, is characterized by and make the rack body with spill reflector with metallic plate;
Use high temperature insulation adhesive layer, the upper surface that two relatively independent sheet metals that separate is fixed on to described rack body forms an integrated all-metal LED package support with input and output electrode under insulation protection condition;
LED chip is fixed on to the upper surface of described spill reflector, described two sheet metals are near forming electrical connection between one end of LED chip and LED chip; Or can do the coating being electrically connected with described LED chip at the upper surface Direct precipitation of described spill reflector by physics or chemical method;
Further, with fluorescent material or silica gel or remote fluorescence film, the LED package support of described all-metal construction is carried out to packaging protection.
Further, described spill reflector cross sectional shape can be trapezoidal.
Further, the method for described fixed L ED chip can be that elargol, silver slurry are fixing.
The mode of the electrical connection further, forming between described one end near LED chip and LED chip can be to stamp spun gold or filamentary silver.
Further, described trapezoidal reflector upper surface is silver-plated or aluminize or adopt nanometer reflectorized material coating.
Further, the rete that described high temperature insulation adhesive layer can be epoxy resin, Parylene, PET or polyimides, esters of acrylic acid or structure glue-line, or the combination of above various materials, or the modification colloid mixing with highly heat-conductive material.
Further, there is Parylene coating on the surface of the LED package support of described all-metal construction encapsulation finished product.
Further, the lower surface heat dissipation metal substrate common and light fixture of described rack body welds, and described heat dissipation metal substrate surface can be electroplated with materials such as the silver of middle soldered, nickel, tin, chemical deposit processing allows its surface possess the weldability energy mutually general with SMT equipment.
Beneficial effect:
Adopt after this programme, LED chip can directly be encapsulated in high reflective, high heat conduction, metal cup body upper base surface face with optical design function.The metal electrode of this support not only has good reflective heat dispersion simultaneously, and is designed with good insulation protection between it and rack body.
The LED device encapsulating by this technology, while being applied to light fixture product, at the bottom of its solderability cup, between (being rack body reverse side) and the heat dissipation metal substrate of light fixture, available low temperature soldering technology forms good thermal dissipating path; The LED package support of all-metal construction proposed by the invention, compares with the LED package support that plastics and metal material and ceramic material are designed to traditional, can significantly promote light efficiency and the heat dispersion of LED packaging.
Brief description of the drawings
Fig. 1 is this novel side sectional view.
Embodiment
With reference to the LED package support of figure 1, a kind of all-metal construction, make the rack body 1 with spill reflector 11 with metallic plate; With high temperature insulation adhesive layer 2, the upper surface that two relatively independent sheet metals that separate 3 is fixed on to described rack body 1 forms an integrated all-metal LED package support with input and output electrode under insulation protection condition; LED chip 4 is fixed on to the upper surface of described spill reflector 11, described two sheet metals 3 are near forming electrical connection between one end of LED chip 4 and LED chip 4; Or can do the coating being electrically connected with described LED chip 4 at the upper surface Direct precipitation of described spill reflector 11 by physics or chemical method; The LED package support of described all-metal construction is carried out to packaging protection with the mixed silica gel of fluorescent material or remote fluorescence film.Described spill reflector 11 cross sectional shapes can be trapezoidal.The method of described fixed L ED chip 4 can be that elargol, silver slurry are fixing.The mode of the electrical connection forming between described one end near LED chip 4 and LED chip 4 can be to stamp spun gold or filamentary silver 5.Described trapezoidal reflector 11 upper surfaces are silver-plated or aluminize or adopt nanometer reflectorized material coating.The rete that described high temperature insulation adhesive layer 2 can be epoxy resin, Parylene, PET or polyimides, esters of acrylic acid or structure glue-line, or the combination of above various materials, or the modification colloid mixing with highly heat-conductive material.The surface treatment of the LED package support encapsulation finished product of described all-metal construction adopts Parylene technology.The lower surface heat dissipation metal substrate common and light fixture of described rack body 1 welds, and described heat dissipation metal substrate surface can be electroplated with materials such as the silver of middle soldered, nickel, tin, chemical deposit processing allows its surface possess the weldability energy mutually general with SMT equipment.
The technology that the thermoelectricity that the present invention adopts separates, compare with traditional scheme, difference is that the present invention adopts trapezoidal reflector 11 upper surfaces silver-plated or aluminize or adopt nanometer reflectorized material coating to form full mirror-reflection, and bright dipping reflection efficiency has improved more than 15% than traditional LED package support.Owing to adopting all-metal construction, and can directly be welded on heat dissipation metal substrate, arrive again traditional LED device application mode of heat dissipation metal substrate to Copper Foil to insulating barrier compared with electrode, the LED device that utilizes this package support to produce, its area of dissipation has had the expansion of tens times compared with traditional electrode, conventional plastic or ceramic light-reflecting cup are upwards reduced by electrode and the Copper Foil thermal diffusion adverse effect forming of dispelling the heat, reduce downwards one deck thermal resistance (packaging of the present invention can directly be welded on nonisulated heat sink on, and conventional package need to be dispelled the heat by the insulation processing of circuit or substrate, it will form together inevitably thermal resistance), its comprehensive heat dispersion will promote hundreds of times.And this scheme technique is simple, and cost is low, good reliability.
Claims (9)
1.
a LED package support for all-metal construction, is characterized by:
make the rack body (1) with spill reflector (11) with metallic plate;
with high temperature insulation adhesive layer (2), the upper surface that two relatively independent sheet metals that separate (3) is fixed on to described rack body (1) forms an integrated all-metal LED package support with input and output electrode under insulation protection condition;
lED chip (4) is fixed on to the upper surface of described spill reflector (11), between one end of the close LED chip (4) of described two sheet metals (3) and LED chip (4), forms electrical connection; Or the upper surface Direct precipitation at described spill reflector (11) can do the coating being electrically connected with described LED chip (4).
2.
the LED package support of a kind of all-metal construction as claimed in claim 1, is characterized by: the LED package support of described all-metal construction is carried out to packaging protection with fluorescent material or silica gel or remote fluorescence film.
3.
the LED package support of a kind of all-metal construction as claimed in claim 2, is characterized by: described spill reflector (11) cross sectional shape can be for trapezoidal.
4.
the LED package support of a kind of all-metal construction as claimed in claim 3, is characterized by: the method for described fixed L ED chip (4) can be fixed for elargol, silver slurry.
5.
the LED package support of a kind of all-metal construction as claimed in claim 4, is characterized by: the mode of the electrical connection forming between described one end near LED chip (4) and LED chip (4) can be to stamp spun gold or filamentary silver (5).
6.
the LED package support of a kind of all-metal construction as claimed in claim 5, is characterized by: described trapezoidal reflector (11) upper surface is silver-plated or aluminize or adopt nanometer reflectorized material coating.
7.
the LED package support of a kind of all-metal construction as claimed in claim 6, is characterized by: described high temperature insulation adhesive layer (2) can be rete or the structure glue-line of epoxy resin, Parylene, PET or polyimides, esters of acrylic acid.
8.
the LED package support of a kind of all-metal construction as claimed in claim 7, is characterized by: there is Parylene coating on the surface of the LED package support encapsulation finished product of described all-metal construction.
9.
the LED package support of a kind of all-metal construction as described in one of claim 1-8, is characterized by: the lower surface of described rack body (1) is welded with heat dissipation metal substrate, and described heat dissipation metal substrate surface has silver, nickel, tin plated material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320794398.1U CN203760508U (en) | 2013-08-21 | 2013-12-06 | All-metal structure LED packaging support |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320511460.1 | 2013-08-21 | ||
| CN201320511460 | 2013-08-21 | ||
| CN201320794398.1U CN203760508U (en) | 2013-08-21 | 2013-12-06 | All-metal structure LED packaging support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203760508U true CN203760508U (en) | 2014-08-06 |
Family
ID=51255750
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320794398.1U Expired - Fee Related CN203760508U (en) | 2013-08-21 | 2013-12-06 | All-metal structure LED packaging support |
| CN201310649054.6A Pending CN104425683A (en) | 2013-08-21 | 2013-12-06 | LED packaging support with all-metal structure |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310649054.6A Pending CN104425683A (en) | 2013-08-21 | 2013-12-06 | LED packaging support with all-metal structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN203760508U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104425683A (en) * | 2013-08-21 | 2015-03-18 | 无锡来德电子有限公司 | LED packaging support with all-metal structure |
| CN105336834A (en) * | 2015-07-17 | 2016-02-17 | 无锡来德电子有限公司 | Circuit-structure-contained mirror-metal-based LED module, production method thereof, and application thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6480389B1 (en) * | 2002-01-04 | 2002-11-12 | Opto Tech Corporation | Heat dissipation structure for solid-state light emitting device package |
| CN2613054Y (en) * | 2003-03-12 | 2004-04-21 | 兴华电子工业股份有限公司 | Base plate structure of LED wafer |
| CN102130110A (en) * | 2010-12-24 | 2011-07-20 | 哈尔滨工业大学 | Multi-chipset high-power LED encapsulation structure |
| CN203134855U (en) * | 2013-01-11 | 2013-08-14 | 华南师范大学 | Power mode LED structure with excellent heat radiation and high color rendering index |
| CN203760508U (en) * | 2013-08-21 | 2014-08-06 | 无锡来德电子有限公司 | All-metal structure LED packaging support |
-
2013
- 2013-12-06 CN CN201320794398.1U patent/CN203760508U/en not_active Expired - Fee Related
- 2013-12-06 CN CN201310649054.6A patent/CN104425683A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104425683A (en) * | 2013-08-21 | 2015-03-18 | 无锡来德电子有限公司 | LED packaging support with all-metal structure |
| CN105336834A (en) * | 2015-07-17 | 2016-02-17 | 无锡来德电子有限公司 | Circuit-structure-contained mirror-metal-based LED module, production method thereof, and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104425683A (en) | 2015-03-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140806 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |