CN206877984U - A kind of DFN2510 high density framework - Google Patents
A kind of DFN2510 high density framework Download PDFInfo
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- CN206877984U CN206877984U CN201720738467.5U CN201720738467U CN206877984U CN 206877984 U CN206877984 U CN 206877984U CN 201720738467 U CN201720738467 U CN 201720738467U CN 206877984 U CN206877984 U CN 206877984U
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- Prior art keywords
- chip
- frame
- installation portion
- pin
- placing area
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- 238000009434 installation Methods 0.000 claims abstract description 75
- 238000005520 cutting process Methods 0.000 claims abstract description 64
- 210000003205 muscle Anatomy 0.000 claims abstract description 18
- 230000002787 reinforcement Effects 0.000 claims abstract description 11
- 238000005728 strengthening Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims abstract description 7
- 230000007797 corrosion Effects 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 9
- 239000004744 fabric Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 4
- 230000002452 interceptive effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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- Reinforcement Elements For Buildings (AREA)
Abstract
It the utility model is related to field of semiconductor manufacture, more particularly to a kind of DFN2510 high density framework, chip installation portion includes chip placing area and pin weld zone, include 8 separate pin weld zones in each chip installation portion, wherein 4 pin weld zones are one group of both sides for being arranged symmetrically in chip placing area, 4 pins welding of homonymy is divided into 2 arrangements and put, and 2 row's pin weld zone be arranged symmetrically with the center line of chip installation portion, pin groove brace rod is additionally provided with pin weld zone away from chip placing area, the reinforcement set is extended between chip installation portion to connect at muscle, and it is connected with strengthening even muscle, the bearing of trend dislocation arrangement of the pin brace rod and pin weld zone.The framework reasonable Arrangement chip layout area and pin weld zone, make full use of frame space, avoid the interference of regional；Pin groove brace rod is set, avoids, because shaking when cutting, causing frame deformation or layering, ensureing structural stability.
Description
Technical field
Technical field of manufacturing semiconductors is the utility model is related to, particularly a kind of DFN2510 high density framework.
Background technology
Semiconductor refers to material of the electric conductivity between conductor and insulator under normal temperature, is that existing electronic product is conventional
A kind of device, the characteristics of during due to the dimensional characteristic of single semiconductor product and its use, half is aided in frequently with lead frame
The production of conductor chip.
The major function of lead frame is that the carrier of mechanical support is provided for chip, as connecting chip inside and outside conducting medium
Circuit and form pathway for electrical signals, and heat caused by chip operation is together outwards distributed with package casing, it is logical to form radiating
Road, it is a kind of electrical connection that chip internal circuits exit and outer lead are realized by means of bonding gold wire, is formed and electrically returned
The key structure part on road, it is required for using lead frame in most semiconductor integrated blocks, is weight in electronics and information industry
The basic material wanted.
Chip package form is DFN2510 chip installation portion, and the size after being encapsulated due to the chip installation portion is：2.5*
1.0mm, pin number is more, the size of one single chip installation portion is larger, how to arrange the resettlement area of chip placing and lead-foot-line
Seem particularly important, rational arrangement can meet the material profit do not known demand, can also improve framework of chip and lead-foot-line
With rate, save production cost；Meanwhile when one single chip installation portion structure becomes large-sized, how to ensure its structural stability
It is to need to solve the problems, such as.
Utility model content
Goal of the invention of the present utility model is：For arranging chip of the chip package form for DFN2510 on framework
During installation portion, the problem of how arranging its chip placing area and lead-foot-line and how to ensure its structural stability, there is provided a kind of
DFN2510 high density frameworks, the framework reasonable Arrangement chip layout area and pin weld zone, rationally and make full use of framework empty
Between, avoid interfering for regional；Set pin groove brace rod, avoid because cutting when shake, cause frame deformation or
Layering, ensure structural stability.
To achieve these goals, the technical solution adopted in the utility model is：
A kind of DFN2510 high density framework, include the framework of rectangular sheet structure, on framework be provided with it is multiple with
The adaptable chip installation portion of DFN2510 encapsulating structures, the chip installation portion include chip placing area and pin weld zone,
Include 8 separate pin weld zones in each chip installation portion, wherein 4 pin weld zones are one group and are arranged symmetrically in
The both sides in chip placing area, 4 pins welding of homonymy is divided into 2 arrangements and put, and 2 row's pin weld zones are with chip installation portion
Center line is arranged symmetrically, and pin groove brace rod, the pin groove support are additionally provided with the pin weld zone away from chip placing area
Muscle extends between chip installation portion the reinforcement set and connected at muscle, and is connected with strengthening even muscle, the pin brace rod and pin
The bearing of trend dislocation arrangement of weld zone.
8 pin weld zones are divided into two groups of both sides for being arranged in chip placing area by the framework, and homonymy draws 4 pin welderings
Connect and divide into 2 arrangements and put, and 2 row's pin weld zones are arranged symmetrically with the center line of chip installation portion, rationally using frame space,
Avoid interfering for regional；And pin groove brace rod is set on the pin weld zone away from chip placing area, and with
Reinforcement connection between chip installation portion, the pin line strength after increase chip installation, avoid, because shaking when cutting, causing
Frame deformation or layering, ensure structural stability.
As preferred scheme of the present utility model, the chip installation portion is rectangle, and the long side of all chip installation portions
Short side with framework is arranged in parallel.
As preferred scheme of the present utility model, the chip placing area is divided into the first chip by the raised skeleton at middle part and pacified
Area and the second chip placing area are put, the first chip placing area and the second chip placing area extend to relative chip peace respectively
Two sides in dress portion, the chip placing area are the region of the frame encirclement of raised skeleton and chip installation portion.By chip placing
Two settlements are divided into, are adapted to the arrangement demand for the chip installation portion that packing forms are DFN2510.
As preferred scheme of the present utility model, the bearing of trend of the pin weld zone and the first chip placing area or
The bearing of trend in two chip placing areas is identical, is provided with chip placing area close to the position of chip installation portion side and narrows gap,
That is the narrowed width of the raised skeleton in chip placing area.
As preferred scheme of the present utility model, it also is provided with receiving between the side of the pin weld zone and chip installation portion
The narrowed width of the raised skeleton of narrow gap, i.e. pin weld zone.
The narrowed gap that chip placing area and pin weld zone extending end are set, reduces knife when product is cut after encapsulating
The contact area of piece and frame metal, increase blade life, while reduce the caloric value of blade, also accordingly reduce the hair of framework
Heat, framework is avoided with plastic packaging material because the excessive caused gap that generates heat is layered, ensure that the q＆r energy of product.
As preferred scheme of the present utility model, rear channel is additionally provided with the back side of chip installation portion.Installed in chip
The back side in portion sets rear channel, does not influence the overall structure stability of framework, and can reduce the material usage of framework matrix, saves
About production cost；Radiating when the rear channel that the chip installation portion back side is set also is beneficial to chip pin wire bonding, avoids welding
Connect the too high influence chip quality of heat.
As preferred scheme of the present utility model, a circle side is provided between the frame of framework and the region of arrangement chip
Frame box frame, the frame retaining frame are half corrosion structure, and hollow slots are interval with frame retaining frame.Outside the region of arrangement chip
One circle frame retaining frame is set, the structural stability of whole framework is further enhanced, reduces chip and lead-foot-line caused by vibrations
The problem of misalignment of installation, and frame retaining frame is half corrosion structure, i.e. its thickness are corroded a part, are easy to cutting separation behaviour
Make；The spaced hollow slots in frame retaining frame, also reduce difficulty for follow-up cutting lock out operation.
As preferred scheme of the present utility model, the chip installation portion close to frame is connected with frame retaining frame, chip peace
The pin weld zone of dress portion side and chip placing area are extended in frame retaining frame.Draw the chip installation portion side of edge
Pin weld zone and chip placing area are connected with frame retaining frame, further enhance the stabilization of the chip installation portion close to frame position
Property.
As preferred scheme of the present utility model, a circle frame Cutting Road is additionally provided between frame retaining frame and frame, is wrapped
Include horizontal frame Cutting Road and vertical frame Cutting Road, on horizontal frame Cutting Road and vertical frame Cutting Road be spaced digging have it is more
Individual dead slot, the positioning for the cutting of adjacent chips installation portion is equipped with horizontal frame Cutting Road and vertical frame Cutting Road
Groove.Dead slot is arranged at intervals on horizontal frame Cutting Road and vertical frame Cutting Road, is easy to the cutting lock out operation of frame；And set
The locating slot for cutting is put, with regard to energy precise positioning cutting position so since being cut frame, beneficial to guarantee product quality.
Specifically, the vertical frame Cutting Road empties groove including multiple spaced Cutting Roads, in addition to transverse direction
The transverse cuts locating slot that dowel is correspondingly arranged, the half corrosion frame plate for being provided with and strengthening in groove is emptied in Cutting Road, adjacent
Reinforcement is connected between half rotten frame plate, strengthens the intensity of vertical frame Cutting Road.
In summary, by adopting the above-described technical solution, the beneficial effects of the utility model are：
1st, the framework reasonable Arrangement chip layout area and pin weld zone, rationally and frame space is made full use of, avoided each
Individual region interferes；Pin groove brace rod is set, avoids, because shaking when cutting, causing frame deformation or layering, ensures
Structural stability；
2nd, the narrowed gap that chip placing area and pin weld zone extending end are set, when reducing product cutting after encapsulating
The contact area of blade and frame metal, increase blade life, while reduce the caloric value of blade, also accordingly reduce framework
Caloric value, framework is avoided with plastic packaging material because the excessive caused gap that generates heat is layered, ensure that the q＆r of product
Energy；
3rd, rear channel is set at the back side of chip installation portion, does not influence the overall structure stability of framework, and can reduce
The material usage of framework matrix, save production cost；Also it is beneficial to chip pin in the rear channel that the chip installation portion back side is set
Radiating during wire bonding, avoid the too high influence chip quality of welding heat；
The 4th, one circle frame retaining frame is set outside the region of arrangement chip, further enhance the structural stability of whole framework,
Chip and the problem of misalignment of lead-foot-line installation caused by vibrations are reduced, and frame retaining frame is half corrosion structure, i.e. its thickness quilt
A part is eroded, is easy to cut lock out operation；The spaced hollow slots in frame retaining frame, also separated for follow-up cutting
Operation reduces difficulty；
5th, dead slot is arranged at intervals on horizontal frame Cutting Road and vertical frame Cutting Road, is easy to the cutting of frame to separate behaviour
Make；And the locating slot of cutting is provided for, with regard to energy precise positioning cutting position so since being cut frame, beneficial to guarantee product
Quality.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model DFN2510 high density frameworks.
Fig. 2 is layout drawing of the multiple chip installation portions of close frame in Fig. 1 on framework.
Fig. 3 is the structural representation of one single chip installation portion.
Fig. 4 be in Fig. 3 A-A to sectional view.
Marked in figure：1- frameworks, 101- chip units, 2- unit separation troughs, 3- chip installation portions, the support of 301- pins groove
Muscle, 302- pins weld zone, 303- narrow gap, the first chip placings of 304- area, the second chip placings of 305- area, 306- first
Leg identifies, 307- rear channels, 4- lateral connection muscle, and 401- connects muscle dead slot, 5- cross dowels, the cutting of 6- transverse directions frame
Road, the vertical frame Cutting Roads of 7-, half rotten frame plates of 701-, 702- Cutting Roads empty groove, 703- reinforcements, the positioning of 704- transverse cuts
Groove, 8- frame retaining frames, 801- hollow slots, the vertical dowels of 9-.
Embodiment
Below in conjunction with the accompanying drawings, the utility model is described in detail.
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining this
Utility model, it is not used to limit the utility model.
Embodiment 1
As shown in Figures 1 to 4, the DFN2510 high density frameworks of the present embodiment, the framework 1 of rectangular sheet structure, frame are included
Frame 1 is divided into two chip units 101 by unit slot segmentation 2, and multiple and DFN2510 is provided with each chip unit 101 and is sealed
The adaptable chip installation portion 3 of assembling structure, the chip installation portion 3 includes chip placing area and pin weld zone 302, each
Include 8 separate pin weld zones 302 in chip installation portion 3, wherein 4 pin weld zones 302 are one group of symmetrical cloth
Put in the both sides in chip placing area, 4 pin weld zones 302 of homonymy divide to be put for 2 arrangements, and 2 row's pin weld zones 302 are with core
The center line of piece installation portion 3 is arranged symmetrically, and pin groove brace rod is additionally provided with the pin weld zone 302 away from chip placing area
301, the pin groove brace rod 301 extends between chip installation portion 3 reinforcement set and connected at muscle, and with strengthening even muscle phase
Even, the bearing of trend dislocation arrangement of the pin brace rod 301 and pin weld zone 302.
8 pin weld zones are divided into two groups of both sides for being arranged in chip placing area by the framework, and homonymy draws 4 pin welderings
Connect and divide into 2 arrangements and put, and 2 row's pin weld zones are arranged symmetrically with the center line of chip installation portion, rationally using frame space,
Avoid interfering for regional；And pin groove brace rod is set on the pin weld zone away from chip placing area, and with
Reinforcement connection between chip installation portion, the pin line strength after increase chip installation, avoid, because shaking when cutting, causing
Frame deformation or layering, ensure structural stability.
Specifically, as shown in Figures 2 and 3, the chip installation portion 3 is rectangle, and the long side of all chip installation portions 3 is equal
It is arranged in parallel with the short side of framework 1.Regular chip installation portion arrangement is advantageous to improve the stock utilization of framework matrix.
Further, the chip placing area is divided into the first chip placing area 304 and the second core by the raised skeleton at middle part
Piece settlement 305, chip placing area 305 of the first chip placing area 304 and second are each extended over to relative chip installation
Two sides in portion 3, the chip placing area are the region of the frame encirclement of raised skeleton and chip installation portion 3.By chip placing
Two settlements are divided into, are adapted to the arrangement demand for the chip installation portion that packing forms are DFN2510.As shown in figure 3, this reality
The the second chip placing area 305 for applying example is extended with arc groove to the raised skeleton at middle part, the second chip placing area 305 of increase
Area, the material usage of raised skeleton is also reduced, save production cost.
Embodiment 2
As shown in Figures 1 to 4, the DFN2510 high density frameworks according to embodiment 1, the pin welding of the present embodiment
The bearing of trend in area 302 is identical with the bearing of trend in the first chip placing area 304 or the second chip placing area 305, pacifies in chip
Put area and be provided with narrowed gap 303 close to the position of the side of chip installation portion 3, be i.e. the width of the raised skeleton in chip placing area becomes
It is narrow.
Further, it also is provided with narrowing gap 303 between the side of the pin weld zone 302 and chip installation portion 3, i.e.,
The narrowed width of the raised skeleton of pin weld zone 302.
The narrowed gap that chip placing area and pin weld zone extending end are set, reduces knife when product is cut after encapsulating
The contact area of piece and frame metal, increase blade life, while reduce the caloric value of blade, also accordingly reduce the hair of framework
Heat, framework is avoided with plastic packaging material because the excessive caused gap that generates heat is layered, ensure that the q＆r energy of product.
Embodiment 3
As shown in figure 4, the DFN2510 high density frameworks according to embodiment 1 or embodiment 2, the present embodiment is in chip
The back side of installation portion 3 is additionally provided with rear channel 307.Rear channel is set at the back side of chip installation portion, does not influence the whole of framework
Body structural stability, and the material usage of framework matrix can be reduced, save production cost；In the back of the body that the chip installation portion back side is set
Portion's groove is also beneficial to radiating during chip pin wire bonding, avoids the too high influence chip quality of welding heat.
As shown in Fig. 2 it is provided with a circle frame retaining frame 8, the side between the frame of framework 1 and the region of arrangement chip
Frame box frame 8 is half corrosion structure, and hollow slots 801 are interval with frame retaining frame 8.One circle is set outside the region of arrangement chip
Frame retaining frame, the structural stability of whole framework is further enhanced, reduce chip and the mistake of lead-foot-line installation caused by vibrations
Position problem, and frame retaining frame be half corrosion structure, i.e. its thickness is corroded a part, is easy to cutting lock out operation；In frame
Spaced hollow slots in retaining frame, also reduce difficulty for follow-up cutting lock out operation.
Further, the chip installation portion 3 close to frame is connected with frame retaining frame 8, the pin of the side of chip installation portion 3
Weld zone 302 and chip placing area are extended in frame retaining frame 8.The pin weld zone of the chip installation portion side of edge and
Chip placing area is connected with frame retaining frame, further enhances the stability of the chip installation portion close to frame position.
Embodiment 4
As shown in Fig. 2 the DFN2510 high density frameworks according to one of embodiment 1 to embodiment 3, in frame retaining frame 8
A circle frame Cutting Road, including horizontal frame Cutting Road 6 and vertical frame Cutting Road 7 are additionally provided between frame, in widthwise edge
Digging is spaced on frame Cutting Road 6 and vertical frame Cutting Road 7 multiple dead slots, is cut in horizontal frame Cutting Road 6 and vertical frame
The locating slot for the cutting of adjacent chips installation portion is equipped with road 7.
Further, the reinforcement between chip installation portion 3 is lateral connection muscle 4 and vertical dowel 9, and the transverse direction connects
The company's of being additionally provided with muscle dead slot 401 on muscle 4 is connect, is easy to subsequent cutting operation；In the position that lateral connection muscle 4 and vertical dowel 9 intersect
Cross dowel 5 is set to, is easy to connection and cutting operation.
Specifically, the vertical frame Cutting Road 7 empties groove 701 including multiple spaced Cutting Roads, in addition to
The transverse cuts locating slot 704 that lateral connection muscle 4 is correspondingly arranged, half corrosion rack for being provided with and strengthening in groove 701 is emptied in Cutting Road
Plate 701, reinforcement 703 is connected between half adjacent rotten frame plate 701, strengthens the intensity of vertical frame Cutting Road 7.
In the present embodiment, dead slot is arranged at intervals on horizontal frame Cutting Road and vertical frame Cutting Road, is easy to frame
Cut lock out operation；And the locating slot of cutting is provided for, with regard to energy precise positioning cutting position, profit so since being cut frame
In guarantee product quality.
Embodiment 5
As shown in figure 3, the DFN2510 high density frameworks according to one of embodiment 1 to embodiment 4, are welded in 8 pins
Connect and the first leg mark 306 is additionally provided with one of them in area 302, be easy to identification and the operation of pin wire bonding.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (10)
1. a kind of DFN2510 high density framework, include the framework of rectangular sheet structure, it is characterised in that be provided with framework more
The individual chip installation portion being adapted with DFN2510 encapsulating structures, the chip installation portion includes chip placing area and pin welds
Area, 8 separate pin weld zones are included in each chip installation portion, wherein 4 pin weld zones are one group symmetrical
The both sides in chip placing area are arranged in, 4 pins welding of homonymy is divided into 2 arrangements and put, and 2 row's pin weld zones are pacified with chip
The center line in dress portion is arranged symmetrically, and pin groove brace rod, the pin are additionally provided with the pin weld zone away from chip placing area
Groove brace rod extends between chip installation portion the reinforcement set and connected at muscle, and is connected with strengthening even muscle, the pin brace rod
Misplace and arrange with the bearing of trend of pin weld zone.
2. DFN2510 high density framework according to claim 1, it is characterised in that the chip installation portion is rectangle, and
The long side of all chip installation portions is arranged in parallel with the short side of framework.
3. DFN2510 high density framework according to claim 1, it is characterised in that the chip placing area is by middle part
Raised skeleton is divided into the first chip placing area and the second chip placing area, the first chip placing area and the second chip placing area
Two sides to relative chip installation portion are each extended over, the chip placing area is the frame of raised skeleton and chip installation portion
The region of encirclement.
4. DFN2510 high density framework according to claim 3, it is characterised in that the extension side of the pin weld zone
To identical with the bearing of trend in the first chip placing area or the second chip placing area, in chip placing area close to chip installation portion side
The position on side is provided with the narrowed width for narrowing gap, the i.e. raised skeleton in chip placing area.
5. DFN2510 high density framework according to claim 4, it is characterised in that pacify with chip the pin weld zone
It also is provided with narrowing the narrowed width in gap, the i.e. raised skeleton of pin weld zone between the side in dress portion.
6. DFN2510 high density framework according to claim 1, it is characterised in that also set at the back side of chip installation portion
There is rear channel.
7. the DFN2510 high density frameworks according to one of claim 1-6, it is characterised in that in the frame and cloth of framework
Put and be provided with a circle frame retaining frame between the region of chip, the frame retaining frame is half corrosion structure, is spaced in frame retaining frame
Provided with hollow slots.
8. DFN2510 high density framework according to claim 7, it is characterised in that close to frame chip installation portion with
Frame retaining frame is connected, and the pin weld zone of the chip installation portion side and chip placing area are extended in frame retaining frame.
9. DFN2510 high density framework according to claim 7, it is characterised in that between frame retaining frame and frame also
Provided with a circle frame Cutting Road, including horizontal frame Cutting Road and vertical frame Cutting Road, in horizontal frame Cutting Road and vertically
Digging is spaced on frame Cutting Road multiple dead slots, is equipped with horizontal frame Cutting Road and vertical frame Cutting Road for adjacent
The locating slot of chip installation portion cutting.
10. DFN2510 high density framework according to claim 9, it is characterised in that the vertical frame Cutting Road includes
Multiple spaced Cutting Roads empty groove, in addition to the transverse cuts locating slot being correspondingly arranged with lateral connection muscle, are cutting
The half corrosion frame plate for being provided with and strengthening in groove is emptied in road, is connected with reinforcement between half adjacent rotten frame plate, is strengthened vertical frame and cut
The intensity cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720738467.5U CN206877984U (en) | 2017-06-23 | 2017-06-23 | A kind of DFN2510 high density framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720738467.5U CN206877984U (en) | 2017-06-23 | 2017-06-23 | A kind of DFN2510 high density framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206877984U true CN206877984U (en) | 2018-01-12 |
Family
ID=61334076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720738467.5U Expired - Fee Related CN206877984U (en) | 2017-06-23 | 2017-06-23 | A kind of DFN2510 high density framework |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206877984U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4027382A4 (en) * | 2019-09-30 | 2023-04-05 | Huawei Technologies Co., Ltd. | Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method |
-
2017
- 2017-06-23 CN CN201720738467.5U patent/CN206877984U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4027382A4 (en) * | 2019-09-30 | 2023-04-05 | Huawei Technologies Co., Ltd. | Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method |
| US11887918B2 (en) | 2019-09-30 | 2024-01-30 | Huawei Technologies Co., Ltd. | Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180112 Termination date: 20180623 |
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| CF01 | Termination of patent right due to non-payment of annual fee |